JPS60206139A - Hydroextractor of semiconductor material - Google Patents
Hydroextractor of semiconductor materialInfo
- Publication number
- JPS60206139A JPS60206139A JP6385784A JP6385784A JPS60206139A JP S60206139 A JPS60206139 A JP S60206139A JP 6385784 A JP6385784 A JP 6385784A JP 6385784 A JP6385784 A JP 6385784A JP S60206139 A JPS60206139 A JP S60206139A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor material
- main shaft
- gripper
- sliding ring
- holding member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Centrifugal Separators (AREA)
Abstract
Description
【発明の詳細な説明】
本発明ハシリコンウエノへやガラスフォトマスクなどの
薄板状の半導体材料を一枚ごとに回転して水切乾燥を行
なうための装置に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an apparatus for draining and drying thin plate-shaped semiconductor materials such as silicon wafers and glass photomasks by rotating them one by one.
半導体制料に配線回路を形成するプロセスレこはエツチ
ング工程が含まれ、従ってその直後Ｕこ２１’＋ ＞、
ｉ’；１体材料を純水により水洗する水洗工程、さらに
その後に半導体材料を乾燥する工程が含まれる。その乾
燥工程は好適には半導体材料を回転することによる水切
乾燥によってなされろ。しかるに従来は、半導体材ネ」
の１枚ごとの水切乾燥は回転主軸を中空にしてその先り
１１に備えられた真空による吸盤で半導体月料を吸着し
て行なわれたため、回転用の駆動装置のほか、真空源お
よび切換弁を要し、従って装置が犬がかりになり且つ操
作も複雑になり、さらに半導体材料の片面しか水切乾燥
ができない欠点があった。The process of forming a wiring circuit on a semiconductor material includes an etching process, so immediately after that,
i': Includes a washing step of washing the one-piece material with pure water, and a subsequent step of drying the semiconductor material. The drying step is preferably done by drain drying by rotating the semiconductor material. However, in the past, semiconductor materials
Draining and drying of each sheet was carried out by making the rotating main shaft hollow and adsorbing the semiconductor material with a vacuum suction cup provided at the tip 11, so in addition to the rotation drive device, a vacuum source and a switching valve were required. Therefore, the device is labor intensive and the operation is complicated, and there is a further drawback that only one side of the semiconductor material can be drained and dried.
本発明の目的は吸盤に伴なう真空源および切換弁などを
用いず、純機械系により半導体材料を比較的広い寸法範
囲にわたり把持し得ろようにし且つ半導体材料の両面の
水切乾燥を行ない得ろ装置を提供することである。The object of the present invention is to provide a device that can grip a semiconductor material over a relatively wide range of dimensions with a pure mechanical system without using a vacuum source or a switching valve associated with a suction cup, and that can drain and dry both sides of the semiconductor material. The goal is to provide the following.
本発明による水切乾燥装置の特徴は回転する主軸の上端
に枢止された少なくも６つのグリッパ−の開閉を各グリ
ッパ−に連結された共通の摺動リングの上下移動によっ
て行ない、その上下移動を該摺動リングを可回動に受入
れろ保持部材とその支持ロッドを介して行なうようにし
たことである。The feature of the drain dryer according to the present invention is that at least six grippers pivotally fixed to the upper end of the rotating main shaft are opened and closed by vertical movement of a common sliding ring connected to each gripper. The sliding ring is rotatably received through a holding member and its support rod.
次に図面を参照のもとに本発明の実施例に関し説明する
。本発明による水切乾燥装置は第１図および第２図に示
すように、回転されろ主軸（１）と、その主軸を回転自
在に且つ直立状態に支持する支持体（２）と、主軸（１
）の上端に枢止された少なくも６つのグリシパー（３）
およびそれらのグリッパ−の開閉機構から成っている。Next, embodiments of the present invention will be described with reference to the drawings. As shown in FIGS. 1 and 2, the draining and drying device according to the present invention includes a rotating main shaft (1), a support (2) that rotatably supports the main shaft in an upright state, and a main shaft (1).
) at least six glycipers (3) pivoted to the upper end of the
and an opening/closing mechanism for those grippers.
（４）は主軸（１）を回転するだめの駆動用モータであ
り、（５）はその間の伝動装置である。この伝動装置（
５）としては通常のベルト伝動、タイミングベルトなど
適当な装置が用いられる。(4) is a drive motor that rotates the main shaft (1), and (5) is a transmission device therebetween. This transmission (
As for 5), a suitable device such as a normal belt transmission or a timing belt is used.
グリッパ−（３）は等間隔に設けられるのが好ましく、
−例では第２図に示すように、対状に組合わされたもの
が６組備えられる。各グリッパ−はピン（６）によって
枢止され且つその」二端は係止部（７）になっている。The grippers (3) are preferably provided at equal intervals,
- In the example, as shown in FIG. 2, six sets are provided which are combined in pairs. Each gripper is pivoted by a pin (6) and has a locking portion (7) at its two ends.
この係止部（７）の形状は第６図に示すように、グリッ
パ−（３）が開いた状態において、」−側に位置して内
側に向ってゆるく下降する傾斜部（７ａ）と、その傾斜
部の外端に接続して急勾配で立」二る部分（７ｂ）と、
その立上り部分の上端に在る内向きの突起（７ｃ）から
成ることが好ましく、このようなグリッパ−の形状によ
り半導体Ａ２料を可成り広範囲の寸法にわたって保持す
ることができろ。As shown in FIG. 6, the shape of this locking part (7) is as follows: when the gripper (3) is in the open state, it has an inclined part (7a) that is located on the "-" side and gently descends inward; a steeply rising portion (7b) connected to the outer end of the slope;
Preferably, it consists of an inwardly directed protrusion (7c) at the upper end of the rising portion, and such a shape of the gripper makes it possible to hold the semiconductor A2 material over a fairly wide range of dimensions.
各グリッパ−（３）を開閉するため、主軸の上部は第４
図に示すようにスプライン軸（ｌａ）になっているのが
好ましく、そこに摺動リング（８）がはめ込まれろ。従
って、この摺動リング（８）の内周面はそのスプライン
に嵌合する凹凸面になっている。なお、このスプライン
としては角形スプラインであっても、インボリュート形
のスプラインであってもよい。そのため摺動リング（８
）は主軸（１）に対し相対的には回転し得ないが、軸方
向には可動になっている。各グリッパ−（３）の主軸（
１）から離れた外側の部分と摺動リング（８）とはアー
ム（９）によって接続され、アーム（９）は両端におい
てグリッパ−の部分および摺動リング（８）に対しピン
により枢止されている。In order to open and close each gripper (3), the upper part of the main shaft is
As shown in the figure, it is preferably a splined shaft (la) into which the sliding ring (8) is fitted. Therefore, the inner circumferential surface of this sliding ring (8) has an uneven surface that fits into the spline. Note that this spline may be a rectangular spline or an involute spline. Therefore, the sliding ring (8
) cannot rotate relative to the main shaft (1), but is movable in the axial direction. The main shaft of each gripper (3) (
The outer part remote from 1) and the sliding ring (8) are connected by an arm (9), which is pivoted at both ends to the gripper part and the sliding ring (8) by pins. ing.
寸だ、第４図および第５図に示すように、摺動リング（
８）の下部は中央部（８′）が小径になっており、その
部分に保持部材（１０）の一対の脚（１０ａ）が嵌合す
ることによって、摺動リング（８） ｄ保持部材００）
にはめ込１れている。この保持部材００）はそれに固定
された支持ロッド（ｌＩ）によって支持される。支持ロ
ンド（１１１は主軸（１）に平行に設置され、その適当
な部分、好−！ Ｌｌｊ：第１図に見られろように、そ
の下部に支持ロッド（１１１を上下に移動する機構が備
えられている。As shown in Figures 4 and 5, the sliding ring (
The lower part of 8) has a small diameter at the center part (8'), and by fitting the pair of legs (10a) of the holding member (10) into that part, the sliding ring (8) d holding member 00 )
It is fitted in 1. This holding member 00) is supported by a support rod (lI) fixed to it. The support rod (111) is installed parallel to the main shaft (1), and a suitable part thereof is provided with a mechanism for moving the support rod (111 up and down) as shown in FIG. It is being
支持ロンド（１１）の上下機構としては好１しくは・き
ルスモータ０２）および伝動装置０３）を含み、且つ第
１図に示すように、支持ロッドＱｌｌの下部にねじ０（
１）が形成され且つそのねじ（１４１に係合するめねし
部材（１５）が備えられ、めねじ部材０９は回転自在に
なっているが、上下には不動になっている。めねじ部材
（１５）は伝動装置０３）を介してパルスモータ（１２
）によって回転されろ。この伝動装置としては確動伝動
ができる点でチェーンまたはタイミングベル１・である
のが好ましい。The vertical mechanism of the support rod (11) preferably includes a screw motor 02) and a transmission device 03), and as shown in FIG.
1) and is provided with a female threaded member (15) that engages with its thread (141), and the female threaded member (09) is rotatable but immobile vertically.Female threaded member ( 15) is a pulse motor (12) via a transmission device 03).
) to be rotated by The transmission device is preferably a chain or a timing bell 1, since positive transmission is possible.
この装置により水切乾燥を行なう際は、パルスモータ（
Ｉｚを予め決められた方向に所定の回転数だけ回転して
、支持ロッド（ｉｌｌおよび保持部材α０）を介して摺
動リング（８）を所定寸法だけ降下し、アーム（９）を
介して各グリッパ−を枢動し、第６図および第７図中に
実線で示すように開く。この状態で、乾燥すべき半導体
易料（Ｓ）をグリ・ソバ−（３）の傾斜部（７ａ）の上
すこ載せる。次いでパルスモータ（１２）を前とは逆の
方向に所定回転数だけ回転し、摺動リング（８）を上昇
すれば、各グリッパ−（３）は閉じろ方向に枢動し、第
７図中に想像線で示すように閉じ、係止部の部分（７ｂ
）で半導体材料（８１を保持する。When performing drain drying with this device, use a pulse motor (
Iz is rotated by a predetermined number of rotations in a predetermined direction, the sliding ring (8) is lowered by a predetermined dimension via the support rod (ill and the holding member α0), and each The gripper is pivoted open as shown in solid lines in FIGS. 6 and 7. In this state, the semiconductor material (S) to be dried is placed on the upper part of the inclined part (7a) of the Gri Soba (3). Next, the pulse motor (12) is rotated a predetermined number of revolutions in the opposite direction to the previous direction, and when the sliding ring (8) is raised, each gripper (3) pivots in the closing direction, as shown in FIG. Close the locking part (7b) as shown in the imaginary line.
) to hold the semiconductor material (81).
このように保持した状態でモータ（４）を作動して主軸
（１）を回転し、グリッパ−（３）および半導体材料も
同時に回転するので、水切乾燥が行なわれる。In this held state, the motor (4) is operated to rotate the main shaft (1), and the gripper (3) and semiconductor material are also rotated at the same time, so that draining and drying is performed.
なお、その際、摺動リング（８）は保持部材００）で保
持された状態で主軸（１）と共に回転する。主軸の回転
数は好捷しくは１，０００〜８．（］ ００ ｒｐｍ
テある。In addition, at that time, the sliding ring (8) rotates together with the main shaft (1) while being held by the holding member 00). The rotation speed of the main shaft is preferably 1,000 to 8. (] 00 rpm
There is.
回転中はパルスモータ０２）は停止したままであり、摺
動リング（８）もその高さ位置を保ち、各グリッパ−（
３）は閉じた状態を維持する。During rotation, the pulse motor 02) remains stopped, the sliding ring (8) also maintains its height position, and each gripper (
3) remains closed.
主軸の回転が所定時間続けられて半導体材料の水切乾燥
が終ると、モータ（４）の作動が停止し、再びパルスモ
ータ０ｚが作動して摺動リング（８）を下げて前と同様
にグリッパ−（３）を開き、乾燥された半導体材料を次
工程に搬送し、次の材料をグリッパ−（３）の傾斜部（
７ａ） ＶＣ載せろ。所望により、主軸（１）を中空に
して、そこから半導体材料の下面の中心区域ＫＮ２ガス
を吹き付は且つ可動のガスノズルにより同じ半導体材料
の上面の中心区域にも１（２ガスを吹き付けてもよく、
それにより両面の中心区域の乾燥を促進することができ
ろ。When the spindle continues to rotate for a predetermined period of time and the semiconductor material is drained and dried, the motor (4) stops operating, and the pulse motor 0z operates again to lower the sliding ring (8) and move the gripper as before. - (3) is opened, the dried semiconductor material is transported to the next process, and the next material is transferred to the inclined part (3) of the gripper (3).
7a) Put on VC. If desired, the main shaft (1) can be made hollow, and KN2 gas can be sprayed from there on the central region of the lower surface of the semiconductor material, and 1 (2 gases can also be sprayed on the central region of the upper surface of the same semiconductor material with a movable gas nozzle). often,
This can promote drying of the central area on both sides.
なお１通常は第１図に示すように、グリッパ−（３）は
被い０７）で包囲され、排気口０８）が設けられろ。Note that normally, as shown in FIG. 1, the gripper (3) is surrounded by a cover 07) and provided with an exhaust port 08).
０９）は水抜きである。09) is water removal.
上記の実施例ではスプラインによって主軸（１）に対す
る摺動リング（８）の回転を阻止しているが、そのよう
な機能はスプラインでなくても可能であり、例えば第６
図に示すように主軸に軸方向に延びる突起（ｌｆｌｉ）
ｆ：設は摺動リング（８）の内周面にそｆＬｋこ（Ｄ；
合する溝を設けてもよい。徒だ、支持口νトＩｆ ＩＩ
’Ｊ ｌ下に移動する装置としてはパルスモータυこ
より、は正確に移動し得る利点があるが、他のモータま
たは駆動体を用いてもよく、さらにねじの代りにウオー
ム機構、またはラックピニオン機構などを用いてもよい
。In the above embodiment, the rotation of the sliding ring (8) with respect to the main shaft (1) is prevented by the spline, but such a function is also possible without the spline.
A protrusion (lfli) extending axially on the main shaft as shown in the figure
f: The setting is on the inner peripheral surface of the sliding ring (8).
A matching groove may be provided. It's useless, support mouth νto If II
As a device for moving downward, a pulse motor υ has the advantage of being able to move accurately, but other motors or drivers may be used, and a worm mechanism or rack and pinion mechanism may be used instead of a screw. etc. may also be used.
」二記のように、本発明によれば、半導体材料はその周
囲の縁で保持された状態で水切乾燥が行なわれるので、
その両面の水切乾燥を行なうことができろ。そして真空
による吸着を用いろ従来の方式に比し、真空源を用いな
いためコンパクトになり、且つ半導体材料を適度に保持
することができ、操作および制御系を単純化でき、円滑
な作業がなされる。その上、半導体材料の水切乾燥を比
較的広い範囲にわたり行なうことができる。2, according to the present invention, the semiconductor material is drained and dried while being held by its surrounding edges.
Be able to drain and dry both sides. In addition, compared to the conventional method that uses vacuum suction, it is more compact because it does not use a vacuum source, and can hold the semiconductor material appropriately, simplifying the operation and control system, and allowing smooth work. Ru. Moreover, the semiconductor material can be drained and dried over a relatively wide range.
第１図は本発明の一例による水切乾燥装置の立面図、第
２図はその平面図、第６図はグリッパ一部分を部分的断
面で示した立面図、第４図は第１図の線Ｊ＼−八断面断
面図５図は第４図の線Ｂ−Ｂ断面図、第６図は他の実施
例を示す第４図に類似の断面図、第７図は第２図の線Ｃ
−Ｃ矢視図である。
図中、１・・・主軸、６・・・グリッパ−１７係止部、
８・・・摺動リング、９・・アーム、１０ 保持部材、
１１・・・支持口ｙド、１２．１３・・・上下移動用の
装置、１４・・・ねじ、１５・・・めねじ部材、１ａ・
・・スプライン軸
３−′−Ｊ
第５図
第７図FIG. 1 is an elevational view of a drain dryer according to an example of the present invention, FIG. 2 is a plan view thereof, FIG. 6 is an elevational view showing a part of the gripper in partial cross section, and FIG. 4 is the same as that shown in FIG. 5 is a sectional view taken along the line B-B of FIG. 4, FIG. 6 is a sectional view similar to FIG. 4 showing another embodiment, and FIG. 7 is a sectional view taken along the line of FIG. C
-C arrow view. In the figure, 1...Main shaft, 6...Gripper 17 locking part,
8...Sliding ring, 9...Arm, 10 Holding member,
DESCRIPTION OF SYMBOLS 11... Support opening y-do, 12.13... Device for vertical movement, 14... Screw, 15... Female thread member, 1a.
...Spline shaft 3-'-J Fig. 5 Fig. 7
Claims (1)
た少なくも６つのグリッパ−と、主軸の上部に軸方向に
可摺動になっているが相対的に回動できないように設け
られた摺動リングを含み、各前記グリッパ−は上部に半
導体材料を係止し得る係止部を備え且つ前記摺動リング
が上下に移動すると枢動するようにアームを介して前記
摺動リングに接続され、さらに前記摺動リングを回動自
在に且つ軸方向には共に移動するようにはめ込む保持部
材と、前記保持部材を支持し且つ前記主軸に平行に延び
る支持ロンドと、前記支持ロッドを上下に移動するため
の装置とを含む半導体材料の水切乾燥装置。 （２、特許請求の範囲第１項に記載の装置において、前
記主軸の上部はスプライン軸になっており且つ前記摺動
リングの内周面は前記スプライン軸に嵌合する凹凸面に
なっている水切乾燥装置。 （３）、特許請求の範囲第１項に記載の装置において、
各前記グリッパ−の係止部は開いた状態にお１ハて上側
に位置する内側に向ってゆるく下降する傾余１部と、そ
の傾斜部の外端に接続して急勾配で立」−６部分と、該
立上り部分の上端に在る内向きの突起を含む水切乾燥装
置。 （４）、特許請求の範囲第１項に記載の装置において、
前記支持ロッドを上下に移動する装置は前記支持ロッド
の下部に形成されたねじと、前記ねじに係合するめねじ
を含み、前記めねじは回転自在であるが上下には不動に
保持され、さらに伝動装置を介し前記めねじを回転する
パルスモータを含む水切乾燥装置。[Claims] (1). A rotationally driven main shaft, at least six grippers pivotally fixed to the upper end of the main shaft, and a slide provided on the upper part of the main shaft to be able to slide in the axial direction but not to rotate relative to the main shaft. Each gripper includes a sliding ring, and each gripper has a locking portion capable of locking a semiconductor material on an upper portion thereof, and is connected to the sliding ring via an arm so as to pivot when the sliding ring moves up and down. , further comprising: a holding member that fits the sliding ring so as to be rotatable and move together in the axial direction; a supporting rod that supports the holding member and extends parallel to the main axis; and a supporting rod that moves the supporting rod up and down. and an apparatus for drying semiconductor materials. (2. In the device according to claim 1, the upper part of the main shaft is a spline shaft, and the inner circumferential surface of the sliding ring is an uneven surface that fits into the spline shaft. Draining drying device. (3) In the device according to claim 1,
When the locking part of each gripper is in the open state, it has a slope part located on the upper side that gently descends inward, and a steep slope that connects to the outer end of the slope part. 6 parts and an inwardly directed protrusion at the upper end of the raised part. (4) In the device according to claim 1,
The device for moving the support rod up and down includes a screw formed at a lower part of the support rod and a female screw that engages with the screw, and the female screw is rotatable but held immovably in the vertical direction; A drain dryer including a pulse motor that rotates the female thread through a transmission device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6385784A JPS60206139A (en) | 1984-03-30 | 1984-03-30 | Hydroextractor of semiconductor material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6385784A JPS60206139A (en) | 1984-03-30 | 1984-03-30 | Hydroextractor of semiconductor material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60206139A true JPS60206139A (en) | 1985-10-17 |
| JPH0458687B2 JPH0458687B2 (en) | 1992-09-18 |
Family
ID=13241424
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6385784A Granted JPS60206139A (en) | 1984-03-30 | 1984-03-30 | Hydroextractor of semiconductor material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60206139A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4924852U (en) * | 1972-06-10 | 1974-03-02 | ||
| JPS5737837A (en) * | 1980-08-20 | 1982-03-02 | Toshiba Corp | Drying device for semiconductor wafer |
-
1984
- 1984-03-30 JP JP6385784A patent/JPS60206139A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4924852U (en) * | 1972-06-10 | 1974-03-02 | ||
| JPS5737837A (en) * | 1980-08-20 | 1982-03-02 | Toshiba Corp | Drying device for semiconductor wafer |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0458687B2 (en) | 1992-09-18 |
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