JP2982281B2 - Wafer scrubber device - Google Patents
Wafer scrubber deviceInfo
- Publication number
- JP2982281B2 JP2982281B2 JP2286101A JP28610190A JP2982281B2 JP 2982281 B2 JP2982281 B2 JP 2982281B2 JP 2286101 A JP2286101 A JP 2286101A JP 28610190 A JP28610190 A JP 28610190A JP 2982281 B2 JP2982281 B2 JP 2982281B2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- cleaning
- support plate
- drying
- back surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は半導体素子の製造工程において、ウエハに付
着したパーティクルを除去するウエハスクラバ装置に関
する。Description: TECHNICAL FIELD The present invention relates to a wafer scrubber device for removing particles attached to a wafer in a semiconductor device manufacturing process.
従来のスクラバ装置は、第６図の構成図のように、順
にローダー部9,ウエハ裏面洗浄部10,ウエハ表面洗浄部1
1,アンローダー部12から構成されている。As shown in FIG. 6, a conventional scrubber apparatus includes a loader unit 9, a wafer back surface cleaning unit 10, and a wafer front surface cleaning unit 1 in that order.
1, comprising an unloader section 12.
次にその動作について説明する。ローダー部９から搬
出されたウエハは、端面を支持されて裏面が上部に来る
様に180゜回転させられる。裏面が上部になったウエハ
は、ウエハ裏面洗浄部10において、ブラシにより裏面の
洗浄が行われる。この時、ウエハは外周部を６本のピン
で支持され、ウエハ下部より逆円錐状に純水を吹きつけ
ている。乾燥は、支持ピンの出ているステージを回転さ
せて行う。Next, the operation will be described. The wafer unloaded from the loader unit 9 is rotated by 180 ° so that the end surface is supported and the back surface is at the top. The back surface of the wafer whose back surface is on the upper side is cleaned by a brush in a wafer back surface cleaning unit 10. At this time, the outer periphery of the wafer is supported by six pins, and pure water is sprayed from the lower part of the wafer in an inverted conical shape. Drying is performed by rotating the stage from which the support pins are exposed.
次に、再びウエハの端面を支持し、ウエハの表面が上
になる様に180゜回転させる。次に、ウエハは、ウエハ
表面洗浄部11へ搬送される。ここでは、スピンチャック
によってウエハの裏面を真空吸着し、ブラシによりスク
ラブが行われる。その後、スピンチャックの回転により
ウエハを回転させ、乾燥を行う。処理が終了すると、ウ
エハは搬送ロボットによって裏面を真空吸着され、アン
ローダー部12へ送られる。Next, the wafer end face is supported again, and the wafer is rotated by 180 ° so that the surface of the wafer faces upward. Next, the wafer is transferred to the wafer surface cleaning unit 11. Here, the back surface of the wafer is vacuum-sucked by a spin chuck, and scrubbing is performed by a brush. Thereafter, the wafer is rotated by the rotation of the spin chuck, and drying is performed. When the processing is completed, the back surface of the wafer is vacuum-sucked by the transfer robot and sent to the unloader unit 12.
この従来のスクラバ装置では、ウエハ裏面の洗浄後、
ウエハ表面の洗浄から乾燥までの間、ウエハをスピンチ
ャックにより真空吸着するため、直前に洗浄したウエハ
裏面を汚染してしまう恐れがあり、また。従来の装置で
は、ウエハの表面と裏面の洗浄及び乾燥を別々のステー
ションで行っていたため、ウエハ一枚の作業時間が長く
かかるという問題があった。In this conventional scrubber device, after cleaning the back surface of the wafer,
During the period from cleaning to drying of the wafer surface, the wafer is vacuum-sucked by the spin chuck, so that the back surface of the wafer that has just been cleaned may be contaminated. In the conventional apparatus, since the cleaning and drying of the front and rear surfaces of the wafer are performed in separate stations, there is a problem that the work time for one wafer is long.
本発明のウエハスクラバ装置は、ウエハの両端面を支
持しウエハの表面と裏面のブラシ洗浄を同時に行い、乾
燥時にはウエハの裏面を汚染しないように真空チャック
の使用をやめ、ウエハの両端面を支持したままウエハを
羽車状に回転させる構造になっている。The wafer scrubber device of the present invention supports both end surfaces of the wafer, simultaneously performs brush cleaning of the front and back surfaces of the wafer, stops using a vacuum chuck so as not to contaminate the back surface of the wafer during drying, and supports both end surfaces of the wafer. The structure is such that the wafer is rotated in the shape of an impeller while being held.
次に本発明について図面を参照して説明する。第１図
は本発明の実施例１のウエハスクラバ装置の斜視図であ
る。ローダーキャリア１のウエハ２を、洗浄するエリア
まで搬送する為に、ローダー用搬送ロボット３が取り付
けてある。ウエハ両端支持板４は、第２図の部分平面図
に示すように、ウエハ２の両端を5mmずつ両面で支持で
き、スクラバ装置側面に取り付け部を軸にして、０〜10
00rpmまで回転させる事ができる。また、アンローダー
の方向へ水平移動も可能となっている。Next, the present invention will be described with reference to the drawings. FIG. 1 is a perspective view of a wafer scrubber device according to Embodiment 1 of the present invention. A loader transfer robot 3 is attached to transfer the wafer 2 of the loader carrier 1 to an area to be cleaned. As shown in the partial plan view of FIG. 2, the wafer both-ends support plate 4 can support both ends of the wafer 2 by 5 mm on both sides.
It can be rotated up to 00 rpm. Also, horizontal movement in the direction of the unloader is possible.
ウエハ両端支持板4aは、上下方向の移動は可能だが、
回転はしない。そして、アンローダーキャリア８にウエ
ハ２を搬送する際に、一時的にウエハ両端支持板４より
ウエハ２を受け取るための支持板であるウエハ洗浄用の
ブラシは、表面洗浄用ブラシ５と裏面洗浄用ブラシ６の
２種があり、それぞれ水平軸及び垂直軸を中心に100〜3
00rpmで回転している。またアンローダーキャリア８に
ウエハ２を収納する為に、アンローダーウエハキャリア
押し込み板７を備えている。The wafer both-ends support plate 4a can be moved up and down,
No rotation. When the wafer 2 is transported to the unloader carrier 8, the wafer cleaning brush, which is a support plate for temporarily receiving the wafer 2 from the wafer both-ends support plate 4, includes the front surface cleaning brush 5 and the back surface cleaning brush. There are two types of brushes 6, 100 to 3 around the horizontal and vertical axes respectively.
It is rotating at 00rpm. In order to store the wafer 2 in the unloader carrier 8, an unloader wafer carrier pushing plate 7 is provided.
次に、本発明のウエハスクラバ装置の動作について説
明する。ローダーキャリア１にセットされているウエハ
２は、ローダー用搬送ロボット３によってウエハ裏面を
真空吸着されて、ウエハ両端支持板４のところまで、表
面を上にして水平に搬送される。この時、ウエハ両端支
持板４は開いた状態になっており、この間にウエハ２が
置かれる。次に、ウエハ両端支持板４はウエハ２の両端
を5mmずつ保持して閉じ、ウエハ２の表面がローダー側
を向くように90゜回転する。Next, the operation of the wafer scrubber device of the present invention will be described. The wafer 2 set on the loader carrier 1 is vacuum-adsorbed on the back surface of the wafer by the loader transfer robot 3 and is transferred horizontally to the wafer both-ends support plate 4 with the front surface up. At this time, the wafer both-ends support plate 4 is in an open state, and the wafer 2 is placed between them. Next, the wafer both-ends support plate 4 is closed while holding both ends of the wafer 2 by 5 mm, and rotated by 90 ° so that the surface of the wafer 2 faces the loader side.
ブラシ洗浄を行う前に、ウエハ両端支持板４にあいて
いる多数の穴より、純水をウエハ２に吹き付ける。ブラ
シ洗浄は、ウエハ表面洗浄用ブラシ５がウエハ２の表面
に当たり、またウエハ裏面洗浄用ブラシ６がウエハ２の
裏面に当たる様にして行う。各ブラシは80g/cm2の圧力
でウエハ２に当てられる。ウエハ２との位置関係は、第
３図の部分正面図に示してある。ブラシ洗浄中は、第４
図のようにウエハ回転用チューブ13がウエハ２の円周に
当たりながら回転し、ウエハ２を回転させる。第４図
（ａ）で、ウエハ回転用チューブ13が左向きに回転した
場合、第４図（ｂ）状態となる。この時オリエンテーシ
ョンフラットは右に来ている。さらにウエハ回転用チュ
ーブ13を回転させると、第４図（ｃ）のようにウエハ２
はオリエンテーションフラットが下になって止まる。こ
こで、ウエハ回転用チューブ13が下へ下がる。Before performing the brush cleaning, pure water is sprayed on the wafer 2 through a number of holes formed in the support plate 4 for both ends of the wafer. The brush cleaning is performed such that the wafer surface cleaning brush 5 contacts the front surface of the wafer 2 and the wafer back surface cleaning brush 6 contacts the back surface of the wafer 2. Each brush is applied to the wafer 2 at a pressure of 80 g / cm 2 . The positional relationship with the wafer 2 is shown in the partial front view of FIG. During brush cleaning, the 4th
As shown in the figure, the wafer rotating tube 13 rotates while hitting the circumference of the wafer 2 to rotate the wafer 2. In FIG. 4A, when the wafer rotation tube 13 rotates to the left, the state shown in FIG. 4B is reached. At this time, the orientation flat is on the right. When the wafer rotation tube 13 is further rotated, as shown in FIG.
Stops with the orientation flat down. Here, the wafer rotation tube 13 is lowered.
次に、ウエハ両端支持板４から再び純水を５秒間吹き
付ける。そして、両ブラシは待機状態に戻る。純水が止
まると、ウエハ支持板４はウエハ２の両端を支持したま
ま軸を中心に回転し、ウエハ２を羽根車状に回転させて
乾燥を行う。ウエハ２は表面を上にして止められ、ウエ
ハ両端支持板4aへウエハ２が移される。ウエハ両端支持
板4aは、ウエハ２をアンローダーキャリア８の入口まで
搬送し止まる。アンローダーキャリア８の溝へはアンロ
ーダーウエハキャリア押し込み板７によって、ウエハ２
の端を当てて押すことで収納する。Next, pure water is sprayed again from the wafer both-ends support plate 4 for 5 seconds. Then, both brushes return to the standby state. When the pure water stops, the wafer support plate 4 rotates about an axis while supporting both ends of the wafer 2, and rotates the wafer 2 in an impeller shape to perform drying. The wafer 2 is stopped with its surface facing upward, and the wafer 2 is transferred to the wafer both-ends support plate 4a. The wafer both-ends support plate 4a conveys the wafer 2 to the entrance of the unloader carrier 8 and stops. The wafer 2 is inserted into the groove of the unloader carrier 8 by the unloader wafer carrier pushing plate 7.
Store by pressing against the end of.
第５図（ａ），（ｂ）は本発明の実施例２のウエハ乾
燥機能を説明する図で、図（ａ）は正面図、図（ｂ）は
支持板の断面図である。この場合は、ウエハ２の乾燥時
に、ウエハ乾燥用支持板14によってウエハ２の支持位置
を上下に変え、軸を中心にして回転させる前に、上部の
ウエハ乾燥用支持板14より約6kg/cm2でN2を吹き付け、
ウエハ上の水分を吹きとばし、予備乾燥を行ってからウ
エハ両端支持板４の回転により乾燥を開始する。この場
合は、予備乾燥を行うことでその後の回転乾燥の時間が
短縮でき、より高速回転に耐えられるという利点があ
る。5 (a) and 5 (b) are diagrams illustrating a wafer drying function according to the second embodiment of the present invention, where FIG. 5 (a) is a front view and FIG. 5 (b) is a cross-sectional view of a support plate. In this case, when the wafer 2 is dried, the support position of the wafer 2 is changed up and down by the wafer drying support plate 14, and before the wafer 2 is rotated about the axis, the wafer drying support plate 14 is about 6 kg / cm higher than the upper wafer drying support plate 14. blowing N 2 at 2,
After the moisture on the wafer is blown off and pre-drying is performed, drying is started by rotation of the support plate 4 for both ends of the wafer. In this case, the pre-drying has the advantage that the time for the subsequent rotational drying can be shortened, and higher rotational speed can be tolerated.
以上説明したように、本発明のスクラバ装置は、ウエ
ハの表面と裏面を同時に洗浄することで、スクラブ時間
が片面ずつ洗浄を行う場合に比べて1/2に短縮でき、洗
浄後にウエハ表裏面に真空吸着を用いないので汚染も防
止できるという効果を有する。As described above, the scrubber device of the present invention can reduce the scrubbing time by half by cleaning the front and back surfaces of the wafer at the same time as compared to the case of cleaning one surface at a time. Since vacuum suction is not used, there is an effect that contamination can be prevented.
第１図は本発明の実施例１の斜視図、第２図は第１図の
ウエハ洗浄，乾燥部の平面図、第３図はウエハ洗浄部の
側面図、第４図（ａ），（ｂ），（ｃ）はウエハ洗浄時
のウエハ回転動作を示した正面図、第５図（ａ），
（ｂ）は実施例２を説明する図で、図（ａ）はウエハ乾
燥部の正面図、図（ｂ）はウエハ乾燥用支持板の断面
図、第６図は従来のウエハスクラバ装置の構成図であ
る。 １……ローダーキャリア、２……ウエハ、３……ローダ
ー用搬送ロボット、４……ウエハ両端支持板、4a……ウ
エハ両端支持板、５……ウエハ表面洗浄用ブラシ、６…
…ウエハ裏面洗浄用ブラシ、７……アンローダーウエハ
キャリア押し込み板、８……アンローダーキャリア、９
……ローダー部、10……ウエハ裏面洗浄部、11……ウエ
ハ表面洗浄部、12……アンローダー部、13……ウエハ回
転用チューブ、14……ウエハ乾燥用支持板。1 is a perspective view of a first embodiment of the present invention, FIG. 2 is a plan view of a wafer cleaning / drying unit in FIG. 1, FIG. 3 is a side view of the wafer cleaning unit, and FIGS. FIGS. 5B and 5C are front views showing the wafer rotating operation during wafer cleaning, and FIGS.
(B) is a view for explaining Example 2, (a) is a front view of a wafer drying unit, (b) is a cross-sectional view of a wafer drying support plate, and FIG. 6 is a configuration of a conventional wafer scrubber device. FIG. DESCRIPTION OF SYMBOLS 1 ... Loader carrier, 2 ... Wafer, 3 ... Transfer robot for loader, 4 ... Support plate for both ends of wafer, 4a ... Support plate for both ends of wafer, 5 ... Brush for cleaning wafer surface, 6 ...
... Wafer backside cleaning brush, 7... Unloader wafer carrier push plate, 8... Unloader carrier, 9
… Loader section, 10 wafer backside cleaning section, 11 wafer front side cleaning section, 12 unloader section, 13 wafer rotation tube, 14 wafer drying support plate.
Claims (1)
ラバ装置において、ウエハの両端面を支持し表面と裏面
の洗浄を同時に行う回転ブラシ機構と、洗浄後ウエハの
両端面を支持したままウエハを羽根車状に回転させる回
転乾燥機構とを備えたことを特徴とするウエハスクラバ
装置。1. A wafer scrubber apparatus for cleaning a front surface and a back surface of a wafer, a rotary brush mechanism for supporting both end surfaces of the wafer and simultaneously cleaning the front surface and the back surface, and removing the wafer while supporting both the end surfaces of the wafer after cleaning. A wafer scrubber device comprising: a rotary drying mechanism for rotating the wafer in an impeller shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2286101A JP2982281B2 (en) | 1990-10-24 | 1990-10-24 | Wafer scrubber device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2286101A JP2982281B2 (en) | 1990-10-24 | 1990-10-24 | Wafer scrubber device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04162426A JPH04162426A (en) | 1992-06-05 |
| JP2982281B2 true JP2982281B2 (en) | 1999-11-22 |
Family
ID=17699953
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2286101A Expired - Lifetime JP2982281B2 (en) | 1990-10-24 | 1990-10-24 | Wafer scrubber device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2982281B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5485644A (en) * | 1993-03-18 | 1996-01-23 | Dainippon Screen Mfg. Co., Ltd. | Substrate treating apparatus |
| JP5371664B2 (en) * | 2009-09-29 | 2013-12-18 | 大日本スクリーン製造株式会社 | Substrate processing equipment |
| CN106217214B (en) * | 2016-09-13 | 2018-02-06 | 长沙华腾智能装备有限公司 | A kind of automatic loading/unloading scribing machine |
-
1990
- 1990-10-24 JP JP2286101A patent/JP2982281B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04162426A (en) | 1992-06-05 |
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