JPH11162898A - Scrubber cleaning equipment of wafer and cleaning method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent generation of a wafer mark on a cleaned surface, and prevent generation of particles, by drying the back of a wafer without rotating the wafer at a high speed when the back of the wafer is cleaned, in scrub cleaning a wafer. SOLUTION: A wafer surface cleaning part 10 is provided with a cleaning brush 11, a rotation/moving mechanism of the cleaning brush, a pure water supply nozzle 12, an IPA(isopropyl alcohol) supplying nozzle 13 and a wafer rotating mechanism 14. A wafer back cleaning part 20 is provided similarly with a cleaning brush 21, a wafer rotating mechanism 24, etc. The wafer rotating mechanism 24 is provided with a wafer holding part 26 which holds a wafer W just above the upper end portion of a rotation axis 25, making a proper gap, and a back rinse nozzle 27. In the case of cleaning the surface and the back of the wafer, a treatment is performed in the order of pure water rinsing, brush cleaning by pure water, pure water rinsing, IPA rinsing and drying. In the case of cleaning the back of the wafer, IPA liquid is always supplied to the surface of the wafer from the back rinse nozzle 27.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a scrubber cleaning technique for a semiconductor wafer, and more particularly, to a semiconductor wafer scrubber cleaning technique.
The present invention relates to a wafer scrubber cleaning apparatus and a wafer cleaning method capable of cleaning so that a watermark is not left on any of the back surfaces.

[0002]

2. Description of the Related Art Conventionally, as a scrubber device for a semiconductor wafer (hereinafter, referred to as a wafer), an operation of rotating a wafer at a high speed so that a cleaning surface of the wafer is directed upward and along a horizontal direction, and cleaning a wafer with a cleaning brush. It is known that a wafer is cleaned by supplying a cleaning liquid to a central portion of a cleaning surface of a wafer or a cleaning brush while performing pressing against a surface, rotation and movement in a wafer diameter direction in parallel.

[0003] The cleaning of a wafer by the conventional scrubber apparatus is usually (1) a pure water rinsing step for removing particles on the wafer surface, (2) a pure water supply to the wafer surface, and a rotation to the wafer surface. A brush cleaning step using pure water (scrubber cleaning: scrubbing) in which the pressing of the brush is performed in parallel; and (3) a pure water rinsing step performed to remove particles remaining on the wafer surface after the brush cleaning step. It is performed in order. These steps (1) to (3) are first performed on the front surface of the wafer, and then performed in the same manner on the rear surface of the wafer. However, in the cleaning of the back surface of the wafer, pure water is supplied to the wafer surface (back rinsing) in order to prevent particles peeled off during the cleaning from going around the wafer surface side.

The wafer after cleaning is treated in a drying step. As a drying method, a spin drying method in which water attached to the wafer surface is spun by centrifugal force by rotating the wafer at a high speed has been mainly adopted. Was.

[0005]

When the wafer surface is dried by the spin-dry method, the wafer is held at a vacuum chuck and rotated at a high speed. However, the centrifugal force at the center of the wafer, and therefore the water shaking-off force is reduced around the wafer. At the center of the wafer, the surface tension of water (which depends on the surface state of the wafer, ie, whether it is hydrophilic or hydrophobic) is greater than the centrifugal force, At the center of the wafer surface, a so-called water mark having a diameter of several μm was easily generated due to water droplets remaining on the wafer. If the watermark is present on the wafer surface, there is a problem that abnormal growth of SiO ₂ or pattern collapse occurs on the wafer surface in a semiconductor manufacturing apparatus in a later process.

When the back surface of the wafer is dried by the spin dry method, the wafer is rotated while holding the outer periphery of the wafer with a large number of pins made of fluororesin or polyetheretherketone. In this case, by increasing the centrifugal force to accelerate the drying of the water and increasing the rotation speed in order to suppress the generation of the watermark, particles are generated from the pins due to friction between the pins and the wafer, which adhere to the wafer surface. In addition, there is a problem that the life of the pin is shortened. For this reason, when drying the back of the wafer,
It has been difficult to achieve both watermark prevention and particle prevention at the same time.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and has as its object a simple structure and a simple operation so that a watermark is not generated on a wafer surface after a drying process. An object of the present invention is to provide a wafer cleaning apparatus capable of efficiently cleaning the back surface and a wafer cleaning method using the same. Also,
An object of the present invention is to efficiently dry the back surface of a wafer without rotating the washed wafer at a high speed.

[0008]

In order to solve the above-mentioned problems, a wafer scrubber cleaning apparatus according to the present invention comprises an operation of rotating a wafer at a high speed so that a cleaning surface is directed upward and along a horizontal direction; The wafer cleaning surface is supplied by supplying a cleaning liquid to the center of the cleaning surface of the wafer or the cleaning brush while pressing the cleaning brush against the wafer cleaning surface, rotating and moving the wafer in the diameter direction in parallel. In the apparatus for cleaning the wafer, a wafer cleaning section is provided in two stages, and the wafer cleaning section in the preceding stage is for cleaning the wafer surface (element forming surface), and vacuum-adsorbs the wafer concentrically with the rotation axis. A wafer high-speed rotation mechanism for high-speed rotation, a rotation / movement mechanism of the cleaning brush, a pure water supply mechanism for supplying pure water as the cleaning liquid, and An IPA supply mechanism for supplying isopropyl alcohol; a wafer cleaning section at a later stage for cleaning the back surface of the wafer; a wafer rotating mechanism for holding and rotating the wafer; and a rotating / moving mechanism for the cleaning brush. A pure water supply mechanism for supplying pure water as the cleaning liquid, and an IPA supply mechanism for supplying isopropyl alcohol as the cleaning liquid, wherein the wafer rotation mechanism appropriately positions the wafer directly above the upper end of the rotation shaft. A wafer holding portion for bringing the outer peripheral portion of the wafer into contact with the wafer and holding the wafer concentrically with the rotating shaft; and an IPA for supplying an isopropyl alcohol liquid to the lower surface of the wafer (the surface opposite to the cleaning surface, ie, the wafer surface). And a supply mechanism.

Further, a wafer scrubber cleaning method according to the present invention is a method of scrubber cleaning a wafer using the above-described cleaning apparatus. In a wafer cleaning section at a preceding stage, a wafer surface is cleaned with pure water using a cleaning brush. After rinsing while supplying pure water to the center of the wafer surface, rinsing while supplying the IPA solution to the center of the wafer surface, and using a cleaning brush for the back surface of the wafer in the subsequent wafer cleaning section. After washing with pure water and rinsing while supplying pure water to the center of the back surface of the wafer,
While rinsing while supplying the PA solution to the center of the back surface of the wafer, washing with pure water, rinsing with pure water and IPA
During the entire rinsing process, I
Rinsing is performed while supplying the PA solution.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The specific structure and operation of the present invention will be described below with reference to the embodiments shown in the drawings. FIG.
(A) and (b) are illustrations of a scrubber cleaning device and a cleaning method using the scrubber cleaning device, (a) cleaning a wafer cleaning section 10 at a front stage for cleaning a wafer surface, and (b) cleaning a wafer back surface. Wafer cleaning units 20 at the subsequent stage are shown. Hereinafter, the configuration of the cleaning device will be described first.

The wafer surface cleaning unit 10 shown in FIG.
A mechanism for rotating and moving the cleaning brush 11 (not shown);
Pure water supply nozzle 12 for supplying pure water to wafer surface Wa
And an IPA supply nozzle 13 that supplies liquid isopropyl alcohol (IPA) to the wafer surface Wa, and a wafer rotation mechanism 14 that vacuum-adsorbs the wafer W concentrically with the rotation shaft 15 and rotates the wafer W at high speed. The wafer rotating mechanism 14 includes the rotating shaft 15 and a vacuum chuck (vacuum suction disk) 16 provided at an upper end thereof. The rotation / movement mechanism of the cleaning brush is capable of performing the rotation of the cleaning brush 11 and the movement along a movement locus indicated by a broken line in FIG. Sign 1
Reference numeral 7 denotes a movement locus of the cleaning brush 11.

The wafer back surface cleaning section 20 shown in FIG.
A rotating and moving mechanism (not shown) of the cleaning brush 21;
Pure water supply nozzle 22 for supplying pure water to wafer back surface Wb
And IPA for supplying liquid IPA to wafer back surface Wb
A supply nozzle 23 and a wafer rotation mechanism 24 for rinsing the wafer surface Wa with the IPA liquid while holding and rotating the wafer W are provided. The rotating / moving mechanism of the cleaning brush is capable of performing the rotation of the cleaning brush 21 and the movement along a movement locus indicated by a broken line in FIG. 1B in parallel. Reference numeral 28 indicates a movement locus of the cleaning brush 21.

The wafer rotating mechanism 24 is made of plastic (fluororesin) that holds the wafer directly above the upper end of the rotating shaft 25 at appropriate intervals, abuts the outer peripheral portion of the wafer, and holds the wafer concentrically with the rotating shaft 25. And the like, and a back rinse nozzle 27 (IPA supply nozzle) for supplying an IPA solution to the wafer surface Wa. The wafer holding portion 26 has a disk 26a concentrically fixed to the upper end of the rotating shaft 25, and an outer peripheral portion on the upper surface of the disk,
And a plurality of wafer holding pins 26b projecting on the same pitch circle of the disk.
Is composed of a cylindrical main body 26c and a small-diameter round bar 26d protruding concentrically on the upper surface of the main body. The back rinse nozzle 27 is provided at the center of the disk 26a and communicates with an IPA supply source (not shown) via a flow path formed in the rotating shaft 25.

In the cleaning of the wafer surface Wa by the wafer surface cleaning unit 10, the wafer W is previously suction-held on the vacuum chuck 16 so that the wafer surface is turned upward, and (1) a pure water rinsing step, and (2) pure water Processing is performed in the order of a brush cleaning step, (3) a pure water rinsing step, (4) an IPA rinsing step, and (5) a drying step. The wafer after the drying step is then processed in the wafer back surface cleaning unit 20.

The pure water rinsing step (1) is for removing particles on the wafer surface (particles generated in a step before the cleaning step and adhered to the wafer surface) that can be easily peeled off. Here, while rotating the wafer at a high speed by the wafer rotating mechanism 14,
Pure water is supplied from the pure water supply nozzle 12 to the center of the wafer surface. Particles separated from the wafer surface are scattered and removed together with water by centrifugal force.

The brush cleaning step (2) is for removing particles relatively firmly attached to the wafer surface. In this step, the cleaning brush 11 is pressed against the wafer surface, rotated (rotated), moved in the diameter direction of the wafer, and the center of the wafer surface or the cleaning brush 1 is rotated.
1 and the supply of pure water to 1 is performed in parallel. In this case, the operation of moving the cleaning brush 11 in the diameter direction of the wafer by the rotation / movement mechanism as shown by a movement locus 17 in FIG. Particles separated from the wafer surface are scattered and removed together with water by centrifugal force.

The pure water rinsing step (3) is performed to remove particles remaining on the wafer surface after the brush cleaning step, and the operation method and operation are (1).
This is the same as the pure water rinsing step.

In the IPA rinsing step (4), water remaining on the wafer surface after the pure water rinsing step (3) is removed by IPA.
It is for removing water by replacing with liquid.
It is the same as the pure water rinsing step (1) except that the IPA liquid is supplied from the PA supply nozzle 13 to the center of the wafer surface.

The drying step (5) is a step performed to remove the IPA solution remaining on the wafer surface after the IPA rinsing step (4), and simply rotates the wafer W at a high speed to remove the wafer surface. The IPA liquid is scattered by centrifugal force.

In these steps (1) to (5), it is preferable to rotate the wafer at a high speed similarly to the conventional method, and the washing and drying of the wafer surface can be efficiently performed in a shorter time. In this case, since the wafer W is sucked and held by the vacuum chuck 16, unlike the case where the wafer W is held by the wafer holding pin, there is no problem that the life of the pin is shortened even when the wafer is rotated at a high speed.
No particles are generated from the wafer.

On the other hand, in the cleaning of the wafer back surface Wb, for the same purpose as in the case of the wafer front surface and in the same manner, (i) a pure water rinsing step, (ii) a brush cleaning step with pure water, and (iii) a pure water The treatment is performed in the order of a rinsing step, (iv) an IPA rinsing step, and (v) a drying step.

In this case, as shown in FIG. 1B, the outer peripheral portion of the wafer W is
Is placed on the upper surface of the main body 26c, and the wafer is held concentrically with the rotating shaft 25, and the wafer back surface Wb is directed upward. As a result, a space of an appropriate size is formed between the disk 26a and the wafer W, so that the back rinse nozzle 27 provided on the disk 26a can supply the IPA liquid to the center of the wafer surface. . The distance between the outer peripheral end of the wafer W and the round bar 26d is set so that there is no large play between them. If the backlash is large, the outer peripheral edge of the wafer and the round bar 26 during wafer rotation
When the distance d is too small, the operation of holding the wafer becomes difficult.

The method of cleaning the back surface of the wafer is significantly different from the method of cleaning the front surface of the wafer.
During the entire process (v), the IPA solution is always supplied to the wafer surface Wa (lower surface side) to perform back rinsing. Part of the water supplied to the wafer back surface Wb during the cleaning process flows into the wafer front surface Wa, and some of the particles separated from the wafer back surface in the pure water rinsing process or the brush cleaning process flow around to the wafer front surface. Is prevented by performing this back-rinsing,
The wafer surface can be maintained in a clean state immediately after the IPA rinsing step (4).

By the way, in the conventional method of cleaning a wafer surface, pure water rinsing, brush cleaning with pure water, pure water rinsing,
It was done in the order of drying. In addition, in cleaning the backside of the wafer, pure water rinsing, brush cleaning with pure water, pure water rinsing, and drying are performed in this order, and pure water is used during the entire process from the preceding pure water rinsing process to the subsequent pure water rinsing process. The wafer surface was rinsed (back rinsed). However, in the conventional method, in both the case of the wafer front surface and the case of the wafer back surface, water is shaken off and dried by centrifugal force, so that it is necessary to rotate the wafer at high speed.

On the other hand, in the present invention, since the drying of the wafer front surface and the drying of the wafer back surface are performed by shaking off the IPA liquid by centrifugal force, it is not necessary to rotate the wafer at a high speed. Therefore, in drying the back surface of the wafer, the generation of particles from the holding pin 26b due to the friction between the wafer and the wafer holding pin 26b is suppressed. If the wafer is not rotated at high speed, some IPA
Although the liquid remains, this IPA liquid does not cause a watermark unlike water, and the residual IPA liquid is volatilized and removed more quickly than water.

As described above, in the present invention, the cleaning of the wafer surface is performed in the order of pure water rinsing, brush cleaning with pure water, pure water rinsing, IPA rinsing, and drying. Also,
In the present invention, the cleaning of the back surface of the wafer is performed in the order of pure water rinsing, brush cleaning with pure water, pure water rinsing, IPA rinsing, and drying. Rinse (back rinse) is performed continuously.

Therefore, according to the present invention, in the step of cleaning the surface of the wafer, the generation of a watermark on the surface of the wafer is suppressed, and the IPA evaporates more quickly than water. It can be carried out. Further, in the step of cleaning the back surface of the wafer, the generation of watermarks on the front surface and the back surface of the wafer is suppressed, and the generation of particles from the wafer holding pins can be prevented by rotating the wafer at a relatively low speed. .

[0028]

Next, an embodiment of the present invention will be described with reference to FIGS. FIG. 2 is a schematic perspective view showing the entire configuration of the scrubber cleaning apparatus, FIGS. 3 to 5 show the components thereof, FIG. 3 is a perspective view of a front surface scrubber unit (wafer cleaning section in the former stage), and FIG. FIG. 5 is a perspective view of a scrubber unit (a wafer cleaning section at a later stage), and FIG. 5 is a perspective view of a wafer reversing unit.

As shown in FIG. 2, the scrubber cleaning apparatus includes a wafer detection arm 31, a cassette stage 32, an indexer unit 33, a transport unit 34, a front scrubber unit 35, a reversing unit 36, a back scrubber unit 37, a reversing unit 38, And an automatic control device (not shown) for automatically operating these.

A plurality of wafer detection arms 31 are provided on the cassette stage 32 at appropriate intervals. The cassette stage 32 is for setting a carrier (not shown) storing a large number of wafers, and the wafer detection arm 31 is for detecting the number of stored wafers in the carrier. The indexer unit 33 performs an operation of taking out wafers in the carrier one by one and transferring them to the transport unit 34, and an operation of receiving wafers one by one from the transport unit 34 and storing them in the carrier. The indexer unit 33 is provided with an indexer arm 33a for holding the wafer by vacuum suction. The indexer arm can be moved up and down, and can move back and forth along the longitudinal direction of the cassette stage 32 so that it can be stopped at a predetermined position. Has become. The indexer arm 33a includes a pair of vacuum suction members opposed to each other, and these members can freely approach and separate from each other.

The transport unit 34 is vertically movable, moves back and forth along a front scrubber unit 35 and a back scrubber unit 37, and can be stopped at a predetermined position. The transport unit 34 includes a pair of arms facing each other, these arms are rotatable integrally, and are movable back and forth in the longitudinal direction of the arms, and are movable toward and away from each other. It is configured such that the wafer can be held by placing it on these arms.

As shown in FIG. 3, the surface scrubber unit 35 includes a rotatable brush arm 41, a cylindrical cleaning brush 42 provided at one end thereof, and a pure water supply nozzle 4.
3, an IPA supply nozzle 44, a vacuum chuck (spin chuck) 45 for holding a wafer, a cleaning liquid collecting cylinder 46, an outer cylinder 47, and a cleaning liquid discharging member 48. The cleaning liquid collecting cylinder 46 is for collecting the cleaning liquid (water, IPA) scattered from the wafer surface and for preventing the cleaning liquid from splashing on the wafer surface, and surrounds the vacuum chuck 45 and is concentric with the vacuum chuck 45. Is provided. The vacuum chuck 45 is a rotating mechanism (not shown)
It can rotate at high speed. The outer cylinder 47 is provided concentrically outside the cleaning liquid recovery cylinder 46. Cleaning liquid recovery cylinder 4
An annular groove is formed between the outer tube 6 and the outer cylinder 47 for leading out the cleaning liquid.
It is connected to.

As shown in FIG. 4, the back side scrubber unit 37 includes a rotatable brush arm 51, a cylindrical cleaning brush 52 provided at one end thereof, and a pure water supply nozzle 5
3, an IPA supply nozzle 54, a mechanical chuck 55 (wafer holding unit) for holding a wafer, a cleaning liquid collecting cylinder 56, and a cleaning liquid discharging member (not shown). The mechanical chuck 55 is rotatable at a relatively high speed by a rotating mechanism (not shown), and has the same configuration as the wafer holding unit 26 described in the above embodiment. A plurality of wafer holding pins 55b concentrically projecting from the upper surface are provided. The cleaning liquid collecting cylinder 56 is for collecting the cleaning liquid scattered from the wafer surface and for preventing the cleaning liquid from bouncing off to the wafer surface, and is provided concentrically with the disk 55a surrounding the mechanical chuck 55. ing. A cleaning liquid discharge path (not shown) is formed below the cleaning liquid collecting cylinder 56.

The reversing units 36 and 38 have the same structure and function and have the structure shown in FIG. 5. The reversing unit 36 is disposed between the front surface scrubber unit 35 and the back surface scrubber unit 37. 38 is arranged in front of the back side scrubber unit 37. That is, it includes a lifting table 62, a plurality of wafer support pins 63 protruding on the same pitch circle on the upper surface thereof, a reversing chuck 61, and an operation mechanism 64 for the reversing chuck. The reversing chuck 61 is composed of a pair of chuck members 61a and 61b facing each other, and these chuck members can be approached / separated from each other by an operation mechanism 64 and can be reversed integrally. In addition, a concave portion for inserting and holding the outer peripheral portion of the wafer is formed at the distal end portion of the chuck members 61a and 61b facing each other. Further, a wafer support pin 63 of the elevating table 62 is located in a gap between the chuck members.

Next, a description will be given of a wafer cleaning method and operation of the scrubber cleaning apparatus. Step 1: An appropriate number of carriers (not shown) containing a plurality of wafers are placed on the cassette stage 32. In this cassette, wafers are stored in multiple stages vertically and horizontally. Step 2: The number of wafers in the carrier is detected by the wafer detection arm 31, and the detection result is input to the automatic control device. The automatic control device automatically controls each mechanism constituting the scrubber cleaning device based on the input signal.

Step 3: The indexer unit 33 moves along the cassette stage 32 and stops before a predetermined carrier. The indexer arm 33a moves up, then advances into the carrier and then retreats, so that the wafer at the top of the carrier is taken out by vacuum suction. Step 4: The indexer unit 33 moves along the cassette stage 32 and stops immediately before the transport unit 34. Next, positioning of the indexer unit 33 with respect to the transport unit 34 in the height direction is performed. Step 5: After the two arms of the transport unit 34 enter directly below the indexer arm 33a, the distance between the pair of members constituting the indexer arm 33a is increased, so that the wafer is transferred onto the arm. (Wafer delivery).

Step 6: The transport unit 34 moves,
It stops just before the surface scrubber unit 35. The arm of the transfer unit 34 rotates 90 °, advances toward the surface scrubber unit 35, stops at a predetermined position, and then descends, so that the wafer is vacuum-sucked to the vacuum chuck 45. The arm retreats, rotates 90 ° and stands by. Step 7: The wafer surface is cleaned.

Step 8: The transport unit 34 collects and holds the washed wafer in the reverse order of Step 7,
It moves and stops just before the reversing unit 36. The arm is set at a predetermined height, then rotates 90 °, advances toward the reversing unit 36, stops at a predetermined position and then descends, so that the wafer is placed on the wafer holding pins 63 of the reversing unit 36. Put on. The arm retreats, rotates 90 ° and stands by. Step 9: The reversing chucks 61a and 61b approach each other to hold the wafer. After the elevating table 62 is lowered, the reversing chucks 61a and 61b rotate by 180 ° (wafer reversal). Next, the wafers are collected in the transport unit 34 in the reverse order.

Step 10: The transport unit 34 moves and stops immediately before the back side scrubber unit 37. The arm is set at a predetermined height, then rotates 90 °, advances toward the back surface scrubber unit 37, stops at a predetermined position, and then descends, whereby the wafer is placed on the holding pin 55b. The arm retreats, 90 °
It turns and waits. Step 11: The back surface of the wafer is cleaned. Step 12: The transport unit 34 collects and holds the washed wafer in the reverse order of step 7, and
Hand over to 8. The transport unit 34 receives the wafer inverted by the reversing unit 38. Step 13: The transport unit 34 moves to the integrator unit 33, and its arm is set at a predetermined height.

Step 14: The wafer is delivered to the integrator arm 33a in the reverse order, and then the wafer is collected in the carrier. With the above steps, the cleaning of the uppermost wafer in the carrier is completed. Step 15: Hereinafter, the same operation is performed on the 2
The wafers in the third, third,... Stages are cleaned in the same manner as described above. Step 16: Next, the wafers are cleaned for the second, third,... Carriers.

[0041]

As described in detail above, the apparatus and method for cleaning scrubbers on the front and back surfaces of a wafer according to the present invention are constructed such that they are rinsed with an IPA solution after cleaning with pure water, so that the structure is simple. , By simple operation,
Regardless of the surface state (hydrophilicity, hydrophobicity) of the wafer, generation of watermarks on the front and back surfaces of the wafer is suppressed. Therefore, problems such as abnormal growth of SiO ₂ and pattern collapse in a later step are solved. Also, IPA
Since IPA remaining on the wafer surface after rinsing evaporates more quickly than water, the drying step can be performed in a shorter time than in the conventional method. Furthermore, according to the wafer scrubber cleaning device and the cleaning method according to the present invention, the back surface of the wafer can be cleaned by rotating the wafer at a relatively low speed, so that generation of particles from the wafer holding pins is suppressed. Therefore, there is an effect that contamination of the wafer can be prevented.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram showing an embodiment of the present invention,
(A) shows a wafer cleaning section at the former stage, and (b) shows a wafer cleaning section at the latter stage.

FIG. 2 is a schematic perspective view showing an embodiment of a scrubber cleaning device according to the present invention.

FIG. 3 is a perspective view of a surface scrubber unit (a front-stage wafer cleaning unit) constituting the apparatus of FIG. 2;

FIG. 4 is a perspective view of a back side scrubber unit (a wafer cleaning unit at a later stage) constituting the apparatus of FIG. 2;

FIG. 5 is a perspective view of a wafer reversing unit constituting the apparatus of FIG. 2;

[Explanation of symbols]

10: Wafer surface cleaning unit (wafer cleaning unit at the preceding stage),
11 cleaning brush, 12 pure water supply nozzle, 13 IP
A supply nozzle, 14: wafer rotating mechanism, 15: rotating shaft, 16: vacuum chuck, 17: movement trajectory (of the cleaning brush), 20: wafer back surface cleaning section (subsequent wafer cleaning section), 21: cleaning brush, 22 ... pure water supply nozzle, 23 ... IPA supply nozzle, 24 ... wafer rotating mechanism, 25 ... rotating shaft, 26 ... wafer holding part, 26a ... disk, 26b ... wafer holding pin, 26c ... body, 26d
... Round bar, 27 ... Back rinse nozzle (IPA supply nozzle), 28 ... Moving locus (of the cleaning brush), 31 ... Wafer detection arm, 32 ... Cassette stage, 33 ... Indexer unit, 33a ... Indexer arm, 34 ... Transport unit , 35 ... Surface scrubber unit, 36 ... Reversing unit, 37 ... Backside scrubber unit, 38 ... Reversing unit, 41 ... Brush arm, 42 ... Cleaning brush, 43 ...
Pure water supply nozzle, 44: IPA supply nozzle, 45: Vacuum chuck (vacuum suction disk), 46: Cleaning liquid collection cylinder,
47 ... outer cylinder, 48 ... cleaning liquid discharge member, 51 ... brush arm, 52 ... cleaning brush, 53 ... pure water supply nozzle, 54 ...
IPA supply nozzle, 55: mechanical chuck (wafer holding portion), 55a: disk, 55b: wafer holding pin, 56: cleaning liquid collecting cylinder, 61: reversing chuck, 61
a, 61b: chuck member, 62: elevating table, 63
… Wafer holding pin, 64… operation mechanism, W… wafer,
Wa: wafer front surface; Wb: wafer back surface.

Claims (2)

[Claims] 1. An operation of rotating a wafer at a high speed with a cleaning surface facing upward and along a horizontal direction, and pressing, rotating, and moving the wafer in the wafer diametric direction in parallel with the cleaning brush against the wafer cleaning surface. In the apparatus for cleaning the wafer cleaning surface by supplying a cleaning liquid to the central part of the cleaning surface of the wafer or the cleaning brush, a wafer cleaning unit is provided in two stages, Is a high-speed wafer rotation mechanism that vacuum-adsorbs the wafer concentrically with the rotation axis and rotates the wafer at high speed.
A rotating / moving mechanism for the cleaning brush, a pure water supply mechanism for supplying pure water as the cleaning liquid, and an IPA supply mechanism for supplying isopropyl alcohol as the cleaning liquid; and a wafer cleaning section at a later stage holds the wafer. A wafer rotation mechanism for rotating the wafer, a cleaning brush rotation / movement mechanism, a pure water supply mechanism for supplying pure water as the cleaning liquid,
I. Supplying isopropyl alcohol as the cleaning liquid
A wafer supply mechanism, wherein the wafer rotation mechanism comprises a wafer holding mechanism for holding the wafer at an appropriate interval directly above the upper end of the rotation shaft, abutting the outer periphery of the wafer, and holding the wafer concentrically with the rotation shaft. A scrubber cleaning device for a wafer, comprising: an IPA supply mechanism for supplying an isopropyl alcohol solution to a lower surface of the wafer. 2. A method for scrubbing a wafer using the apparatus according to claim 1, wherein in the wafer cleaning section at the first stage, the wafer surface is cleaned with pure water using a cleaning brush, and then the pure water is cleaned. After rinsing while supplying the wafer to the center of the wafer surface, rinsing while supplying the IPA liquid to the center of the wafer surface. In the subsequent wafer cleaning section, the back of the wafer is cleaned with pure water using a cleaning brush, Then, after rinsing while supplying pure water to the center of the wafer back surface, rinsing while supplying the IPA liquid to the center of the wafer back surface,
A wafer scrubber cleaning method characterized by continuously rinsing while supplying the IPA liquid to the center of the wafer surface during all the steps of pure water cleaning, pure water rinsing and IPA rinsing.