JP2016131186A - Spinner cleaning device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a spinner cleaning device capable of cleaning the entire surface even of a warped object to be cleaned uniformly and efficiently.SOLUTION: In a spinner cleaning device including cleaning means for cleaning the surface of an object to be cleaned, the cleaning means includes a cleaning arm, a cleaning member for cleaning the object to be cleaned, disposed at the tip of the cleaning arm, by coming into contact therewith, swinging means for swinging the cleaning arm so that the cleaning member passes through the center of rotation of a spinner table, moving means for moving the cleaning member forward and backward with respect to the object to be cleaned held on the spinner table, and a load meter for measuring the load when the cleaning member is brought into contact with the object to be cleaned by the moving means, and sending the load to control means. The control means controls the moving means, so that the cleaning member presses the object to be cleaned with a preset predetermined load.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a spinner cleaning apparatus for cleaning a disk-shaped object to be cleaned.

  A semiconductor chip on the surface of which an electronic circuit such as an IC or LSI is formed has a rectangular area defined by a plurality of division lines formed in a lattice shape on the surface of a disk-shaped semiconductor wafer, and the electronic circuit is divided into these rectangular areas. After the semiconductor wafer is formed, the semiconductor wafer is manufactured through a process of cutting along the planned dividing line.

  There are semiconductor chip types in which a plurality of protruding metal electrodes (bumps) are formed on the surface, and a resin film is formed by applying a resin as an insulating means. Some semiconductor chips are both provided on the surface.

  As the resin for coating the surface of the semiconductor wafer, a resin of a kind such as polyimide or epoxy is used. When such a resin is applied to the surface of the semiconductor wafer and dried, the shrinkage action of the resin during curing causes the semiconductor wafer to shrink. Deformation is likely to be warped to the resin side. This deformation occurs remarkably in the case where the resin is heated and applied and cured by cooling because the shrinkage force is large.

  In the case where the chuck table of a grinding apparatus for grinding a semiconductor wafer holds the semiconductor wafer by suction, the chuck table cannot be sucked and held if the semiconductor wafer is warped, and there is a problem that grinding cannot be performed. .

  In view of this, a semiconductor wafer warped during grinding is pressed against a chuck table of a grinding device by a flat plate pressing means to be sucked and held. By this method, a flat state is maintained during grinding, but when the semiconductor wafer is cleaned after processing, the warped semiconductor wafer must be cleaned.

  The surface side of the semiconductor wafer is always kept wet by supplying pure water or the like to prevent dirt from sticking during processing or transportation. Spray to remove dirt on the surface side and dry.

  In this case, even if the semiconductor wafer is warped, it can be cleaned without any problem. However, if the surface is contaminated for some reason or if the surface is cleaned with a chemical, In some cases, the semiconductor wafer may be cleaned by bringing a cleaning member into contact with a pen brush disposed at the tip.

  When the surface of the semiconductor wafer is flat, the cleaning member can be uniformly brought into contact with the surface of the semiconductor wafer by keeping the height of the pen brush constant, and no cleaning unevenness or cleaning residue occurs.

Japanese Patent Application Laid-Open No. 2000-173954

  However, in the case of pen brush cleaning, if the semiconductor wafer is warped, the pen brush cannot follow the warpage, so that there is a problem that uneven cleaning occurs, or if the warpage is significant, a portion that cannot be cleaned is generated. is there.

  The present invention has been made in view of these points, and an object of the present invention is to provide a spinner cleaning apparatus capable of cleaning the entire surface evenly and efficiently even with a warped object to be cleaned. .

  According to the present invention, a spinner table that can rotate while holding an object to be cleaned, a cleaning liquid supply unit that supplies a cleaning liquid to the object to be cleaned held on the spinner table, and a cleaning unit that cleans the surface of the object to be cleaned. A spinner cleaning apparatus comprising: a spinner table; a cleaning liquid supply means; and a control means for controlling the cleaning means, wherein the cleaning means is disposed at a cleaning arm and a tip portion of the cleaning arm. A cleaning member that comes into contact with an object to be cleaned and cleans the cleaning object, a swinging means that swings the cleaning arm so that the cleaning member passes through the rotation center of the spinner table, and the cleaning member attached to the spinner table Advancing / retreating means for advancing / retreating the object to be cleaned, and a load meter for measuring the load of the cleaning member contacting the object to be cleaned by the advancing / retreating means and sending the load to the control means, the control means comprising: , Spinner cleaning apparatus characterized by cleaning member controls the 該進 withdrawal means so as to press the object to be cleaned with a predetermined load set in advance is provided.

  Preferably, the advancing / retreating means includes a piston having the cleaning member mounted at a tip thereof, a cylinder that moves the piston up and down, an air supply path that communicates with an air supply source that supplies air to the cylinder, and the air supply Pressure adjusting means for adjusting the pressure of the air supplied to the cylinder disposed in the path, and the control means controls the pressure adjusting means so that the measurement result of the load meter becomes a preset load value. Control.

  Preferably, the spinner table includes three or more outer periphery holding members that move in the radial direction of the object to be cleaned to hold the outer periphery of the object to be cleaned and form a space below the object to be cleaned. The cleaning liquid supply means supplies the cleaning liquid to the front surface side and the back surface side of the object to be cleaned held by the spinner table.

  According to the spinner cleaning apparatus of the present invention, the cleaning member is swung by the swinging means while pressing the object to be cleaned with a predetermined load while supplying the cleaning liquid from the cleaning liquid supply means. But the entire surface can be cleaned uniformly and efficiently.

It is a perspective view of a cutting device provided with a spinner cleaning device of an embodiment of the present invention. 1 is a perspective view of a spinner cleaning apparatus according to an embodiment of the present invention. It is a figure which shows typically the attachment structure of a cleaning member. It is a schematic diagram which shows the adjustment means of the pressing force of a cleaning member. It is a top view of the spinner cleaning device concerning an embodiment. It is sectional drawing explaining the injection method of a washing | cleaning liquid.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Referring to FIG. 1, a perspective view of a cutting device provided with a spinner cleaning device according to an embodiment of the present invention is shown. The cutting device 2 is a cutting device for edge trimming or a cutting device for half cut that removes a chamfered portion formed on the outer peripheral edge of a wafer.

  The cutting device 2 includes a base 4. A rectangular opening 4a is formed at the front corner of the base 4, and a cassette mounting table 6 is installed in the opening 4a so as to be movable up and down. On the upper surface of the cassette mounting table 6, a rectangular parallelepiped cassette 8 that houses a plurality of wafers is mounted. In FIG. 1, only the outline of the cassette 8 is shown for convenience of explanation.

  A rectangular opening 4b that is long in the X-axis direction (front-rear direction and processing feed direction) is formed on the side of the cassette mounting table 6. In this opening 4b, an X-axis moving table 10, an X-axis moving mechanism (processing feed means) (not shown) for moving the X-axis moving table 10 in the X-axis direction, and a dustproof and splash-proof cover that covers the X-axis moving mechanism 12 is provided.

  The X-axis movement mechanism includes a pair of X-axis guide rails (not shown) parallel to the X-axis direction, and the X-axis movement table 10 is slidably installed on the X-axis guide rails. A nut portion (not shown) is provided on the lower surface side of the X-axis moving table 10, and an X-axis ball screw (not shown) parallel to the X-axis guide rail is screwed to the nut portion. .

  An X-axis pulse motor (not shown) is connected to one end of the X-axis ball screw. By rotating the X-axis ball screw with the X-axis pulse motor, the X-axis moving table 10 moves in the X-axis direction along the X-axis guide rail.

  A chuck table 14 for sucking and holding a workpiece (not shown) such as a wafer is provided above the X-axis moving table 10. The chuck table 14 is connected to a rotation drive source (not shown) such as a motor, and rotates around a rotation axis parallel to the Z-axis direction (vertical direction, vertical direction).

  The surface (upper surface) of the chuck table 14 is a holding surface 14a for sucking and holding the workpiece. The holding surface 14 a is connected to a suction source (not shown) through a flow path (not shown) formed inside the chuck table 14.

  On the upper surface of the base 4, a gate-type support structure 20 that supports the cutting units (cutting means) 18a and 18b is disposed so as to straddle the opening 4b. Two sets of cutting unit moving mechanisms 22 for moving the cutting units 18a and 18b in the Y-axis direction (left-right direction and index feed direction) and the Z-axis direction are provided on the upper front surface of the support structure 20.

  Each cutting unit moving mechanism 22 includes a pair of Y-axis guide rails 24 arranged in front of the support structure 20 and parallel to the Y-axis direction. On the Y-axis guide rail 24, a Y-axis moving plate 26 constituting each cutting unit moving mechanism 22 is slidably installed.

  A nut portion (not shown) is provided on the rear surface side (rear surface side) of each Y-axis moving plate 26, and a Y-axis ball screw 28 parallel to the Y-axis guide rail 24 is screwed to each nut portion. Are combined.

  A Y-axis pulse motor 30 is connected to one end of each Y-axis ball screw 28. If the Y-axis ball screw 28 is rotated by the Y-axis pulse motor 30, the Y-axis moving plate 26 moves in the Y-axis direction along the Y-axis guide rail 24.

  A pair of Z-axis guide rails 32 parallel to the Z-axis direction are provided on the surface (front surface) of each Y-axis moving plate 26. A Z-axis moving plate 34 is slidably installed on the Z-axis guide rail 32.

  A nut portion (not shown) is provided on the back surface side (rear surface side) of each Z-axis moving plate 34, and a Z-axis ball screw 36 parallel to the Z-axis guide rail 32 is screwed to each nut portion. Are combined.

  A Z-axis pulse motor 38 is connected to one end of each Z-axis ball screw 36. When the Z-axis ball screw 36 is rotated by the Z-axis pulse motor 38, the Z-axis moving plate 34 moves in the Z-axis direction along the Z-axis guide rail 32.

  Cutting units 18 a and 18 b for cutting a workpiece are provided at the lower part of each Z-axis moving plate 34. A camera (imaging means) 40 that captures an image of the upper surface side of the workpiece is installed at a position adjacent to the cutting unit 18a.

  Each of the cutting units 18a and 18b includes an annular cutting blade 44 attached to one end side of a spindle that constitutes a rotation axis parallel to the Y-axis direction. A rotational drive source (not shown) such as a motor is connected to the other end of the spindle, and rotates the cutting blade 44 mounted on the spindle.

  A circular opening 4c is formed at a position opposite to the opening 4a with respect to the opening 4b. A spinner cleaning device (spinner cleaning means) 46 for cleaning the workpiece after cutting is provided in the opening 4c.

  Referring to FIG. 2, a perspective view of the spinner cleaning device 46 is shown. The spinner cleaning device 46 includes a spinner table 48 that holds a workpiece, and the spinner table 48 is rotatably arranged by a motor 50.

  The motor 50 is moved up and down by an elevating mechanism 52 composed of an air cylinder 54 and a piston 56, and a spinner table 48 is moved up to place an object to be cleaned such as a wafer on the spinner table, and the object to be cleaned is spun. It can be positioned between the lowered position to be cleaned.

  Three outer peripheral edge holding members 58 are disposed on the outer periphery of the spinner table 48. Each outer peripheral edge holding member 58 is movable along a moving groove 60 formed so as to extend in the radial direction of the spinner table 48, and the outer peripheral edge holding member 58 is moved in accordance with the diameter of the object to be cleaned. The notch 59 of the peripheral holding member 58 engages with the outer peripheral edge of the object to be cleaned, and holds the object to be cleaned from the surface 48 a of the spinner table 48.

  At the center of the surface 48a of the spinner table 48, a back surface side cleaning liquid injection nozzle 62 that injects the cleaning liquid onto the back surface side of the object to be cleaned is formed. Reference numeral 64 denotes cleaning means, and a motor 66 of the cleaning means 64 is attached to the side surface of the spinner table 48.

  A cylindrical member 68 is connected to the output shaft 66 a of the motor 66, and the base end portion of the cleaning arm 70 is fixed to the cylindrical member 68. The motor 66, the cylindrical member 68, and the cleaning arm 70 constitute swing means.

  As shown in FIG. 3, an air cylinder 72 is attached to the tip of the cleaning arm 70, and a cleaning member 78 such as a cleaning pad is attached to the tip of the piston 74 of the air cylinder 72 via a load meter 76. It has been. A surface-side cleaning liquid jet nozzle 80 connected to a cleaning liquid supply source 88 (see FIG. 6) is attached to the side surface of the air cylinder 72.

  As shown in FIG. 4, the air cylinder 72 communicates with an air supply source 82 via an air supply path 81, and a pressure adjusting means 84 is interposed in the air supply path 81. The load meter 76 is connected to the control unit 86, and the control unit 86 controls the pressure adjusting unit 84 so that the measurement result of the load meter 76 becomes a preset load value.

  Accordingly, even when the object to be cleaned 11 is warped, the cleaning member 78 is pressed against the surface of the object to be cleaned 11 with a predetermined load value to clean the surface of the object to be cleaned 11. A piston 74 with a cleaning member 78 attached to the tip, an air cylinder 72 that moves the piston 74 up and down, an air supply path 81 that supplies air to the air cylinder 72, an air supply source 82, and an air supply path 81 The provided pressure adjusting means 84 constitutes an advancing / retreating means for advancing and retracting the cleaning member 78 with respect to the object to be cleaned 11 held by the spinner table 48.

  As shown in FIG. 5, the spinner table 48 holding the object 11 to be cleaned is rotated in the direction of the arrow R 1, the cleaning liquid is sprayed from the surface side cleaning liquid spray nozzle 80, and the cleaning member 78 is further applied to the surface of the object 11 to be cleaned. The object to be cleaned 11 is cleaned while being swung by the arm 70 so that the cleaning member 78 passes through the center of rotation of the spinner table 48 as shown by an arrow R2 by being brought into contact.

  When cleaning the object 11 to be cleaned, as shown in FIG. 6, the notch 59 of the outer peripheral edge holding member 58 engages with the outer periphery of the object 11 to form a space below the object 11 to be cleaned. Therefore, in addition to injecting the cleaning liquid from the front surface side cleaning liquid spray nozzle 80 onto the surface of the target object 11 to be cleaned, the back surface side cleaning liquid spray nozzle 62 formed in the central portion of the spinner table 48 is used to clean the target object 11. The cleaning liquid can also be sprayed onto the back surface of the substrate 11 to clean both the front and back surfaces of the object 11 to be cleaned at a time.

  During the cleaning of the object 11 to be cleaned, the cleaning member 78 performs cleaning while pressing the object 11 to be cleaned with a predetermined load set in advance, so that the entire surface of the object to be cleaned is evenly and efficiently cleaned. be able to.

  In the above-described embodiment, the example in which the spinner cleaning apparatus of the present invention is applied to a cutting apparatus has been described. However, the spinner cleaning apparatus of the present invention is not limited to this, and other processes such as a grinding apparatus and a polishing apparatus are performed. The same applies to the device.

2 Cutting device 14 Chuck table 18a, 18b Cutting unit 46 Spinner cleaning device 48 Spinner table 58 Outer peripheral edge holding member 62 Back surface side cleaning liquid jet nozzle 64 Cleaning means 66 Motor 70 Cleaning arm 72 Air cylinder 74 Piston 76 Load meter 78 Cleaning member 80 Surface Side cleaning liquid injection nozzle 81 Air supply path 84 Pressure adjusting means

Claims (3)

A spinner table that can rotate while holding an object to be cleaned, a cleaning liquid supply unit that supplies a cleaning liquid to the object to be cleaned held on the spinner table, a cleaning unit that cleans the surface of the object to be cleaned, the spinner table, A spinner cleaning apparatus comprising: the cleaning liquid supply means; and a control means for controlling the cleaning means,
The cleaning means includes a cleaning arm, a cleaning member for cleaning the cleaning object in contact with an object to be cleaned disposed at a tip portion of the cleaning arm, and the cleaning member passing through the rotation center of the spinner table. Swing means for swinging the cleaning arm, advance / retreat means for moving the cleaning member forward / backward with respect to the object to be cleaned held by the spinner table, and load by which the cleaning member contacts the object to be cleaned by the advance / retreat means A load meter that measures and sends to the control means,
The spinner cleaning apparatus, wherein the control means controls the advance / retreat means so that the cleaning member presses the object to be cleaned with a predetermined load set in advance. The advancing / retreating means is disposed in the air supply path, a piston having the cleaning member attached to the tip thereof, a cylinder that moves the piston up and down, an air supply path that communicates with an air supply source that supplies air to the cylinder, and the air supply path. And pressure adjusting means for adjusting the pressure of air supplied to the cylinder,
2. The spinner cleaning apparatus according to claim 1, wherein the control means controls the pressure adjusting means so that a measurement result of the load meter becomes a preset load value. The spinner table includes three or more outer periphery holding members that move in the radial direction of the object to be cleaned to hold the outer periphery of the object to be cleaned and form a space below the object to be cleaned.
2. The spinner cleaning apparatus according to claim 1, wherein the cleaning liquid supply means supplies the cleaning liquid to the front surface side and the back surface side of the object to be cleaned held by the spinner table.