JP6403564B2 - Cleaning device - Google Patents

Cleaning device Download PDF

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JP6403564B2
JP6403564B2 JP2014252211A JP2014252211A JP6403564B2 JP 6403564 B2 JP6403564 B2 JP 6403564B2 JP 2014252211 A JP2014252211 A JP 2014252211A JP 2014252211 A JP2014252211 A JP 2014252211A JP 6403564 B2 JP6403564 B2 JP 6403564B2
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cleaning
cleaned
rotating
cleaning member
axis
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JP2016115776A (en
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浩吉 湊
浩吉 湊
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Disco Corp
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Disco Corp
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Description

本発明は、円盤状の被洗浄物を洗浄する洗浄装置に関する。   The present invention relates to a cleaning apparatus for cleaning a disk-shaped object to be cleaned.

ストリートと呼ばれる分割予定ラインで区画された表面側の複数の領域に、それぞれIC等のデバイスが形成された半導体ウェーハは、例えば、切削ブレードを備える切削装置で各デバイスに対応する複数の半導体チップへと分割され、電子機器等に組み込まれる。   For example, a semiconductor wafer in which devices such as ICs are formed in a plurality of areas on the surface side partitioned by dividing lines called streets is converted into a plurality of semiconductor chips corresponding to each device by a cutting apparatus equipped with a cutting blade, for example. And is incorporated into an electronic device or the like.

上述した半導体チップの絶縁性を確保するために、半導体ウェーハの表面(又は裏面)を樹脂膜で被覆することがある(例えば、特許文献1参照)。この樹脂膜は、例えば、原料となる液状の樹脂を半導体ウェーハの表面(又は裏面)に塗布し、硬化させることによって形成される。   In order to ensure the insulating properties of the semiconductor chip described above, the front surface (or back surface) of the semiconductor wafer may be covered with a resin film (see, for example, Patent Document 1). This resin film is formed, for example, by applying a liquid resin as a raw material to the front surface (or back surface) of the semiconductor wafer and curing it.

特開2000−173954号公報Japanese Patent Application Laid-Open No. 2000-173954

ところで、切削装置や研削装置に代表される加工装置では、加工時に発生する異物が半導体ウェーハに固着しないように、純水等を絶えず供給して半導体ウェーハの上面側を濡れた状態に保っている。一方、保持機構であるチャックテーブルと接触する半導体ウェーハの下面側を濡れた状態に保つのは容易でない。   By the way, in a processing device represented by a cutting device or a grinding device, pure water or the like is constantly supplied to keep the upper surface side of the semiconductor wafer wet so that foreign matter generated during processing does not adhere to the semiconductor wafer. . On the other hand, it is not easy to keep the lower surface side of the semiconductor wafer in contact with the chuck table as a holding mechanism wet.

そのため、加工時に露出しない半導体ウェーハの下面側には異物が固着し易くなっていた。このような経緯から、半導体ウェーハの洗浄時には、円筒状のスポンジブラシを回転させながら半導体ウェーハの下面に接触させている。これにより、半導体ウェーハの下面に固着した異物をスポンジブラシで擦って除去できる。   For this reason, foreign substances are likely to adhere to the lower surface side of the semiconductor wafer that is not exposed during processing. For this reason, when cleaning the semiconductor wafer, the cylindrical sponge brush is rotated and brought into contact with the lower surface of the semiconductor wafer. Thereby, the foreign matter fixed to the lower surface of the semiconductor wafer can be removed by rubbing with the sponge brush.

しかしながら、液状の樹脂を塗布して硬化させる上述の方法で半導体ウェーハの表面(又は裏面)に樹脂膜を形成すると、樹脂の硬化に伴う収縮作用によって半導体ウェーハが反ってしまう。その結果、スポンジブラシで下面側を十分に擦ることができなくなって、半導体ウェーハに洗い残しが発生していた。   However, when a resin film is formed on the front surface (or back surface) of the semiconductor wafer by the above-described method of applying and curing a liquid resin, the semiconductor wafer is warped by a shrinking action accompanying the curing of the resin. As a result, the lower surface side could not be sufficiently rubbed with the sponge brush, and the semiconductor wafer was left unwashed.

本発明はかかる問題点に鑑みてなされたものであり、その目的とするところは、被洗浄物が反っている場合にも下面側を適切に洗浄できる洗浄装置を提供することである。   The present invention has been made in view of such problems, and an object of the present invention is to provide a cleaning device capable of appropriately cleaning the lower surface side even when an object to be cleaned is warped.

本発明によれば、円盤状の被洗浄物の下面側を洗浄する洗浄装置であって、被洗浄物を保持して回転させる回転保持手段と、被洗浄物の下面側を洗浄する洗浄手段と、を備え、該回転保持手段は、被洗浄物の外周縁に接触して被洗浄物を保持し鉛直方向に平行な回転軸の周りに回転する3個以上の回転ローラと、該回転ローラのいずれかに連結され対応する該回転ローラを回転させる回転ローラ駆動手段と、該回転ローラを被洗浄物の大きさに合わせて水平方向に移動させる水平移動手段と、を備え、該洗浄手段は、所定の厚みの弾性部材で被洗浄物の半径以上の長さに形成され被洗浄物の径方向に平行な回転軸の周りに回転する円筒状の洗浄部材と、該洗浄部材に洗浄液を供給する洗浄液供給手段と、該洗浄部材の一端側に連結され該洗浄部材を回転させる洗浄部材回転モータと、該洗浄部材の他端側を支持する軸受け部材と、該洗浄部材回転モータと該軸受け部材とを下方から支持する支持部材と、該支持部材の下方に接続され、該洗浄部材の一端側と他端側とが被洗浄物の下面に合わせて上下動するように該支持部材を支えるとともに、該洗浄部材の全体を上下に移動させる上下動手段と、を備え、該上下動手段は、該支持部材の一端と他端との間の接続部に接続されたピストンと、該ピストンを上下動させるシリンダと、該支持部材の該接続部と一端との間又は該支持部材の該接続部と他端との間に接続され、該洗浄部材の一端及び他端の上下動をガイドするガイド部材と、を備え、該上下動手段によって、被洗浄物の中心から外周縁に至る半径に対応する被洗浄物の下面側に該洗浄部材を接触させることで、被洗浄物の下面側を洗浄し、該洗浄部材の一端側と他端側とは、該接続部を支点に上下動することを特徴とする洗浄装置が提供される。 According to the present invention, there is provided a cleaning device for cleaning the lower surface side of a disk-shaped object to be cleaned, the rotation holding means for holding and rotating the object to be cleaned, and the cleaning means for cleaning the lower surface side of the object to be cleaned. The rotation holding means includes three or more rotating rollers that contact the outer peripheral edge of the object to be cleaned, hold the object to be cleaned, and rotate about a rotation axis parallel to the vertical direction; and comprising a rotary roller drive means for rotating the rotating roller corresponding coupled to either a horizontal moving means for moving in a horizontal direction in accordance with the rotating roller to the size of the object to be cleaned, and the cleaning means, A cylindrical cleaning member formed of an elastic member having a predetermined thickness and having a length equal to or larger than the radius of the object to be cleaned and rotating around a rotation axis parallel to the radial direction of the object to be cleaned, and a cleaning liquid is supplied to the cleaning member The cleaning liquid supply means and the cleaning member connected to one end side of the cleaning member A cleaning member rotating motor for rotating the material, a bearing member for supporting the other end of the cleaning member, a supporting member for supporting the cleaning member rotating motor and the bearing member from below, and a connection below the supporting member And a vertical movement means for supporting the support member so that one end side and the other end side of the cleaning member move up and down in accordance with the lower surface of the object to be cleaned, and move the entire cleaning member up and down. The vertical movement means includes a piston connected to a connection part between one end and the other end of the support member, a cylinder for moving the piston up and down, and a connection between the connection part and one end of the support member. Or a guide member that is connected between the connection portion and the other end of the support member and guides the vertical movement of the one end and the other end of the cleaning member, and the center of the object to be cleaned by the vertical movement means. The bottom surface of the object to be cleaned corresponding to the radius from the outer periphery to the outer periphery In the contacting said cleaning member, washed lower surface of the object to be cleaned, the one end and the other end of said cleaning member, a cleaning apparatus characterized by vertically moving the connection portion as a fulcrum Provided.

本発明に係る洗浄装置は、円筒状の洗浄部材の一端側と他端側とが被洗浄物の下面に合わせて上下動するように支持部材を支える上下動手段を備えるので、被洗浄物が反っている場合にも、上下動手段によって、被洗浄物の中心から外周縁に至る半径に対応する被洗浄物の下面側に洗浄部材を接触させて、被洗浄物の下面側を適切に洗浄できる。   The cleaning apparatus according to the present invention includes vertical movement means for supporting the support member so that one end side and the other end side of the cylindrical cleaning member move up and down in accordance with the lower surface of the object to be cleaned. Even when warped, the cleaning member is brought into contact with the lower surface side of the object to be cleaned corresponding to the radius from the center of the object to be cleaned to the outer peripheral edge, and the lower surface side of the object to be cleaned is appropriately cleaned by the vertical movement means. it can.

洗浄装置を含む切削装置を模式的に示す図である。It is a figure which shows typically the cutting device containing a washing | cleaning apparatus. 洗浄装置を模式的に示す平面図である。It is a top view which shows a washing | cleaning apparatus typically. 図3(A)は、保持ユニットの構成例を模式的に示す側面図であり、図3(B)は、洗浄機構の構成例を模式的に示す図である。FIG. 3A is a side view schematically illustrating a configuration example of the holding unit, and FIG. 3B is a diagram schematically illustrating a configuration example of the cleaning mechanism. 板状物の下面が洗浄される様子を模式的に示す側面図である。It is a side view which shows a mode that the lower surface of a plate-shaped object is wash | cleaned.

添付図面を参照して、本発明の実施形態について説明する。はじめに、本実施形態に係る洗浄装置を含む加工装置の全体像を説明する。図1は、本実施形態に係る洗浄装置を含む切削装置を模式的に示す図である。なお、本実施形態では、洗浄装置を切削装置に設けているが、研削装置等の別の加工装置に洗浄装置を設けても良い。もちろん、洗浄装置を単独で用いることもできる。   Embodiments of the present invention will be described with reference to the accompanying drawings. First, an overall image of a processing apparatus including a cleaning apparatus according to the present embodiment will be described. FIG. 1 is a diagram schematically showing a cutting device including a cleaning device according to the present embodiment. In the present embodiment, the cleaning device is provided in the cutting device, but the cleaning device may be provided in another processing device such as a grinding device. Of course, the cleaning device can be used alone.

図1に示すように、切削装置2は、各構造を支持する基台4を備えている。基台4の前方の角部には、平面視で矩形状の開口4aが形成されており、この開口4a内には、カセット載置台6が昇降可能に設置されている。カセット載置台6の上面には、複数の板状物(被洗浄物)11を収容する直方体状のカセット8が載置される。なお、図1では、説明の便宜上、カセット8の輪郭のみを示している。   As shown in FIG. 1, the cutting device 2 includes a base 4 that supports each structure. A rectangular opening 4a is formed in the front corner of the base 4 in a plan view, and a cassette mounting table 6 is installed in the opening 4a so as to be movable up and down. On the upper surface of the cassette mounting table 6, a rectangular parallelepiped cassette 8 that houses a plurality of plate-like objects (objects to be cleaned) 11 is placed. In FIG. 1, only the outline of the cassette 8 is shown for convenience of explanation.

板状物11は、例えば、シリコン等の半導体材料で略円盤状に形成されており、その表面側は、中央のデバイス領域と、デバイス領域を囲む外周余剰領域とに分けられている。デバイス領域は、格子状に配列されたストリート(分割予定ライン)でさらに複数の領域に区画されており、各領域にはIC等のデバイスが形成されている。なお、本実施形態の板状物11は、上方に露出する表面側を樹脂膜(不図示)で被覆され、下(裏面側)に凸の形状に反っている(図3(A)等参照)。   The plate-like object 11 is formed in a substantially disc shape with a semiconductor material such as silicon, for example, and the surface side is divided into a central device region and an outer peripheral surplus region surrounding the device region. The device region is further divided into a plurality of regions by streets (division lines) arranged in a grid pattern, and devices such as ICs are formed in each region. In addition, the plate-like object 11 of the present embodiment is covered with a resin film (not shown) on the surface side exposed upward, and warps in a convex shape on the bottom (back side) (see FIG. 3A, etc.). ).

カセット載置台6の側方には、X軸方向(前後方向)に長い矩形状の開口4bが形成されている。この開口4b内には、X軸移動テーブル10、X軸移動テーブル10をX軸方向に移動させるX軸移動機構(不図示)、及びX軸移動機構を覆う防塵防滴カバー12が設けられている。   A rectangular opening 4b that is long in the X-axis direction (front-rear direction) is formed on the side of the cassette mounting table 6. In this opening 4b, there are provided an X-axis moving table 10, an X-axis moving mechanism (not shown) for moving the X-axis moving table 10 in the X-axis direction, and a dustproof and splash-proof cover 12 that covers the X-axis moving mechanism. Yes.

X軸移動機構は、X軸方向に平行な一対のX軸ガイドレール(不図示)を備えており、X軸ガイドレールには、X軸移動テーブル10がスライド可能に設置されている。X軸移動テーブル10の下面側には、ナット部(不図示)が設けられており、このナット部には、X軸ガイドレールと平行なX軸ボールネジ(不図示)が螺合されている。   The X-axis movement mechanism includes a pair of X-axis guide rails (not shown) parallel to the X-axis direction, and the X-axis movement table 10 is slidably installed on the X-axis guide rails. A nut portion (not shown) is provided on the lower surface side of the X-axis moving table 10, and an X-axis ball screw (not shown) parallel to the X-axis guide rail is screwed to the nut portion.

X軸ボールネジの一端部には、X軸パルスモータ(不図示)が連結されている。X軸パルスモータでX軸ボールネジを回転させることで、X軸移動テーブル10は、X軸ガイドレールに沿ってX軸方向に移動する。   An X-axis pulse motor (not shown) is connected to one end of the X-axis ball screw. By rotating the X-axis ball screw with the X-axis pulse motor, the X-axis moving table 10 moves in the X-axis direction along the X-axis guide rail.

X軸移動テーブル10の上方には、板状物11を吸引保持するチャックテーブル14が設けられている。チャックテーブル14は、モータ等の回転駆動源(不図示)と連結されており、Z軸方向(鉛直方向)に平行な回転軸の周りに回転する。また、X軸移動テーブル10をX軸移動機構でX軸方向に移動させれば、チャックテーブル14は加工送りされる。   A chuck table 14 that sucks and holds the plate-like object 11 is provided above the X-axis moving table 10. The chuck table 14 is connected to a rotation drive source (not shown) such as a motor, and rotates around a rotation axis parallel to the Z-axis direction (vertical direction). If the X-axis moving table 10 is moved in the X-axis direction by the X-axis moving mechanism, the chuck table 14 is processed and fed.

チャックテーブル14の表面(上面)は、板状物11を吸引保持する保持面14aとなっている。この保持面14aは、チャックテーブル14の内部に形成された流路(不図示)を通じて吸引源(不図示)と接続されている。   The surface (upper surface) of the chuck table 14 is a holding surface 14 a for sucking and holding the plate-like object 11. The holding surface 14 a is connected to a suction source (not shown) through a flow path (not shown) formed inside the chuck table 14.

開口4bと近接する位置には、上述した板状物11をチャックテーブル14へと搬送する搬送機構(不図示)が設けられている。搬送機構で搬送された板状物11は、例えば、表面側が上方に露出するようにチャックテーブル14に載置される。   A transport mechanism (not shown) for transporting the plate-like object 11 described above to the chuck table 14 is provided at a position close to the opening 4b. The plate-like object 11 transported by the transport mechanism is placed on the chuck table 14 so that the surface side is exposed upward, for example.

基台4の上面には、2組の切削ユニット18を支持する門型の支持構造20が、開口4bを跨ぐように配置されている。支持構造20の前面上部には、各切削ユニット18をY軸方向(左右方向)及びZ軸方向に移動させる2組の切削ユニット移動機構22が設けられている。   On the upper surface of the base 4, a gate-type support structure 20 that supports two sets of cutting units 18 is disposed so as to straddle the opening 4 b. Two sets of cutting unit moving mechanisms 22 for moving each cutting unit 18 in the Y-axis direction (left-right direction) and the Z-axis direction are provided on the upper front surface of the support structure 20.

各切削ユニット移動機構22は、支持構造20の前面に配置されY軸方向に平行な一対のY軸ガイドレール24を共通に備えている。Y軸ガイドレール24には、各切削ユニット移動機構22を構成するY軸移動プレート26がスライド可能に設置されている。   Each cutting unit moving mechanism 22 includes a pair of Y-axis guide rails 24 arranged in front of the support structure 20 and parallel to the Y-axis direction. On the Y-axis guide rail 24, a Y-axis moving plate 26 constituting each cutting unit moving mechanism 22 is slidably installed.

各Y軸移動プレート26の裏面側(後面側)には、ナット部(不図示)が設けられており、このナット部には、Y軸ガイドレール24と平行なY軸ボールネジ28がそれぞれ螺合されている。各Y軸ボールネジ28の一端部には、Y軸パルスモータ30が連結されている。Y軸パルスモータ30でY軸ボールネジ28を回転させれば、Y軸移動プレート26は、Y軸ガイドレール24に沿ってY軸方向に移動する。   A nut portion (not shown) is provided on the rear surface side (rear surface side) of each Y-axis moving plate 26, and a Y-axis ball screw 28 parallel to the Y-axis guide rail 24 is screwed into each nut portion. Has been. A Y-axis pulse motor 30 is connected to one end of each Y-axis ball screw 28. If the Y-axis ball screw 28 is rotated by the Y-axis pulse motor 30, the Y-axis moving plate 26 moves in the Y-axis direction along the Y-axis guide rail 24.

各Y軸移動プレート26の表面(前面)には、Z軸方向に平行な一対のZ軸ガイドレール32が設けられている。Z軸ガイドレール32には、Z軸移動プレート34がスライド可能に設置されている。   A pair of Z-axis guide rails 32 parallel to the Z-axis direction are provided on the surface (front surface) of each Y-axis moving plate 26. A Z-axis moving plate 34 is slidably installed on the Z-axis guide rail 32.

各Z軸移動プレート34の裏面側(後面側)には、ナット部(不図示)が設けられており、このナット部には、Z軸ガイドレール32と平行なZ軸ボールネジ36がそれぞれ螺合されている。各Z軸ボールネジ36の一端部には、Z軸パルスモータ38が連結されている。Z軸パルスモータ38でZ軸ボールネジ36を回転させれば、Z軸移動プレート34は、Z軸ガイドレール32に沿ってZ軸方向に移動する。   A nut portion (not shown) is provided on the back surface side (rear surface side) of each Z-axis moving plate 34, and a Z-axis ball screw 36 parallel to the Z-axis guide rail 32 is screwed to each nut portion. Has been. A Z-axis pulse motor 38 is connected to one end of each Z-axis ball screw 36. When the Z-axis ball screw 36 is rotated by the Z-axis pulse motor 38, the Z-axis moving plate 34 moves in the Z-axis direction along the Z-axis guide rail 32.

各Z軸移動プレート34の下部には、板状物11を切削する切削ユニット18が設けられている。また、切削ユニット18と隣接する位置には、板状物11を撮像するカメラ40が設置されている。各切削ユニット移動機構22でY軸移動プレート26をY軸方向に移動させれば、切削ユニット18及びカメラ40は割り出し送りされ、Z軸移動プレート34をZ軸方向に移動させれば、切削ユニット18及びカメラ40は昇降する。   A cutting unit 18 for cutting the plate-like object 11 is provided below each Z-axis moving plate 34. Further, a camera 40 that images the plate-like object 11 is installed at a position adjacent to the cutting unit 18. If the Y-axis moving plate 26 is moved in the Y-axis direction by each cutting unit moving mechanism 22, the cutting unit 18 and the camera 40 are indexed, and if the Z-axis moving plate 34 is moved in the Z-axis direction, the cutting unit is moved. 18 and the camera 40 move up and down.

切削ユニット18は、Y軸方向に平行な回転軸を構成するスピンドル(不図示)の一端側(先端部)に装着された円環状の切削ブレード42を備えている。スピンドルの他端側にはモータ等の回転駆動源(不図示)が連結されており、スピンドルに装着された切削ブレード42を回転させる。   The cutting unit 18 includes an annular cutting blade 42 attached to one end side (tip portion) of a spindle (not shown) that constitutes a rotation axis parallel to the Y-axis direction. A rotational drive source (not shown) such as a motor is connected to the other end side of the spindle, and rotates the cutting blade 42 attached to the spindle.

開口4bに対して開口4aと反対側の位置には、平面視で矩形状の開口4cが形成されている。開口4c内には、切削後の板状物11を洗浄する洗浄装置44が設けられている。図2は、本実施形態に係る洗浄装置44の構成例を模式的に示す平面図である。   A rectangular opening 4c in a plan view is formed at a position opposite to the opening 4a with respect to the opening 4b. A cleaning device 44 for cleaning the plate-like object 11 after cutting is provided in the opening 4c. FIG. 2 is a plan view schematically showing a configuration example of the cleaning device 44 according to the present embodiment.

図2に示すように、洗浄装置44は、板状物11を保持して回転させる回転保持機構(回転保持手段)50を備えている。回転保持機構50は、互いの長手方向に対して垂直な方向に離間した2組の保持ユニット50a,50bを含む。保持ユニット50aと保持ユニット50bとの間には、板状物11の下面側を洗浄する洗浄機構(洗浄手段)52が配置されている。   As shown in FIG. 2, the cleaning device 44 includes a rotation holding mechanism (rotation holding means) 50 that holds and rotates the plate-like object 11. The rotation holding mechanism 50 includes two sets of holding units 50a and 50b that are separated in a direction perpendicular to the longitudinal direction of each other. A cleaning mechanism (cleaning means) 52 that cleans the lower surface side of the plate-like object 11 is disposed between the holding unit 50a and the holding unit 50b.

図3(A)は、保持ユニット50aの構成例を模式的に示す側面図である。なお、保持ユニット50bの構成は保持ユニット50aの構成と同様であるから、ここでは、保持ユニット50aの構成についてのみ説明する。   FIG. 3A is a side view schematically showing a configuration example of the holding unit 50a. Since the configuration of the holding unit 50b is the same as that of the holding unit 50a, only the configuration of the holding unit 50a will be described here.

図2及び図3(A)に示すように、保持ユニット50aは、各構造を支持する直方体状の基台54を備えている。基台54の上面には、保持ユニット50aの長手方向に離間する2組の可動プレート56a,56bが設けられている。   As shown in FIGS. 2 and 3A, the holding unit 50a includes a rectangular parallelepiped base 54 that supports each structure. On the upper surface of the base 54, two sets of movable plates 56a and 56b that are separated in the longitudinal direction of the holding unit 50a are provided.

可動プレート56a,56bは、基台54の上面に配置され回転軸として機能する連結具58a,58bを介して基台54に接続されており、この連結具58a,58bの周りに回転する。基台54の外側の領域(洗浄機構52と反対側の領域)には、可動プレート56a,56bを回転させる可動プレート駆動機構(水平移動手段)60が配置されている。   The movable plates 56a and 56b are connected to the base 54 via connecting tools 58a and 58b which are arranged on the upper surface of the base 54 and function as a rotation shaft, and rotate around the connecting tools 58a and 58b. A movable plate driving mechanism (horizontal moving means) 60 for rotating the movable plates 56a and 56b is disposed in an area outside the base 54 (an area opposite to the cleaning mechanism 52).

可動プレート駆動機構60は、例えば、エアアクチュエータ(エアシリンダ)であり、基端側に底のある有底円筒状のシリンダ60aと、基端側をシリンダ60aの先端側に挿入されたピストンロッド60bとを含む。   The movable plate driving mechanism 60 is, for example, an air actuator (air cylinder), and a bottomed cylindrical cylinder 60a having a bottom on the base end side, and a piston rod 60b inserted on the base end side to the tip end side of the cylinder 60a. Including.

シリンダ60aの基端側には、連結具62aを介して可動プレート56aが接続されている。一方、ピストンロッド60bの先端側には、連結具62bを介して可動プレート56bが接続されている。そのため、シリンダ60aの内圧を変化させて可動プレート駆動機構60を伸縮させれば、可動プレート56a,56bを連結具58a,58bの周りに回転させることができる。   A movable plate 56a is connected to the base end side of the cylinder 60a via a connector 62a. On the other hand, the movable plate 56b is connected to the tip end side of the piston rod 60b via a connector 62b. Therefore, if the movable plate drive mechanism 60 is expanded and contracted by changing the internal pressure of the cylinder 60a, the movable plates 56a and 56b can be rotated around the couplers 58a and 58b.

可動プレート56a,56bの上面には、板状物11の外周縁11aに当接し、鉛直方向に平行な回転軸の周りに回転する回転ローラ64がそれぞれ配置されている。上述のように可動プレート56a,56bを回転させて、複数の回転ローラ64を板状物11の大きさに合わせて水平方向に移動させることで、板状物11を複数の回転ローラ64で挟み込むように保持できる。   On the upper surfaces of the movable plates 56a and 56b, rotating rollers 64 that are in contact with the outer peripheral edge 11a of the plate-like object 11 and rotate around a rotation axis parallel to the vertical direction are arranged. As described above, the movable plates 56a and 56b are rotated, and the plurality of rotating rollers 64 are moved in the horizontal direction in accordance with the size of the plate-like object 11, whereby the plate-like object 11 is sandwiched between the plurality of rotating rollers 64. Can be held.

この回転ローラ64には、モータ等の回転駆動源(回転ローラ駆動手段)(不図示)が連結されている。板状物11を複数の回転ローラ64で挟み込むように保持した後に、回転駆動源で回転ローラ64を回転させれば、鉛直方向に平行な回転軸の周りに板状物11を回転させることができる。   A rotating drive source (rotating roller driving means) (not shown) such as a motor is connected to the rotating roller 64. After holding the plate-like object 11 so as to be sandwiched between the plurality of rotating rollers 64, if the rotating roller 64 is rotated by a rotational drive source, the plate-like object 11 can be rotated around a rotation axis parallel to the vertical direction. it can.

図3(B)は、洗浄機構52の構成例を模式的に示す図である。図2及び図3(B)に示すように、洗浄機構52は、スポンジ等の弾性部材で所定の厚みに形成された円筒状の洗浄ローラ(洗浄部材)70を含む。洗浄ローラ70は、板状物11の半径以上の長さに形成されており、回転軸となるシャフト72の周囲に固定される。   FIG. 3B is a diagram schematically illustrating a configuration example of the cleaning mechanism 52. As shown in FIGS. 2 and 3B, the cleaning mechanism 52 includes a cylindrical cleaning roller (cleaning member) 70 formed with a predetermined thickness by an elastic member such as sponge. The cleaning roller 70 is formed to have a length equal to or longer than the radius of the plate-like object 11 and is fixed around a shaft 72 serving as a rotation shaft.

シャフト72(洗浄ローラ70)の一端側には、洗浄ローラ70を回転させる回転駆動源(洗浄部材回転モータ)74が接続されている。一方、シャフト72(洗浄ローラ70)の他端側は、軸受け部材76で支持されている。シャフト72の内部には、洗浄ローラ70に純水等の洗浄液を供給するための洗浄液供給路(洗浄液供給手段)78が設けられている。   A rotation drive source (cleaning member rotation motor) 74 for rotating the cleaning roller 70 is connected to one end side of the shaft 72 (cleaning roller 70). On the other hand, the other end side of the shaft 72 (cleaning roller 70) is supported by a bearing member 76. Inside the shaft 72, a cleaning liquid supply path (cleaning liquid supply means) 78 for supplying a cleaning liquid such as pure water to the cleaning roller 70 is provided.

洗浄液供給路78は、洗浄液を供給する洗浄液供給源80と接続されている。洗浄液供給源80から洗浄ローラ70に洗浄液を供給しつつ、回転駆動源74で洗浄ローラ70を回転させて板状物11の下面側に接触させることで、板状物11の下面側を擦るように洗浄できる。   The cleaning liquid supply path 78 is connected to a cleaning liquid supply source 80 that supplies the cleaning liquid. While the cleaning liquid is supplied from the cleaning liquid supply source 80 to the cleaning roller 70, the cleaning roller 70 is rotated by the rotational drive source 74 and brought into contact with the lower surface side of the plate-like object 11, thereby rubbing the lower surface side of the plate-like object 11. Can be washed.

なお、図2に示すように、板状物11の回転方向A1と洗浄ローラ70の回転方向A2とは、板状物11と洗浄ローラ70との接触部において、主に逆向きになるように制御される。   As shown in FIG. 2, the rotation direction A1 of the plate-like object 11 and the rotation direction A2 of the cleaning roller 70 are mainly opposite to each other at the contact portion between the plate-like object 11 and the cleaning roller 70. Be controlled.

回転駆動源74及び軸受け部材76の下方には、回転駆動源74及び軸受け部材76を支持する支持部材82が設けられている。支持部材82の下方には、洗浄ローラ70を上下に移動させる昇降ユニット(上下動手段)84が接続されている。   A support member 82 that supports the rotation drive source 74 and the bearing member 76 is provided below the rotation drive source 74 and the bearing member 76. Below the support member 82 is connected an elevating unit (vertical moving means) 84 that moves the cleaning roller 70 up and down.

昇降ユニット84は、洗浄ローラ70の全体を上下に移動させる昇降機構86を備えている。昇降機構86は、例えば、エアアクチュエータ(エアシリンダ)であり、有底円筒状のシリンダ86aと、シリンダ86aの上端側に挿入されたピストンロッド(ピストン)86bとを含む。   The lifting unit 84 includes a lifting mechanism 86 that moves the entire cleaning roller 70 up and down. The elevating mechanism 86 is an air actuator (air cylinder), for example, and includes a bottomed cylindrical cylinder 86a and a piston rod (piston) 86b inserted on the upper end side of the cylinder 86a.

ピストンロッド86bの先端部は、支持部材82の一端(回転駆動源74側の端部)と支持部材82の他端(軸受け部材76側の端部)との間の接続部88において、支持部材82と接続されている。支持部材82は、一端側と他端側とが接続部88を支点に上下動するように支持されている。   The tip of the piston rod 86b is connected to the support member 82 at a connection portion 88 between one end of the support member 82 (end on the rotational drive source 74 side) and the other end of the support member 82 (end on the bearing member 76 side). 82. The support member 82 is supported such that one end side and the other end side move up and down with the connection portion 88 as a fulcrum.

また、昇降ユニット84は、支持部材82の接続部88と一端との間に接続されたガイド部材90a、及び、支持部材82の接続部88と他端との間に接続されたガイド部材90bを含む。ガイド部材90a,90bは、伸縮自在に構成されており、連結部92a,92bにおいて支持部材82と接続される。   The elevating unit 84 includes a guide member 90a connected between the connection portion 88 of the support member 82 and one end, and a guide member 90b connected between the connection portion 88 of the support member 82 and the other end. Including. The guide members 90a and 90b are configured to be extendable and contracted, and are connected to the support member 82 at the coupling portions 92a and 92b.

ガイド部材90a,90bによって、支持部材82(洗浄ローラ70)の一端及び他端の上下動がガイドされる。なお、連結部92a,92bが係合する支持部材82の係合穴82a,82bには、支持部材82(洗浄ローラ70)の一端及び他端の上下動を許容する隙間(遊び)が設けられている。   The guide members 90a and 90b guide the vertical movement of one end and the other end of the support member 82 (cleaning roller 70). The engagement holes 82a and 82b of the support member 82 with which the coupling portions 92a and 92b engage are provided with a gap (play) that allows the one end and the other end of the support member 82 (cleaning roller 70) to move up and down. ing.

次に、本実施形態の洗浄装置44を用いる洗浄の手順を説明する。図4は、板状物11の下面が洗浄される様子を模式的に示す側面図である。まず、回転保持機構50で板状物11を保持し、昇降機構86のピストンロッド86bを上昇させる。これにより、板状物11の下面側に洗浄ローラ70が接触する。   Next, a cleaning procedure using the cleaning device 44 of this embodiment will be described. FIG. 4 is a side view schematically showing how the lower surface of the plate-like object 11 is cleaned. First, the plate-like object 11 is held by the rotation holding mechanism 50, and the piston rod 86b of the elevating mechanism 86 is raised. As a result, the cleaning roller 70 contacts the lower surface side of the plate-like object 11.

上述のように、洗浄ローラ70は、一端側と他端側とが接続部88を支点に上下動するように支持されている。そのため、板状物11の下面側に接触した洗浄ローラ70は、板状物11の下面の形状に合わせて傾斜し、洗浄ローラ70と板状物11の下面との接触面積が最大化される。   As described above, the cleaning roller 70 is supported so that one end side and the other end side move up and down with the connecting portion 88 as a fulcrum. Therefore, the cleaning roller 70 in contact with the lower surface side of the plate-like object 11 is inclined according to the shape of the lower surface of the plate-like object 11, and the contact area between the cleaning roller 70 and the lower surface of the plate-like object 11 is maximized. .

したがって、この状態で、洗浄液を供給しながら洗浄ローラ70を板状物11の径方向に平行な回転軸の周りに回転させ、また、板状物11を鉛直方向に平行な回転軸の周りに回転させることで、板状物11の下面を適切に洗浄できる。   Accordingly, in this state, the cleaning roller 70 is rotated around the rotation axis parallel to the radial direction of the plate-like object 11 while supplying the cleaning liquid, and the plate-like object 11 is rotated around the rotation axis parallel to the vertical direction. By rotating, the lower surface of the plate-like object 11 can be cleaned appropriately.

以上のように、本実施形態に係る洗浄装置44は、円筒状の洗浄ローラ(洗浄部材)70の一端側と他端側とが板状物(被洗浄物)11の下面に合わせて上下動するように支持部材82を支える昇降ユニット(上下動手段)84を備えるので、板状物11が反っている場合にも、昇降ユニット84によって、板状物11の中心から外周縁11aに至る半径に対応する板状物11の下面側に洗浄ローラ70を接触させて、板状物11の下面側を適切に洗浄できる。   As described above, in the cleaning device 44 according to the present embodiment, one end side and the other end side of the cylindrical cleaning roller (cleaning member) 70 move up and down in accordance with the lower surface of the plate-like object (object to be cleaned) 11. Since the elevating unit (vertical movement means) 84 that supports the support member 82 is provided, the radius from the center of the plate-like object 11 to the outer peripheral edge 11a is also raised by the elevating unit 84 even when the plate-like object 11 is warped. The cleaning roller 70 is brought into contact with the lower surface side of the plate-like object 11 corresponding to the above, and the lower surface side of the plate-like object 11 can be appropriately cleaned.

なお、本発明は上記実施形態の記載に限定されず、種々変更して実施可能である。例えば、上記実施形態では、回転保持機構(回転保持手段)50に4個の回転ローラ64を設けているが、回転保持機構(回転保持手段)が備える回転ローラは3個以上であれば良い。また、上記実施形態では、全ての回転ローラ70に回転駆動源(回転ローラ駆動手段)を連結しているが、回転駆動源は、少なくとも1個の回転ローラに連結されていれば良い。   In addition, this invention is not limited to description of the said embodiment, A various change can be implemented. For example, in the above-described embodiment, the four rotation rollers 64 are provided in the rotation holding mechanism (rotation holding unit) 50, but the rotation holding mechanism (rotation holding unit) may include three or more rotation rollers. In the above embodiment, the rotation drive source (rotation roller driving means) is connected to all the rotation rollers 70, but the rotation drive source only needs to be connected to at least one rotation roller.

また、上記実施形態では、昇降ユニット(上下動手段)84に2個のガイド部材90a,90bを設けているが、昇降ユニット(上下動手段)が備えるガイド部材は1個でも良い。さらに、上記実施形態では、下に凸の形状に反った板状物(被洗浄物)11の下面を洗浄する例について説明しているが、本実施形態の洗浄装置44は、上に凸の形状に反った板状物(被洗浄物)や平坦な板状物(洗浄物)の下面を洗浄することもできる。   Moreover, in the said embodiment, although the two guide members 90a and 90b are provided in the raising / lowering unit (up-and-down moving means) 84, the guide member with which an raising / lowering unit (up-and-down moving means) is provided may be one. Furthermore, although the said embodiment demonstrated the example which wash | cleans the lower surface of the plate-shaped object (to-be-cleaned object) 11 which curved downward convex shape, the washing | cleaning apparatus 44 of this embodiment is convex upward. It is also possible to clean the lower surface of a plate-shaped object (object to be cleaned) warped in shape or a flat plate-shaped object (cleaned object).

その他、上記実施形態に係る構成、方法等は、本発明の目的の範囲を逸脱しない限りにおいて適宜変更して実施できる。   In addition, the configurations, methods, and the like according to the above-described embodiments can be appropriately modified and implemented without departing from the scope of the object of the present invention.

2 切削装置
4 基台
4a,4b,4c 開口
6 カセット載置台
8 カセット
10 X軸移動テーブル
12 防塵防滴カバー
14 チャックテーブル
14a 保持面
18 切削ユニット
20 支持構造
22 切削ユニット移動機構
24 Y軸ガイドレール
26 Y軸移動プレート
28 Y軸ボールネジ
30 Y軸パルスモータ
32 Z軸ガイドレール
34 Z軸移動プレート
36 Z軸ボールネジ
38 Z軸パルスモータ
40 カメラ
42 切削ブレード
44 洗浄装置
50 回転保持機構(回転保持手段)
50a,50b 保持ユニット
52 洗浄機構(洗浄手段)
54 基台
56a,56b 可動プレート
58a,58b 連結具
60 可動プレート駆動機構(水平移動手段)
60a シリンダ
60b ピストンロッド
62a,62b 連結具
64 回転ローラ
70 洗浄ローラ(洗浄部材)
72 シャフト
74 回転駆動源(洗浄部材回転モータ)
76 軸受け部材
78 洗浄液供給路(洗浄液供給手段)
80 洗浄液供給源
82 支持部材
82a,82b 係合穴
84 昇降ユニット(上下動手段)
86 昇降機構
86a シリンダ
86b ピストンロッド(ピストン)
88 接続部
90a,90b ガイド部材
92a,92b 連結部
11 板状物(被洗浄物)
11a 外周縁
A1,A2 回転方向
DESCRIPTION OF SYMBOLS 2 Cutting device 4 Base 4a, 4b, 4c Opening 6 Cassette mounting base 8 Cassette 10 X-axis moving table 12 Dust-proof drip-proof cover 14 Chuck table 14a Holding surface 18 Cutting unit 20 Support structure 22 Cutting unit moving mechanism 24 Y-axis guide rail 26 Y-axis moving plate 28 Y-axis ball screw 30 Y-axis pulse motor 32 Z-axis guide rail 34 Z-axis moving plate 36 Z-axis ball screw 38 Z-axis pulse motor 40 Camera 42 Cutting blade 44 Cleaning device 50 Rotation holding mechanism (rotation holding means)
50a, 50b Holding unit 52 Cleaning mechanism (cleaning means)
54 base 56a, 56b movable plate 58a, 58b coupling tool 60 movable plate drive mechanism (horizontal movement means)
60a Cylinder 60b Piston rod 62a, 62b Connector 64 Rotating roller 70 Cleaning roller (cleaning member)
72 Shaft 74 Rotation drive source (cleaning member rotation motor)
76 Bearing member 78 Cleaning liquid supply path (cleaning liquid supply means)
80 Cleaning liquid supply source 82 Support member 82a, 82b Engagement hole 84 Elevating unit (vertical movement means)
86 Lifting mechanism 86a Cylinder 86b Piston rod (piston)
88 connection part 90a, 90b guide member 92a, 92b connection part 11 plate-like object (object to be cleaned)
11a Outer peripheral edge A1, A2 Direction of rotation

Claims (1)

円盤状の被洗浄物の下面側を洗浄する洗浄装置であって、
被洗浄物を保持して回転させる回転保持手段と、被洗浄物の下面側を洗浄する洗浄手段と、を備え、
該回転保持手段は、被洗浄物の外周縁に接触して被洗浄物を保持し鉛直方向に平行な回転軸の周りに回転する3個以上の回転ローラと、該回転ローラのいずれかに連結され対応する該回転ローラを回転させる回転ローラ駆動手段と、該回転ローラを被洗浄物の大きさに合わせて水平方向に移動させる水平移動手段と、を備え
該洗浄手段は、所定の厚みの弾性部材で被洗浄物の半径以上の長さに形成され被洗浄物の径方向に平行な回転軸の周りに回転する円筒状の洗浄部材と、該洗浄部材に洗浄液を供給する洗浄液供給手段と、該洗浄部材の一端側に連結され該洗浄部材を回転させる洗浄部材回転モータと、該洗浄部材の他端側を支持する軸受け部材と、該洗浄部材回転モータと該軸受け部材とを下方から支持する支持部材と、該支持部材の下方に接続され、該洗浄部材の一端側と他端側とが被洗浄物の下面に合わせて上下動するように該支持部材を支えるとともに、該洗浄部材の全体を上下に移動させる上下動手段と、を備え、
該上下動手段は、該支持部材の一端と他端との間の接続部に接続されたピストンと、該ピストンを上下動させるシリンダと、該支持部材の該接続部と一端との間又は該支持部材の該接続部と他端との間に接続され、該洗浄部材の一端及び他端の上下動をガイドするガイド部材と、を備え、
該上下動手段によって、被洗浄物の中心から外周縁に至る半径に対応する被洗浄物の下面側に該洗浄部材を接触させることで、被洗浄物の下面側を洗浄し、
該洗浄部材の一端側と他端側とは、該接続部を支点に上下動することを特徴とする洗浄装置。
A cleaning device for cleaning the lower surface side of a disk-shaped object to be cleaned,
Rotation holding means for holding and rotating the object to be cleaned, and cleaning means for cleaning the lower surface side of the object to be cleaned,
The rotation holding means is connected to one of the rotation rollers and three or more rotation rollers that contact the outer peripheral edge of the object to be cleaned and hold the object to be cleaned and rotate around a rotation axis parallel to the vertical direction. is provided with a rotary roller drive means for rotating the corresponding said rotating roller, and the horizontal moving means for moving in a horizontal direction in accordance with the rotating roller to the size of the object to be cleaned, and
The cleaning means includes a cylindrical cleaning member formed of an elastic member having a predetermined thickness and having a length equal to or longer than the radius of the object to be cleaned and rotating around a rotation axis parallel to the radial direction of the object to be cleaned, and the cleaning member Cleaning liquid supply means for supplying cleaning liquid to the cleaning member, a cleaning member rotating motor connected to one end of the cleaning member for rotating the cleaning member, a bearing member for supporting the other end of the cleaning member, and the cleaning member rotating motor And a support member that supports the bearing member from below, and the support member is connected to the lower side of the support member so that one end side and the other end side of the cleaning member move up and down in accordance with the lower surface of the object to be cleaned. A vertical movement means for supporting the member and moving the entire cleaning member up and down,
The vertical movement means includes a piston connected to a connection portion between one end and the other end of the support member, a cylinder for moving the piston up and down, and between the connection portion and one end of the support member, or the A guide member that is connected between the connecting portion and the other end of the support member and guides the vertical movement of the one end and the other end of the cleaning member,
The lower surface side of the object to be cleaned is cleaned by bringing the cleaning member into contact with the lower surface side of the object to be cleaned corresponding to the radius from the center of the object to be cleaned to the outer peripheral edge by the vertical movement means .
The cleaning apparatus characterized in that the one end side and the other end side of the cleaning member move up and down with the connecting portion as a fulcrum .
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Publication number Priority date Publication date Assignee Title
JP6549936B2 (en) * 2015-08-19 2019-07-24 株式会社ディスコ Cleaning device
JP7161412B2 (en) * 2019-01-15 2022-10-26 株式会社ディスコ cleaning unit

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07211677A (en) * 1993-11-30 1995-08-11 M Setetsuku Kk Method and apparatus for scrubbing substrate
JPH08139062A (en) * 1994-11-11 1996-05-31 M Setetsuku Kk Device for scrubbing substrate
JP2010006529A (en) * 2008-06-26 2010-01-14 Ricoh Co Ltd Sheet carrying device, and image forming device equipped with the same
JP5955635B2 (en) * 2012-05-11 2016-07-20 株式会社ディスコ Cleaning device

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