JPH08139062A - Device for scrubbing substrate - Google Patents

Abstract

PURPOSE: To sufficiently clean the central part of a semiconductor substrate without deteriorating cleaning at all by a method wherein rotary cylindrical brush is brought into contact with the central part to the end of the cleaning surface while adjusting the contact level of the rotary cylindrical brush to the cleaning line. CONSTITUTION: In order to clean the surface 1a on the rear surface of a substrate 1, an automatic aligning clamp groove 4 is formed in the inner peripheral side surface of a substrate chuck 6. The automatic aligning clamp trench 4 is composed of an inner side face 4a abutting against or approaching to the outer peripheral face of the substrate 1, a pawl body 5 positioned below the inner side face 4a for supporting the lower part taper face of the substrate 1 as well as a peripheral upper part engagement face 4b positioned above the pawl body 5. A rotary cylindrical brush 3 is in contact with the central part of the end of the cleaning substrate 1a of the substrate 1 for cleaning up the cleaning surface 1a. Furthermore, a contact level adjusting part adjusts the contact level of the rotary cylindrical brush 3 to the cleaning line from the central part to the end part of the substrate 1.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a scrubbing apparatus for chucking only the peripheral edge of a substrate and cleaning the entire upper surface, which is the cleaning surface, with a cylindrical brush.

[0002]

2. Description of the Related Art Semiconductors are currently used in ultra LSIs and ultra LSs.
I has been developed, and extremely fine circuits formed by applying the ultra-precision photoengraving technique are densely formed on the surface thereof. Therefore, if extremely fine dust adheres to the surface, it will appear as a circuit defect of the semiconductor circuit, and the yield will decrease. As described above, as the semiconductor becomes more precise, its manufacturing cost will increase, and the improvement of the yield will greatly contribute to the cost reduction. Therefore, the dust removal countermeasure becomes a very important issue.

At the semiconductor manufacturing site, at present, the surface cleaning control for forming fine circuits is extremely strict, but the back surface cleaning control is so strict. is not. However, it has been found that the back surface of the semiconductor substrate is contaminated by coming into contact with the suction base of the equipment or the handling device in each process, which is one of the causes of the contamination on the front surface side.

Therefore, recently, the back surface of the semiconductor substrate has come to be sufficiently cleaned, but it has the following problems.

Since the fine circuits are densely formed on the front surface (100b) of the semiconductor substrate (100), the front surface (100b) cannot be used for back surface cleaning. Therefore,
Only the peripheral portion of the semiconductor substrate (100) should be chucked by the grip claws (101), and the central portion of the semiconductor substrate (100) should be cleaned without being supported. However, the conventional grip claw (101) for gripping the end portion of the semiconductor substrate (100) has a part thereof protruding outward from the cleaning surface (100a) of the semiconductor substrate (100), as shown in FIG. Moreover, only the disk-shaped brush (102) having a small area can be used, and there is a problem that the cleaning ability is low.

Therefore, as shown in FIGS.
The back surface (100a) was cleaned by rotating the substrate (100) with the rotating cylindrical brush (3 ′) arranged from one end to the other end of the (100). In this case, by rotating the rotating cylindrical brush (3 ') and rotating the substrate (100), the cleaning ability could be dramatically improved unlike the case of the desk brush (102). The substrate (100) warps to the opposite side due to the contact pressure of), and the parallelism between the substrate (100) and the rotating cleaning brush (3 ') is insufficient, and the rotating cylindrical brush to the central part of the substrate (100)
Due to insufficient contact of (3 ′) and the like, there arises a problem that the cleanliness of the central part of the substrate (100) is worse than that of the peripheral part.

[0007]

The problem to be solved by the apparatus of the present invention is to make it possible to sufficiently clean the central portion of the semiconductor substrate without lowering the cleaning performance.

[0008]

A scrubbing device according to claim 1, wherein "a clamp groove (4) into which a peripheral edge of a substrate (1) is fitted is provided, and the clamp groove (4) is formed. Substrate chuck in which the cleaning-side locking protrusion is a substrate locking claw (5) located inside the cleaning surface (1a) of the substrate (1).
(6) and the rotating cylindrical brush (3) that contacts the cleaning surface (1a) of the substrate (1) from the central part to the end of the cleaning surface (1a) of the substrate (1), and the substrate (1) The contact height adjuster (53) for adjusting the contact height of the rotating cylindrical brush (3) with respect to the cleaning line (L) from the central part to the end of the substrate, and the substrate chuck (6) on the substrate (1).
It is composed of a rotating mechanism (8) that rotates in a plane parallel to the.

As a result, the cleaning pressure is applied to the substrate (1) at the time of cleaning the back surface, the substrate (1) bends in the opposite direction, and the parallelism between the substrate (1) and the rotary cleaning brush (3) at the time of setting is reduced. Even if it is not enough, the contact height adjuster (53) will
The support height of the rotating cylindrical tube brush (3) to the cleaning line (L) of the cleaning surface (1a) of (1) is adjusted so that the parallelism is always maintained, and the periphery from the central portion of the substrate (1) Therefore, the rotating cylindrical brush (3) comes into uniform contact with the surface of the cleaning surface (1a), so that cleaning unevenness does not occur on the entire surface of the cleaning surface (1a).

A scrubbing device (A) according to claim 2.
Is characterized in that "the lower peripheral edge locking surface (4b) extends below the lower surface of the substrate (1)", whereby the rotating cylindrical brush (3) is strongly pressed from above. Even if the substrate (1) is slightly displaced downward, the lower taper portion of the peripheral edge of the substrate (1) still does not separate from the lower peripheral edge engaging surface (4b), and the substrate can be cleaned safely.

According to the scrubbing apparatus (A) of claim 3, "a static eliminator (J) for eliminating static electricity charged on the substrate (1) after cleaning is installed in the substrate cleaning section and / or the substrate transfer path. According to this, the rotating cylindrical brush (3) and the cleaning liquid come into contact with the substrate (1) during cleaning, and after cleaning, the substrate (1) is rotated at high speed to dehydrate and dry. However, at this time, the rotating cylindrical brush (3), the cleaning liquid (especially when the cleaning liquid is pure water) or the room air and the substrate (1)
There is a case where static electricity is charged on the substrate (1) due to the contact with, by this, it is possible to effectively eliminate the static electricity by the static eliminating means, without adsorbing airborne dust, Can maintain a clean condition after washing.

[0012]

EXAMPLES The method of the present invention and its apparatus will be described below with reference to examples. In the figure, a semiconductor wafer is described as an example of the substrate (1), but other thin plates such as a glass plate, an alumina, a quartz plate, a ceramic plate, a sapphire plate, an aluminum disc and others can be applied. Of course. The scrubbing device (A) shown in FIG.
A transfer robot for loading (1) into and out of the cleaning section (E)
(C), a loader (B) for supplying the substrate (1) to the transfer robot (C), and an unloader for accommodating the cleaned substrate (1)
(D), a control section (F) for controlling the entire apparatus, a cleaning section (E) for cleaning the substrate, and an apparatus main body (G) on which these apparatuses are mounted.

The loader (B) sets the unprocessed substrate (1) stored in the cassette (54) and moves up or down step by step in accordance with the removal of the transfer robot (C) to obtain the unprocessed substrate.
(1) is moved to a predetermined position. Unloader
On the contrary, (D) is backside cleaned in the cleaning section (E), and the transfer robot
A cassette (54) for storing the substrate (1) transferred in (C)
It is for mounting the board.
This is for preparing an empty storage portion of the cassette (54) by moving up or down step by step. Transfer robot (C)
Removes the substrate (1) from the loader (B) and supplies it to the cleaning unit (E), and also removes the substrate (1) whose back surface was cleaned by the cleaning unit (E) from the cleaning unit (E), It is for transfer to D). An ultraviolet ray generating lamp as a dust removing means (J) is installed in the installation department of the transfer robot (C). The operation of the ultraviolet ray generating lamp will be described later. The loader (B), the unloader (D) and the transfer robot (C) have known structures, and their details are omitted.

2 and 3 are sectional views of the cleaning unit (E) according to the present invention, in which the substrate chuck (6) is slidably attached to the rotary upper housing (10) via the slider (9). . The substrate chuck (6) has a ring shape and is divided into three parts so that the chuck diameter can be expanded and contracted as shown in FIGS. A self-aligning clamp groove (4) is formed on the inner circumference of the substrate chuck (6) to allow
The whole circumference of (1) can be chucked.

FIG. 6 shows a case where the cleaning surface (1a) on the lower surface of the substrate (1) is cleaned by the rotating brush (3).
In the partially enlarged sectional view of (4), a self-aligning clamp groove (4) is formed on the inner peripheral side surface of the substrate chuck (6). The self-aligning clamp groove (4) includes an inner side surface (4a) that is in contact with or close to the outer peripheral surface of the substrate (1) and a claw body that is positioned below the inner side surface (4a) and supports the lower tapered surface of the substrate (1). 5) and the upper peripheral edge locking surface (4b) located thereabove. In the embodiment of FIG. 6, the shape of the upper peripheral edge locking surface (4b) is formed by a curved surface with a slight convex and concave connecting in a gently curved line, and the cross sectional shape is S-shaped. It is formed into a shape and is gently connected to the inner surface (4a). As a result, the peripheral edge of the substrate (1) fitted into the self-aligning clamp groove (4) slides very slightly along the upper peripheral edge locking surface (4b) and fits inside the inner side surface (4a). The lower tapered portion on the periphery of the claw body (5) is held. The claw body (5) only slightly engages the lower tapered surface (1c) of the peripheral edge of the substrate (1), and the lower surface of the claw body (5) is the cleaning surface (1a) which is the lower surface of the substrate (1). ) It doesn't stick out more.

A plurality of fluid discharge holes (11) are formed at a predetermined interval near the inner circumference of the substrate chuck (6), and the direction of the holes is the tangential direction of the self-aligning clamp groove (4). Has become. The drilling position of the fluid discharge hole (11) is formed in a downward slope from the inner side surface to the lower surface of the substrate chuck (6) so that the fluid flowing out onto the back pressure surface (1b) of the substrate (1) smoothly flows. It is designed to be smoothly discharged downward through the discharge hole (11).

The substrate chuck (6) is a roller mounting block (70
It is connected to each other by the expansion / contraction guide (12) fixed to b), and the slide part (12a) of the expansion / contraction guide (12) is drilled in the roller mounting block (70a) of the adjacent substrate chuck (6). As shown in FIG. 4, the expansion cylinder head (14) is slidably held in the slide hole (71a), and the expansion cylinder head (14) is inserted between the expansion rollers (13) provided in the pair of adjacent substrate chucks (6). Thus, the distance between the substrate chucks (6) is increased. At this time, the slide portion (70a) moves in the direction of coming out of the slide hole (71a).

The expansion / contraction slide of the substrate chuck (6) is performed through the sliders (9) respectively arranged on the lower surface of the substrate chuck (6). Expansion of the chuck diameter of the substrate chuck (6) is performed by the expansion cylinder head (14) as described above, but contraction of the chuck diameter is expanded cylinder head.
Chuck diameter shrinking cylinder (15) opposite to (14)
Done by That is, the chuck diameter shrinking cylinder (1
By activating 5) to press the substrate chuck (6), the slide part (12a) is pushed back into the slide hole (71a), and the whole substrate chuck (6) is closed as shown in FIG. . At this time, the expansion cylinder head (14) is pulled back to the rear. When the substrate chuck (6) is closed as described above and the peripheral edge of the substrate (1) is clamped in the self-aligning clamp groove (4), one of the expansion / contraction guides (12) is locked by the lock mechanism (H). The substrate chuck (6) is prevented from opening due to centrifugal force during rotation.

Since the lock mechanism (H) is not a main constituent element here, it will be briefly described. In this embodiment, since the substrate (1) is locked by the substrate chuck (6) and rotates,
The lock mechanism (H) for locking the substrate chuck (6) is preferably compact and has a small weight in order to minimize the moment of inertia of the substrate chuck (6). Therefore,
The lock hole (70c) provided adjacent to the roller mounting block (70a) has a lock through hole (7) coaxial with the slide hole (71a).
1c) and a slit (not shown) is provided in the lock through hole (71c), and the lock through hole (71c) is tightened so that the slit is closed at the time of tightening. Tighten and fix the slide part (12a) of the expansion / contraction guide (12) inserted in the through hole (71c), and loosen the lock through hole (71c) so that the slit opens when opening, and the lock through hole (71c). The slide part (12a) inserted in the
c) Sliding inside.

The rotating upper housing (10) is connected to the rotating cylinder (17) via a rotating head cover (16). A driven pulley (18) is attached to the rotary cylinder (17) and is connected to a drive pulley (20) of a substrate rotation drive motor (21) via a drive belt (19). As a result, the rotational force of the substrate rotation drive motor (21) is transmitted to the driven pulley (18), and the substrate chuck (6) rotates. A positioning cam (22) is attached to the driven pulley (18), and the positioning cam follower (23) fits into the groove of the positioning cam (22), and the substrate chuck (6) is always forced at a predetermined position. The positioning sensor (24) constantly detects the stop position so that the positioning cam follower (23) always fits correctly into the groove of the positioning cam (22). Has been done. Since this means is also a conventional means, detailed description is omitted.

Reference numeral (24) is a fixed housing fitted to the outside of the rotary cylinder (17), and rotatably holds the rotary cylinder (17) via a bearing. (25) is a fixed liquid-proof cover provided on the upper end of the fixed housing (24). Lower base plate
A pillar (27) is erected on the (26), and a fixing block (29) is fixed to the upper end of the pillar. Reference numeral (28) is a fixed head cover which is attached to the upper end of the fixed block (29) and covers the rotary head cover (16) from above.

A substrate receiving cylinder rod (30) is slidably inserted through the center of the fixed block (29), and a substrate receiving working cylinder installed below the fixed block (29).
It can be moved up and down by (31).
A base bearing intermediate member (32) having a V-shaped cross section is attached to the upper end of the substrate receiving cylinder rod (30), and a substrate receiving rod (33) is erected from the base bearing intermediate member (32). In this embodiment, the number of the substrate receiving rods (33) is four, and the receiving head (35) is fitted to the tip of the substrate receiving rods (33) via the cushioning material (34).

Reference numeral (36) is a liquid receiving member having a V-shaped cross section, which is arranged below the cylindrical brush (3). (37) is a fixed block (2
The brush lifting bar (37) is slidably inserted into the brush lifting bar (37), and the brush lifting cylinder (38) is attached to the lower end of the brush lifting bar (37) to lift the brush sliding bar (37). . A brush attachment member (39) is attached to the upper end of the brush lift bar (37). A contact height adjusting portion (53) is provided at the tip of the brush mounting member (39).

The contact height adjusting unit (53) adjusts the contact height of the cylindrical brush (3) from the substrate (1) so that the entire cylindrical brush (3) is in contact line (L) of the substrate (1). This is to prevent it from being hit against. FIG. 7 shows the first embodiment. In the embodiment of FIG. 7, the brush attachment member (39) is divided into an arm portion (39a) and an attachment portion (39b), and a cylindrical brush (3) is rotatably attached between the attachment portions (39b). There is. A pair of slide shafts (56) are erected on the mounting portion (39b) and slidably inserted into the arm portion (39a). A spring (55) is arranged between the slide shafts (56) and presses and urges the attachment portion (39b) away from the arm portion (39a). A stopper (57) is provided at the tip of the slide shaft (56) to prevent the attachment portion (39a) from falling off.

[0025] A cylindrical brush attached to the attachment portion (39a)
A brush driven pulley (41) is installed on the rotary shaft (40) of (3), and the brush driven pulley (41) and the brush drive motor (4
Brush drive belt (4) between brush drive pulley (43)
2) is suspended so that the rotational force of the brush drive pulley (43) is transmitted to the cylindrical brush (3). The tension pulley (58) contacts the brush drive belt (42) to apply tension to the brush drive belt (42), and the brush drive belt (42) becomes loose when the mounting part (39b) moves. I try not to.

The second embodiment of the contact height adjusting part (53) is as shown in FIG. 8 and has an elastic support (59) such as sponge or rubber.
This is an example in which the ring-shaped cylindrical brush (3) is attached to the rotating shaft (41) via the. The contact height adjusting part (53) is not limited to the structure described above, and the length of the brush mounting member (39) may be adjusted by a screw or the like, and the cylindrical brush (3) is a substrate ( If the substrate (1) is not installed parallel to the cleaning line (L) of 1) or the substrate (1) bends due to the pressing force during cleaning, the cylindrical brush (3) with respect to the cleaning line (L) of the substrate (1) This includes all the structures that can adjust the parallelism automatically or manually when the parallelism is lost.

As can be seen from FIG. 3, the cylindrical brush (3) is slightly longer than the radius of the substrate (1), one end of which is slightly beyond the center point of the substrate (1) and the other end of which is the substrate (1). It is installed slightly beyond the periphery. In addition, the material of the contact portion of the cylindrical brush (3) is a buff in this embodiment (of course, not limited to this, depending on the application, such as long bristles or conversely short bristles) Appropriate one is used.), So that it is sufficiently hydrated.

Reference numeral (45) is a drain pipe provided in the fixed block (29), which has a function of discharging the cleaning fluid dropped onto the fixed block (29). Reference numeral (46) is a cleaning liquid ejecting nozzle, which is adapted to eject the cleaning liquid from the tip of the cleaning liquid ejecting nozzle (46) toward the cylindrical brush (3). Pure water is used as the cleaning liquid in this embodiment, but the cleaning liquid is not limited to this, and liquids such as alcohols and inert gases such as nitrogen gas and argon gas can also be used. . When using the ultrapure water back pressure forming fluid (2), since there is a risk of charge-up, CO ₂ in pure water was lowered once laden conductivity and gas points antistatic preferable. The same applies to the case of gas, and gas passed through an ionizer is preferable.

Reference numeral (7) is a paddle arranged directly above the cylindrical brush (3), which is adapted to move up and down toward the substrate (1), and a fluid ejection port (7a) is bored in the center thereof. There is. The fluid ejection port (7a) may be provided with one hole in the center of the substrate (1) immediately above the cylindrical brush (3), but the cylindrical brush
A large number may be formed in one row along the longitudinal direction of (3),
It may be formed on the slit. In this embodiment, paddle (7)
A slit-shaped fluid ejection port (7a) is formed on the lower surface of the, and a fluid for back pressure or cleaning flows out along the groove-shaped fluid ejection port (7a). As described above, the back pressure or cleaning fluid may be an inert gas such as nitrogen gas or a liquid such as pure water.

Reference numeral (49) is a displacement sensor mounted in the paddle (7), which is input to one terminal of the comparator (50) and is a displacement amount of the substrate (1) compared with a reference voltage. The output of (50) is input to the driver (51), which drives the pressure regulator (52) to adjust the blowout pressure of the fluid (2) blown out from the fluid ejection port (7a). (52a) is a gas supply source. The block circuit is shown in FIG. The fluid (2) is a displacement sensor
The blowout pressure may be controlled according to the output of (49) (in this case, it is used for back pressure), the displacement sensor (49) and its control device are removed, and the board (1 The cleaning liquid may be simply sprayed to prevent the cleaning liquid on the back surface (1a) from flowing around to the pattern surface (1b) side of (1).

Next, the static eliminator (J) is installed in the installation section of the cleaning section (E) and the transfer robot (C) as required. As the static eliminator (J), deuterium is used in this embodiment. Lamps such as lamps, mercury lamps and barrier lamps are used. (Of course, the static elimination means is not limited to this, static elimination by an ionizer using corona discharge, static elimination by an isotope,
It is possible to apply static elimination by electron beam irradiation, plasma static elimination, static X-ray irradiation, etc., but the lamps are the easiest to use and no harmful dust is generated during use. ) Here, static electricity is eliminated in a dust-free manner by using the lamp that emits ultraviolet rays.

The lamp (J) emits ultraviolet rays. When the wavelength of ultraviolet rays is short, the gas around the irradiated portion is ionized to electrically discharge the dust removal surface (1a) of the substrate (1). It will be neutralized. In the long wavelength ultraviolet light, photoelectrons are generated (that is, ultraviolet light generates photoelectrons from its glass envelope, thereby extinguishing the positive charge of the substrate (1),
Further, the ultraviolet rays hit the charged body {= substrate (1)} to charge the charged body.
(1) Erases the negative charge by itself generating photoelectrons) to eliminate the charge. In the case of a mercury lamp,
There are three types: ultra-high pressure, high pressure, and low pressure. When using ultraviolet rays of short wavelength, a low pressure mercury lamp is suitable. Therefore, it is important to directly irradiate the charged substrate (1) to eliminate static electricity by ultraviolet rays, and since the photoelectron generation increases as the energy increases, the wavelength should be short and the irradiation intensity should be high.

Next, the operation of the first embodiment of the present invention will be described with reference to FIG. 1 and FIGS. Board (1) for loader (B)
A cassette (54) accommodating a large number of is stored, and an empty cassette (54) is installed in the unloader (D). Operate the control unit (F) to activate the transfer robot (C),
Take out one substrate (1) from (B). Board removed (1)
Is supplied to the cleaning unit (E) by the transfer robot (C). As shown in FIG. 9, the substrate chuck (6) is expanded as shown in FIG. 4 by the action of the expansion cylinder head (14). The transfer robot (C) inserts the substrate (1) whose peripheral portion is clamped by the transfer robot (C) into the opened substrate chuck (6).

At this time, the substrate receiving rod (33) projects above the self-aligning clamp groove (4) of the substrate chuck (6) by the action of the substrate receiving operation cylinder (31), and the substrate (1) is cleaned. surface
It comes in contact with (1a). When the substrate (1) is placed on the receiving head (35) of the substrate receiving rod (33), the transfer robot (C) separates from the peripheral edge of the substrate (1), and the substrate (1) receiving head ( 35) Install on top. Next, substrate receiving working cylinder
(31) is reversely operated and moves down to a position where the substrate (1) substantially coincides with the self-aligning clamp groove (4) of the substrate chuck (6), and stops at this point. FIG. 6 shows an enlarged view of that state. As shown by the phantom lines in Fig. 6, the substrate (1) is a self-aligning clamp groove.
It is designed to be held slightly above by the inner surface (4a) of (4), and when the substrate chuck (6) is closed by the action of the chuck diameter contraction cylinder (15), the peripheral edge of the substrate (1). Part contacts the lower peripheral edge locking surface (4b) of the self-aligning clamp groove (4),
It moves downward along the lower peripheral edge locking surface (4b) so that the peripheral edge portion of the substrate (1) is accurately fitted into the inner side surface (4a). At this time, the claw body (5) of the substrate chuck (6) is in contact with the lower surface of the taper portion at the peripheral edge of the substrate (1), and the substrate chuck (6)
The lower surface of the substrate does not protrude below (1a) of the substrate (1).

When the self-centering clamp of the substrate (1) by the self-aligning clamp groove (4) is completed, the substrate receiving working cylinder (3
1) activates further and lowers the board receiving rod (33) to lower the board.
It should be separated from the cleaning surface (1a) of (1). During this time,
The transfer robot (C) returns to the home position, waits for the cleaning of the substrate (1) to be completed, and is ready to take out the cleaned substrate (1) from the cleaning unit (E). When the transfer robot (C) moves from above the substrate (1) to the home position, the paddle (7) descends from above and stops immediately above the back pressure surface (1b) of the substrate (1). Then, or at the same time as it descends, a back pressure or cleaning fluid (2) is jetted to apply back pressure on the back pressure surface (1b) of the substrate (1), or simply wrap around the cleaning liquid on the pattern surface (1b). Perform preventative cleaning.

On the other hand, the cylindrical brush (3) stands by below the substrate (1), is lifted upward by the operation of the brush lifting cylinder (38), and contacts the cleaning surface (1a) of the substrate (1). . At this time, as described above, the cylindrical brush (3) has a half size, one end of which is located substantially in the center of the substrate (1) and the other end of which is located at the periphery of the substrate (1). , Substrate (1)
Adjust the contact height even if the central part of the cylinder slightly bends due to the contact pressure of the cylindrical brush (3) or the parallelism between the cylindrical brush (3) and the cleaning line (L) of the substrate (1) is insufficient. The parallelism is adjusted by the part (53), and the central part of the substrate (1) is sufficiently cleaned. Further speaking, for example, in the cleaning line (L) of the cylindrical brush (3) and the substrate (1), the central portion of the substrate (1) is bent and the other end of the cylindrical brush (3) and the peripheral edge of the substrate (1) are If the gap height between the one end of the cylindrical brush (3) and the central part of the substrate (1) becomes larger than the gap height of, the one of the one end of the cylindrical brush (3) with respect to the central part of the substrate (1) The contact pressure on the peripheral edge of the other end is larger than the contact pressure, and the cleaning of the peripheral portion is performed more often than the central portion. However, the contact height adjuster (53) separates the other end of the cylindrical brush (3), which is the peripheral side, from the substrate (1) side, and moves the one end, which is the central portion side, to the substrate (1) side. Both by the matter
(1) The gap between (1) and (3) is adjusted so that the cylindrical brush (3) comes into uniform contact over the entire length of the contact line (L) of the substrate (1).

Simultaneously with or before or after such gap adjustment, the cleaning liquid is ejected from the cleaning liquid injection nozzle (46) toward the cylindrical brush (3), the cylindrical brush (3) is wetted, and the cylindrical brush (3) is removed. The cleaning surface (1a) is cleaned by rotating the brush drive motor (44). At the same time as cleaning the cylindrical brush (3), the rotating upper housing (10) is rotated by the substrate rotation drive motor (21), and the substrate (1) chucked by the substrate chuck (6) is rotated within its plane. . This allows
Cleaning surface (1a) of substrate (1) is cylindrical brush (3) and cleaning line (L)
Since the line brushes uniformly contact each other over the entire length and rotate in the plane, the entire surface is uniformly washed at a high speed by the cylindrical brush (3).

As shown in FIG. 6, the other end of the cylindrical brush (3) extends beyond the outer periphery of the substrate (1) toward the substrate chuck (6) side, and the claw body (5) extends from the cleaning surface (1a). Since it does not project downward, the entire surface of the wash surface (1a) can be washed with almost no washing residue. The back pressure or cleaning fluid (2) ejected from the paddle (7) may be a gas such as nitrogen gas as described above, or a liquid such as pure water. In the case of liquid, the fluid discharge hole (1) opens on the inner surface (4a) and leads to the lower surface of the substrate chuck (6).
Since a plurality of (1) are drilled along the self-aligning clamp groove (4), when the substrate chuck (6) rotates, the back pressure fluid accumulated on the substrate (1) is discharged through the fluid discharge hole ( It will pass through 11) and flow out below the substrate chuck (6) and will not accumulate on the substrate (1). The drilling direction of the fluid discharge hole (11) is an elliptical or oval shape extending in the tangential direction of the self-aligning clamp groove (4).

In this way, the cleaning surface (1a) of the substrate (1) is cleaned by the cylindrical brush (3). When the displacement sensor (49) provided in the paddle (7) is used, the substrate (1) is cleaned. The displacement sensor (49) constantly senses between the (1) and the displacement sensor (49), and the paddle (7) is arranged so that the distance between the substrate (1) and the displacement sensor (49) is constant. Since the flow rate of the back pressure fluid (2) ejected from the back pressure surface (1b) to the back pressure surface (1b) can be feedback-controlled, the substrate (1) can be cleaned in a flat planar state.

Looking at the relationship between the paddle (7) and the cylindrical brush (3), as shown in FIG. 4, the fluid ejection port (7a) of the paddle (7) is elongated along the cylindrical brush (3). Linear fluid (2)
Can be made to flow on the pattern surface (1b). Fluid (2)
When back pressure is applied by applying pressure to the cleaning surface (1a) of the substrate (1) that is held in a floating state, only the peripheral edge is held by the self-aligning clamp groove (4). It can be washed with a cylindrical brush (3).

When the cleaning of the substrate (1) is completed, the brush elevating cylinder (38) reversely operates and descends to separate the cylindrical brush (3) from the cleaning surface (1a) of the substrate (1). At the same time, the brush drive motor (44) stops, stopping the rotation of the cylindrical brush (3).

At the same time, the ejection of the fluid (2) from the paddle (7) is stopped, and then the paddle (7) is moved upward to move the substrate (1).
Stop applying back pressure to. Of course, the cleaning liquid injection nozzle (4
The injection of 6) will also be stopped. Substrate for cylindrical brush (3)
After the separation from (1) and the removal of the paddle (7) are completed, the rotation speed of the substrate rotation drive motor (21) is increased and the rotation speed of the rotation upper housing (10) is increased. Thereby, the water adhering to the surface of the substrate (1) is blown off by the centrifugal force,
It flows out from the fluid discharge hole (11). This allows the substrate
(1) becomes dry.

A cleaning liquid such as pure water or the rotating brush (3) contacts the substrate (1) during cleaning, and the substrate (1) is rotated at a high speed during drying, so that it contacts the air in the room. There is a possibility that static electricity may be charged, and the static electricity is removed from the substrate (1) by the mechanism described above by irradiating the substrate (1) with ultraviolet rays with the static eliminator (J) during and after drying. Be seen.

In this way, after the substrate (1) is dried and discharged, the rotation speed of the substrate chuck (6) gradually decreases, and the positioning sensor (23a) rotates the upper housing (10).
Check the rotational position of the positioning cam, fit the positioning cam follower (23) into the positioning cam (22), stop the rotating upper housing (10) at the specified position, and then release the lock block (70c). The slide part (70a) is opened by tightening the lock through hole (71c) so that it can be freely slid.

After that, the expansion cylinder head (14) is re-activated and inserted between the pair of expansion rollers (13) to open the gap (6a) as shown in FIG. Inside surface (4a)
Expand the diameter of to free the substrate (1) from the self-aligning clamp groove (4).

On the other hand, when the rotating upper housing (10) is stopped prior to the release of the substrate chuck (6), the substrate receiving operation cylinder (31) is re-activated to raise the substrate receiving rod (33), and the substrate ( The cushioning material (34) at the tip is brought into contact with the cleaning surface (1a) of (1). At that time, the spring force of the cushioning material (34) causes the receiving head (35) to slightly bend. Receiving head (35)
When the cleaning surface (1a) of the substrate (1) is supported by the substrate chuck (6), the substrate chuck (6) expands as described above, and the substrate (1) is
It becomes free from the self-aligning clamp groove (4) of (6) and is placed only on the receiving head (35). In this state, the substrate receiving operation cylinder (31) is operated to project the substrate (1) above the substrate chuck (6) while the substrate (1) is placed,
The substrate (1) is picked up by the transfer robot (C).

The transfer robot (C) once returns to the home position and is transferred to the unloader (D). During transfer, the ultraviolet ray generating lamp, which is the static eliminator (J), is installed at the home position. The static electricity of the substrate (1) generated by the friction with the indoor air is eliminated.

When the charge-removed substrate (1) is transferred to the unloader (D) by the transfer robot (C), it is inserted into the empty portion of the cassette (54) installed in the unloader (D), and thus 1 Cleaning of one side (back side) of the substrate (1) is completed.

As described above, the cleaning surface (1a) of the substrate (1)
The cleaning method was not limited to this, but the cleaning method is not limited to this.
Depending on the type of (1) or the request of the site, when cleaning the substrate (1) with the cleaning surface (1a) facing upward as shown in FIGS. 12 to 17, or cleaning both front and back surfaces as shown in FIGS. In some cases. This case will be briefly described.

The second embodiment is a half size cylindrical brush.
In the example in which (3) is arranged above the substrate (1), the cylindrical brush (3)
Is erected between the brush elevating arms (37), and the brush elevating arm (37) has a contact height adjusting unit (5) as in the first embodiment.
3) is provided. And the paddle (7) is the substrate (1)
Which is disposed below the lower surface of the substrate (1) [pattern surface (1
b)] is sprayed with fluid (2). In this case, since the cylindrical brush (3) is not housed in the rotating upper housing (10), the weight of the rotating upper housing (10) can be reduced. The other mechanism is the same as that of the first embodiment.

The operation of the second embodiment will be described. The cylindrical brush (3) stands by above the substrate (1) as described above, and the brush lifting arm for supporting the cylindrical brush (3) at both ends. (3
When the cleaning liquid is sprayed from the cleaning liquid spraying nozzle (46), the cleaning surface (1) rotates and rotates while the substrate (1) rotates by contacting the cleaning surface (1a) of the substrate (1). Wash 1a). Since the cleaning surface (1a) of the substrate (1) in the present invention is the upper surface of the substrate (1), the cleaning liquid flows from the center on the cleaning surface (1a) of the substrate (1) toward the outer peripheral direction. Are accumulated on the cleaning surface (1a), the supply amount of the cleaning liquid may be smaller than that in the case of cleaning the lower surface.

Self-aligning clamp groove in the second embodiment
(4) is a very slight claw body (5) that locks to the upper tapered portion (1d) of the peripheral edge of the substrate (1) and the lower tapered portion (1c) of the peripheral edge of the substrate (1).
The cleaning surface (1a) of the substrate (1) has a cylindrical brush because it is engaged with the whole and further comprises a lower peripheral edge locking surface (4b) extending below the lower tapered portion (1c). Even if (3) is strongly pressed and washed, the lower tapered portion of the peripheral edge of the substrate (1) is only strongly pressed against the peripheral lower engaging surface (4b), and the substrate (1) is clamped by the clamp groove (4 ) Does not fall out.

The third embodiment is a half size cylindrical brush.
18 to 22 show an example in which (3) is disposed so as to face each other vertically and both surfaces of the substrate (1) are cleaned. In this case, the clamp of the substrate chuck (6) for double-sided cleaning is made thinner than the substrate (1), and the self-aligning clamp groove (4) is formed on the inner circumference of the clamp, The taper portion of the periphery of the substrate (1) is chucked by the substrate locking claws (5a), (5b) of the body (5). Also in this case, of course, a brush mounting member that supports the vertically movable cylindrical brushes (3a) (3b)
(39) and brush lifting arm (37) have contact height adjuster (5
3) is provided to adjust the contact state of the cylindrical brushes (3a) and (3b) with the substrate (1).

After the cleaning is completed, when the substrate (1) is taken by the transfer robot (C), the substrate (1) is transferred to the unloader (D) by the transfer robot (C), and the cassette installed in the unloader (D). The double-sided cleaning of the substrate (1) is completed by being inserted into the empty portion of (54). In this case, since the both surfaces of the substrate (1) are irradiated with ultraviolet rays, the static eliminators (J) are installed on both sides of the substrate (1).

[0055]

As described above, according to the apparatus of the present invention, when cleaning a substrate whose substantially entire circumference is held by the substrate chuck, the rotating cylindrical brush surface contacts from the central portion to the end portion of the cleaning surface. The contact height adjustment unit adjusts the contact height of the rotating cylindrical brush with respect to the cleaning line from the center to the end of the substrate, so that the substrate will not bend or rotate with the substrate during backside cleaning. Even if the parallelism with the cleaning brush is inadequate, the support height of the rotating cylindrical cylinder brush with respect to the cleaning line on the cleaning surface of the substrate is adjusted so that the parallelism is always maintained. Therefore, the rotating cylindrical brush comes into contact with the brush evenly, and there is an advantage that the entire cleaning surface can be uniformly cleaned.

[Brief description of drawings]

FIG. 1 is an overall plan view of a scrubbing device according to the present invention.

FIG. 2 is a sectional view of a cleaning unit of a scrubbing device according to the present invention.

FIG. 3 is a cross-sectional view in the direction perpendicular to FIG.

FIG. 4 is a plan view of the cleaning unit according to the present invention when the cleaning unit is opened.

FIG. 5 is a plan view of the cleaning unit according to the present invention in a contracted state.

FIG. 6 is an enlarged sectional view showing the relationship between the substrate and the clamp groove in the first embodiment of the invention.

FIG. 7 is a partially enlarged view of the first embodiment of the contact height adjusting portion of the present invention.

FIG. 8 is a partially enlarged view of the second embodiment of the contact height adjusting portion of the present invention.

FIG. 9 is a schematic cross-sectional view showing a state of the cleaning unit before substrate supply in the first embodiment of the present invention.

FIG. 10 is a schematic cross-sectional view of the cleaning unit during substrate supply in the first embodiment of the present invention.

FIG. 11 is a schematic cross-sectional view showing a cleaning state of the cleaning unit in the first embodiment of the present invention.

FIG. 12 is a partially enlarged front view of the second embodiment of the present invention.

FIG. 13 is a partially enlarged cross-sectional view in the direction perpendicular to FIG.

FIG. 14 is a schematic cross-sectional view of the cleaning unit during substrate supply in the second embodiment of the present invention.

FIG. 15 is a schematic cross-sectional view of the cleaning unit according to the second embodiment of the present invention when a substrate is supplied.

FIG. 16 is a schematic cross-sectional view showing a cleaning state of the cleaning section in the second embodiment of the present invention.

FIG. 17 is an enlarged sectional view showing the relationship between the substrate and the clamp groove in the second embodiment of the present invention.

FIG. 18 is a schematic cross-sectional view showing a double-sided cleaning state of the cleaning section in the third embodiment of the present invention.

FIG. 19 is a schematic cross-sectional view showing a state before a substrate is supplied to a cleaning unit in double-sided cleaning according to the present invention.

FIG. 20 is a schematic cross-sectional view after a substrate is supplied to a cleaning unit in double-sided cleaning according to the present invention.

FIG. 21 is a schematic cross-sectional view showing the cleaning state of the cleaning section in double-sided cleaning according to the present invention.

FIG. 22 is an enlarged cross-sectional view showing the relationship between the substrate and the clamp groove on the double-sided cleaning surface of the present invention.

FIG. 23 is a block circuit diagram of a displacement sensor used in the present invention.

FIG. 24 is a schematic view of a conventional cleaning device.

FIG. 25 is a sectional view of another conventional example.

[Explanation of symbols]

(1) ... Substrate (1a) ...
Cleaning surface (1b)… Surface opposite to cleaning surface (2)… Fluid (3)… Cylindrical brush (4)… Clamp groove (5)… Board locking claw (6)… Board chuck (8) … Rotating mechanism (53)…
Contact height adjuster (L) ... Cleaning line

 ─────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Toshinori Konaka 3-6-16 Yanaka, Taito-ku, Tokyo M Setek Co., Ltd. (72) Inventor Tsuyoshi Murai 3-6-16 Yanaka, Taito-ku, Tokyo M SETEK Co., Ltd.

Claims (3)

[Claims] 1. A substrate locking claw body in which a clamp groove into which a peripheral edge of a substrate is fitted is recessed, and a cleaning-side locking ridge portion forming the clamp groove is located inside a cleaning surface of the substrate. Rotating cylinder brush for cleaning the substrate cleaning surface by contacting the substrate chuck with the substrate cleaning area from the central portion to the edge portion, and the rotating cylinder for the cleaning line from the central portion to the edge of the substrate. A scrubbing device comprising a contact height adjusting unit for adjusting a contact height of a brush and a rotating mechanism for rotating the substrate chuck in a plane parallel to the substrate. 2. The scrubbing device according to claim 1, wherein the lower peripheral edge locking surface extends below the lower surface of the substrate. 3. The scrubbing device according to claim 1, wherein a static eliminator for removing static electricity charged on the cleaned substrate is installed in the substrate cleaning unit and / or the substrate transfer path. apparatus.