JP3259745B2 - Substrate chuck structure of scrubbing device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement in a substrate chuck structure of a scrubbing apparatus for chucking only a peripheral portion of a substrate and cleaning one or both surfaces of the substrate with a cylindrical brush at a time.

[0002]

2. Description of the Related Art At present, semiconductors are changed from super LSI to ultra super LS.
The surface is densely formed with extremely fine circuits formed by applying ultra-precision photoengraving technology. Therefore, if extremely fine dust adheres to the surface, it appears as a circuit failure of the semiconductor circuit, and the yield is reduced. As described above, as semiconductors become more precise, their manufacturing costs increase steadily, and improvement in yield greatly contributes to cost reduction. Dust removal measures are a very important problem.

[0003] At the semiconductor manufacturing site, at present, the cleaning of the front surface for forming a fine circuit is extremely strictly controlled, but the cleaning of the rear surface is performed so strictly. is not. However, it has been found that the back surface of the semiconductor substrate is contaminated by contacting the suction base of the equipment and the handling device in each process, and this is one of the causes of contamination on the front surface side.

Therefore, recently, the back surface of the semiconductor substrate has been sufficiently cleaned, but has the following problems.

(1) On the surface (100b) of the semiconductor substrate (100),
As described above, since the fine circuits are densely formed, the front surface (100b) cannot be used for back surface cleaning. Therefore, only the peripheral portion of the semiconductor substrate (100) needs to be chucked with the gripping claws (101), and the semiconductor substrate (100) must be cleaned without supporting the central portion.

A gripper for gripping an end of a semiconductor substrate (100)
(101) is generally thin and small as can be seen from FIG. 21, and chucks only a very small part of the peripheral portion of the semiconductor substrate (100). In this case, when cleaning the substrate (100), a load is applied only to the contact portion with the gripping claws (101), so that there is a problem that a large force cannot be applied when cleaning the back surface.

Therefore, it is most preferable to hold the entire periphery of the semiconductor substrate (100). In this case, the substrate chuck must rotate while holding the substrate (100). At present, the scrubbing device cannot chuck the entire circumference of the substrate (100) due to conditions that must be as light as possible and that the diameter does not expand due to the centrifugal force during rotation. Was.

[0008]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems of the prior art, and its object is to make it possible to chuck the substrate all around, and to apply centrifugal force during rotation. Accordingly, the diameter of the substrate chuck is not increased, and the weight of the substrate chuck is reduced.

[0009]

According to a first aspect of the present invention, there is provided an apparatus according to the first aspect, wherein a clamp groove (4) into which substantially the entire periphery of the substrate (1) is fitted is recessed in the inner periphery thereof. The substrate chuck (6) is disposed around the periphery of (1) so as to be freely expandable and contractable, and accommodates the substrate (1) in its clamp groove (4) and rotates together with the substrate (1). A chuck expanding / contracting mechanism (Ea) that is held independently and is capable of radially expanding and contracting the chuck divided body (6a), and is installed on the substrate chuck (6), and the substrate ( Substrate chuck when chucking around 1)
The reduced state holding mechanism (Eb) for holding the reduced state of (6) and the reduced state holding mechanism (Ea) of the substrate chuck (6) which are independently held apart from the substrate chuck (6) are operated or actuated. And a lock mechanism (H) for releasing ”.

Accordingly, even when only the peripheral edge of the substrate (1) is held, the rotating substrate chuck (6) is provided with only a minimum mechanism for preventing the substrate chuck (6) from expanding during rotation. The weight of the rotating part can be minimized.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The method and the apparatus according to the present invention will be described below together with embodiments. In the drawings, a semiconductor wafer is described as an example of the substrate (1) .However, the present invention can be applied to other thin plates, for example, a glass plate, alumina, a quartz plate, a ceramic plate, a sapphire plate, an aluminum disk, and the like. Of course. The scrubbing device (A) shown in FIG.
Transfer robot for loading and unloading (1) to and from the washing unit (E)
(C), a loader (B) for supplying the substrate (1) to the transfer robot (C), and an unloader for storing the cleaned substrate (1)
(D), a control section (F) for controlling the entire apparatus, a cleaning section (E) for cleaning the substrate, and an apparatus main body (G) on which these apparatuses are mounted.

The loader (B) sets the unprocessed substrate (1) stored in the cassette (54), and moves up or down one step at a time in accordance with the removal of the transfer robot (C).
(1) is moved to a predetermined position. Unloader
(D) is reversely cleaned by the cleaning unit (E),
Cassette (54) for storing substrate (1) transferred in (C)
For mounting the substrate (1) according to the supply of the substrate (1).
This is for raising or lowering step by step to prepare an empty storage section of the cassette (54). Transfer robot (C)
Removes the substrate (1) from the loader (B) and supplies it to the cleaning unit (E), and removes the substrate (1) whose back surface has been cleaned in the cleaning unit (E) from the cleaning unit (E), and unloads the substrate (1). D). Since the loader (B), unloader (D) and transfer robot (C) have known structures, their details are omitted.

FIGS. 2 and 3 are cross-sectional views of the cleaning section (E) according to the present invention, in which a substrate chuck (6) is slidably mounted on a rotating upper housing (10) via a slider (9). . The substrate chuck (6) has a ring shape and is divided into three parts, each of which is (6a). Of course, the number of divisions is not limited to three, and may be two or three or more. As shown in FIGS. 4 and 5, the chuck diameter of the substrate chuck 6 can be enlarged and reduced. A self-aligning clamp groove (4) is formed on the inner periphery of the substrate chuck (6) so that the entire periphery of the thin substrate (1) can be chucked.

FIG. 6 is a partially enlarged sectional view of the self-aligning clamp groove (4). The self-aligning clamp groove (4) is formed on the inner peripheral side surface of the substrate chuck (6). Self-aligning clamp groove (4)
Is an inner surface (4a) contacting the outer peripheral surface of the substrate (1), and a claw body located thereunder and supporting a lower tapered surface of the substrate (1).
(5) and an upper slide inclined surface (4b) located above the upper surface. In the embodiment of FIG. 6, the shape of the upper slide inclined surface (4 b) is formed by a curved surface whose cross section is formed by connecting slight convexities and concaves with gentle curves, and has an S-shaped cross section. And is smoothly connected to the inner surface (4a). As a result, the periphery of the substrate (1) fitted into the self-aligning clamp groove (4) slides very slightly along the upper slide inclined surface (4b), and the inner surface (4a)
And the claw body (5) holds the tapered portion of the peripheral edge. The claw body (5) only slightly engages the lower tapered surface of the periphery of the substrate (1), and the lower surface of the claw body (5) protrudes from the cleaning surface (1a) which is the lower surface of the substrate (1). Not to be.

A plurality of fluid discharge holes (11) are formed at predetermined intervals in the vicinity of the inner periphery of the substrate chuck (6), and the direction of drilling is in the tangential direction of the self-aligning clamp groove (4). It has become. The drilling position of the fluid discharge hole (11) is formed so as to be inclined downward from the inner side surface to the lower surface of the substrate chuck (6), so that the fluid flowing out onto the back pressure surface (1b) of the substrate (1) can be smoothly fluidized. The liquid is smoothly discharged downward through the discharge hole (11).

Next, the chuck expansion / contraction mechanism (Ea) of the substrate chuck (6) will be described. The substrate chuck (6) is connected to each other by an expansion / contraction guide (12) fixed to the roller mounting block (70b), and the slide portion (12a) of the expansion / contraction guide (12) is adjacent to the roller of the substrate chuck (6). The expansion cylinder head (14) is slidably held in a slide hole (71a) drilled in the mounting block (70a), and extends between expansion rollers (13) provided on a pair of adjacent substrate chucks (6). By inserting the substrate chuck as shown in FIG.
(6) Expand the interval between each other. At this time, slide part
(70a) will move in the direction of exiting from the slide hole (71a).

The expansion and contraction slide of the substrate chuck (6) is performed via sliders (9) disposed on the lower surface of the substrate chuck (6). The expansion of the chuck diameter of the substrate chuck (6) is performed by the expansion cylinder head (14) as described above.
Cylinder for chuck diameter contraction (15) located on the opposite side of (14)
Done by That is, the chuck diameter shrinking cylinder (1
By actuating 5) to press the substrate chuck 6, the slide portion 12a is pushed back into the slide hole 71a, and the entire substrate chuck 6 is closed as shown in FIG. . At this time, the expansion cylinder head (14) is being pulled back. Therefore, in this case, the chuck expansion / contraction mechanism (Ea) includes the expansion roller (13) and the expansion cylinder head (1).
4), slider (9) and cylinder for chuck diameter reduction (15)
Will be composed by When the substrate chuck (6) is closed as described above and the peripheral portion of the substrate (1) is clamped in the self-aligning clamp groove (4), one of the expansion and contraction guides (12) is locked by the locking mechanism (H). The substrate chuck (6) is not opened by the centrifugal force during rotation. The lock mechanism (H) will be described later.

The rotating upper housing (10) is connected to a rotating cylinder (17) via a rotating head cover (16). A driven pulley (18) is attached to the rotary cylinder (17), and is connected to a drive pulley (20) of a substrate rotation drive motor (21) via a drive belt (19). Thus, the rotational force of the substrate rotation drive motor (21) is transmitted to the driven pulley (18), and the substrate chuck (6) rotates. A positioning cam (22) is attached to the driven pulley (18), the positioning cam follower (23) fits into the groove of the positioning cam (22), and the substrate chuck (6) is always forcibly held at a predetermined position. However, in order to ensure that the positioning cam follower (23) always fits into the groove of the positioning cam (22), the stop position is always detected by the positioning sensor (24). Have been. Since this means is also a conventional means, details are omitted.

Reference numeral (24) denotes a fixed housing fitted to the outside of the rotary cylinder (17), which rotatably holds the rotary cylinder (17) via a bearing. (25) is a fixed liquid-proof cover provided on the upper end of the fixed housing (24). Lower base plate
A pillar (27) is erected on (26), and a fixed block (29) is fixed to the upper end thereof. (28) is a fixed head cover attached to the upper end of the fixed block (29) and covering the rotary head cover (16) from above.

A substrate receiving cylinder rod (30) is slidably inserted into the center of the fixed block (29), and a substrate receiving operating cylinder installed below the fixed block (29).
By (31), it can be driven up and down freely.
A base bearing intermediate member (32) having a V-shaped cross section is attached to the upper end of the substrate receiving cylinder rod (30), and a substrate receiving rod (33) stands upright from the base bearing intermediate member (32). In the present embodiment, the number of the substrate receiving rods (33) is four, and the receiving head (35) is fitted to the end of the substrate receiving rod (33) via the cushioning material (34).

A liquid receiving member 36 has a V-shaped cross section and is disposed below the cylindrical brush 3. (37) is a fixed block (2
A brush elevating bar slidably inserted into 9), a brush elevating cylinder (38) is attached to the lower end of the brush elevating bar (37), and the brush elevating bar (37) is adapted to elevate and lower. . A brush attachment member (39) is attached to an upper end of the brush lifting bar (37), and a cylindrical brush (3) is rotatably held at an upper end of the brush attachment member (39).

The cylindrical brush (3) is rotatably held around a rotating shaft (40), and (41) is attached to one end of the rotating shaft (40). A brush drive belt (42) is suspended from the brush driven pulley (41), and is connected to the brush drive pulley (43) of the brush drive motor (44).
The rotation force of 3) is transmitted to the cylindrical brush (3).
In the present embodiment, a buff is used as the cylindrical brush (3) (of course, the buff is not limited to this, and a brush having a long bristle or a bristle having a short bristle may be used according to the intended use. ), So that it is sufficiently hydrated.

Reference numeral (45) denotes a drain pipe provided in the fixed block (29), which has a function of discharging fluid dropped on the fixed block (29). A cleaning liquid injection nozzle (46) is connected to a cleaning pipe (47) provided in the fixed block (29), and injects the cleaning liquid from the tip of the cleaning liquid injection nozzle (46) toward the cylindrical brush (3). It has become. As the cleaning liquid, pure water is used in this embodiment.

Reference numeral (7) denotes a back pressure paddle disposed directly above the cylindrical brush (3), which rises and lowers toward the substrate (1), and has a fluid ejection port (7a) formed at the center thereof. Have been. The fluid ejection port (7a) may be provided with a single hole at the center of the substrate (1) directly above the cylindrical brush (3).
Many may be formed in a line along the longitudinal direction of (3),
It may be formed on a slit. In this embodiment, the back pressure paddle
A slit-shaped fluid ejection port (7a) is formed on the lower surface of (7), and the back pressure fluid flows out along the groove-shaped fluid ejection port (7a). The back pressure fluid may be an inert gas such as nitrogen gas or a liquid such as pure water.

(49) is a displacement sensor mounted in the back pressure paddle (7), which is inputted to one terminal of the comparator (50),
The amount of displacement of the substrate (1) compared with the reference voltage
0) is input to the driver (51) and the regulator (52)
Back pressure fluid blown out from the fluid ejection port (7a) by driving
The blowing pressure of (2) is adjusted. (53) is a gas supply source,
The fluid (2) is supplied to the regulator (52) at a constant pressure. FIG. 20 shows the block circuit.

Next, a reduced state holding mechanism (Eb) and a lock mechanism
(H) will be described in detail. The contracted state holding mechanism (Eb) holds the guide lock portion (12c) of the expansion / contraction guide (12) to prevent expansion due to centrifugal force during rotation of the substrate chuck (6). A joint (6a) of the substrate chuck (6) is provided with a pair of roller mounting blocks (70a) (70b), and the locking block (70c) is integrally connected to the roller mounting block (70b). In addition, an insulating groove (68) is formed between the roller mounting block (70b) and the lock block (70c). Lock shaft body (67) at the upper end of the rotating upper housing (10)
And penetrates through the opening side of the lock block (70c). The inverted U is located above the lock block (70c).
The actuating lever (61)
The lock shaft (66) is inserted through the lock horizontal shaft (62) arranged horizontally in 1), and the height of the lock shaft (66) is adjustable with the adjustment nut (62a). are doing. The lock shaft (66) and the lock shaft body (67)
And has become one.

A lock lever mounting bar (62b) is further fixed to the lock horizontal shaft (62), and rotates with the rotation of the lock shaft (62). At the lower end of the lock lever mounting bar (62b), a lock roller (63) is rotatably mounted on a roller mounting shaft (64) so as to press the opening side of the lock block (70c). .

The lock mechanism (H) is provided with the reduced state holding mechanism.
It activates or releases the function of (Eb). A locking block (72) is installed on a block mounting base (65) arranged around the rotating upper housing (10), and a locking groove (72a) is recessed on the side surface, and the locking block is provided. Bolt (73) protruding from the lower part of the block (70c)
Is fitted. A lever operating block (74) is installed above the locking block (72), and the lever operating block (74) is installed so as to be able to move up and down, and a lock cylinder (60) is mounted. Stop block (72)
Is mounted with a cylinder rod (60a) of a lock cylinder (60) so as to move up and down the lever operation block (74). Lever operating groove on lever operating block (74)
(74a) is formed, and the operation lever (61) is fitted therein. The locking block (72) has a lifting guide (7
5) is erected, and the lever operation block (74) is slidably inserted therethrough, and serves as a guide when the lever operation block (74) is moved up and down.

Next, the operation of the present invention will be described with reference to FIG. 1 and FIGS. The loader (B) is provided with a cassette (54) containing a large number of substrates (1).
An empty cassette (54) is installed in (D). Control unit (F)
To operate the transfer robot (C) to take out one substrate (1) from the loader (B). The removed substrate (1) is supplied to the cleaning unit (E) by the transfer robot (C). As shown in FIG. 9, the substrate chuck (6) is moved by the action of the expansion cylinder head (14). The substrate (1), which has been expanded as shown in FIG. 4 and is clamped on the periphery of the substrate (1) by the transfer robot (C), is inserted into the expanded substrate chuck (6).

At this time, the substrate receiving rod (33) is projected above the self-aligning clamp groove (4) of the substrate chuck (6) by the action of the substrate receiving operating cylinder (31), and the substrate (1) is cleaned. surface
(1a). When the substrate (1) is placed on the receiving head (35) of the substrate receiving rod (33), the transfer robot (C) separates from the periphery of the substrate (1) and receives the substrate (1). 35) Install on top. Next, the board receiving working cylinder
(31) operates in reverse to lower the substrate (1) to a position substantially matching the self-aligning clamp groove (4) of the substrate chuck (6), and stops at this point. FIG. 6 shows an enlarged view of this state. As shown by the phantom line in FIG. 6, the substrate (1) has a self-aligning clamp groove.
It is held slightly above by the inner side surface (4a) of (4), and when the substrate chuck (6) is closed by the action of the chuck diameter shrinking cylinder (15), the periphery of the substrate (1) Part contacts the upper slide inclined surface (4b) of the self-aligning clamp groove (4), moves downward along the upper slide inclined surface (4b), and the peripheral portion of the substrate (1) moves to the inner surface (4a). It fits exactly into the At this time, the claw body (5) of the substrate chuck (6) is
The lower surface of the substrate chuck (6) does not protrude below (1a) of the substrate (1) because it is in contact with the lower surface of the tapered portion on the periphery of (1).

When the self-centering clamp of the board (1) by the self-centering clamp groove (4) is completed, the board receiving operation cylinder (3
1) operates further and lowers the board receiving rod (33),
Keep away from the cleaning surface (1a) of (1). During this time,
The transfer robot (C) returns to the home position, and waits for completion of the cleaning of the substrate (1), and is ready to take out the cleaned substrate (1) from the cleaning unit (E). When the transfer robot (C) moves to the home position from above the substrate (1), the back pressure paddle
(7) descends from above and stops just above the back pressure surface (1b) of the substrate (1). Back pressure fluid (2)
And apply back pressure on the back pressure surface (1b) of the substrate (1). On the other hand, the cylindrical brush (3) waits below the substrate (1), is lifted upward by the operation of the brush lifting cylinder (38), and comes into contact with the cleaning surface (1a) of the substrate (1). At the same time, the cleaning liquid is sprayed from the cleaning liquid spray nozzle (46) toward the cylindrical brush (3) to wet the cylindrical brush (3). Cylindrical brush (3)
Is rotated by the rotation of the brush drive motor (44) to clean (1a). At the same time as the cleaning of the cylindrical brush (3), the rotating upper housing (10) is rotated by the substrate rotating drive motor (21), and the substrate (1) chucked by the substrate chuck (6) is rotated in its plane. . As a result, the cleaning surface (1
Since a) is in line contact with the cylindrical brush (3) and rotates within the plane, the entire surface is cleaned at a high speed by the cylindrical brush (3).

As shown in FIG. 6, the cylindrical brush (3) is a substrate (1).
Extending beyond the outer periphery of the
(5) does not protrude below the cleaning surface (1a).
The entire cleaning surface (1a) can be cleaned with almost no remaining (1a). The back pressure fluid (2) injected from the back pressure paddle (7) may be a gas such as nitrogen gas as described above, or may be a liquid such as pure water. In the case of liquid, a plurality of fluid discharge holes (11) are opened along the self-aligning clamp groove (4), which are opened on the inner side surface (4a) and communicate with the lower surface of the substrate chuck (6). When the substrate chuck (6) rotates, the back pressure fluid accumulated on the substrate (1) flows out below the substrate chuck (6) through the fluid discharge hole (11) and accumulates on the substrate (1). It will not be. The direction in which the fluid discharge hole (11) is formed is an elliptical or elliptical shape extending in the tangential direction of the self-aligning clamp groove (4).

Next, the operation of the lock mechanism (H) will be described. When the substrate chuck (6) is rotated during the cleaning, the centrifugal force causes the substrate chuck (6) to move in the radial direction and to move in a direction to increase the chuck diameter of the self-aligning clamp groove (4). Therefore, after the chuck diameter of the substrate chuck (6) is reduced by the action of the chuck diameter reducing cylinder (15),
Activate the lock cylinder (60) to operate the lever operation block (7
4) Pull up and rotate the operating lever (61) engaged with the lever operating groove (74a) upward. Then, the roller mounting shaft (64) moves clockwise in the drawing via the lock horizontal shaft (62) fixed to (64), and the lock roller (63) strongly presses the upper surface of the locking block (70c). Then, the interval between the locking grooves (69) is reduced. Then, the guide lock portion (12c) inserted into the lock through-hole (71c) is thereby strongly clamped. When the lock cylinder (60) is operated to pull up the lever operation block (74), the locking groove (72a)
Since the locking bolt (73) is engaged with the
(6) No excessive bending force is applied.

The lock roller (63) is provided with a lock block (70).
The lock state of the guide lock portion (12c) is maintained by the elastic force of c). When the substrate chuck (6) rotates in this state, the operating lever (61) is moved to the lever operating groove (74).
a), the locking bolt (73) is separated from the locking groove (72a), and the substrate (1) rotates together with the substrate chuck (6) while maintaining the locked state shown in the figure. Therefore, lock cylinder
(60) and the member attached to the lock cylinder (60) will not rotate. The lock mechanism (H) rotates together with the substrate chuck (6) while maintaining the locked state. However, as described above, only the part necessary for locking is mounted on the substrate chuck (6), so the substrate chuck (6) is ) Can be made very light, and the rotation of the substrate chuck (6) is facilitated.

In this way, the cleaning surface (1a) of the substrate (1) is cleaned by the cylindrical brush (3). The displacement sensor (49) provided on the back pressure paddle (7) is used for cleaning the substrate (1). ) And displacement sensor (49)
Between the board (1) and the displacement sensor
(49) so that the flow rate of the back pressure fluid (2) ejected from the back pressure paddle (7) toward the back pressure surface (1b) is feedback-controlled so that the distance to the back pressure paddle (7) is constant. In addition, the contact pressure of the cylindrical brush (3) at the center of the substrate (1) can be sufficiently taken, so that insufficient cleaning does not occur.

Looking at the relationship between the back pressure paddle (7) and the cylindrical brush (3), as shown in FIG.
a) is elongated along the cylindrical brush (3) so as to apply a linear back pressure. As a result, only the peripheral edge is held by the self-aligning clamp groove (4), and the cleaning surface (1a) of the substrate (1) held in a floating state is cleaned with a cylindrical brush (3) by applying pressure. Can be done. substrate
When the cleaning of (1) is completed, the rotation of the substrate chuck (6) is stopped, but it is necessary that the operating lever (61) stops exactly at the position of the lever operating block (74). , Rotating upper housing (10) with positioning sensor (23a)
The rotation position of the lever (61) is checked, and the stop position of the operating lever (61) is accurately controlled by fitting the positioning cam follower (23) into the positioning cam (22).

The operating lever (61) is a lever operating block (74)
When the operation lever (61) fits into the lever operation groove (74a) at the same position, the lock cylinder (60) is reversely operated to lower the lever operation block (74), and the lever operation groove (74) is lowered. 74a), the operating lever (61) refitted is pressed down and lowered, and the lock lever mounting bar (62b) is moved through the lock horizontal shaft (62) fixed to the operating lever (61). The lock roller (63) is detached from the upper surface of the lock block (70c) by rotating counterclockwise in the figure. As a result, the locking groove (69) expands due to the resilience of the locking block (70c), and the guide locking portion (12c) opens the locking through hole (71).
It is released from the tightening of c) and can slide freely.

Thereafter, the expansion cylinder head (14) is reactivated and inserted between the pair of expansion rollers (13) to open the gap (6a) as shown in FIG. Inside surface (4a)
The substrate (1) is freed from the self-aligning clamp groove (4) by expanding the diameter of the substrate.

Next, the operation after the stop of the rotating upper housing (10) will be described. When the rotating upper housing (10) stops, the brush lifting cylinder (38) operates in reverse and descends, and the substrate receiving operation cylinder (31) is moved to the cleaning surface (1a) of the substrate (1).
Away from At the same time, the brush drive motor (44) stops, and the rotation of the substrate receiving rod (33) stops.

On the other hand, the back pressure paddle (7) stops the ejection of the back pressure fluid (2), moves upward, and stops applying the back pressure to the substrate (1). Of course, the injection of the cleaning liquid injection nozzle (46) is also stopped. After the separation of the cylindrical brush (3) from the substrate (1) and the removal of the back pressure paddle (7), the substrate receiving operation cylinder (31)
Is reactivated to raise the substrate receiving rod (33) so that the buffer material (34) at the tip thereof comes into contact with the cleaning surface (1a) of the substrate (1).
At this time, the receiving head (35) is slightly bent by the spring force of the cushioning material (34). When the cleaning surface (1a) of the substrate (1) is supported by the receiving head (35), the substrate chuck is moved as described above.
(6) is expanded, and the substrate (1) is released from the self-aligning clamp groove (4) of the substrate chuck (6), and is placed on only the receiving head (35). In this state, the substrate receiving operation cylinder (31) is operated, the substrate (1) is protruded above the substrate chuck (6) with the substrate (1) placed thereon, and the substrate (1) is transferred to the transfer robot (C). Take over.

When the substrate (1) is transferred to the unloader (D) by the transfer robot (C), the substrate (1) is inserted into an empty portion of the cassette (54) installed in the unloader (D). The cleaning of one side (back side) of (1) is completed.

In some cases, cleaning of the front and back surfaces is required depending on the type of the substrate (1) or the request of the site. The substrate chuck (6) for double-sided cleaning has its clamp part formed thinner than the substrate (1),
A self-aligning clamp groove (4) is formed on the inner periphery of the clamp part, and the tapered portion of the peripheral edge of the substrate (1) is chucked by the substrate locking claws (5a) and (5b) of the claw body (5). It is supposed to be.

Brushes (3a) which can be moved up and down on both sides of the substrate (1)
(3b) comes into contact, and both surfaces of the substrate (1) are simultaneously cleaned by the brushes (3a) and (3b). Therefore, for double-sided cleaning, replace the back pressure paddle (7) with the upper brush.
The point (3b) is different from the first embodiment.

After completion of the cleaning, when the substrate (1) is picked up by the transfer robot (C), the substrate (1) is transferred to the unloader (D) by the transfer robot (C), and the cassette mounted on the unloader (D) is set. This is inserted into the empty portion of (54), whereby the double-sided cleaning of the substrate (1) is completed.

[0045]

As described above, the apparatus according to the present invention can chuck the entire circumference of the substrate, so that the substrate is not partially damaged even when a large load is applied to the substrate during cleaning.
In addition, the rotation mechanism is constituted only by a mechanism necessary for rotation, and is very simple and light. Moreover, the diameter of the substrate chuck does not increase due to centrifugal force at the time of rotation, so that the substrate can be scrubbed safely and securely.

[Brief description of the drawings]

FIG. 1 is an overall plan view of a scrubbing device according to the present invention.

FIG. 2 is a sectional view of a cleaning unit of the scrubbing apparatus according to the present invention.

FIG. 3 is a cross-sectional view in a direction perpendicular to FIG. 2;

FIG. 4 is a plan view when the cleaning unit according to the present invention is expanded.

FIG. 5 is a plan view of the cleaning unit according to the present invention in a contracted state.

FIG. 6 is an enlarged sectional view showing a relationship between a substrate and a clamp groove in the present invention.

FIG. 7 is a cross-sectional view of a body part of the cleaning unit according to the present invention.

FIG. 8 is a partial plan view of a lock mechanism according to the present invention.

FIG. 9 is a front view of FIG. 8;

FIG. 10 is a partial side view of the lock mechanism according to the present invention before operation.

FIG. 11 is a partial side view after the lock mechanism of the present invention is operated.

FIG. 12 is a schematic sectional view showing a state before a substrate is supplied to a cleaning unit according to the present invention.

FIG. 13 is a schematic cross-sectional view of the cleaning unit according to the present invention when supplying a substrate.

FIG. 14 is a schematic sectional view showing a cleaning state of a cleaning unit according to the present invention.

FIG. 15 is a schematic cross-sectional view showing a cleaning unit in a double-sided cleaning state according to the present invention.

FIG. 16 is a schematic cross-sectional view showing a state before a substrate is supplied to a cleaning unit in double-side cleaning according to the present invention.

FIG. 17 is a schematic cross-sectional view after a substrate is supplied to a cleaning unit in double-side cleaning according to the present invention.

FIG. 18 is a schematic cross-sectional view illustrating a cleaning state of a cleaning unit in double-sided cleaning according to the present invention.

FIG. 19 is an enlarged cross-sectional view illustrating a relationship between a substrate and a clamp groove on a double-sided cleaning surface according to the present invention.

FIG. 20 is a block circuit diagram of a displacement sensor used in the present invention.

FIG. 21 is a schematic view of a conventional cleaning device.

[Explanation of symbols]

 (1) ... Substrate (1a) ... Cleaning surface (1b) ... Surface opposite to cleaning surface (2) ... Forming fluid for back pressure (3) ... Cylindrical brush

──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Toshinori Konaka 3-6-16 Yanaka, Taito-ku, Tokyo M-Setec Co., Ltd. (72) Inventor Go Murai 3-6-16-1 Yanaka, Taito-ku, Tokyo (56) References JP-A-4-150051 (JP, A) JP-A-63-89246 (JP, U) (58) Fields surveyed (Int. Cl. ⁷ , DB name) ) H01L 21/304 B08B 1/00-1/04

Claims (1)

(57) [Claims] A clamp groove into which substantially the entire circumference of the substrate fits is recessed in the inner periphery thereof, and is arranged around the substrate so as to be freely expandable and contractable. a substrate rotating chuck are held independently away from substrate chuck, a chuck decreasing mechanism that allows scaling the chuck divided body in the radial direction is disposed on the substrate chuck of the substrate by reducing the diameter A reduced state holding mechanism for holding the reduced state of the substrate chuck when the periphery is chucked, and independently held away from the substrate chuck,
A substrate chuck structure for a scrubbing device, comprising: a lock mechanism for operating or releasing a reduced state holding mechanism of the substrate chuck.