JP2001185522A - Apparatus for treating rectangular substrate - Google Patents
Apparatus for treating rectangular substrateInfo
- Publication number
- JP2001185522A JP2001185522A JP36818099A JP36818099A JP2001185522A JP 2001185522 A JP2001185522 A JP 2001185522A JP 36818099 A JP36818099 A JP 36818099A JP 36818099 A JP36818099 A JP 36818099A JP 2001185522 A JP2001185522 A JP 2001185522A
- Authority
- JP
- Japan
- Prior art keywords
- rectangular substrate
- holding member
- processing
- holding
- held
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 147
- 230000007246 mechanism Effects 0.000 claims abstract description 44
- 230000002093 peripheral effect Effects 0.000 claims description 34
- 238000003780 insertion Methods 0.000 claims description 27
- 230000037431 insertion Effects 0.000 claims description 27
- 238000005452 bending Methods 0.000 claims description 9
- 230000005540 biological transmission Effects 0.000 claims description 6
- 230000002265 prevention Effects 0.000 claims 1
- 238000000034 method Methods 0.000 description 14
- 238000004140 cleaning Methods 0.000 description 12
- 239000007788 liquid Substances 0.000 description 9
- 238000005192 partition Methods 0.000 description 3
- 101100219325 Phaseolus vulgaris BA13 gene Proteins 0.000 description 2
- 108010064539 amyloid beta-protein (1-42) Proteins 0.000 description 2
- 230000003749 cleanliness Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 230000001174 ascending effect Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Liquid Crystal (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning In General (AREA)
- Cleaning By Liquid Or Steam (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】この発明は矩形基板の上面と
下面とを処理するための処理装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a processing apparatus for processing the upper and lower surfaces of a rectangular substrate.
【０００２】[0002]
【従来の技術】たとえば液晶表示装置の製造工程におい
ては、ガラス製の矩形基板を高い清浄度で洗浄処理する
ことが要求される工程がある。矩形基板を洗浄処理する
方式としては、洗浄液中に矩形基板を浸漬するデイップ
方式や矩形基板を１枚ずつ洗浄処理する枚葉方式があ
り、最近では高い清浄度が得られるとともに、コスト的
に有利な枚葉方式が採用されることが多くなってきてい
る。2. Description of the Related Art For example, in a process of manufacturing a liquid crystal display device, there is a process that requires a glass rectangular substrate to be cleaned with high cleanliness. As a method of cleaning rectangular substrates, there are a dip method in which rectangular substrates are immersed in a cleaning liquid and a single-wafer method in which rectangular substrates are cleaned one by one. Recently, high cleanliness is obtained and cost is advantageous. In many cases, a single-wafer method is adopted.
【０００３】枚葉方式の１つとして矩形基板を搬送ロー
ラで搬送しながらその上下面を洗浄処理する処理装置が
知られている。このような搬送方式によると、通常、所
定間隔で配設された搬送ローラによって矩形基板の幅方
向両端部を保持しならが搬送するようにしている。[0003] As one of the single-wafer systems, there is known a processing apparatus for cleaning the upper and lower surfaces of a rectangular substrate while transporting the substrate by a transport roller. According to such a transport system, usually, both ends in the width direction of the rectangular substrate are held by transport rollers arranged at predetermined intervals, and the rectangular substrate is transported.
【０００４】しかしながら、矩形基板が大型化した場合
には幅方向中央部に生じるたわみが大きくなるから、た
わみが生じないようにするため、幅方向中途部の裏面の
１乃至複数個所を支持ローラで支持するようにしてい
る。However, when the size of the rectangular substrate is increased, the deflection occurring at the center in the width direction becomes large. Therefore, in order to prevent the deflection from occurring, one or a plurality of locations on the back surface of the intermediate portion in the width direction are supported by support rollers. I support them.
【０００５】[0005]
【発明が解決しようとする課題】ところで、矩形基板を
搬送ローラによって搬送しながら洗浄処理する方式の場
合、装置の全長が長くなるということがある。とくに、
矩形基板が大型化すると、その傾向が顕著になる。その
ため、クリーンルーム内に大きな設置スペースが必要に
なるということがある。By the way, in the case of a system in which a rectangular substrate is washed while being transported by a transport roller, the overall length of the apparatus may be long. In particular,
When the size of the rectangular substrate is increased, the tendency becomes remarkable. Therefore, a large installation space may be required in the clean room.
【０００６】そこで、搬送ローラを用いた搬送方式に代
えて矩形基板を回転させながらその上下面を洗浄処理す
るスピン処理方式とすることが考えられている。しかし
ながら、従来のスピン処理方式は、矩形基板を保持する
回転テーブルが回転モータの回転軸に取り付けられる基
部から４本のアームを放射状に突出させた構成であるた
め、この回転テーブルに保持された矩形基板の下面側に
処理ツールを進入させることができなかった。In view of this, instead of a transport system using a transport roller, a spin processing system for cleaning the upper and lower surfaces of a rectangular substrate while rotating it has been considered. However, the conventional spin processing method has a configuration in which a rotary table for holding a rectangular substrate has four arms radially protruding from a base attached to a rotary shaft of a rotary motor. The processing tool could not enter the lower surface of the substrate.
【０００７】そのため、回転テーブルに保持された矩形
基板の上面は確実に洗浄処理することができても、下面
は確実に洗浄処理することができないので、上面を洗浄
処理してから上下面を反転させ、再度上面を洗浄処理し
なければならないということになり、洗浄処理を能率よ
く行うことができないということがあった。Therefore, although the upper surface of the rectangular substrate held on the rotary table can be reliably cleaned, the lower surface cannot be reliably cleaned. As a result, the upper surface must be cleaned again, and the cleaning process cannot be performed efficiently.
【０００８】この発明は、基板の上下両面を同時に、し
かも良好に処理することができるようにした矩形基板の
処理装置を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a rectangular substrate processing apparatus capable of simultaneously and favorably processing both upper and lower surfaces of a substrate.
【０００９】[0009]
【課題を解決するための手段】請求項１の発明は、矩形
基板の上下面を処理する処理装置において、外形が円形
状をなし上記矩形基板が挿入される挿入孔及びこの挿入
孔に入れられた矩形基板の周縁部を保持する保持部を有
する保持孔が形成された保持部材と、この保持部材をほ
ぼ水平な状態で保持する支持手段と、この保持手段に保
持された上記保持部材を周方向に回転駆動する回転駆動
機構と、上記保持部材の保持部に保持された上記矩形基
板の上面を処理する上部処理機構と、上記保持部材の保
持部に保持された上記矩形基板の下面を処理する下部処
理機構とを具備したことを特徴とする矩形基板の処理装
置にある。According to a first aspect of the present invention, there is provided a processing apparatus for processing upper and lower surfaces of a rectangular substrate, wherein the outer shape of the rectangular substrate is circular, and the rectangular substrate is inserted into the insertion hole. A holding member having a holding hole for holding a peripheral portion of the rectangular substrate, supporting means for holding the holding member in a substantially horizontal state, and the holding member held by the holding means. A rotation drive mechanism that rotates in the direction, an upper processing mechanism that processes the upper surface of the rectangular substrate held by the holding portion of the holding member, and a lower surface of the rectangular substrate that is held by the holding portion of the holding member. And a lower processing mechanism.
【００１０】請求項２の発明は、上記保持手段は、軸線
をほぼ垂直にして回転可能に設けられ上端部を小径軸部
とすることで上記保持部材の周辺部を係合保持する段部
が形成された少なくとも３本の軸体からなることを特徴
とする請求項１記載の矩形基板の処理装置にある。According to a second aspect of the present invention, the holding means is rotatably provided with the axis substantially vertical and has a small-diameter shaft portion at its upper end to form a step portion for engaging and holding a peripheral portion of the holding member. 2. The apparatus for processing a rectangular substrate according to claim 1, wherein the apparatus comprises at least three shafts formed.
【００１１】請求項３の発明は、上記回転駆動機構は、
上記軸体の少なくと１本を回転駆動する駆動手段と、上
記軸体の回転を上記保持部材に伝達する動力伝達手段と
から構成されていることを特徴とする請求項２記載の矩
形基板の処理装置にある。According to a third aspect of the present invention, the rotary drive mechanism comprises:
3. The rectangular substrate according to claim 2, further comprising driving means for rotating at least one of said shafts, and power transmission means for transmitting rotation of said shaft to said holding member. In the processing unit.
【００１２】請求項４の発明は、上記回転駆動機構は、
上記軸体の少なくと１本を回転駆動する駆動手段と、上
記保持部材の外周面に形成された第１の歯車と、上記軸
体の小径軸部の外周面に形成され上記第１の歯車と噛合
する第２の歯車とから構成されていることを特徴とする
請求項２記載の矩形基板の処理装置にある。According to a fourth aspect of the present invention, the rotary drive mechanism includes:
Driving means for rotating at least one of the shafts, a first gear formed on the outer peripheral surface of the holding member, and a first gear formed on the outer peripheral surface of the small diameter shaft portion of the shaft; 3. The rectangular substrate processing apparatus according to claim 2, further comprising a second gear meshing with the second gear.
【００１３】請求項５の発明は、上記回転駆動機構は、
回転軸に駆動プーリが設けられた第１の駆動源と、上記
保持部材に一体的に設けられた従動プーリと、この従動
プーリと上記駆動プーリとに張設された伝動ベルトから
構成されていることを特徴とする請求項１記載の矩形基
板の処理装置にある。According to a fifth aspect of the present invention, the rotary drive mechanism includes:
It comprises a first drive source having a drive pulley provided on a rotating shaft, a driven pulley provided integrally with the holding member, and a transmission belt stretched between the driven pulley and the drive pulley. 2. The apparatus for processing a rectangular substrate according to claim 1, wherein:
【００１４】請求項６の発明は、上記上部処理機構と下
部処理機構は、先端に処理ツールが設けられたアームを
有し、少なくとも上部処理機構のアームは第２の駆動源
によって上記処理ツールが上記保持部材に保持された矩
形基板の板面に対向する位置と、その板面から退避する
位置との間で駆動されることを特徴とする請求項１記載
の矩形基板の処理装置にある。According to a sixth aspect of the present invention, the upper processing mechanism and the lower processing mechanism each have an arm provided with a processing tool at a tip thereof, and at least the arm of the upper processing mechanism is configured such that the processing tool is driven by a second drive source. 2. The apparatus for processing a rectangular substrate according to claim 1, wherein the apparatus is driven between a position facing the plate surface of the rectangular substrate held by the holding member and a position retracted from the plate surface.
【００１５】請求項７の発明は、上記保持部材の下方に
は、保持部に保持された矩形基板を保持部材から押し上
げる押し上げ手段が設けられていることを特徴とする請
求項１記載の矩形基板の処理装置にある。According to a seventh aspect of the present invention, there is provided a rectangular substrate according to the first aspect, wherein a push-up means for pushing up the rectangular substrate held by the holding portion from the holding member is provided below the holding member. Processing equipment.
【００１６】請求項８の発明は、上記保持部材に形成さ
れた保持部は、矩形基板の周縁部の全長を保持する構成
であることを特徴とする請求項１記載の矩形基板の処理
装置にある。According to an eighth aspect of the present invention, in the apparatus for processing a rectangular substrate according to the first aspect, the holding portion formed on the holding member holds the entire length of the peripheral portion of the rectangular substrate. is there.
【００１７】請求項９の発明は、上記保持部材に形成さ
れる挿入孔は、上記保持部に保持される矩形基板の外周
面との間に所定の隙間を形成する形状であることを特徴
とする請求項１記載の矩形基板の処理装置にある。According to a ninth aspect of the present invention, the insertion hole formed in the holding member has a shape that forms a predetermined gap between the insertion hole and the outer peripheral surface of the rectangular substrate held by the holding portion. An apparatus for processing a rectangular substrate according to claim 1.
【００１８】請求項１０の発明は、上記保持部材の保持
部に保持された矩形基板の下面を支持してこの矩形基板
が撓むのを制限する撓み防止手段を有することを特徴と
する請求項１記載の矩形基板の処理装置にある。According to a tenth aspect of the present invention, there is provided a semiconductor device having a bending preventing means for supporting a lower surface of the rectangular substrate held by the holding portion of the holding member to limit the bending of the rectangular substrate. 1 is a processing apparatus for a rectangular substrate.
【００１９】請求項１乃至請求項５の発明によれば、保
持部材の保持部に矩形基板を保持し、この保持部材をほ
ぼ水平な状態で保持して回転させるようにしたから、保
持部材の上面側と下面側とにそれぞれ処理機構を進入さ
せ、矩形基板の上面と下面とを処理することが可能とな
る。According to the first to fifth aspects of the present invention, the holding portion of the holding member holds the rectangular substrate, and the holding member is held and rotated in a substantially horizontal state. It is possible to process the upper and lower surfaces of the rectangular substrate by allowing the processing mechanisms to enter the upper and lower surfaces, respectively.
【００２０】請求項６の発明によれば、少なくとも上部
処理機構のアームを保持部材に保持された基板の板面と
対向する位置から退避する位置へ移動させれば、ロボッ
トなどによって保持部材に対する矩形基板の着脱を自動
で行うことが可能となる。According to the sixth aspect of the present invention, if at least the arm of the upper processing mechanism is moved from a position facing the plate surface of the substrate held by the holding member to a position to be retracted, a robot or the like can move the rectangular shape with respect to the holding member. The substrate can be automatically attached and detached.
【００２１】請求項７の発明によれば、矩形基板を保持
部材の保持部から押し上げることができるため、それに
よって保持部材から矩形基板を容易に取り出すことが可
能となる。According to the seventh aspect of the present invention, since the rectangular substrate can be pushed up from the holding portion of the holding member, it is possible to easily take out the rectangular substrate from the holding member.
【００２２】請求項８の発明によれば、矩形基板は保持
部材の保持部によって周縁部の全長が保持されるため、
下方への撓み量が低減されることになる。According to the eighth aspect of the present invention, the entire length of the peripheral portion of the rectangular substrate is held by the holding portion of the holding member.
The amount of downward bending will be reduced.
【００２３】請求項９の発明によれば、保持部材の保持
部に保持される矩形基板の外周面と挿入孔との間に隙間
が形成されるようにしたことで、その隙間にロボットの
ハンドを入れることができるから、保持部材に対する矩
形基板の着脱を自動化することが可能となる。According to the ninth aspect of the present invention, a gap is formed between the outer peripheral surface of the rectangular substrate held by the holding portion of the holding member and the insertion hole. Can be automatically inserted and removed from the holding member.
【００２４】請求項１０の発明によれば、矩形基板が大
型化しても、保持部材の保持部に保持された矩形基板が
撓み過ぎるのを防止することができる。According to the tenth aspect, even if the rectangular substrate becomes large, it is possible to prevent the rectangular substrate held by the holding portion of the holding member from being excessively bent.
【００２５】[0025]
【発明の実施形態】以下、この発明の形態を図面を参照
して説明する。Embodiments of the present invention will be described below with reference to the drawings.
【００２６】図１乃至図３はこの発明の第１の実施の形
態で、図１に示すこの発明の処理装置は処理槽１を備え
ている。この処理槽１はベース板２上に設けられた筒状
ケース３を有する。この筒状ケース３内の高さ方向中途
部には仕切板５が設けられている。この仕切板５には周
壁６によって囲まれた複数の挿通孔、この実施の形態で
は３つの挿通孔７がほぼ同一円周上に位置するよう形成
されている。各挿通孔７にはそれぞれ軸体８ａ〜８ｃが
挿通されている。３本の軸体のうちの１本は駆動軸８ａ
で、残りの２本は従動軸８ｂ、８ｃとなっている。FIGS. 1 to 3 show a first embodiment of the present invention. The processing apparatus of the present invention shown in FIG. The processing tank 1 has a cylindrical case 3 provided on a base plate 2. A partition plate 5 is provided in the middle of the cylindrical case 3 in the height direction. A plurality of insertion holes surrounded by a peripheral wall 6, in this embodiment, three insertion holes 7 are formed in the partition plate 5 so as to be located on substantially the same circumference. The shafts 8a to 8c are inserted into the respective insertion holes 7. One of the three shafts is a drive shaft 8a.
The remaining two are driven shafts 8b and 8c.
【００２７】なお、各軸体８ａ〜８ｃには上記周壁６と
でラビリンス構造をなす周壁９が設けられ、それによっ
て上記挿通孔７から処理槽１に供給される処理液が漏れ
出るのを防止するようになっている。Each of the shafts 8a to 8c is provided with a peripheral wall 9 forming a labyrinth structure with the peripheral wall 6, thereby preventing the processing liquid supplied to the processing tank 1 from leaking from the insertion hole 7. It is supposed to.
【００２８】上記筒状ケース３の下方には支持板１１が
配設されている。この支持板１１には第１の軸受体１２
が設けられている。この第１の軸受体１２には、軸線を
ほぼ垂直にした上記駆動軸８ａの下端部が回転可能に支
持されている。A support plate 11 is provided below the cylindrical case 3. The support plate 11 has a first bearing 12
Is provided. The first bearing body 12 rotatably supports the lower end of the drive shaft 8a whose axis is substantially vertical.
【００２９】２本の従動軸８ｂ，８ｃは、同じく軸線を
ほぼ垂直にして第２の軸受体１３によって下端部が回転
可能に支持されている。上記第２の軸受体１３は上記支
持板１１の下面に接合固定された保持板１４によって保
持固定され、図示せぬ調整ねじで矢印方向に位置決め調
整可能となっている。The lower ends of the two driven shafts 8b and 8c are rotatably supported by a second bearing body 13 with their axes substantially vertical. The second bearing body 13 is held and fixed by a holding plate 14 joined and fixed to the lower surface of the support plate 11, and can be positioned and adjusted in the direction of the arrow by an adjustment screw (not shown).
【００３０】上記駆動軸８ａの下端部は上記支持板１１
に形成された通孔１８から下面側に突出し、その突出端
には従動プーリ１９が嵌着されている。The lower end of the drive shaft 8a is connected to the support plate 11
And a driven pulley 19 is fitted to the protruding end thereof.
【００３１】上記駆動軸８ａの支持板１１からの突出端
の近傍には駆動手段である回転駆動源２１が配設されて
いる。この回転駆動源２１の出力軸２２には駆動プーリ
２３が嵌着され、この駆動プーリ２３と上記従動プーリ
１９とにはベルト２４が張設されている。したがって、
上記回転駆動源２１が作動すれば、上記駆動軸８ａが回
転駆動されるようになっている。In the vicinity of the protruding end of the drive shaft 8a from the support plate 11, a rotary drive source 21 as a drive means is provided. A drive pulley 23 is fitted on the output shaft 22 of the rotary drive source 21, and a belt 24 is stretched between the drive pulley 23 and the driven pulley 19. Therefore,
When the rotation drive source 21 operates, the drive shaft 8a is driven to rotate.
【００３２】上記駆動軸８ａと従動軸８ｂ、８ｃの上端
部はそれぞれ小径軸部２５，２６，２７に形成されてい
る。この小径軸部２５，２６，２７によって各軸体の上
端部には保持手段を構成する段部２８，２９，３０が形
成されている。The upper ends of the drive shaft 8a and the driven shafts 8b and 8c are formed in small diameter shaft portions 25, 26 and 27, respectively. The small diameter shaft portions 25, 26, 27 form step portions 28, 29, 30 constituting the holding means at the upper end of each shaft body.
【００３３】３本の軸体８ａ〜８ｃの段部２８〜３０に
は外形が円形をなした保持部材３２が周辺部の下面を係
合させて保持されている。この保持部材３２には矩形状
の挿入孔３３が穿設されている。この挿入孔３３の内周
には保持部としての段部３４が形成され、この段部３４
には液晶表示装置に用いられるガラス製の矩形基板３５
が周辺部を係合させて着脱可能に保持されている。A holding member 32 having a circular outer shape is held on the steps 28-30 of the three shafts 8a-8c by engaging the lower surfaces of the peripheral portions. The holding member 32 is provided with a rectangular insertion hole 33. A step portion 34 as a holding portion is formed on the inner periphery of the insertion hole 33.
Has a rectangular substrate 35 made of glass used for a liquid crystal display device.
Are detachably held by engaging their peripheral portions.
【００３４】上記保持部材３２は上記駆動軸８ａによっ
て回転駆動されるようになっている。つまり、図３に示
すように保持部材３２の外周面には第１の歯車５１が形
成され、各軸体８ａ〜８ｃの小径軸部２５〜２７の外周
面には上記第１の歯車５１に噛合する第２の歯車５２が
形成されている。The holding member 32 is driven to rotate by the drive shaft 8a. That is, as shown in FIG. 3, the first gear 51 is formed on the outer peripheral surface of the holding member 32, and the first gear 51 is formed on the outer peripheral surface of the small-diameter shaft portions 25 to 27 of the shafts 8 a to 8 c. A meshing second gear 52 is formed.
【００３５】それによって、駆動軸８ａが回転駆動され
ると、その小径軸部２５の第２の歯車５２に噛合した第
１の歯車５１が形成された保持部材３２が回転駆動され
ることになるから、その回転に一対の従動軸８ｂ，８ｃ
がこれらの小径軸２６、２７に形成された第２歯車５２
を介して連動することになる。つまり、保持部材３２は
３本の軸体８ａ〜８ｃの段部２８〜３０によってほぼ水
平に保持された状態で周方向に回転駆動されることにな
る。Thus, when the drive shaft 8a is driven to rotate, the holding member 32 on which the first gear 51 meshed with the second gear 52 of the small diameter shaft portion 25 is driven to rotate. From the pair of driven shafts 8b, 8c
Are formed on the small diameter shafts 26 and 27 by the second gear 52.
Will work together. In other words, the holding member 32 is driven to rotate in the circumferential direction while being held substantially horizontally by the steps 28 to 30 of the three shafts 8a to 8c.
【００３６】なお、第１の歯車５１に噛合する第２の歯
車５２は、駆動軸８ａだけに形成し、一対の従動軸８
ｂ，８ｃには形成しなくともよい。The second gear 52 meshing with the first gear 51 is formed only on the drive shaft 8a, and the pair of driven shafts 8
It is not necessary to form them on b and 8c.
【００３７】保持部材３２に保持された基板３５の下方
には、この基板３５を保持部材３２から押し上げる押上
げ手段としての３本の押上げ軸３６が軸線をほぼ垂直に
して設けられている。各押上げ軸３６の下端部は仕切板
５に穿設された挿通孔７１に挿通され、連結板７２に連
結固定されている。この連結板７２は上記支持板１１上
に配設されたシリンダ３７によって上下方向に駆動され
るようになっている。Below the substrate 35 held by the holding member 32, three push-up shafts 36 as pushing-up means for pushing up the substrate 35 from the holding member 32 are provided with their axes substantially vertical. The lower end of each push-up shaft 36 is inserted into an insertion hole 71 formed in the partition plate 5 and is connected and fixed to a connection plate 72. The connecting plate 72 is driven up and down by a cylinder 37 disposed on the support plate 11.
【００３８】上記挿通孔７１の周囲は周壁７３によって
囲まれ、上記押上げ軸３６には上記周壁７３とでラビリ
ンス構造をなす周壁７４が設けられている。それによっ
て、上記挿通孔７１から処理液が流出するのを阻止して
いる。The periphery of the insertion hole 71 is surrounded by a peripheral wall 73, and the push-up shaft 36 is provided with a peripheral wall 74 forming a labyrinth structure with the peripheral wall 73. This prevents the processing liquid from flowing out of the insertion hole 71.
【００３９】さらに、保持部材３２に保持された基板３
５の下面は回転自在に設けられた複数のローラ３８によ
って支持され、それによって基板３５の下方への撓み量
が制限されている。なお、各ローラ３８は基板３５が回
転することで一緒に回転するように配置されている。そ
れによって、基板３５とローラ３８との間に生じる摩擦
力が低減されるようになっている。Further, the substrate 3 held by the holding member 32
The lower surface of 5 is supported by a plurality of rollers 38 provided rotatably, whereby the amount of downward bending of the substrate 35 is limited. The rollers 38 are arranged so as to rotate together with the rotation of the substrate 35. Thereby, the frictional force generated between the substrate 35 and the roller 38 is reduced.
【００４０】保持部材３２に保持された基板３５の上方
には上部処理機構４１が配置され、下方には下部処理機
構４２が配置されている。各処理機構４１，４２はアー
ム４３を有する。上部処理機構４１のアーム４３の一端
は上部回転駆動源４４の回転軸４５に連結され、他端に
は上部処理ツール４６が設けられている。下部処理機構
４２のアーム４３の一端は下部回転駆動源４７の回転軸
４８に連結され、他端には下部処理ツール４９が設けら
れている。An upper processing mechanism 41 is disposed above the substrate 35 held by the holding member 32, and a lower processing mechanism 42 is disposed below the substrate 35. Each of the processing mechanisms 41 and 42 has an arm 43. One end of an arm 43 of the upper processing mechanism 41 is connected to a rotation shaft 45 of an upper rotation drive source 44, and an upper processing tool 46 is provided at the other end. One end of an arm 43 of the lower processing mechanism 42 is connected to a rotation shaft 48 of a lower rotation drive source 47, and a lower processing tool 49 is provided at the other end.
【００４１】上記上部回転駆動源４４と下部回転駆動源
４７とはそれぞれアーム４３を所定の範囲内で回動させ
るようになっている。つまり、各アーム４３に設けられ
た上部処理ツール４６と下部処理ツール４９とは、図２
に実線で示すように保持部材３２に保持された矩形基板
３５から退避した位置と、同図に鎖線で示すように矩形
基板３５の上面及び下面のほぼ中心部に対向する位置の
間で回動駆動されるようになっている。The upper rotation drive source 44 and the lower rotation drive source 47 each rotate the arm 43 within a predetermined range. That is, the upper processing tool 46 and the lower processing tool 49 provided on each arm 43 are the same as those in FIG.
The rotation between the position retracted from the rectangular substrate 35 held by the holding member 32 as shown by the solid line and the position substantially facing the center of the upper and lower surfaces of the rectangular substrate 35 as shown by the chain line in FIG. It is designed to be driven.
【００４２】なお、上記押上げ軸３６とローラ３８と
は、回動するアーム４３に干渉することのない位置に配
設されている。The push-up shaft 36 and the roller 38 are disposed at positions where they do not interfere with the rotating arm 43.
【００４３】上記各処理ツール４６，４９としては処理
液を噴射するノズル体、処理液に超音波振動を与えて噴
射する超音波ノズル体、矩形基板３５をブラシ洗浄する
ディスクブラシなどを選択的に使用することが可能であ
り、この実施の形態では矩形基板３５に洗浄液を噴射し
て洗浄処理するノズル体が用いられている。As the processing tools 46 and 49, a nozzle body for injecting the processing liquid, an ultrasonic nozzle body for applying ultrasonic vibration to the processing liquid to inject, and a disk brush for brush-cleaning the rectangular substrate 35 are selectively used. In this embodiment, a nozzle body for performing cleaning processing by spraying a cleaning liquid onto the rectangular substrate 35 is used.
【００４４】矩形基板３５の処理としては洗浄処理に限
られず、上面に付着したレジストを薬液によって剥離処
理し、下面を洗浄処理する場合にも適用でき、さらに上
面にエッチング液を供給してエッチング処理し、下面を
洗浄処理する場合などのように、上面と下面とで異なる
処理をする場合にも適用することができる。The processing of the rectangular substrate 35 is not limited to the cleaning processing. The present invention can also be applied to the case where the resist adhering to the upper surface is peeled off with a chemical solution and the lower surface is cleaned. However, the present invention can also be applied to a case where different processes are performed on the upper surface and the lower surface, such as a case where the lower surface is cleaned.
【００４５】つぎに、上記構成の処理装置を用いて矩形
基板３５の上下面を洗浄処理する場合について説明す
る。Next, a case in which the upper and lower surfaces of the rectangular substrate 35 are cleaned by using the processing apparatus having the above configuration will be described.
【００４６】まず、３本の軸体８ａ〜８ｃによってほぼ
水平に保持された保持部材３２の挿入孔３３に矩形基板
３５が図示しないロボットによって供給され、周縁部を
段部３４に係合して保持される。つまり、押上げ軸３６
を上昇させておき、その上端に矩形基板３５をロボット
のハンドによって供給したならば、上記押上げ軸３６を
下降させることで、矩形基板３５が挿入孔３３に入り込
んで周縁部が段部３４に係合して保持されることにな
る。First, a rectangular substrate 35 is supplied by a robot (not shown) into the insertion hole 33 of the holding member 32 which is held substantially horizontally by the three shafts 8a to 8c. Will be retained. That is, the push-up shaft 36
Is raised, and the rectangular substrate 35 is supplied to the upper end thereof by a robot hand. By lowering the push-up shaft 36, the rectangular substrate 35 enters the insertion hole 33, and the peripheral portion becomes the step portion 34. It will be engaged and held.
【００４７】矩形基板３５が供給されたならば、回転駆
動源２１を作動させて駆動軸８ａを回転させる。それに
よって、駆動軸８ａの回転がその小径軸部２５の第２の
歯車５２から保持部材３２の第１の歯車５１に伝達され
るから、保持部材３２は周方向に回転駆動されることに
なる。When the rectangular substrate 35 is supplied, the rotation drive source 21 is operated to rotate the drive shaft 8a. Thereby, the rotation of the drive shaft 8a is transmitted from the second gear 52 of the small-diameter shaft portion 25 to the first gear 51 of the holding member 32, so that the holding member 32 is driven to rotate in the circumferential direction. .
【００４８】保持部材３２を回転駆動したならば、上部
処理機構４１と下部処理機構４２との回転駆動源４４、
４７を作動させてそれぞれのアーム４３を図２に矢印で
示すように矩形基板３５の径方向に沿って所定の範囲で
回動駆動すると同時に、各処理機構４１，４２の処理ツ
ール４６、４９から矩形基板３５の上面と下面とに向け
て洗浄液を噴射する。それによって、矩形基板３５の上
面と下面とが同時に洗浄処理されることになる。When the holding member 32 is driven to rotate, the rotation driving sources 44 of the upper processing mechanism 41 and the lower processing mechanism 42
The arm 47 is operated to rotate and drive each arm 43 within a predetermined range along the radial direction of the rectangular substrate 35 as shown by an arrow in FIG. 2, and at the same time, from the processing tools 46 and 49 of the processing mechanisms 41 and 42. The cleaning liquid is jetted toward the upper and lower surfaces of the rectangular substrate 35. Thus, the upper surface and the lower surface of the rectangular substrate 35 are simultaneously cleaned.
【００４９】このようにして矩形基板３５の上下面を所
定時間洗浄処理したならば、各処理ツール４６、４９か
らの洗浄液の噴射を停止すると共に、各処理機構４１、
４２のアーム４３を図２に実線で示す位置に退避させ
る。ついで、押上げ軸３６を上昇方向に駆動して保持部
材３２の段部３４に保持された矩形基板３５を上昇させ
る。When the upper and lower surfaces of the rectangular substrate 35 have been cleaned for a predetermined time in this manner, the jetting of the cleaning liquid from each of the processing tools 46 and 49 is stopped, and each of the processing mechanisms 41 and 49 is stopped.
The arm 43 is retracted to the position shown by the solid line in FIG. Next, the lifting shaft 36 is driven in the ascending direction to raise the rectangular substrate 35 held by the step portion 34 of the holding member 32.
【００５０】矩形基板３５を保持部材３２から上昇させ
たならば、図示しないロボットのハンドによって矩形基
板３５の周縁部を保持し、処理槽１から搬出する。つい
で未処理の矩形基板３５を供給し、上述した洗浄処理が
繰り返して行われることになる。When the rectangular substrate 35 is lifted from the holding member 32, the peripheral portion of the rectangular substrate 35 is held by a robot hand (not shown) and carried out of the processing tank 1. Next, the unprocessed rectangular substrate 35 is supplied, and the above-described cleaning process is repeatedly performed.
【００５１】このように、矩形基板３５を保持した保持
部材３２を３本の軸体８ａ〜８ｃに保持して回転駆動す
ると共に、その上面と下面とに処理ツール４６、４９に
よって処理液を噴射することができるようにした。その
ため、矩形基板３５の上下面をスピン方式によって同時
に洗浄処理することができる。As described above, the holding member 32 holding the rectangular substrate 35 is held by the three shafts 8a to 8c and driven to rotate, and the processing liquid is sprayed on the upper and lower surfaces by the processing tools 46 and 49. I can do it. Therefore, the upper and lower surfaces of the rectangular substrate 35 can be simultaneously cleaned by the spin method.
【００５２】つまり、保持部材３２を３本の軸体８ａ〜
８ｃに形成された段部２８〜３０よって支持した。その
ため、保持部材３２の挿入孔３３に入れられて周縁部が
段部３４に保持された矩形基板３５の下面側に、アーム
４３の先端に設けられた下部処理ツール４９を、このア
ーム４３を回動させることで進入させることができるか
ら、矩形基板３５を回転させながら処理するスピン方式
であっても、矩形基板３５の下面を上面と同時に処理す
ることが可能となる。That is, the holding member 32 is connected to the three shafts 8a to 8a.
8c was supported by steps 28-30. For this reason, the lower processing tool 49 provided at the tip of the arm 43 is turned on the lower surface side of the rectangular substrate 35 which is inserted into the insertion hole 33 of the holding member 32 and whose peripheral edge is held by the stepped portion 34. By moving the rectangular substrate 35, the lower surface of the rectangular substrate 35 can be processed simultaneously with the upper surface even in the spin method in which the processing is performed while rotating the rectangular substrate 35.
【００５３】上部処理機構４１の上部処理ツール４６と
下部処理機構４２の下部処理ツール４９とを、それぞれ
アーム４３を回動させることで矩形基板３５の上面及び
下面に対向する位置から退避させることができるように
した。そのため、保持部材３２に対して矩形基板３５を
ロボットによって着脱する際、上部処理ツール４６が邪
魔になることがない。The upper processing tool 46 of the upper processing mechanism 41 and the lower processing tool 49 of the lower processing mechanism 42 can be retracted from positions facing the upper and lower surfaces of the rectangular substrate 35 by rotating the arm 43, respectively. I made it possible. Therefore, when the rectangular substrate 35 is attached to and detached from the holding member 32 by the robot, the upper processing tool 46 does not interfere.
【００５４】保持部材３２の挿入孔３３に保持された矩
形基板３５を押上げ軸３６によって押し上げることがで
きるようにした。そのため、ロボットによって保持部材
３２の保持孔３２から処理された矩形基板３２を取り出
すときや供給するときに、そのロボットのハンドによっ
て矩形基板３５の周辺部を確実に保持することが可能と
なる。The rectangular substrate 35 held in the insertion hole 33 of the holding member 32 can be pushed up by the pushing shaft 36. Therefore, when the processed rectangular substrate 32 is taken out or supplied from the holding hole 32 of the holding member 32 by the robot, the peripheral portion of the rectangular substrate 35 can be reliably held by the robot hand.
【００５５】保持部材３２の保持孔３３に保持された矩
形基板３５の下面はローラ３８によって支持されてい
る。そのため、矩形基板３５が大型化しても、その下方
への撓み量が制限されることになるから、矩形基板３５
が撓み過ぎて損傷するのを防止できる。The lower surface of the rectangular substrate 35 held by the holding holes 33 of the holding member 32 is supported by rollers 38. Therefore, even if the size of the rectangular substrate 35 is increased, the amount of downward bending is limited.
Can be prevented from being excessively bent and damaged.
【００５６】上記ローラ３８が矩形基板３５の下面に接
触すると、接触による汚れの発生を招く虞がある。しか
しながら、矩形基板３５が回転駆動されることで、ロー
ラ３８が矩形基板３５の同一部分に接触し続けることが
ないから、矩形基板３５のローラ３８と接触する部分で
あっても、非接触時に洗浄されるため、矩形基板３５の
裏面が部分的に汚れるということがない。When the roller 38 comes into contact with the lower surface of the rectangular substrate 35, there is a possibility that the contact may cause contamination. However, since the rectangular substrate 35 is rotationally driven, the roller 38 does not keep in contact with the same portion of the rectangular substrate 35. Therefore, the back surface of the rectangular substrate 35 is not partially stained.
【００５７】矩形基板３５は挿入孔３４の内周に形成さ
れた段部３４によって周辺部の全長が保持されている。
そのため、ローラ搬送時のように、幅方向両端部だけが
保持される場合に比べて下方への撓みが発生しにくくな
っているから、その点でもローラ搬送方式に比べて優れ
ている。The entire length of the rectangular substrate 35 is held by the step 34 formed on the inner periphery of the insertion hole 34.
For this reason, unlike the case where only both ends in the width direction are held as in the case of roller conveyance, downward bending is less likely to occur, which is also superior to the roller conveyance method in that respect.
【００５８】なお、上記第１の実施の形態では下部処理
ツール４９をアーム４３によって保持部材３２に保持さ
れた基板３５に対向する位置と退避する位置との間で回
動できるようにしたが、矩形基板３５の下面に対向する
位置に固定的に配置するようにしてもよい。In the first embodiment, the lower processing tool 49 is rotatable between a position facing the substrate 35 held by the holding member 32 by the arm 43 and a retracted position. It may be fixedly arranged at a position facing the lower surface of the rectangular substrate 35.
【００５９】また、一対の処理ツール４６，４９はアー
ム４３によって回動駆動させるようにしたが、直線駆動
によって矩形板３５に対向する位置と退避する位置との
間で移動させるようにしてもよい。さらに、各処理ツー
ル４６，４７がディスクブラシなどの場合には、回転駆
動だけでなく、上下駆動できる構成とした方がよい。Although the pair of processing tools 46 and 49 are driven to rotate by the arm 43, they may be moved between a position facing the rectangular plate 35 and a retracted position by linear driving. . Further, when each of the processing tools 46 and 47 is a disk brush or the like, it is preferable that the processing tools 46 and 47 be configured to be capable of vertical drive as well as rotational drive.
【００６０】図４（ａ），（ｂ）はこの発明の第２の実
施の形態を示す。この第２の実施の形態は保持部材３２
を回転駆動するための機構の変形例である。つまり、保
持部材３２の下面にはこの保持部材３２と一体に従動プ
ーリ５５が形成されている。保持部材３２の近傍には回
転駆動源５６が配設されている。この回転駆動源５６の
回転軸５７には駆動プーリ５８が嵌着されている。そし
て、この駆動プーリ５８と上記従動プーリ５５とにはた
とえばタイミングベルトなどの伝動ベルト５９が張設さ
れている。FIGS. 4A and 4B show a second embodiment of the present invention. In the second embodiment, the holding member 32
11 is a modified example of a mechanism for rotationally driving a motor. That is, the driven pulley 55 is formed integrally with the holding member 32 on the lower surface of the holding member 32. A rotation drive source 56 is provided near the holding member 32. A drive pulley 58 is fitted on a rotation shaft 57 of the rotation drive source 56. A transmission belt 59 such as a timing belt is stretched between the driving pulley 58 and the driven pulley 55.
【００６１】したがって、上記回転駆動源５６が作動す
れば、伝動ベルト５９を介して保持部材３２が回転駆動
されることになる。Therefore, when the rotation driving source 56 operates, the holding member 32 is driven to rotate via the transmission belt 59.
【００６２】なお、この第２の実施の形態において、各
軸体８ａ〜８ｃは保持部材３２を回転可能に支持するだ
けでよく、駆動軸８ａを回転駆動する構成は不要となる
こと明らかである 第１、第２の実施の形態において、３本の軸体及び保持
部材の外周面を歯車とせず、一対の従動軸８ｂ、８ｃを
図示しない直線駆動源によって駆動軸８ａに対して接離
する方向に駆動できる構成とし、それによって３本の軸
体８ａ〜８ｃの小径軸２５〜２７の外周面を保持部材３
２の外周面に圧接させるようにすれば、これらの摩擦力
によって駆動軸８ａの回転を保持部材３２に伝達するこ
とが可能となる。In the second embodiment, each of the shafts 8a to 8c only needs to support the holding member 32 so as to be rotatable, and it is apparent that the configuration for rotating and driving the drive shaft 8a is unnecessary. In the first and second embodiments, the outer peripheral surfaces of the three shafts and the holding member are not gears, and the pair of driven shafts 8b and 8c are moved toward and away from the drive shaft 8a by a linear drive source (not shown). , So that the outer peripheral surfaces of the small diameter shafts 25 to 27 of the three shafts 8 a to 8 c can be held by the holding member 3.
If the outer peripheral surface of the second shaft 2 is pressed against the outer peripheral surface of the second shaft 2, the rotation of the drive shaft 8 a can be transmitted to the holding member 32 by these frictional forces.
【００６３】図５（ａ）、（ｂ）はこの発明の第３の実
施の形態を示す。この第３の実施の形態は保持部材３２
に形成される挿入孔３３の変形例で、この挿入孔３３に
は、ここに保持される矩形基板３５の対向する一対の両
側辺に対向する部分に、この矩形基板３５の両側辺との
間に所定の隙間を形成する凹部６１が形成されている。FIGS. 5A and 5B show a third embodiment of the present invention. In the third embodiment, the holding member 32
In a modification of the insertion hole 33 formed in the rectangular substrate 35, a portion opposed to a pair of opposite sides of the rectangular substrate 35 held here is provided between the opposite sides of the rectangular substrate 35. Are formed with a concave portion 61 forming a predetermined gap.
【００６４】また、矩形基板３５は挿入孔３３の四隅部
にだけに設けられた段部３４ａによって保持されるよう
になっている。The rectangular substrate 35 is held by step portions 34 a provided only at the four corners of the insertion hole 33.
【００６５】このような構成の保持部材３２によれば、
矩形基板３５をロボットによって着脱する際、そのハン
ドを凹部６１に挿入することで、矩形基板３５の両側部
を保持することができる。したがって、矩形基板３５を
第１の実施の形態に示された押上げ軸３６によって挿入
孔３３から押し上げることなく着脱することが可能とな
る。According to the holding member 32 having such a structure,
When the rectangular substrate 35 is attached and detached by the robot, by inserting the hand into the concave portion 61, both sides of the rectangular substrate 35 can be held. Therefore, the rectangular substrate 35 can be attached and detached without being pushed up from the insertion hole 33 by the push-up shaft 36 shown in the first embodiment.
【００６６】[0066]
【発明の効果】請求項１乃至請求項５の発明によれば、
保持部材の保持部に矩形基板を保持し、この保持部材を
ほぼ水平な状態で保持して回転させるようにした。According to the first to fifth aspects of the present invention,
The rectangular substrate is held by the holding portion of the holding member, and the holding member is held and rotated in a substantially horizontal state.
【００６７】そのため、保持部材の上面側と下面側とに
それぞれ処理機構を進入させ、矩形基板の上面と下面と
を同時に処理することが可能となるから、処理能率の向
上を図ることができる。For this reason, the processing mechanism can enter the upper surface side and the lower surface side of the holding member, respectively, and the upper surface and the lower surface of the rectangular substrate can be processed simultaneously, so that the processing efficiency can be improved.
【００６８】請求項６の発明によれば、少なくとも上部
処理機構の処理ツールを保持部材に保持された基板の板
面と対向する位置から退避する位置へ駆動できるように
した。According to the sixth aspect of the present invention, at least the processing tool of the upper processing mechanism can be driven to a position to be retracted from a position facing the plate surface of the substrate held by the holding member.
【００６９】そのため、上部処理機構の処理ツールを退
避させることで、保持部材からロボットによって矩形基
板を着脱する際、処理ツールにロボットが干渉するのを
防止できるから、ロボットによる矩形基板の着脱を自動
で行うことが可能となる。For this reason, by retreating the processing tool of the upper processing mechanism, it is possible to prevent the robot from interfering with the processing tool when the robot mounts and removes the rectangular substrate from the holding member. It is possible to do with.
【００７０】請求項７の発明によれば、矩形基板を保持
部材の挿入孔から押し上げることができるため、それに
よって保持部材から矩形基板を容易に取り出すことが可
能となる。According to the seventh aspect of the present invention, the rectangular substrate can be pushed up from the insertion hole of the holding member, so that the rectangular substrate can be easily taken out from the holding member.
【００７１】請求項８の発明によれば、矩形基板は保持
部材の保持部によって周縁部の全長が保持されるため、
下方への撓み量が低減されることになる。According to the eighth aspect of the present invention, the entire length of the peripheral edge of the rectangular substrate is held by the holding portion of the holding member.
The amount of downward bending will be reduced.
【００７２】請求項９の発明によれば、保持部材の保持
孔と、この保持孔に保持される矩形基板の外周面との間
に隙間が形成されるようにした。According to the ninth aspect of the present invention, a gap is formed between the holding hole of the holding member and the outer peripheral surface of the rectangular substrate held by the holding hole.
【００７３】そのため、保持孔と矩形基板との隙間にロ
ボットのハンドを入れることができるから、保持部材に
対する矩形基板の着脱を自動化することが可能となる。For this reason, the hand of the robot can be inserted into the gap between the holding hole and the rectangular substrate, and the attachment and detachment of the rectangular substrate to and from the holding member can be automated.
【００７４】請求項１０の発明によれば、保持部材に保
持された矩形基板の下面を支持するようにした。According to the tenth aspect, the lower surface of the rectangular substrate held by the holding member is supported.
【００７５】そのため、矩形基板が大型化しても、保持
部材に保持された矩形基板が撓み過ぎるのを防止するこ
とができる。Therefore, even if the size of the rectangular substrate is increased, it is possible to prevent the rectangular substrate held by the holding member from being excessively bent.
【図１】この発明の第１の実施の形態を示す処理装置の
概略的構成を示す縦断面図。FIG. 1 is a longitudinal sectional view showing a schematic configuration of a processing apparatus according to a first embodiment of the present invention.
【図２】同じく上部処理機構と下部処理機構の配置状態
を示す平面図。FIG. 2 is a plan view showing an arrangement state of an upper processing mechanism and a lower processing mechanism.
【図３】同じく保持部材を回転駆動する回転駆動機構の
側面図。FIG. 3 is a side view of a rotary drive mechanism that drives the holding member to rotate.
【図４】（ａ）はこの発明の第２の実施の形態を示す回
転駆動機構の平面図、（ｂ）は同じく側面図。FIG. 4A is a plan view of a rotary drive mechanism according to a second embodiment of the present invention, and FIG. 4B is a side view of the same.
【図５】（ａ）はこの発明の第３の実施の形態を示す保
持部材の平面図、（ｂ）は同じく断面図。FIG. 5A is a plan view of a holding member according to a third embodiment of the present invention, and FIG. 5B is a sectional view of the same.
８ａ〜８ｃ…軸体 ２１…回転駆動源 ３２…保持部材 ３３…挿入孔 ３４…段部（保持部） ３５…矩形基板 ３６…押上げ軸 ４１…上部処理機構 ４２…下部処理機構 ４４…上部回転駆動源（第２の駆動源） ４６…上部処理ツール ４７…下部回転駆動源 ４９…下部処理ツール ５６…回転駆動源（第１の駆動源） 8a to 8c: Shaft 21: Rotational drive source 32: Holding member 33: Insertion hole 34: Step (holding part) 35: Rectangular substrate 36: Push-up shaft 41: Upper processing mechanism 42: Lower processing mechanism 44: Upper rotation Drive source (second drive source) 46 upper processing tool 47 lower rotation drive source 49 lower processing tool 56 rotary drive source (first drive source)
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｇ０２Ｆ 1/13 １０１ Ｇ０２Ｆ 1/13 １０１ 1/1333 ５００ 1/1333 ５００ Ｈ０１Ｌ 21/68 Ｈ０１Ｌ 21/68 Ｎ Ｆターム(参考） 2H088 FA17 FA21 FA30 HA01 MA20 2H090 JB02 JC19 3B116 AA02 AB33 AB42 BA02 BA08 BA13 BA34 BB24 BB32 BB45 BB55 BB83 3B201 AA02 AB33 AB42 BA02 BA08 BA13 BA34 BB24 BB32 BB45 BB55 BB83 BB92 BB94 BB95 5F031 CA05 FA05 FA12 HA25 HA59 MA23 PA18 PA30 ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat ゛ (Reference) G02F 1/13 101 G02F 1/13 101 1/1333 500 1/1333 500 H01L 21/68 H01L 21/68 N F-term (Reference) 2H088 FA17 FA21 FA30 HA01 MA20 2H090 JB02 JC19 3B116 AA02 AB33 AB42 BA02 BA08 BA13 BA34 BB24 BB32 BB45 BB55 BB83 3B201 AA02 AB33 AB42 BA02 BA08 BA13 BA34 BB24 BB32 BB45 BB55 FA23 BB55 MA92 PA18 PA30
Claims (10)
おいて、 外形が円形状をなし上記矩形基板が挿入される挿入孔及
びこの挿入孔に入れられた矩形基板の周縁部を保持する
保持部を有する保持部材と、 この保持部材をほぼ水平な状態で保持する支持持手段
と、 この保持手段に保持された上記保持部材を周方向に回転
駆動する回転駆動機構と、 上記保持部材の保持部に保持された上記矩形基板の上面
を処理する上部処理機構と、 上記保持部材の保持部に保持された上記矩形基板の下面
を処理する下部処理機構とを具備したことを特徴とする
矩形基板の処理装置。1. A processing apparatus for processing upper and lower surfaces of a rectangular substrate, comprising: an insertion hole having a circular outer shape into which the rectangular substrate is inserted; and a holding portion for holding a peripheral portion of the rectangular substrate inserted into the insertion hole. A holding member that holds the holding member in a substantially horizontal state; a rotation drive mechanism that rotates the holding member held by the holding member in a circumferential direction; and a holding portion of the holding member. An upper processing mechanism for processing the upper surface of the rectangular substrate held by the lower substrate, and a lower processing mechanism for processing the lower surface of the rectangular substrate held by the holding portion of the holding member. Processing equipment.
回転可能に設けられ上端部を小径軸部とすることで上記
保持部材の周辺部を係合保持する段部が形成された少な
くとも３本の軸体からなることを特徴とする請求項１記
載の矩形基板の処理装置。2. The at least three supporting means, wherein the supporting means is rotatably provided with the axis substantially vertical and has a stepped portion for engaging and holding a peripheral portion of the holding member by forming an upper end portion with a small diameter shaft portion. 2. The apparatus for processing a rectangular substrate according to claim 1, wherein the apparatus comprises a shaft.
と１本を回転駆動する駆動手段と、上記軸体の回転を上
記保持部材に伝達する動力伝達手段とから構成されてい
ることを特徴とする請求項２記載の矩形基板の処理装
置。3. The rotary drive mechanism according to claim 1, wherein the rotary drive mechanism includes a drive unit for rotating at least one of the shafts, and a power transmission unit for transmitting rotation of the shaft to the holding member. The apparatus for processing a rectangular substrate according to claim 2, wherein:
と１本を回転駆動する駆動手段と、上記保持部材の外周
面に形成された第１の歯車と、上記軸体の小径軸部の外
周面に形成され上記第１の歯車と噛合する第２の歯車と
から構成されていることを特徴とする請求項２記載の矩
形基板の処理装置。4. The rotating drive mechanism includes: a driving unit that rotationally drives at least one of the shaft members; a first gear formed on an outer peripheral surface of the holding member; and a small-diameter shaft portion of the shaft member. 3. The apparatus for processing a rectangular substrate according to claim 2, further comprising a second gear formed on an outer peripheral surface of said first gear and meshing with said first gear.
リが設けられた第１の駆動源と、上記保持部材に一体的
に設けられた従動プーリと、この従動プーリと上記駆動
プーリとに張設された伝動ベルトから構成されているこ
とを特徴とする請求項１記載の矩形基板の処理装置。5. The rotation drive mechanism includes a first drive source having a drive shaft provided with a drive pulley on a rotation shaft, a driven pulley provided integrally with the holding member, and a driven pulley and the drive pulley. 2. The rectangular substrate processing apparatus according to claim 1, wherein the apparatus is constituted by a transmission belt stretched.
端に処理ツールが設けられたアームを有し、少なくとも
上部処理機構のアームは第２の駆動源によって上記処理
ツールが上記保持部材に保持された矩形基板の板面に対
向する位置と、その板面から退避する位置との間で駆動
されることを特徴とする請求項１記載の矩形基板の処理
装置。6. The upper processing mechanism and the lower processing mechanism each have an arm provided with a processing tool at a tip, and at least the arm of the upper processing mechanism is held by the holding member by the second driving source. 2. The rectangular substrate processing apparatus according to claim 1, wherein the apparatus is driven between a position facing the plate surface of the rectangular substrate and a position retracted from the plate surface.
された矩形基板を保持部材から押し上げる押し上げ手段
が設けられていることを特徴とする請求項１記載の矩形
基板の処理装置。7. The rectangular substrate processing apparatus according to claim 1, further comprising a push-up unit that pushes up the rectangular substrate held by the holding unit from the holding member below the holding member.
形基板の周縁部の全長を保持する構成であることを特徴
とする請求項１記載の矩形基板の処理装置。8. The rectangular substrate processing apparatus according to claim 1, wherein the holding portion formed on the holding member is configured to hold the entire length of the peripheral portion of the rectangular substrate.
記保持部に保持される矩形基板の外周面との間に所定の
隙間を形成する形状であることを特徴とする請求項１記
載の矩形基板の処理装置。9. The device according to claim 1, wherein the insertion hole formed in the holding member has a shape that forms a predetermined gap between the insertion hole and the outer peripheral surface of the rectangular substrate held by the holding portion. Processing equipment for rectangular substrates.
形基板の下面を支持してこの矩形基板が撓むのを制限す
る撓み防止手段を有することを特徴とする請求項１記載
の矩形基板の処理装置。10. The rectangular substrate according to claim 1, further comprising a bending prevention means for supporting a lower surface of the rectangular substrate held by the holding portion of the holding member and for limiting the bending of the rectangular substrate. Processing equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP36818099A JP4482188B2 (en) | 1999-12-24 | 1999-12-24 | Rectangular substrate processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP36818099A JP4482188B2 (en) | 1999-12-24 | 1999-12-24 | Rectangular substrate processing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001185522A true JP2001185522A (en) | 2001-07-06 |
| JP4482188B2 JP4482188B2 (en) | 2010-06-16 |
Family
ID=18491158
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP36818099A Expired - Lifetime JP4482188B2 (en) | 1999-12-24 | 1999-12-24 | Rectangular substrate processing equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4482188B2 (en) |
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| JP2008268284A (en) * | 2007-04-16 | 2008-11-06 | Shibaura Mechatronics Corp | Substrate treatment apparatus |
| JP2015079879A (en) * | 2013-10-17 | 2015-04-23 | 東京エレクトロン株式会社 | Liquid treatment apparatus |
| JP2016162842A (en) * | 2015-02-27 | 2016-09-05 | 株式会社東京精密 | Washing apparatus |
| KR20220034675A (en) * | 2020-09-11 | 2022-03-18 | 시바우라 메카트로닉스 가부시끼가이샤 | Substrate processing apparatus |
| JP2022047493A (en) * | 2020-09-11 | 2022-03-24 | 芝浦メカトロニクス株式会社 | Substrate processing apparatus |
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