JP2004079637A - Holding device of plate-like member, method for holding and spin treating apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a holding device of a plate-like member which supports the member such as, a glass substrate or the like for a semiconductor wafer or a liquid crystal without bringing into contact with its lower surface and which can surely clamp its peripheral edges. <P>SOLUTION: The holding device of the plate-like member includes a rotatably driven rotor 7, a plurality of tilting edges 20 having bearing surfaces 21 provided with a predetermined interval in a circumferential direction of the rotor, tilting toward a radial direction of the rotor and supporting the peripheries of the lower surfaces of the semiconductor wafers U, clamp pins 19 respectively provided near the plurality of the tilting edges, and a drive mechanism 81 for moving the pins in the radial inward of the rotor along the tilting bearing surfaces to hold the edges of the wafers U supported to the edges. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a spin processing apparatus that processes a plate-shaped member such as a semiconductor wafer or a glass substrate for liquid crystal while rotating the plate-shaped member in a circumferential direction, and more particularly to a plate-shaped member gripping device and a gripping method that grip a peripheral edge of the plate-shaped member About.
[0002]
[Prior art]
2. Description of the Related Art In a manufacturing process of a semiconductor device or a liquid crystal display device, there are a film forming process and a photo process for forming a circuit pattern on a plate-shaped member such as a semiconductor wafer or a glass substrate for a liquid crystal. In these processes, after processing such as development and etching is performed on the plate-shaped member, washing and drying are repeatedly performed.
[0003]
In order to perform processing such as washing and drying on the plate member, a spin processing device is used. As shown in FIG. 11, the spin processing device has a cup body a. In the cup body a, a semiconductor wafer U as a plate-like member is gripped and the wafer b is rotated by a motor b. ₁ A substrate gripping mechanism c that is driven to rotate about the center is provided substantially horizontally.
[0004]
A rotating shaft member e is fixed to a hollow rotating shaft d of the motor b by a bolt f. The rotating shaft member e is hollow like the rotating shaft d of the motor b, and a disk-shaped rotating body g constituting the substrate holding mechanism c is fixed to an upper end by bolts h.
[0005]
The rotating body g is formed by joining an upper plate i and a lower plate j, and a plurality of shaft members k are arranged at equal intervals in a peripheral portion and the rotating shaft L ₂ Are provided so as to be rotatable around the center. The lower ends of these shaft members k protrude from the lower surface of the rotating body g, and small gears l are fitted to these protruding lower ends, respectively.
[0006]
As shown in FIG. 12, a rotation axis L ₂ Clamp pins m project from eccentric positions. An inclined edge n extending toward the center in the radial direction of the shaft member k is integrally provided below the clamp pin m. The inclined clamp n grips the peripheral edge of the semiconductor wafer U with the clamp pin m and the inclined edge n. o.
[0007]
On the upper surface of the inclined edge n, there is formed an inclined surface p which inclines lower as the distance from the clamp pin m increases. The peripheral edge of the semiconductor wafer U is supported on the inclined surface p.
[0008]
A gear q is provided above the rotary shaft member e via a pair of bearings r. The gear q meshes with each of the small gears l fitted to the lower end of the shaft member k. By rotating the gear g with respect to the rotating shaft member e, the small gear meshing with the gear g is engaged. l are all rotated in the same direction.
[0009]
When the small gear l rotates, the inclination clamp o provided on the upper surface of the shaft member k also rotates in the same direction as the small gear l. As a result, the clamp pin m of the tilt clamp o is ₂ Approaching the semiconductor wafer U supported by the slanted edge n while eccentrically rotating about.
[0010]
Then, the semiconductor wafer U supported by the inclined edge n is moved by the clamp pin m to the wafer rotation axis L. ₁ , And finally the periphery is clamped.
[0011]
An upper surface nozzle s for processing the upper surface of the semiconductor wafer U is disposed on the upper surface side of the semiconductor wafer U gripped by the substrate gripping mechanism c, and a lower surface nozzle t for processing the lower surface is disposed on the lower surface side. Is established.
[0012]
Various processing liquids are ejected from the upper nozzle s and the lower nozzle t toward the upper and lower surfaces of the semiconductor wafer U, respectively. Thereby, each processing is performed on the semiconductor wafer U which rotates together with the substrate holding mechanism c.
[0013]
The clamping force for clamping the semiconductor wafer U is given by the torsion force of a clamp spring u spirally wound around the rotating shaft member e. When releasing the clamp of the semiconductor wafer U, the gear rotation pin v is raised from a motor fixing table (not shown) in the direction shown by the arrow A in FIG.
[0014]
That is, the tip of the gear rotation pin v is brought into contact with the lower surface of the gear g to stop the rotation of the gear g, and the motor b is rotated in this state to give the small gear l when clamping the semiconductor wafer U. It can be rotated in the opposite direction to the rotation. This operation releases the clamp of the semiconductor wafer U.
[0015]
[Problems to be solved by the invention]
By the way, in order to clamp the peripheral part of the semiconductor wafer U, each shaft member is ₂ , The periphery of the lower surface of the semiconductor wafer U rises while slidingly contacting the inclined surfaces of the inclined edges with the rotation of the shaft member. At this time, if the inclined surface is scratched, the peripheral portion of the lower surface may be caught by the inclined surface, and the portion may not rise on the inclined surface.
[0016]
However, since the inclined edge adjacent to the trapped inclined edge is raised with the peripheral portion of the lower surface of the semiconductor wafer U while rotating with the shaft member, the semiconductor wafer U is inclined on the upper surface side of the rotating body, and the trapped portion is generated. Wafer rotation axis L for inclined edge ₁ In some cases, the semiconductor wafer U may greatly rise from the inclined edge located on the opposite side from the inclined edge.
[0017]
As a result, when the semiconductor wafer U rises above the height of the clamp pins, even if the clamp pins are moved inward in the radial direction of the rotating body, the clamp pins cannot contact the peripheral edge of the semiconductor wafer U. The semiconductor wafer U cannot be reliably clamped.
[0018]
When the semiconductor wafer U is dried in such an unstable clamp state, a large centrifugal force generated by rotating the semiconductor wafer U at a high speed causes a serious accident such as breakage of the semiconductor wafer U or breakage of an apparatus. It is possible that
[0019]
Therefore, in order to securely clamp the semiconductor wafer U, it is conceivable to lengthen the clamp pins.
[0020]
However, when the clamp pins are lengthened, the dimension of the clamp pins protruding toward the upper surface of the semiconductor wafer U increases. Therefore, during the drying process of the semiconductor wafer U, the processing liquid scattered radially outward from the plate surface of the semiconductor wafer U due to centrifugal force easily collides with the clamp pins, and the processing liquid reflected by the clamp pins causes the semiconductor wafer U Again, and the cleanliness of the plate surface may be reduced.
[0021]
In addition, when the semiconductor wafer U is rotated at a high speed, the airflow in the cup is turbulent due to the clamp pins protruding to the upper surface side of the semiconductor wafer U, which may adversely affect the processing of the semiconductor wafer U.
[0022]
The present invention has been made based on the above circumstances, and an object thereof is to support a plate-like member such as a semiconductor wafer or a glass substrate for a liquid crystal without touching a lower surface, and to reliably form a peripheral portion thereof. An object of the present invention is to provide a holding device for a plate-like member that can be clamped.
[0023]
[Means for Solving the Problems]
According to a first aspect of the present invention, there is provided a rotating body which is driven to rotate, and is provided at a predetermined interval in a circumferential direction of the rotating body, and is inclined inwardly in a radial direction of the rotating body so as to be in the vicinity of the lower surface of the plate-shaped member. A plurality of support members each having a receiving surface for supporting the portion, a gripping member provided in the vicinity of each of the plurality of support members, and a radially inward direction of the rotating body along the inclination of the receiving surface. And a drive mechanism for causing the peripheral portion of the plate-like member supported by the support member to be gripped.
[0024]
According to a second aspect of the present invention, the support member is provided integrally with the gripping member, and in a state in which the plate-like member is supported, the support member and the gripping member are provided along the inclined direction of the receiving surface. The plate-like member gripping device according to claim 1, wherein the plate-like member is moved radially inward.
[0025]
According to a third aspect of the present invention, there is provided the plate-like member gripping device according to the first aspect, wherein the support member is restricted from moving radially inward of the rotating body.
[0026]
According to a fourth aspect of the present invention, there is provided the plate-like member gripping device according to the third aspect, wherein the support member is retractable below a supporting position of the plate-like member.
[0027]
According to a fifth aspect of the present invention, there is provided a rotating body which is driven to rotate, and is provided at a predetermined interval in a circumferential direction of the rotating body, and is inclined downward inward in a radial direction of the rotating body and is provided around a lower surface of the plate-shaped member. A plurality of support members each having a receiving surface for supporting the portion, a gripping member provided in the vicinity of each of the plurality of support members, and a radially inward direction of the rotating body along the inclination of the receiving surface. And a processing mechanism for processing the plate surface by rotating the plate member together with the rotator so as to grip the peripheral portion of the plate member supported by the support member. A spin processing apparatus according to the present invention.
[0028]
The invention according to claim 6, wherein the plurality of support members provided at predetermined intervals in a circumferential direction of the rotating body that is driven to rotate and having a receiving surface that is inclined low inward in the radial direction of the rotating body. A supporting step of supporting the peripheral portion of the lower surface of the plate-shaped member on the surface, and a gripping member provided on the rotating body in the vicinity of the receiving surface of the supporting member, the diameter of the rotating body along the inclination of the receiving surface. A gripping step of gripping a peripheral edge of the plate-like member supported on the receiving surface by moving inward in the direction.
[0029]
According to the present invention, since the gripping member is engaged with the peripheral edge of the plate-like member while moving along the inclination of the receiving surface, the peripheral edge of the plate-like member supported on the receiving surface is gripped smoothly and reliably. be able to.
[0030]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0031]
1 to 4 show a first embodiment of the present invention, FIG. 1 is a partial sectional view showing a configuration of a spin processing device, FIG. 2 is a perspective view showing a schematic configuration of a plate-like member gripping device, and FIG. 3 is a schematic diagram showing a state in which the holding device for the plate-like member is not clamping the semiconductor wafer U, and FIG. 4 is a schematic diagram showing a state in which the holding device for the plate-like member is clamping the semiconductor wafer U.
[0032]
The spin processing device shown in FIG. The cup body 1 is formed of a cylindrical body having an open upper surface, and an upper end portion is provided with an inclined plate 1a that is inclined inward in the radial direction over the entire circumference. An insertion hole 2 communicating vertically is formed substantially at the center of the bottom plate 1b of the cup body 1 in the radial direction, and a control motor 3 is arranged on the lower surface side of the bottom plate 1b in a position corresponding to the insertion hole 2. Have been.
[0033]
The control motor 3 has a cylindrical stator 3a and a cylindrical rotor 3b rotatably inserted inside the stator 3a. The rotor 3b is driven to rotate by a control device (not shown). It has become so.
[0034]
A rotating shaft member 4 is fixed to the upper end of the rotor 3b with its axis aligned with the rotating shaft of the rotor 3b. The rotary shaft member 4 has a cylindrical shape like the stator 3a and the rotor 3b of the control motor 3, and a flange 5 is formed over the entire periphery at a lower end portion joined to the rotor 3b.
[0035]
The rotating shaft member 4 protrudes from the insertion hole 2 formed in the bottom plate 1b of the cup body 1 toward the upper surface side of the bottom plate 1b, and has a plate-like member gripped substantially horizontally inside the cup body 1 at the upper end. The device 6 is provided with its central axis L aligned with the axis of the rotating shaft member 4.
[0036]
The plate-shaped member gripping device 6 has a rotating body 7 that is driven to rotate about the central axis L by the control motor 3. The rotating body 7 has a plurality of, in this embodiment, three casings 9 made of a substantially L-shaped plate material on the inner peripheral surface of an upper plate 8 made of a dish-shaped body arranged with the opening face downward. Are joined at equal intervals in the circumferential direction.
[0037]
An insertion hole 8a that communicates with the internal space of the rotary shaft member 4 is formed at the radial center of the upper plate 8, and an annular wall 8d protrudes around the insertion hole 8a on the upper surface.
[0038]
A guide rail 10a having a U-shape in cross section is fixed to the inner surface of the side wall 9a of each casing 9 so that the opening surface faces the rotary shaft member 4 and the axis is inclined at an angle α to the horizontal plane. Have been.
[0039]
A rectangular slider 10b is provided inside each guide rail 10a so as to be movable along the axis of the guide rail 10a. The guide rail 10a and the slider 10b constitute a linear guide 10.
[0040]
A rack 11 is provided on the side surface of each slider 10b facing the rotation shaft member 4, with the tooth traces being substantially vertical. That is, each rack 11 is movable along the axis of the guide rail 10a together with the slider 10b.
[0041]
At the upper end of the rotating shaft member 4, a spur gear 13 having a horizontal plate 13a on the outer periphery is rotatably provided via a pair of bearings 12 which are vertically separated from each other. The spur gear 13 meshes with each of the racks 11 and is urged by a clamp spring 14 spirally wound around the rotary shaft member 4 in a direction indicated by an arrow A in FIGS. . The rack 11, the spur gear 13, and the linear guide 10 constitute a drive mechanism 81 that drives a clamp pin 19 and an inclined edge 20, which will be described later.
[0042]
As shown in FIG. 1, a through hole 1c is formed near the insertion hole 2 of the bottom plate 1b of the cup body 1. From this through hole 1c, a gear fixing pin 41 driven up and down by a mechanism (not shown) arranged on the lower surface side of the cup body 1 projects into the cup body 1.
[0043]
Therefore, as shown in FIGS. 1 and 2, when the control motor 3 is rotated with the rotation of the spur gear 13 fixed to the rotating shaft member 4 by the gear fixing pin 41, the spur gear 13 It will rotate in the opposite direction relatively. Further, when the rack 11 rotates in the direction of arrow A, which is the biasing direction of the clamp spring 14, each rack 11 meshed with the spur gear 13 obtains propulsive force in the direction of arrow B.
[0044]
However, since each slider 10b is guided along the axis of the guide rail 10a, the rack 11 integrally attached to each slider 10b moves along the axis of the guide rail 10a together with the slider 10b in the direction indicated by the arrow C. Will move to.
[0045]
That is, each rack 11 meshes with the spur gear 13 with the rotation of the spur gear 13, and slides in the tooth trace direction of the spur gear 13 while moving at an angle α to the horizontal plane. It has become.
[0046]
One end of a connection bar 15 is fixed substantially horizontally to one end of each rack 11 in the longitudinal direction. The other end sides of the connection bars 15 project radially outward of the rotating body 7 from elongated holes 8c formed in the side walls 8b of the upper plate 8 at positions corresponding to the connection bars 15, respectively. At the other end of the connection bar 15, a dish-shaped cover body 16 arranged to cover the rotating body 7 from above is supported.
[0047]
In each connection bar 15, a shaft member 17 is provided substantially vertically between the upper plate 8 and the cover body 16, and an inclined clamp 18 is provided on an upper end surface of each of the shaft members 17.
[0048]
The inclined clamp 18 is a clamp pin 19 as a gripping member provided substantially perpendicularly to the upper end surface of the shaft member 17, and extends below the clamp pin 19 radially inward of the rotating body 7. An inclined edge 20 as a support member is provided, and protrudes from the insertion hole 16b formed in the upper wall 16a of the cover body 16 at a position corresponding to the inclined clamp 19 to the upper surface side of the cover body 16.
[0049]
That is, since the shaft member 17 and the rack 11 are integrated via the connecting bar 15, when the spur gear 13 is rotated with respect to the rotary shaft member 4 in the directions indicated by arrows a in FIGS. Each of the clamp pins 19 and the inclined edges 20 integrally provided on the upper end surface of the shaft member 17 are inclined at an angle α with respect to a horizontal plane in conjunction with the movement of each rack 11, and are indicated by arrows d in FIG. It moves in the direction shown, that is, radially inward of the rotating body 7.
[0050]
Thereby, as described later, the semiconductor wafer U supported by each of the inclined edges 20 is centered about the central axis L of the plate-shaped member gripping device 6 by each of the clamp pins 19, and the peripheral edge is finally clamped. It has become so.
[0051]
A receiving surface 21 is formed on the upper surface of the inclined edge 20 and is inclined downward inward in the radial direction of the rotating body 7 and supports a peripheral portion of the lower surface of the semiconductor wafer U. The angle of inclination of the receiving surface 21 is set to an angle α with respect to the horizontal plane, similarly to the mounting angle of the guide rail 10 a of the linear guide 10.
[0052]
Therefore, as shown in FIGS. 3 and 4, when the spur gear 13 is rotated in the direction of the arrow a with respect to the rotary shaft member 4 as shown in FIGS. 3 and 4, the receiving surface 21 is flush with the plane including the receiving surface 21. It keeps moving.
[0053]
Therefore, when each of the inclined clamps 18 clamps the semiconductor wafer U supported on the receiving surface 21, each inclined edge 20 moves so as to slide toward the lower surface side of the semiconductor wafer U, so that the semiconductor wafer U is not lifted. The peripheral edge portion can be gripped by the clamp pin 19.
[0054]
A fixed cylindrical body 22 is provided substantially vertically inside the rotary shaft member 4 and the rotor 3b of the control motor 3. A nozzle head 23 is fitted and fixed to the upper end of the fixed cylindrical body 22 with its radial center portion aligned with the center of the rotating body 7.
[0055]
The nozzle head 23 protrudes toward the upper surface of the rotating body 7, and an annular groove 23 a that rotatably accommodates the annular wall 8 d protruding from the upper plate 8 is formed around the lower surface of the nozzle head 23. ing.
[0056]
In other words, a labyrinth structure is formed by the annular wall 8d and the annular groove 23a, and the processing liquid scattered on the upper surface side of the rotating body 7 receives the processing liquid scattered on the upper surface side of the upper plate 8 and the inside of the rotating shaft member 4 as described later. It is prevented from flowing out of the cup body 1 through the space.
[0057]
In the nozzle head 23, a plurality of, in this embodiment, two lower nozzles 24 are embedded. The lower nozzles 24 are respectively connected to the distal ends of supply pipes 25 disposed in the fixed cylinder 22. An insertion hole 16c is formed in the upper wall 16a of the cover body 16 at a position where the lower nozzle 24 is exposed.
[0058]
Thus, the lower nozzles 24 can spray the processing liquid supplied from the supply pipes 25 toward the lower surface of the semiconductor wafer U gripped by the tilt clamp 18.
[0059]
An upper nozzle 26 is disposed on the upper surface side of the semiconductor wafer U supported by the tilt clamp 18. The tip of a supply pipe 26a is connected to the upper nozzle 26. This allows the upper nozzle 26 to spray the processing liquid supplied from the supply pipe 26 a toward the upper surface of the semiconductor wafer U held by the tilt clamp 18.
[0060]
Next, the operation when the spin processing apparatus having the above configuration is used will be described.
[0061]
When supplying the semiconductor wafer U as a plate-like member to the spin processing apparatus, first, the tip of the gear rotating pin 41 is brought into contact with the lower surface of the horizontal plate 13a of the spur gear 13 to stop the rotation of the spur gear 13.
[0062]
Next, by driving the control motor 3 in this state, the spur gear 13 moves the spur gear 13 with respect to the rotary shaft member 4 in a direction indicated by an arrow E in FIGS. Rotate relatively. Thereby, the tilt clamp 18 provided on the upper end surface of each shaft member 17 is moved radially outward of the rotating body 7.
[0063]
After the tilt clamp 18 has been moved to a predetermined position, the receiving surface 21 of each tilt edge 20 supports the peripheral portion of the lower surface of the semiconductor wafer U. Next, by rotating the control motor 3 in the reverse direction, the clamp pin 19 grips the wafer edge while centering it. Then, the input to the spur gear 13 by the gear rotation pin 41 is released.
[0064]
Then, the spur gear 13 is rotated in the direction indicated by the arrow A with respect to the rotary shaft member 4 by using the biasing force of the clamp spring 14, and the inclined clamp 18 is moved radially inward of the rotating body 7.
[0065]
As a result, the clamp pin 19 moves radially inward of the rotating body 7 and engages with the peripheral edge of the semiconductor wafer U supported by the inclined edge 20, so that the semiconductor wafer U is placed on the upper surface side of the rotating body 7. Clamped. That is, the clamping force for clamping the semiconductor wafer U is given by the torsion force of the clamp spring 14 spirally wound around the rotary shaft member 4.
[0066]
When the semiconductor wafer U is firmly clamped on the upper surface side of the rotating body 7, the control motor 3 is driven to rotate the semiconductor wafer U in the circumferential direction to perform each processing on the upper and lower surfaces.
[0067]
When the processing of the semiconductor wafer U is completed, the spur gear 13 is again rotated relative to the rotary shaft member 4 in the direction indicated by the arrow E by the gear rotating pins 41 and the control motor 3 so that the semiconductor wafer is The clamp of U is released, and the semiconductor wafer U is removed from the upper surface of the rotating body 7.
[0068]
Thus, the process by the spin processing device is completed.
[0069]
According to the spin processing apparatus having the above configuration, the clamp pin 19 for gripping the peripheral portion of the semiconductor wafer U is moved radially inward of the rotating body 7 along the inclination of the receiving surface 21 of the inclined edge 20.
[0070]
Therefore, the peripheral portion of the semiconductor wafer U can be pushed along the inclination of the receiving surface 21, so that the peripheral portion of the semiconductor wafer U is hardly caught on the receiving surface 21. Therefore, when the clamp pins 19 are engaged with the peripheral portion of the semiconductor wafer U, the semiconductor wafer U can be smoothly and securely clamped on the upper surface side of the rotating body 7.
[0071]
Moreover, by forming the clamp pin 19 and the inclined edge 20 integrally, when the clamp pin 19 is brought close to the semiconductor wafer U, the inclined edge 20 is formed in the radial direction of the rotating body 7 along the inclination of the receiving surface 21. Moved inward.
[0072]
Therefore, when the clamp pins 19 approach the semiconductor wafer U supported on the receiving surface 21, the load of the semiconductor wafer U on the receiving surface 21 is reduced because the semiconductor wafer U does not rise with respect to the receiving surface 21.
[0073]
As a result, the peripheral portion of the semiconductor wafer U is less likely to be caught on the receiving surface 21 during the clamping operation, so that the semiconductor wafer U can be smoothly and securely clamped on the upper surface side of the rotating body 7.
[0074]
5 to 8 show a second embodiment of the present invention, FIG. 5 is a partial sectional view showing the configuration of a spin processing device, FIG. 6 is a plan view of the spin processing device, and FIG. FIG. 8 is a plan view showing the eccentricity with the semiconductor wafer U, and FIG. 8 is a graph showing the value of the maximum lifting amount δ of the semiconductor wafer U with respect to the eccentricity indicated by λ in FIG.
[0075]
On the side wall 8b of the upper plate 8 constituting the rotating body 7 of the spin processing device shown in FIG. 5, the connecting members are provided at equal intervals, that is, at intervals of approximately 60 degrees with respect to the circumferential direction. 32 are provided integrally.
[0076]
On the upper surface of the inclined edge 31, similarly to the first embodiment, a receiving surface 33 that inclines low inward in the radial direction of the rotating body 7 and engages and supports the lower peripheral portion of the semiconductor wafer U is formed. The inclination angle of the receiving surface 33 forms an angle α with the horizontal plane.
[0077]
As shown in FIG. 6, shaft members 34 driven by the same driving mechanism 81 as in the first embodiment are provided at positions slightly shifted in the circumferential direction of the rotating body 7 with respect to the inclined edge 31. A clamp pin 35 is provided upright on the upper end surface of each shaft member 34 as a gripping material.
[0078]
As shown in FIG. 5, the clamp pins 35 protrude toward the upper surface side of the cover body 16 from insertion holes 34a formed in the upper wall 16a of the cover body 16 at positions corresponding to the respective clamp pins 35. That is, the clamp pins 35 move along the inclination of the receiving surface 33 on the side of the receiving surface 33 of the inclined edge 31.
[0079]
As described above, in this embodiment, the inclined edge 31 supporting the semiconductor wafer U is separated from the clamp pin 35 and provided integrally with the rotating body 7.
[0080]
Therefore, the semiconductor wafer U does not move relative to the inclined edge 31 until the clamp pins 35 contact the peripheral edge of the semiconductor wafer U, so that the lifting of the semiconductor wafer U caused by the peripheral edge being caught on the receiving surface 33 is prevented. Can be suppressed.
[0081]
However, even when the semiconductor wafer U is supported by the inclined edge 31 fixed to the rotating body 7 as described above, when a flat surface is used as the shape of the receiving surface as in this embodiment, the semiconductor wafer U Depending on the way of supplying U, floating may occur at the peripheral portion of the semiconductor wafer U.
[0082]
That is, in order to support the semiconductor wafer U without contacting the lower surface thereof, the receiving surface 33 needs to be inclined downward inward in the radial direction of the rotating body 7, but the receiving surface 33 is inclined. As a result, when the semiconductor wafer U is supported eccentrically with respect to the center axis L of the rotating body 7, a portion that rises from the inclined edge 20 occurs at the peripheral edge of the semiconductor wafer U.
[0083]
When the lift amount δ from the inclined edge 31 generated in this way exceeds the height of the clamp pin 35, the clamp pin 35 cannot be engaged with the peripheral portion even when approached to the semiconductor wafer U. It may be.
[0084]
Thus, the inventor calculated the lift amount δ of the semiconductor wafer U by changing the inclination angle α of the receiving surface 33 variously. In this calculation, as shown in FIG. 7, as the calculation model, six inclined edges 31a to 31f arranged at equal intervals in an annular shape are used, and the semiconductor wafer U is eccentrically supported with respect to these inclined edges 31a to 31f. The lift amount δ of the semiconductor wafer U at the inclined edge 31e in this case was calculated.
[0085]
The semiconductor wafer U is supported at three points by three adjacent inclined edges 31a, 31b and 31c among the six inclined edges 31a to 31f, and is different from the remaining inclined edges 31d, 31e and 31f. It is in contact.
[0086]
As a result of the above calculation, as shown in FIG. 8, it was confirmed that when the inclination angle α was reduced, the value of the lifting amount δ with respect to the given eccentricity λ was reduced. Further, it has been confirmed that, when the eccentric amount λ is increased at each inclination angle α, the floating amount δ of the semiconductor wafer U with respect to the inclined edge 31e is increased.
[0087]
Each condition in the above calculation is as follows.
[0088]
Diameter dimension of semiconductor wafer U: 300 mm
Angle of inclination of receiving surface: 20 degrees and 30 degrees
Eccentricity: 0mm to 5mm
According to this calculation, even under the condition that the lifting amount δ is maximum, that is, as shown by the point P in FIG. 8, the inclination angle α of the receiving surface 33 is 30 degrees and the eccentricity δ is 5 mm, the lifting amount δ Was about 0.13 mm.
[0089]
From this result, it is understood that the height dimension of the clamp pin 35 according to the second embodiment shown in FIG. 5 can be reduced to about the thickness of the semiconductor wafer U.
[0090]
Accordingly, by setting the inclination angle α of the receiving surface 33 to be small, the height of the clamp pin 35 can be reduced, so that the processing liquid scattered from the plate surface due to the centrifugal force during the drying process of the semiconductor wafer U is removed. It is hard to hit 35.
[0091]
As a result, the processing liquid splashed by the clamp pins 35 can be prevented from re-adhering to the plate surface of the semiconductor wafer U, and the plate surface of the semiconductor wafer U cleaned by the cleaning process is contaminated by the subsequent drying process. Is prevented.
[0092]
In addition, since the height dimension of the clamp pin 35 is reduced, it is possible to suppress the generation of undesired turbulence in the airflow generated in the cup body 1 due to the high-speed rotation of the plate-shaped member gripping device 6. it can.
[0093]
Normally, it is difficult to imagine that the semiconductor wafer U is supported by the three adjacent inclined edges 31a, 31b, 31c. In such a case, that is, when the floating amount δ at the inclined edge 31e is the largest. Also, as described above, the height of the clamp pin 35 can be set very low.
[0094]
Therefore, it can be said that reducing the inclination angle α of the receiving surface 33 formed on the inclined edge 31 is very effective from the viewpoint of improving the cleaning effect by preventing liquid splashing.
[0095]
In the second embodiment, the clamp pin 35 is moved inward in the radial direction of the rotating body 7 at substantially the same angle as the inclination angle α of the receiving surface 33 of the inclined edge 31. However, the clamp pin 35 may be moved within a range within ± 30 degrees with respect to the inclination angle α of the receiving surface 33, for example.
[0096]
As described above, various effects can be obtained by providing a certain width to the movement angle of the clamp pin 35. For example, when the clamp pin 35 is moved at an inclination angle α of the receiving surface 33 of about +30 degrees, the semiconductor wafer U can be pressed radially inward of the rotating body 7 while pressing the peripheral edge of the semiconductor wafer U against the inclined edge 31. Thus, the semiconductor wafer U can be stably clamped.
[0097]
On the other hand, when the clamp pins 35 are moved at the inclination angle α-30 degrees of the receiving surface 33, the peripheral portion can be clamped without applying an extra pressing force to the semiconductor wafer U. The frictional force acting between the clamp pin 33 and the clamp pin 35 is reduced, and the clamp pin 35 can move smoothly.
[0098]
Further, even when the clamp pin 35 is moved along the inclination of the receiving surface 33, the above-described effect can be obtained by deforming the shape of the clamp pin 35. That is, the semiconductor wafer U can be pressed against the receiving surface 33 of the inclined edge 31 by making the shape of the clamp pin 35 reversely tapered, and the semiconductor wafer U can be received by the cylindrical or tapered shape. The frictional force with the surface 33 can be reduced.
[0099]
The shape of the receiving surface 33 may be, for example, a spherical surface. That is, since the semiconductor wafer U has a disk shape, the shape of the receiving surface 33 is spherical, so that the semiconductor wafer U supported by the receiving surface 33 is eccentric from the center axis L of the plate-like member gripping device 6. However, the angle formed between the semiconductor wafer U and the receiving surface 33 is always kept constant.
[0100]
Therefore, by moving the clamp pins 35 radially inward of the rotating body 7 along the receiving surface 33, that is, the spherical surface, the semiconductor wafer U supported by these receiving surfaces 33 is pressed with a constant pressing force throughout. Therefore, the semiconductor wafer U can be more smoothly clamped.
[0101]
9 and 10 show a third embodiment of the present invention. This embodiment relates to the support mechanism of the inclined edge 31 according to the second embodiment, and the connecting member 32 supports the inclined edge 31 by integrally connecting the inclined edge 31 to the rotating body 7. Instead, a retreat support mechanism 51 having a retreat function for retreating each inclined edge 31 downward from the support position of the semiconductor wafer U during the cleaning process is provided.
[0102]
The evacuation support mechanism 51 has a bearing 52 integrally provided on a side wall 8b of the upper plate 8 constituting the rotating body 7 via a member 82, and a longitudinally intermediate portion can be moved only in the vertical direction by the bearing 52. , A support shaft 54 having the inclined edge 31 at the upper end and a flange 53 at the lower end, and a ring 55 arranged substantially horizontally below the inside of the cup 1.
[0103]
An insertion hole 56 is formed in the ring body 55 at a position corresponding to the support shaft 54, and is vertically moved by a driving device (not shown). The diameter of each insertion hole 56 is set slightly larger than the outer diameter of the support shaft 54 and smaller than the outer diameter of the flange 53.
[0104]
Therefore, when the ring body 55 is driven upward by the driving device, the shoulder of the insertion hole 56 of the ring body 55 pushes the flange 53 of the support shaft 54 upward. The inclined edge 31 rises integrally with the support shaft 54.
[0105]
The operation when the spin processing device having the above configuration is used will be described.
[0106]
When using the spin processing apparatus, first, the semiconductor wafer U is supplied to the plurality of inclined edges 31 set at a predetermined height (support position). When the inclined edge 31 supports the peripheral portion of the lower surface of the semiconductor wafer U, the clamp pin 35 is moved inward in the radial direction of the rotating body 7 to clamp the peripheral edge and lower the ring body 55.
[0107]
When the ring 55 is lowered, the support shaft 54 supported by the ring 55 via the flange 53 is lowered together with the ring 55. When the lower surface of each inclined edge 31 reaches the upper surface of the cover 16, the lowering of the support shaft 54 stops, so that only the ring 55 continues to lower, and the lower end of the support shaft 54 is formed on the ring 55. Through the insertion hole 56.
[0108]
When the lower end of the support shaft 54 comes out of the insertion hole 56 of the ring body 55, the lowering of the ring body 55 is stopped by the driving device, and the semiconductor wafer U whose peripheral edge is clamped by the clamp pins 35 is moved in the circumferential direction. By rotating, each process is performed on the plate surface.
[0109]
When the processing of the semiconductor wafer U is completed, the ring 55 is raised by the driving device to set the inclined edge 31 at the above-mentioned supporting position, and the clamp of the semiconductor wafer U is released. Thus, the semiconductor wafer U supported by the inclined edge 31 is taken out of the spin processing device. Thus, the processing of the semiconductor wafer U by the spin processing device is completed.
[0110]
According to the spin processing apparatus having such a configuration, when processing the semiconductor wafer U, the inclined edge 31 is retracted downward.
[0111]
Therefore, when the semiconductor wafer U is dried, the cleaning liquid scattered radially outward from the plate surface of the semiconductor wafer U due to the centrifugal force due to the rotation of the semiconductor wafer U is less likely to collide with the inclined edge 31. The splashing of the cleaning liquid prevents the cleaning liquid from re-adhering to the plate surface of the semiconductor wafer U.
[0112]
Moreover, in this embodiment, when the inclined edge 31 is retracted downward from the position where the semiconductor wafer U is supported, the receiving surface 33 is located on the upper surface side of the cover body 16.
[0113]
Therefore, the processing liquid adhered to the receiving surface 33 of the inclined edge 31 by each processing can be washed away by the cleaning liquid at the time of the cleaning processing, and the lower surface peripheral portion of the semiconductor wafer U supplied to the inclined edge 31 thereafter is treated by the processing liquid. Prevents contamination.
[0114]
The present invention is not limited to the above embodiments, and can be variously modified without departing from the gist of the invention. For example, the plate-shaped member is not limited to the semiconductor wafer U, but may be a glass substrate W for liquid crystal. The invention can be applied.
[0115]
However, since the glass substrate W for liquid crystal is usually in the shape of a rectangular plate, the plate-shaped member holding device 6 according to each of the above embodiments cannot be used as it is. Therefore, when the present invention is applied to the liquid crystal glass substrate W, a rectangular plate material gripping device that grips four corners of the liquid crystal glass substrate W is used instead of the plate-like member gripping device 6.
[0116]
In the spin processing device, a rotary table generally used to hold a rectangular plate-shaped glass substrate W for a liquid crystal is used as the gripping device for a rectangular plate. The supporting portion that supports the corner portion of the glass substrate W may be an inclined clamp including an inclined edge having a receiving surface and a clamp pin, as in the above embodiments.
[0117]
That is, similarly to the first embodiment, the liquid crystal glass substrate W is supported on the inclined edge, and the clamp pin is moved along the inclination of the receiving surface of the inclined edge toward the radial center of the liquid crystal glass substrate W. , The periphery of the liquid crystal glass substrate W is gripped.
[0118]
In the above-described gripping device for a rectangular plate-shaped member, the present invention is not limited to the configuration in which the inclined edge and the clamp pin are integrally provided as in the first embodiment, and they may be formed by separate members. Needless to say. By doing so, the same effect as in the second embodiment can be obtained.
[0119]
Further, in each of the above embodiments, the inclined edge 20 and the clamp pin 19 are arranged at equal intervals in the circumferential direction of the rotating body 7. However, if the positions are symmetrical with respect to the symmetry axis of the plate-shaped member, the intervals are equal. No need.
[0120]
Further, when rotating the spur gear 13, the tip of the gear rotation pin 41 is brought into contact with the lower surface of the horizontal plate 13a of the spur gear 13 to stop the rotation of the spur gear 13, and in this state, the rotor 3b of the control motor 3 is rotated. By doing so, the spur gear 13 is rotated relatively to the rotary shaft member 4, but an inclined cam or the like may be used to stop the rotation of the spur gear 13.
[0121]
【The invention's effect】
According to the present invention, the peripheral portion can be gripped without raising the plate-shaped member, so that the peripheral portion is hardly caught on the receiving surface, and the plate-shaped member can be firmly and reliably gripped. .
[Brief description of the drawings]
FIG. 1 is a partial cross-sectional view showing a configuration of a spin processing device according to a first embodiment of the present invention.
FIG. 2 is a perspective view showing a schematic configuration of a plate-shaped member gripping device according to the first embodiment of the present invention.
FIG. 3 is a schematic diagram showing a state where the plate-shaped member gripping device according to the first embodiment of the present invention does not clamp a semiconductor wafer.
FIG. 4 is a schematic diagram showing a state where the plate-like member gripping device according to the first embodiment of the present invention is clamping a semiconductor wafer.
FIG. 5 is a partial cross-sectional view illustrating a configuration of a spin processing device according to a second embodiment of the present invention.
FIG. 6 is a plan view of a spin processing device according to a second embodiment of the present invention.
FIG. 7 is a plan view showing the eccentricity between an inclined edge and a semiconductor wafer according to a second embodiment of the present invention.
8 is a graph showing a maximum lift amount δ of the semiconductor wafer with respect to an eccentric amount indicated by λ in FIG. 7;
FIG. 9 is a partial cross-sectional view illustrating a configuration of a spin processing device according to a third embodiment of the present invention.
FIG. 10 is a configuration diagram of an inclined edge support mechanism according to a third embodiment of the present invention.
FIG. 11 is a side sectional view showing a configuration of a spin processing apparatus according to a conventional embodiment.
FIG. 12 is a partially enlarged view showing a configuration of a tilt clamp according to a conventional embodiment.
[Explanation of symbols]
U: Semiconductor wafer (plate member)
W: Glass substrate for liquid crystal (plate-like member)
6 ... Plate member gripping device
7 ... Rotating body
81 ... Drive mechanism
21, 33 ... receiving surface
20, 31 ... inclined edge (support member)
19, 35 ... clamp pin (gripping member)

Claims (6)

A rotating body driven to rotate,
A plurality of support members provided at predetermined intervals in a circumferential direction of the rotating body, and having a receiving surface for supporting a peripheral portion of a lower surface of the plate-shaped member inclined downward inward in a radial direction of the rotating body;
Gripping members provided respectively near the plurality of support members,
A drive mechanism for moving these gripping members radially inward of the rotating body along the inclination of the receiving surface to grip the peripheral edge of the plate-like member supported by the support member. For holding a plate-shaped member. The support member is provided integrally with the gripping member, and moves inward in the radial direction of the rotating body along the inclination direction of the receiving surface together with the gripping member while supporting the plate-shaped member. The device for holding a plate-shaped member according to claim 1, characterized in that: 2. The holding device for a plate-shaped member according to claim 1, wherein the support member is restricted from moving radially inward of the rotating body. 4. The device according to claim 3, wherein the support member is retractable below a support position of the plate member. A rotating body driven to rotate,
A plurality of support members provided at predetermined intervals in a circumferential direction of the rotating body, and having a receiving surface for supporting a peripheral portion of a lower surface of the plate-shaped member inclined downward inward in a radial direction of the rotating body;
Gripping members provided respectively near the plurality of support members,
A drive mechanism for moving these gripping members radially inward of the rotating body along the inclination of the receiving surface to grip the peripheral edge of the plate-like member supported by the support member,
Processing means for rotating the plate member together with the rotating body to process the plate surface. Around the lower surface of the plate-shaped member on the receiving surface of a plurality of supporting members provided at predetermined intervals in a circumferential direction of the rotating body driven to rotate and having a receiving surface inclined downward inward in the radial direction of the rotating body. A supporting step for supporting the part,
A plate-like member supported on the receiving surface by moving a gripping member provided on the rotating member in the vicinity of the receiving surface of the support member in a radial direction of the rotating member along the inclination of the receiving surface. A gripping step of gripping a peripheral portion of the member.

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