KR20080071685A - Support member and apparatus for treating substrate with the same - Google Patents

Abstract

A support member and a substrate processing apparatus with the same are provided to prevent a substrate from being separated from a support member by configuring the support member with a plate and chucking pins. A housing(10) provides a space in which a substrate processing process is performed. A support member(20) supports a substrate in the housing. A driving member(30) rotates the support member to allow the substrate to be rotated in a processing speed. A nozzle sprays a processing fluid onto the substrate supported by the support member. The support member includes a plate and chucking pins for chucking and dechucking an edge portion of the substrate. The chucking pin includes a driving pin being rotated on an upper surface of the plate with a constant angle, a receiving unit, an inclined unit for sliding the substrate by the revolution of the driving pin, a fixing unit, and a separation preventing unit having a diameter greater than that of an outer circumference of the fixing unit.

Description

SUPPORT MEMBER AND APPARATUS FOR TREATING SUBSTRATE WITH THE SAME

1 is a configuration diagram of a substrate processing apparatus according to the present invention.

FIG. 2 is a perspective view of the supporting member shown in FIG. 1. FIG.

3 is a view for explaining the configuration of the chucking pin shown in FIG.

4A through 5B are diagrams for describing a process of chucking and unchucking a substrate by chucking pins during a process.

* Description of symbols on the main parts of the drawings *

1: substrate processing apparatus

10: housing

20: support member

30: drive member

40: treatment liquid supply member

100: chucking pin

110: drive pin

120: seating part

130: chucking unit

The present invention relates to a member for supporting a substrate and a substrate processing apparatus, and more particularly, to a support member for supporting a semiconductor substrate during a process and an apparatus for processing a semiconductor substrate having the support member.

In general, semiconductor manufacturing apparatus are manufactured by repeated or selective performance of unit processes such as deposition, photolithography, etching, chemical mechanical polishing, cleaning, drying, and the like. Among these unit processes, a cleaning process is a process of removing foreign substances or unnecessary films attached to the surface of the semiconductor substrate during each unit process. Such a cleaning process has become increasingly important as the pattern formed on the semiconductor substrate becomes smaller and the aspect ratio of the pattern increases.

Among the apparatuses for performing the cleaning process, the single wafer type spin cleaning apparatus is a device for cleaning a substrate by spraying a processing fluid onto the rotated substrate after rotating the sheet substrate. Typical single wafer spin cleaning apparatus includes a housing, a support member, and a nozzle. The housing has a cylindrical container shape with an open top. The support member supports the substrate in the housing during the process. The nozzle sprays the cleaning liquid onto the substrate rotated by the support member during the process. When the spin cleaning process is started, the spin cleaning apparatus rotates the support member to rotate the substrate at a high speed, so that the substrate fixing means prevents the substrate from being separated from the support member by centrifugal force due to the high speed rotation. ) Is provided. A method of fixing a substrate by using a plurality of chucking pins of the substrate fixing means is widely used.

In the supporting member having the chucking pins, the chucking pins fix the substrate by chucking a part of the edge of the substrate during the process. However, in the general method of fixing the substrate using the chucking pins, the substrate is separated from the supporting member during the process because the substrate is not accurately fixed in the process.

In addition, general chucking pins simply perform functions of chucking and unchucking a substrate. Therefore, the supporting member is provided with a seating member such that the substrate is positioned at a height for the chucking pins to chuck the substrate. The mounting member is installed on the upper portion of the support member so that each of the chucking pins is placed in a position to chuck the substrate when the substrate is loaded. As the seating member, a plurality of seating pins installed perpendicular to the upper surface of the support member are used. However, there is a problem that the support member provided with such a seating member is complicated in structure and increases in manufacturing cost.

In order to solve the above problems, an object of the present invention is to provide a support member for effectively fixing the substrate during the process to prevent the separation of the substrate and a substrate processing apparatus having the support member.

In addition, an object of the present invention is to provide a support member that can simplify the structure and a substrate processing apparatus having the support member.

The support member according to the present invention for achieving the above object is a plate, a plurality of which is disposed at an equal angle relative to the center of the plate and includes chucking pins for chucking and unchucking the edge of the substrate during the process, Each of the chucking pins has a driving pin installed to rotate at an angle on the upper surface of the plate, a seating portion provided to be eccentric with the driving pin and having a diameter larger than that of the driving pin at an upper end of the driving pin. An inclined portion provided at an upper end thereof, the inclined portion having a smaller diameter toward the upper portion and provided to slide the substrate by the rotation of the driving pin, and provided at an upper end of the inclined portion and sliding along the inclined portion when the driving pin is rotated. A fixing part into which a part of an edge is inserted, and an upper part of the fixing part, From the substrate to prevent the escape and avoidance it includes having a larger diameter than the diameter of the outer peripheral surface portion government.

A substrate processing apparatus according to the present invention for achieving the above object is a housing for providing a space for performing a substrate processing process therein, a support member for supporting a substrate in the housing during the process, by rotating the support member during the process A drive member for rotating the substrate at a process speed, and a nozzle for injecting a processing fluid to the substrate supported by the support member during the process, wherein the support member includes a plate and a plurality of equal angles relative to the center of the plate. And a chucking pin arranged to chuck and unchuck a portion of the edge of the substrate during the process, wherein each of the chucking pins is installed to be rotated at an angle on the upper surface of the plate, and the drive at the top of the driving pins. Seating portion having a diameter larger than the diameter of the pin and provided to be eccentric with the drive pin, the top of the seating portion An inclined portion having a smaller diameter toward the top and provided to slide the substrate by the rotation of the driving pin, and a portion of an edge of the substrate that is provided at an upper end of the inclined portion and slid along the inclined portion when the driving pin is rotated; The fixing portion is inserted, and provided on the upper end of the fixing portion includes a separation preventing portion having a diameter larger than the diameter of the outer peripheral surface of the fixing portion to prevent the substrate from being separated during the process.

The substrate supporting method according to the present invention for achieving the above object is to support the substrate using a support member having chucking pins for chucking and unchucking a portion of the edge of the substrate during the process, the substrate during the process to the chucking pins A fixing part is provided on each of the chucking pins to prevent deviation of the substrate, and the chucking of the substrate is performed by eccentric rotation of the chucking pins after seating the substrate on the chucking pins before proceeding the process. It is made by sliding the substrate to be inserted into the fixing part.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described below and may be embodied in other forms. Rather, the embodiments introduced herein are provided so that the disclosure may be made thorough and complete, and to fully convey the spirit of the invention to those skilled in the art. In addition, in the present embodiment, the apparatus for cleaning the semiconductor substrate by a single sheet is described as an example, but the present invention can be applied to all substrate processing apparatuses having a supporting member for supporting the substrate.

(Example)

1 is a block diagram of a substrate processing apparatus according to the present invention, Figure 2 is a perspective view of the support member shown in FIG. And, Figure 3 is a view for explaining the configuration of the chucking pin in accordance with the present invention in detail.

Referring to FIG. 1, an apparatus for treating substrate 1 according to the present invention includes a housing 10, a support member 20, and a driving member 30. And a treating liquid supply member 40.

The housing 10 provides a space for processing the semiconductor substrate W therein. The housing 10 has a cylindrical shape with an open top. The open upper part of the housing 10 is used as an opening through which the substrate W enters and exits from the outside of the housing 10 and the space during the process. The drain line 12 is connected to the lower portion of the housing 10. The drain line 12 discharges the treatment liquid used in the process from the space inside the housing 10.

The support member 20 supports the substrate W in the housing 10 during the process. As the support member 20, a spin chuck is used. The support member 20 includes a plate 22, a rotating shaft 24, and a chucking pin 100. The plate 22 has a generally cylindrical shape. The plate 22 has an upper surface on which the substrate W is seated during the process. The rotating shaft 24 is coupled to the lower center of the plate 22. The rotating shaft 24 is installed to penetrate the center of the lower wall of the housing 10. The rotating shaft 24 is installed to be rotatable. Therefore, the plate 22 is rotated in the housing 10 by the rotation of the rotary shaft 24 during the process. The chucking pin 100 fixes the substrate W during the process. Detailed description of the chucking pin 100 will be described later.

The drive member 30 drives the support member 20. The drive member 30 rotates the rotation shaft 24 of the support member 20 during the process to rotate the substrate W at a predetermined process speed. In addition, the driving member 30 adjusts the height of the substrate W seated on the support member 20 by raising and lowering the rotary shaft 24 up and down.

The treatment liquid supply member 40 sprays treatment fluid onto the substrate W during the process. The treatment liquid supply member 40 includes a nozzle 42 and a nozzle transfer member 44. The nozzle 42 sprays the processing fluid a to the processing surface of the substrate W that is supported and rotated by the support member 20 during the process. Here, the treatment fluid (a) includes a cleaning liquid, a rinse liquid, a dry gas, etc. to remove foreign substances remaining on the surface of the substrate W during the process. The nozzle transfer member 44 transfers the nozzle 42 between the spray position and the standby position during the process. The injection position is the position of the nozzle 42 for injecting the processing fluid a described above during the process, and the standby position is the position of the nozzle 42 waiting outside the housing 10 before moving to the injection position.

Subsequently, the configuration of the chucking pin 100 according to the present invention will be described in detail. Referring to FIG. 3, the chucking pin 100 includes a driving pin 110, a loading member 120, and a chucking member 130.

The plurality of driving pins 110 are installed at the edge of the upper surface of the plate 22. Each driving pin 110 is installed perpendicular to the upper surface of the plate 22. Each of the driving pins 110 generally has a pin shape. The driving pins 110 are installed at an equal angle with respect to the center of the plate 22. In addition, each drive pin 110 is installed to be rotatable at a predetermined angle on the plate (22). For rotation of the drive pin 110, the support member 20 is provided with a pin drive means (not shown). The pin driving means rotates each of the driving pins 110 at a predetermined angle so that each of the chucking pins 110 chucks and unchucks the substrate (W). The chucking and unchucking process of the substrate W according to the rotation of the chucking pins 110 will be described later.

The mounting part 120 mounts the substrate W when loading and unloading the substrate W. FIG. In particular, the seating portion 120 is provided such that each of the chucking pins 100 is placed in a position for chucking and unchucking the substrate W upon loading and unloading the substrate W. As shown in FIG. The seating portion 120 has a seating body 122 and a slope memeber 124. The seating body 122 is provided on an upper portion of the driving pin 110. The seating body 122 has a cylindrical shape having a diameter larger than the diameter of the driving pin 110. The seating body 122 is installed to eccentrically rotate with the driving pin 110. That is, the center of rotation of the seating body 112 is provided to deviate from the center of rotation of the drive pin 110. The inclined portion 124 is provided above the seating body 122. The inclined portion 124 has a shape in which the diameter decreases toward the top. Therefore, the inclined portion 124 is provided with a surface inclined at a predetermined angle. Here, it is preferable that the substrate W is mounted on the inclined surface of the inclined portion 124 during loading and unloading of the substrate W. When the substrate W is seated on the seating portion 120, the greater the contact area between the substrate W and the seating portion 120, the greater the possibility that scratches occur on the surface of the substrate W processing. Therefore, when the substrate W is seated on the seating portion 120, the edge of the substrate W is placed on the inclined surface of the inclined portion 120 so that the contact area between the chucking pin 100 and the substrate W is reduced. This prevents the occurrence of scratches on the surface of the substrate (W).

The chucking unit 130 chucks and unchucks the substrate W during the process. The chucking portion 130 includes a fixing groove 132 and a secession protect sill 134. The fixing portion 132 is an edge of the substrate W when the substrate W is chucked. Some are provided for fixing. The fixing part 132 is provided at the top of the inclined part 124. When chucking the substrate W, the substrate W is slid upward along the inclined surface of the inclined portion 124, and then a portion of the edge of the substrate W is inserted into the fixing portion 132 and fixed. The departure prevention part 134 prevents the substrate W fixed by the fixing part 132 from being separated by centrifugal force due to the rotation of the support member 20 during the process. The departure prevention part 134 is provided on the upper part of the fixing part 132. The departure preventing part 134 is provided to protrude laterally from the outer surface of the fixing part 132. The departure prevention part 134 generally has a disk shape. At this time, the diameter of the separation prevention portion 134 has a diameter smaller than the diameter of the seating portion (120). This prevents the substrate W from colliding with the release preventing portion 134 when the apparatus 1 loads and unloads the substrate W into and out of the seating portion 120 of the chucking pin 100 during the process. To do this.

Hereinafter, the process of the substrate processing apparatus 1 described above will be described in detail. Here, the same reference numerals for the same components as the above-described components are the same, and detailed description of the components is omitted.

When the substrate processing process is started, a substrate transfer device (not shown), such as a robot arm, seats the substrate W on the support member 20. When the substrate W is seated on the support member 20, the chucking pins 100 chuck the substrate W. When the substrate W is chucked, the driving member 30 rotates the support member 20 to rotate the substrate W at a predetermined process speed. Then, the nozzle transfer member 44 moves the nozzle 42 from the standby position to the injection position, the nozzle 42 injects the processing fluid to the processing surface of the substrate (W) to be rotated. The injected treatment fluid removes foreign substances remaining on the surface of the substrate (W). When the removal of foreign matter on the surface of the substrate W is completed, the driving member 30 stops the rotation of the support member 20, and the chucking pins 100 unchuck the substrate W. Then, the substrate transfer apparatus unloads the substrate W from the support member 20 and moves to the facility where the subsequent process is performed.

Subsequently, the process of chucking and unchucking the substrate W by the chucking pin 100 will be described in detail. 4A and 4B are views illustrating a state before chucking pins chuck a substrate during a process. 5A and 5B illustrate chucking pins chucking the substrate during the process.

4A and 4B, when the substrate W is loaded onto the support member 20 by the substrate transfer device, the substrate W is seated on the seating portion 120 of each chucking pin 100. . At this time, when the substrate (W) is seated on the inclined portion 124 of the mounting portion 120, the chucking pins 100 are eccentrically rotated at a predetermined angle to chuck the substrate (W). That is, referring to FIGS. 5A and 5B, when the chucking pin 100 is eccentrically rotated at a predetermined angle, the substrate W placed on the inclined portion 124 of the seating portion 120 may have an inclined surface of the inclined portion 124. It moves upward while sliding along. A portion of the edge of the substrate W is inserted into the fixing part 132 of the chucking part 130. When the substrate W is fixed by the chucking unit 130, the driving member 30 rotates the support member 20 to rotate the substrate W. At this time, the departure prevention part 132 of the chucking unit 130 prevents the substrate (W) from being separated from the chucking pin 100 by the centrifugal force due to the rotation of the support member 20.

When the substrate processing process is completed, the chucking pins 100 unchuck the substrate W. That is, the chucking pins 100 are eccentrically rotated at an angle in a direction opposite to the rotational direction when the substrate W is chucked. When the chucking pins 100 are rotated, the substrate W fixed by the fixing part 132 is unchucked, and the substrate W slides downward along the inclined surface of the inclined portion 124. When the substrate W is slid and placed on the inclined portion 120, the substrate transfer device (not shown) unloads the substrate W.

As described above, according to the present invention, by providing the seating portion 120 to the chucking pin 100 for chucking and unchucking the substrate (W), before the chucking pins conventionally chuck the substrate (W) support member 20 is not provided with a separate mounting member for mounting the substrate (W). Therefore, it is possible to simplify the structure of the support member 100 and to reduce the manufacturing cost.

In addition, according to the present invention, the substrate W is placed on the inclined portion 124 having an inclined surface during loading and unloading of the substrate W on the seating portion 120 of the chucking pin 100. The contact area between the king pin 100 and the substrate W is reduced. Accordingly, generation of scratches and generation of particles due to scratches are prevented in the substrate W during the process.

In addition, according to the present invention, by providing the fixing portion 132 and the separation prevention portion 134 for effectively fixing the substrate (W) to the chucking pin 100, centrifugal force due to the support member 20 that is rotated during the process This prevents the substrate W from being separated from the support member 20.

The foregoing detailed description illustrates the present invention. In addition, the foregoing description merely shows and describes preferred embodiments of the present invention, and the present invention can be used in various other combinations, modifications, and environments. That is, changes or modifications may be made within the scope of the concept of the invention disclosed in this specification, the scope equivalent to the disclosed contents, and / or the skill or knowledge in the art. The above-described embodiments are for explaining the best state in carrying out the present invention, the use of other inventions such as the present invention in other state known in the art, and the specific fields of application and uses of the present invention. Various changes are also possible. Accordingly, the detailed description of the invention is not intended to limit the invention to the disclosed embodiments. Also, the appended claims should be construed to include other embodiments.

As described above, the support member and the substrate processing apparatus having the support member according to the present invention effectively fix the substrate to prevent the substrate from being separated from the support member during the process.

In addition, the support member and the substrate processing apparatus including the support member according to the present invention have a simple structure and can reduce manufacturing costs.

Further, the support member and the substrate processing apparatus including the support member according to the present invention prevent the substrate from being damaged when the substrate is loaded into and unloaded from the support member.

Claims (2)

With plates, A plurality of pieces are disposed at an equal angle with respect to the center of the plate, and includes chucking pins for chucking and unchucking a part of the edge of the substrate during the process, Each of the chucking pins, A driving pin installed to rotate at a predetermined angle on the upper surface of the plate; A seating portion having a diameter larger than a diameter of the driving pin at an upper end of the driving pin and provided to be eccentric with the driving pin; An inclination part installed at an upper end of the seating part, the inclined part having a smaller diameter toward the upper part, and provided to slide the substrate by the rotation of the driving pin; A fixing part provided at an upper end of the inclined part and inserted into a part of an edge of the substrate slid along the inclined part when the driving pin is rotated, and And a separation prevention part provided at an upper end of the fixing part, the separation preventing part having a diameter larger than the diameter of the outer circumferential surface of the fixing part to prevent the substrate from being separated from the fixing part during the process. In the apparatus for processing a semiconductor substrate, A housing providing a space therein for performing a substrate processing process; A support member for supporting a substrate in the housing during the process; A driving member for rotating the substrate at a process speed by rotating the support member during the process; and Including a nozzle for injecting the processing fluid to the substrate supported by the support member during the process, The support member, With plates, A plurality of pieces are disposed at an equal angle with respect to the center of the plate, and includes chucking pins for chucking and unchucking a part of the edge of the substrate during the process, Each of the chucking pins, A driving pin installed to rotate at a predetermined angle on the upper surface of the plate; A seating portion having a diameter larger than a diameter of the driving pin at an upper end of the driving pin and provided to be eccentric with the driving pin; An inclination part installed at an upper end of the seating part, the inclined part having a smaller diameter toward the upper part, and provided to slide the substrate by the rotation of the driving pin; A fixing part provided at an upper end of the inclined part and inserted into a part of an edge of the substrate slid along the inclined part when the driving pin is rotated, and And a separation prevention part provided at an upper end of the fixing part and having a diameter larger than a diameter of an outer circumferential surface of the fixing part to prevent the substrate from being separated from the fixing part during the process.

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