KR20210117393A - wet wafer mounting device - Google Patents

wet wafer mounting device Download PDF

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KR20210117393A
KR20210117393A KR1020200033427A KR20200033427A KR20210117393A KR 20210117393 A KR20210117393 A KR 20210117393A KR 1020200033427 A KR1020200033427 A KR 1020200033427A KR 20200033427 A KR20200033427 A KR 20200033427A KR 20210117393 A KR20210117393 A KR 20210117393A
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wafer
groove
water
fluid supply
wet
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KR1020200033427A
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Korean (ko)
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KR102359377B1 (en
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박종익
이경석
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주식회사 세정로봇
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Abstract

The present invention relates to a wafer wet mounting device. More particularly, provided is the wafer wet mounting device for preventing a wafer from drying out or being damaged by contact while temporarily mounting the wafer. In addition, the wafer wet mounting device includes a guide for supporting the side to prevent separation of the supplied wafer and a fluid supply unit for preventing the surface of the wafer from drying while floating the wafer by spraying water on a lower portion of the wafer.

Description

웨이퍼 습식 거치장치{wet wafer mounting device}Wet wafer mounting device

본 발명은 웨이퍼 습식 거치장치에 관한 것으로, 보다 상세하게는 웨이퍼를 임시 거치하는 동안 웨이퍼가 마르거나, 접촉에 의해 손상되는 것을 방지하기 위한 웨이퍼 습식 거치장치에 관한 것이다.The present invention relates to a wafer wet mounting apparatus, and more particularly, to a wafer wet mounting apparatus for preventing a wafer from drying out or being damaged by contact while temporarily mounting the wafer.

반도체 등의 전자부품을 생산하기 위한 소재로 사용되는 웨이퍼는, 단결정 실리콘 잉곳을 얇게 절단하는 슬라이싱을 실시한 후 일정한 두께를 가지도록 정밀하게 연마를 실시하게 된다.A wafer used as a material for producing electronic components such as semiconductors is precisely polished to have a constant thickness after slicing to thinly cut a single crystal silicon ingot.

웨이퍼 연마 장치는 상정반과 하정반 사이에 웨이퍼가 안착된 캐리어를 배치한 후 연마용 입자가 혼합된 슬러리를 공급하면서 상정반 또는 하정반을 회전시켜 웨이퍼의 표면을 연마하게 된다.The wafer polishing apparatus grinds the surface of the wafer by arranging a carrier on which the wafer is mounted between the upper platen and the lower platen, then rotating the upper platen or the lower platen while supplying a slurry mixed with abrasive particles.

생산속도를 높이기 위해 한국등록특허 제10-0504098호 "실리콘 반도체웨이퍼 및 다수 반도체웨이퍼의 제조방법"과 같이 한번에 다수의 웨이퍼를 동시에 연마하기 위한 장치가 개발되었다.In order to increase the production speed, an apparatus for simultaneously polishing a plurality of wafers has been developed, as in Korean Patent Registration No. 10-0504098 "Silicon semiconductor wafer and method for manufacturing a plurality of semiconductor wafers".

이와 같이 연마가 완료된 웨이퍼를 배출하고, 이송시키는 과정에서 웨이퍼가 마를 경우, 물자국이 생기는 문제점과 웨이퍼를 거치시키는 과정에서 웨이퍼의 표면이 접촉에 의해 손상되는 문제점이 있었다.When the wafer dries in the process of discharging and transferring the polished wafer as described above, there is a problem in that water marks are generated and the surface of the wafer is damaged by contact in the process of mounting the wafer.

물자국은 공정 전반에 걸쳐 불량을 발생시킬 수 있음에 따라, 트랜스퍼 사이 또는 이송과정에서도 웨이퍼가 마르지 않도록 웨이퍼의 표면에 탈이온수(deionized water)와 같은 물을 뿌려 젖은 상태로 유지시켜줄 수 있으며, 웨이퍼가 거치될 때 웨이퍼의 손상을 방지하기 위한 기술 개발의 필요성이 제기되고 있다. As water stains can cause defects throughout the process, water such as deionized water can be sprayed on the surface of the wafer to keep it wet so that the wafer does not dry out between transfers or during the transfer process. There is a need to develop a technology to prevent damage to the wafer when it is mounted.

한국등록특허 제10-0504098호 "실리콘 반도체웨이퍼 및 다수 반도체웨이퍼의 제조방법"Korean Patent Registration No. 10-0504098 "Silicon semiconductor wafer and manufacturing method of multiple semiconductor wafers"

본 발명의 목적은 상술한 바와 같은 문제점을 해결하기 위해 안출된 것으로서, 웨이퍼가 이송되는 과정에서 거치되는 웨이퍼가 마르는 것을 방지하기 위한 웨이퍼 습식 거치장치를 제공하는 것이다.SUMMARY OF THE INVENTION It is an object of the present invention to provide a wafer wet mounting apparatus for preventing the wafer being mounted from drying out in the process of transferring the wafer, which has been devised to solve the above-described problems.

본 발명의 다른 목적은 웨이퍼가 거치될 때, 접촉에 의해 웨이퍼의 표면이 손상되는 것을 방지하기 위한 웨이퍼 습식 거치장치를 제공하는 것이다.Another object of the present invention is to provide a wafer wet mounting apparatus for preventing the surface of the wafer from being damaged by contact when the wafer is mounted.

상기 목적을 달성하기 위해 본 발명에 따른 웨이퍼 습식 거치장치는 공급된 웨이퍼의 이탈을 방지하기 위해 측면을 지지하는 가이드와 웨이퍼의 하부에 물을 분사하여 웨이퍼를 띄워주면서 웨이퍼의 표면이 마르는 것을 방지하기 위한 유체공급부를 포함하는 것을 특징으로 한다.In order to achieve the above object, the wafer wet mounting apparatus according to the present invention is to prevent the surface of the wafer from drying out while floating the wafer by spraying water on the guide supporting the side and the lower part of the wafer to prevent separation of the supplied wafer. It is characterized in that it comprises a fluid supply for.

또한, 상기 유체공급부는 상부로 복수 개의 분사 홀이 배열된 공급관이 방사형으로 배치된 것을 특징으로 한다.In addition, the fluid supply unit is characterized in that a supply pipe having a plurality of injection holes arranged at an upper portion is radially disposed.

또한, 상기 유체공급부를 통해 분사된 물을 배출시키기 위해 상면에 홈이 형성된 플레이트를 더 포함하며, 상기 유체공급부를 통해서 공급되어 홈을 따라 배출되는 물은 홈에서 넘치도록 공급되어 홈의 외부로 넘치는 물이 상부에 올려지는 웨이퍼를 띄워주는 것을 특징으로 한다.In addition, it further includes a plate having a groove formed on the upper surface to discharge the water sprayed through the fluid supply unit, the water supplied through the fluid supply unit and discharged along the groove is supplied to overflow from the groove to overflow out of the groove It is characterized by floating the wafer on which water is placed on top.

또한, 상기 유체공급부를 통해 분사된 물을 배출시키기 위해 상면에 홈이 형성된 플레이트를 더 포함하며, 상기 유체공급부를 통해서 공급되는 물은 표면장력에 의해 홈을 따라 볼록하게 형성되어 홈을 따라 배출되면서 상부에 올려지는 웨이퍼를 띄워주는 것을 특징으로 한다.In addition, it further comprises a plate having a groove formed on the upper surface to discharge the water sprayed through the fluid supply unit, the water supplied through the fluid supply unit is formed convexly along the groove by the surface tension and discharged along the groove. It is characterized in that the wafer placed on the upper part is floated.

또한, 상기 플레이트의 홈은 유체공급부를 따라 형성되는 제1 홈과 제1 홈과 교차하도록 형성되어 물을 양측으로 배출시켜주기 위한 제2 홈으로 구성되는 것을 특징으로 한다.In addition, the groove of the plate is characterized in that it is composed of a first groove formed along the fluid supply unit and a second groove formed to intersect the first groove to discharge water to both sides.

또한, 웨이퍼의 상부에 물을 분사하여 웨이퍼의 표면이 마르는 것을 방지하기 위한 유체분사부를 더 포함하는 것을 특징으로 한다.In addition, it characterized in that it further comprises a fluid injection unit for preventing the surface of the wafer from drying by spraying water on the upper portion of the wafer.

상술한 바와 같이, 본 발명에 따른 웨이퍼 습식 거치장치에 의하면, 웨이퍼가 이송되는 과정에서 거치되면 물을 지속적으로 공급하여 웨이퍼가 마르는 것을 방지할 수 있는 효과가 있다.As described above, according to the wafer wet mounting apparatus according to the present invention, when the wafer is mounted in the process of being transported, water is continuously supplied to prevent the wafer from drying out.

또한, 본 발명에 따른 웨이퍼 습식 거치장치에 의하면, 웨이퍼의 하부에 물을 분사하여 웨이퍼가 띄워진 상태로 거치되어 접촉에 의해 웨이퍼의 표면이 손상되는 것을 방지할 수 있는 효과가 있다.In addition, according to the wafer wet mounting apparatus according to the present invention, there is an effect that can prevent the surface of the wafer from being damaged by contact while the wafer is mounted in a floating state by spraying water on the lower part of the wafer.

도 1은 본 발명에 따른 웨이퍼 습식 거치장치의 실시예를 도시한 사시도.
도 2는 본 발명에 따른 웨이퍼 습식 거치장치를 도시한 사시도.
도 3 또는 도 4는 본 발명에 따른 웨이퍼 습식 거치장치의 동작예를 도시한 단면도.1 is a perspective view showing an embodiment of a wafer wet mounting apparatus according to the present invention.
2 is a perspective view showing a wafer wet mounting apparatus according to the present invention.
3 or 4 is a cross-sectional view showing an operation example of the wafer wet mounting apparatus according to the present invention.

본 명세서에 개시되어 있는 본 발명의 개념에 따른 실시 예들에 대해서 특정한 구조적 또는 기능적 설명은 단지 본 발명의 개념에 따른 실시 예들을 설명하기 위한 목적으로 예시된 것으로서, 본 발명의 개념에 따른 실시 예들은 다양한 형태들로 실시될 수 있으며 본 명세서에 설명된 실시 예들에 한정되지 않는다.Specific structural or functional descriptions of the embodiments according to the concept of the present invention disclosed in this specification are only exemplified for the purpose of explaining the embodiments according to the concept of the present invention, and the embodiments according to the concept of the present invention are It may be implemented in various forms and is not limited to the embodiments described herein.

본 발명의 개념에 따른 실시 예들은 다양한 변경들을 가할 수 있고 여러 가지 형태들을 가질 수 있으므로 실시 예들을 도면에 예시하고 본 명세서에서 상세하게 설명하고자 한다. 그러나, 이는 본 발명의 개념에 따른 실시 예들을 특정한 개시 형태들에 대해 한정하려는 것이 아니며, 본 발명의 사상 및 기술 범위에 포함되는 모든 변경, 균등물, 또는 대체물을 포함한다.Since the embodiments according to the concept of the present invention may have various changes and may have various forms, the embodiments will be illustrated in the drawings and described in detail herein. However, this is not intended to limit the embodiments according to the concept of the present invention to specific disclosed forms, and includes all modifications, equivalents, or substitutes included in the spirit and scope of the present invention.

이하, 본 발명의 바람직한 실시예를 첨부된 도면을 참조하여 설명하면 다음과 같다.Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

도 1은 본 발명에 따른 웨이퍼 습식 거치장치의 실시예를 도시한 사시도이며, 도 2는 본 발명에 따른 웨이퍼 습식 거치장치를 도시한 사시도이고, 도 3 또는 도 4는 본 발명에 따른 웨이퍼 습식 거치장치의 동작예를 도시한 단면도이다.1 is a perspective view showing an embodiment of a wafer wet mounting apparatus according to the present invention, FIG. 2 is a perspective view showing a wafer wet mounting apparatus according to the present invention, and FIG. 3 or 4 is a wafer wet mounting apparatus according to the present invention. It is sectional drawing which shows the operation example of an apparatus.

도 1에 도시된 바와 같이, 본 발명에 따른 웨이퍼 습식 거치장치(100)는 트랜스퍼를 통해 이송되는 웨이퍼(101)의 개수 및 배열에 따라 복수 개가 배치될 수 있으며, 각 웨이퍼 습식 거치장치(100)는 상부에 거치되는 웨이퍼(101)가 마르지 않도록 웨이퍼의 표면에 탈이온수(deionized water)와 같은 물을 지속적으로 뿌려줌으로써 웨이퍼의 표면을 젖은 상태로 유지시켜주며, 웨이퍼(101)를 비접촉 방식으로 거치하여 접촉에 의한 손상을 방지하게 된다.As shown in FIG. 1 , a plurality of wafer wet mounting apparatus 100 according to the present invention may be arranged according to the number and arrangement of wafers 101 transferred through transfer, and each wafer wet mounting apparatus 100 . keeps the surface of the wafer wet by continuously spraying water such as deionized water on the surface of the wafer so that the wafer 101 mounted thereon does not dry out, and the wafer 101 is mounted in a non-contact manner This will prevent damage caused by contact.

보다 상세하게는, 웨이퍼 습식 거치장치(100)는 공급된 웨이퍼(101)의 이탈을 방지하기 위해 웨이퍼(101)의 측면을 지지하는 복수 개의 가이드(1)와 웨이퍼(101)의 하부에 물을 분사하여 웨이퍼(101)를 띄워주면서 웨이퍼(101)의 표면이 마르는 것을 방지하기 위한 유체공급부를 포함하여 구성된다.In more detail, the wafer wet mounting apparatus 100 includes a plurality of guides 1 supporting the side of the wafer 101 in order to prevent separation of the supplied wafer 101 and water in the lower part of the wafer 101 . It is configured to include a fluid supply unit for preventing the surface of the wafer 101 from drying while floating the wafer 101 by spraying.

또한, 웨이퍼(101)의 상부에 물을 분사하여 웨이퍼(101)의 표면이 마르는 것을 방지하기 위한 유체분사부(미도시)를 더 포함하도록 구성될 수도 있다.In addition, it may be configured to further include a fluid spraying unit (not shown) for preventing the surface of the wafer 101 from drying by spraying water on the upper portion of the wafer 101 .

또한, 상기 유체공급부는 도 2에 도시된 바와 같이 상부로 복수 개의 분사 홀(11)이 배열된 공급관(2)을 통해 물을 상부로 분사시켜 공급하도록 구성되며, 공급관(2)은 웨이퍼의 하면에 고르게 물이 분사될 수 있도록 방사형으로 배치됨이 바람직하다.In addition, as shown in FIG. 2 , the fluid supply unit is configured to spray and supply water upward through a supply pipe 2 having a plurality of injection holes 11 arranged thereon, and the supply pipe 2 is the lower surface of the wafer. It is preferable to be arranged radially so that water can be evenly sprayed on the .

또한, 상기 공급관(2)에 배열된 분사 홀(11)은 각 열의 분사 각도가 상이하게 구성됨이 바람직하다.In addition, it is preferable that the injection holes 11 arranged in the supply pipe 2 have different injection angles for each row.

예를 들면, 중앙 열은 수직하게 물을 분사하도록 형성되고, 양측 열은 각각 소정의 각도로 경사지게 물을 분사하도록 형성될 수 있다.For example, the central row may be formed to spray water vertically, and both rows may be formed to spray water inclined at a predetermined angle, respectively.

이때, 양측 열은 좌,우로 20~40도 범위로 경사지게 형성됨이 가장 바람직하다.At this time, it is most preferable that both rows are inclined in the range of 20 to 40 degrees left and right.

도 2 또는 도 3에 도시된 바와 같이, 웨이퍼(101)를 보다 안정적으로 거치시키기 위해 상기 유체공급부를 통해 분사된 물을 배출시키기 위해 상면에 홈(12a, 12b)이 형성된 플레이트(3)를 더 포함하도록 구성될 수도 있다.2 or 3, in order to more stably mount the wafer 101, a plate 3 having grooves 12a and 12b formed on the upper surface to discharge the water sprayed through the fluid supply unit is further added. It may be configured to include

이때, 상기 유체공급부의 공급관(2)을 통해서 분사되어 공급된 물(102)은 플레이트(3)의 상부에 형성된 홈(12a, 12b)을 따라 배출되되, 공급되는 물(102)의 유량은 홈(12a, 12b)에서 넘치도록 공급됨이 바람직하다.At this time, the supplied water 102 sprayed through the supply pipe 2 of the fluid supply unit is discharged along the grooves 12a and 12b formed in the upper portion of the plate 3, and the flow rate of the supplied water 102 is the groove. It is preferable to supply overflow at (12a, 12b).

이를 통해, 홈(12a, 12b)의 외부로 넘치는 물(102)이 상부에 올려지는 웨이퍼(101)를 소정의 높이만큼 띄워주게 된다.Through this, the water 102 overflowing to the outside of the grooves 12a and 12b floats the wafer 101 on which it is placed by a predetermined height.

또한, 상기 플레이트(3)의 홈(12a, 12b)은 유체공급부의 공급관(2)을 따라 형성되는 제1 홈(12a)과 제1 홈(12a)에 교차하도록 형성되어 물을 플레이트(3)의 양측으로 배출시켜주기 위한 제2 홈(12b)으로 구성되어 각각 상이한 방향으로 형성된 홈(12a, 12b)을 따라 흐르는 물이 보다 안정적으로 웨이퍼를 지지하도록 구성될 수 있다.In addition, the grooves 12a and 12b of the plate 3 are formed to intersect the first groove 12a and the first groove 12a formed along the supply pipe 2 of the fluid supply unit, so that the water is supplied to the plate 3 . It is composed of second grooves 12b for discharging to both sides of the , and water flowing along the grooves 12a and 12b formed in different directions may be configured to more stably support the wafer.

또 다른 실시예로써, 상기 유체공급부의 공급관(2)을 통해서 분사되어 공급된 물(102)은 유량이 제어되어 도 4에 도시된 바와 같이 표면장력에 의해 각 홈(12b)을 따라 볼록하게 형성된 상태로 홈(12b)을 따라 배출되도록 구성될 수 있다.As another embodiment, the flow rate of the water 102 sprayed and supplied through the supply pipe 2 of the fluid supply unit is controlled so as to be convexly formed along each groove 12b by surface tension as shown in FIG. 4 . It may be configured to be discharged along the groove 12b in a state.

이를 통해, 상부에 웨이퍼(101)가 올려진 상태에서도 표면장력에 의해 홈(12b)을 따라 배출되면서 안정적으로 웨이퍼(101)를 소정의 높이만큼 띄워주게 된다.Through this, the wafer 101 is stably floated by a predetermined height while being discharged along the groove 12b by the surface tension even in a state where the wafer 101 is placed thereon.

이상과 같이 본 발명은 첨부된 도면을 참조하여 바람직한 실시예를 중심으로 기술되었지만 당업자라면 이러한 기재로부터 본 발명의 범주를 벗어남이 없이 많은 다양한 자명한 변형이 가능하다는 것은 명백하다. 따라서 본 발명의 범주는 이러한 많은 변형의 예들을 포함하도록 기술된 청구범위에 의해서 해석되어져야 한다.As described above, the present invention has been mainly described with reference to the accompanying drawings, but it is apparent to those skilled in the art that many various obvious modifications are possible without departing from the scope of the present invention from these descriptions. Accordingly, the scope of the present invention should be construed by the appended claims to include examples of many such modifications.

1 : 가이드
2 : 공급관
3 : 플레이트
11 : 분사 홀
12 : 홈
100 : 웨이퍼 습식 거치장치
101 : 웨이퍼
102 : 물1: Guide
2: supply pipe
3: plate
11: injection hole
12 : home
100: wafer wet mounting device
101: wafer
102: water

Claims (6)

공급된 웨이퍼의 이탈을 방지하기 위해 측면을 지지하는 가이드와;
웨이퍼의 하부에 물을 분사하여 웨이퍼를 띄워주면서 웨이퍼의 표면이 마르는 것을 방지하기 위한 유체공급부를 포함하는 것을 특징으로 하는
웨이퍼 습식 거치장치.
a guide for supporting the side to prevent separation of the supplied wafer;
A fluid supply unit for preventing the surface of the wafer from drying while floating the wafer by spraying water on the lower part of the wafer
Wafer wet mounter.
 제 1항에 있어서,
상기 유체공급부는
상부로 복수 개의 분사 홀이 배열된 공급관이 방사형으로 배치된 것을 특징으로 하는
웨이퍼 습식 거치장치.
The method of claim 1,
The fluid supply unit
A supply pipe in which a plurality of injection holes are arranged at an upper portion is radially arranged.
Wafer wet mounter.
 제 1항에 있어서,
상기 유체공급부를 통해 분사된 물을 배출시키기 위해 상면에 홈이 형성된 플레이트를 더 포함하며,
상기 유체공급부를 통해서 공급되어 홈을 따라 배출되는 물은 홈에서 넘치도록 공급되어 홈의 외부로 넘치는 물이 상부에 올려지는 웨이퍼를 띄워주는 것을 특징으로 하는
웨이퍼 습식 거치장치.
The method of claim 1,
Further comprising a plate having a groove formed on the upper surface to discharge the water sprayed through the fluid supply,
Water supplied through the fluid supply unit and discharged along the groove is supplied to overflow from the groove, and the water overflowing to the outside of the groove floats the wafer on which it is placed.
Wafer wet mounter.
 제 1항에 있어서,
상기 유체공급부를 통해 분사된 물을 배출시키기 위해 상면에 홈이 형성된 플레이트를 더 포함하며,
상기 유체공급부를 통해서 공급되는 물은 표면장력에 의해 홈을 따라 볼록하게 형성되어 홈을 따라 배출되면서 상부에 올려지는 웨이퍼를 띄워주는 것을 특징으로 하는
웨이퍼 습식 거치장치.
The method of claim 1,
Further comprising a plate having a groove formed on the upper surface to discharge the water sprayed through the fluid supply,
The water supplied through the fluid supply unit is formed convexly along the groove by surface tension and discharged along the groove to float the wafer placed on the upper part.
Wafer wet mounter.
 제 3항 또는 제 4항에 있어서,
상기 플레이트의 홈은 유체공급부를 따라 형성되는 제1 홈과;
제1 홈과 교차하도록 형성되어 물을 양측으로 배출시켜주기 위한 제2 홈으로 구성되는 것을 특징으로 하는
웨이퍼 습식 거치장치.
5. The method of claim 3 or 4,
The groove of the plate includes a first groove formed along the fluid supply unit;
It is formed to intersect the first groove, characterized in that it is composed of a second groove for discharging water to both sides.
Wafer wet mounter.
 제 1항에 있어서,
웨이퍼의 상부에 물을 분사하여 웨이퍼의 표면이 마르는 것을 방지하기 위한 유체분사부를 더 포함하는 것을 특징으로 하는
웨이퍼 습식 거치장치.
The method of claim 1,
By spraying water on the upper portion of the wafer, it characterized in that it further comprises a fluid injection unit for preventing the surface of the wafer from drying out.
Wafer wet mounter.
KR1020200033427A 2020-03-18 2020-03-18 wet wafer mounting device KR102359377B1 (en)

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