CN210788335U - Substrate cleaning head and substrate cleaning device - Google Patents
Substrate cleaning head and substrate cleaning device Download PDFInfo
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- CN210788335U CN210788335U CN201920764868.7U CN201920764868U CN210788335U CN 210788335 U CN210788335 U CN 210788335U CN 201920764868 U CN201920764868 U CN 201920764868U CN 210788335 U CN210788335 U CN 210788335U
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Abstract
The utility model discloses a substrate cleaning head and substrate cleaning device, the substrate cleaning head includes: the cleaning device comprises a disk-shaped base with a certain thickness and a circular cleaning pad concentrically connected to the lower surface of the base, wherein the base is provided with a plurality of fluid channels along the thickness direction, the cleaning pad is provided with a plurality of through holes, each through hole is coupled to different fluid channels, and cleaning liquid can be sprayed to the surface of a substrate through one part of the through holes and sucked away through the other part of the through holes after being combined with pollutants on the surface of the substrate.
Description
Technical Field
The utility model belongs to the technical field of the chemical mechanical polishing, particularly, relate to a substrate cleaning head and substrate belt cleaning device.
Background
With the rapid development of the semiconductor industry, the feature size of the integrated circuit tends to be miniaturized continuously, the semiconductor wafer is developed towards small volume, high circuit density, high speed and low power consumption, and the integrated circuit enters the submicron-scale technical stage of the super-large scale integrated circuit. As the diameter of silicon wafers gradually increases, the width of scribe lines in devices gradually decreases, the number of metal layers increases, and the flatness of the surface of a semiconductor thin film has an important influence on the high performance, low cost, and high yield of devices, and the requirement for the flatness of the surface of a silicon wafer is becoming stricter.
Currently, Chemical Mechanical Polishing (CMP) has been developed as a Planarization technique for obtaining global Planarization effect, and integrates polishing, substrate transportation, on-line measurement, cleaning, and the like. The chemical mechanical polishing method generally attracts a substrate to a lower portion of a carrier head, wherein one surface of the substrate, which has a deposition layer, abuts against a rotating polishing pad, and the carrier head is driven by a driving part to rotate in the same direction as the polishing pad and to apply a downward load to the substrate; meanwhile, the polishing solution is supplied to the upper surface of the polishing pad and distributed between the substrate and the polishing pad, and the global polishing of the substrate is completed under the combined action of chemistry and machinery. After the chemical mechanical polishing of the substrate, the removal object and the polishing solution remain on the surface of the substrate, and the chemical mechanical polishing apparatus is configured with a corresponding cleaning unit in order to remove the contaminants on the surface of the substrate in time.
At present, the cleaning units are mainly configured with a substrate vertical cleaning mode and a substrate horizontal cleaning mode, and the configuration of each substrate cleaning unit is different. The vertical cleaning unit can save the space of equipment, the process consistency of megasonic cleaning and scrubbing is better, but the drying effect is inferior to the horizontal cleaning unit due to the influence of gravity in the spin-drying process, and the horizontal cleaning unit is not beneficial to timely removing pollutants out of the surface of the substrate.
Therefore, it is desirable to design a substrate cleaning head and a substrate cleaning apparatus to solve the technical problems in the prior art.
SUMMERY OF THE UTILITY MODEL
The utility model discloses aim at solving one of the technical problem that exists among the prior art to at least a certain extent. To this end, the present invention provides a substrate cleaning head, including a disk-shaped substrate having a certain thickness and a circular cleaning pad concentrically connected to a lower surface of the substrate, the substrate has a plurality of fluid passages along a thickness direction, the cleaning pad has a plurality of through holes, each of which is coupled to a different fluid passage, so that a cleaning solution can be sprayed to a surface of the substrate through one of the plurality of through holes and sucked away through another portion of the through holes after being combined with contaminants on the surface of the substrate.
Preferably, the through holes are evenly distributed at equal intervals along the circumference of the cleaning pad having different diameters.
Preferably, the through holes are evenly distributed along the radius direction of the cleaning pad at equal intervals.
Preferably, two adjacent through holes are used for spraying and sucking away the cleaning liquid respectively.
Preferably, the radius of the cleaning pad is less than the radius of the base.
Preferably, an attachment plate is removably disposed between the base and the cleaning pad, the attachment plate having through holes distributed in the same manner as the cleaning pad such that the cleaning solution can be sprayed onto the substrate surface via the coupled fluid passages, the through holes of the attachment plate, the through holes of the cleaning pad, or such that the cleaning solution can be drawn from the substrate surface via the coupled through holes of the cleaning pad, the through holes of the attachment plate, the fluid passages.
Preferably, the fluid passages, the through holes of the connecting plate, and the through holes of the cleaning pad have different cross-sectional radii.
Preferably, the fluid channels, the through holes of the connection plate, and the inner walls of the through holes of the cleaning pad differ in hydrophobicity.
Preferably, the lower surface of the cleaning pad is provided with a plurality of protrusions.
Preferably, the cleaning pad has a radius less than the radius of the substrate.
And simultaneously, the utility model also provides a base plate belt cleaning device, it includes above arbitrary the base plate cleaning head.
Preferably, the substrate cleaning device further comprises a cleaning head driving device, a substrate fixing device, a cleaning liquid pipeline and a gas pipeline, so that the cleaning head can move parallel to the substrate surface at a certain distance from the substrate surface, and the cleaning liquid pipeline and the gas pipeline respectively connect the cleaning head with the liquid supply unit and the air suction unit.
The application substrate cleaning head and substrate cleaning device thereof, its is rational in infrastructure, can remove the pollutant on substrate surface fast, high-efficient washing substrate surface.
Drawings
The advantages of the invention will become clearer and more easily understood from the detailed description given with reference to the following drawings, which are given by way of illustration only and do not limit the scope of protection of the invention, wherein:
FIG. 1 is a schematic view of a substrate cleaning head according to the present invention;
FIG. 2 is an exploded view of the substrate cleaning head of FIG. 1;
FIGS. 3 to 4 are schematic views showing the distribution of through holes on the cleaning pad according to the present invention;
FIG. 5 is a schematic view of another embodiment of a substrate cleaning head according to the present invention;
FIGS. 6a, 6b, 6c, and 6d are schematic structural views of other embodiments of the substrate cleaning head according to the present invention;
FIG. 7 is a perspective view of a cleaning pad of the present invention;
FIG. 8 is a schematic structural view of the substrate cleaning apparatus of the present invention;
FIG. 9 is a schematic view of the substrate cleaning head and its connecting lines of FIG. 8;
FIG. 10 is a schematic view of another embodiment of the substrate cleaning apparatus of the present invention;
fig. 11 to 12 are schematic structural views of the cleaning head driving device according to the present invention.
Wherein the numerical references have the following meanings:
1000-a substrate cleaning apparatus;
100-a cleaning head;
200-a substrate fixture;
300-cleaning head drive means;
301-a cross-bar; 302-vertical bar;
10-a base; 11-a fluid channel; 1101-an upper opening; 1102-lower opening;
20-a cleaning pad; 21-a through hole; 22-a bump;
30-a substrate holding device; 31-a through hole;
40-cleaning liquid pipeline;
50-gas line;
60-a liquid supply unit;
70-an air extraction unit;
80-a rotating electrical machine;
90-contamination and/or splashed cleaning solution.
Detailed Description
The technical solution of the present invention will be described in detail with reference to the following embodiments and accompanying drawings. The embodiments described herein are specific embodiments of the present invention and are provided to illustrate the concepts of the present invention; the description is intended to be illustrative and exemplary and should not be taken to limit the scope of the invention. In addition to the embodiments described herein, those skilled in the art will be able to employ other technical solutions which are obvious based on the disclosure of the claims and the specification thereof, and these technical solutions include technical solutions which make any obvious replacement or modification of the embodiments described herein.
The drawings in the present specification are schematic views to assist in explaining the concept of the present invention, and schematically show the shapes of the respective portions and the mutual relationships thereof. It should be understood that the drawings are not necessarily to scale, the same reference numerals being used to identify the same elements in the drawings in order to clearly illustrate the structure of the various elements of the embodiments of the invention.
The structure of the substrate cleaning head of the present invention is schematically illustrated, as shown in fig. 1 and fig. 2, the substrate cleaning head 100 includes a base 10 and a cleaning pad 20, the base 10 is a disc-shaped structure, the base 10 has a certain thickness along an axis direction, the base 10 is provided with a plurality of fluid passages 11 parallel to the axis of the base 10 along the thickness direction, the upper portion of the fluid passages 11 extends to the upper surface of the base 10 and forms an upper opening 1101 on the upper surface, the lower portion of the fluid passages 11 extends to the lower surface of the base 10 and forms a lower opening 1102 on the lower surface, so that the external cleaning liquid or gas can flow into the cleaning head 100 through the upper opening 1101 of the fluid passages 11 of the cleaning head 100 and flow out from the lower opening 1102 of the fluid passages 11, thereby spraying the external cleaning liquid or gas onto the surface of the substrate to be cleaned; similarly, after the cleaning liquid sprayed to the surface of the substrate to be cleaned is combined with the contaminants on the surface of the substrate, the cleaning liquid is sucked into the cleaning head 100 from the lower opening 1102 of the fluid channel 11 of the cleaning head 100 and flows out from the upper opening 1101 of the fluid channel 11 of the cleaning head 100 under the negative pressure action of the lower opening 1102 of the fluid channel 11, so that the contaminants on the surface of the substrate are sucked away through the fluid channel 11 of the cleaning head 100, and the cleaning of the surface of the substrate is completed.
In the embodiment shown in fig. 1, the cross-sectional radius of fluid passage 11 for ejecting cleaning liquid is smaller than the cross-sectional radius of fluid passage 11 for suctioning away cleaning liquid containing contaminants to ensure the speed at which cleaning liquid is ejected from through-holes 21 of cleaning pad 20 and the effectiveness of suctioning cleaning liquid containing contaminants through-holes 21 of cleaning pad 20. It will be appreciated that the cross-sectional radius of the fluid passage 11 for ejecting the cleaning liquid and the cross-sectional radius of the fluid passage 11 for sucking away the cleaning liquid containing contaminants may also be the same.
The cleaning pad 20 detachably concentrically attached to the lower surface of the base 10 has a circular structure, the upper surface of the circular structure is parallel to the lower surface so that the cleaning pad 20 has a uniform thickness in a diameter direction, and the upper surface and the lower surface of the cleaning pad 20 are both flat; in accordance with an aspect of an embodiment of the present invention, the lower surface of the cleaning pad 20 can be provided with a plurality of protrusions 22; the thickness of the cleaning pad 20 is 0.1mm to 22mm, preferably, the thickness of the cleaning pad 20 is 10mm to 20mm, so that the cleaning pad 20 can absorb/absorb a certain amount of liquid such as cleaning liquid, and the cleaning pad 20 becomes soft after absorbing/absorbing the liquid, thereby ensuring that the cleaning pad 20 can effectively remove contaminants when in contact with the surface of the substrate to be cleaned and does not cause damage to the surface of the substrate to be cleaned, i.e., ensuring that the cleaning pad 20 does not damage the features of the substrate while cleaning the surface of the substrate; according to another aspect of the present embodiment, the cleaning pad 20 is made of a porous polymeric material, and in particular, the cleaning pad 20 may be made of any one of a polyvinyl alcohol polymer, an acrylic polymer, a polyoxyethylene polymer, a polyether polymer, a condensation polymer, and a urethane resin.
The cleaning pad 20 has a plurality of through holes 21 vertically arranged through in a thickness direction thereof, and each through hole 21 of the cleaning pad 20 is in one-to-one correspondence with a different fluid channel 11 of the base 10, so that the cleaning liquid can be sprayed onto the surface of the substrate to be cleaned through the fluid channel 11 of the base 10 and the through hole 21 of the cleaning pad 20, or the cleaning liquid is combined with the contaminants on the surface of the substrate and then delivered to the outside of the cleaning head 100 through the through hole 21 of the cleaning pad 20 and the fluid channel 11 of the base 10.
Specifically, the through hole 21 of the cleaning pad 20 is coupled with the lower opening 1102 of the fluid channel 11 of the cleaning head 100, so that the cleaning liquid can flow along the fluid channel 11 from top to bottom, i.e. the cleaning liquid can be sprayed to the surface of the substrate to be cleaned through the upper opening 1101 of the fluid channel 11 of the cleaning head 100, the lower opening 1102 and the through hole 21 of the cleaning pad 20, or after the cleaning liquid is combined with the contaminants on the surface of the substrate, the cleaning liquid containing the contaminants is sucked away from bottom to top through the through hole 21 of the cleaning pad 20 under the action of the negative pressure transmitted by the fluid channel 11, i.e. the cleaning liquid containing the contaminants is conveyed to the outside of the cleaning head through the through hole 21 of the cleaning pad 20, the lower opening 1102 of the fluid channel 11, the fluid channel 11 and the upper opening 1101.
As shown in FIG. 3, the through holes 21 are distributed on the circumference of the cleaning pad 20 having different radii so that the cleaning solution is appliedCan flow continuously between the substrate surface and the cleaning head 100; FIG. 3 shows the distribution of the locations of the through holes 21 of the cleaning pad 20, the through holes 21 being distributed over a circumference C having different radiin(n is 1, 2, 3 … … n, n is a positive integer), and the circumference C is a circlenDistributed around the geometric center O of the cleaning pad 20, said through holes 21 being along a circumference C of the cleaning pad 20 having different radiinThe cleaning pads 20 are equally spaced, meaning that the distance between two adjacent through holes 21 on the same circumference is equal. According to one aspect of the embodiment, the function of the through-holes 21 on adjacent circumferences may be different, for example, the cleaning liquid passes through the innermost circumference C1Is sprayed to the surface of the substrate to be cleaned, at the circumference C1And the discharge pressure of the through-hole 21 and the adjacent circumference C2Is passed through the circumference C under the combined action of the vacuum suction of the through-holes 212The plurality of through holes 21 are delivered to the outside of the cleaning head 100; as a variant of this embodiment, the cleaning liquid can also pass through the circumference C2Is sprayed to the surface of the substrate to be cleaned, at the circumference C2Discharge pressure and innermost circumference C of the through-hole 211Is passed through the circumference C under the combined action of the vacuum suction of the through-holes 211To the outside of the cleaning head 100.
As an alternative example of the location distribution of the through holes 21, fig. 4 shows another location distribution form of the through holes 21 of the cleaning pad 20, the through holes 21 are distributed on a radius centered on the geometric center O of the cleaning pad 20, and the distances between the adjacent through holes 21 distributed on the same radius may be equal or different; the effect of the through-openings 21 distributed over adjacent radii is generally different, so that the cleaning liquid passes through the radius R1Is sprayed to the surface of the substrate to be cleaned at a radius R1And the adjacent radius R of the plurality of through holes 212Is passed through the radius R by the combined action of the vacuum suction of the through-hole 212The upper through-hole 21 is delivered to the outside of the cleaning head 100.
It is understood that the through holes 21 and the fluid passages 11 coupled thereto can be arranged according to other positions, for example, the through holes 21 are uniformly disposed on the cleaning pad 20 at substantially equal intervals, or the through holes 21 are disposed on the cleaning pad 20 at different intervals, or the through holes 21 are disposed on the cleaning pad 20 in a specific shape, as long as the through holes 21 are disposed on the cleaning pad 20, the following effects can be achieved without departing from the spirit of the present invention and falling within the scope of the present invention: after the cleaning liquid is sprayed to the surface of the substrate to be cleaned through the through holes 21, the cleaning liquid is conveyed to the outside of the cleaning head 100 through the through holes 21 of the cleaning pad 20 and the fluid passages 11 on the base 10 under the combined action of the discharge pressure of the through holes 21 and the vacuum suction force of other through holes 21, so that the cleaning liquid combined with the contaminants is sucked or discharged, thereby realizing the post-treatment of the substrate surface.
According to another embodiment of the present invention, as shown in fig. 1, a cleaning pad 20 is concentrically attached to the lower surface of a base 10, and the radius of the cleaning pad 20 is smaller than that of the base 10, so that contaminants and/or splashed cleaning solution 90 during a substrate cleaning operation are splashed to the outer circumferential surface of the cleaning pad 20 and a step area near the outer circumferential surface, so that the contaminants and/or the cleaning solution splashed to the step area are cleaned by a water stream jetted from the bottom to the top after the cleaning head 100 completes the operation; in contrast, if the radius of cleaning pad 20 is the same as the radius of base 10, contaminants and/or cleaning fluid are more likely to splash down to the underlying circumferential surface of base 10, thereby causing difficulty in cleaning the cleaning head according to the present invention by a bottom-to-top water spray cleaning pattern commonly used in the art. It will also be appreciated by those skilled in the art that the radius of cleaning pad 20 can also be configured to be larger than the radius of base 10 to prevent cleaning fluid and/or contaminants from splashing onto the lower circumferential area of base 10 during operation of cleaning head 100. Generally, the radius of the cleaning pad 20 is 80% to 95% of the radius of the base 10, and preferably, the radius of the cleaning pad 20 is 90% of the radius of the base 10.
According to another embodiment of the present invention, a connection plate 30 is detachably disposed between the base 10 and the cleaning pad 20, as shown in fig. 5, the connection plate 30 is a disk structure having a certain thickness, the radius of the connection plate 30 is substantially the same as the radius of the cleaning pad 20, the upper surface and the lower surface of the disk structure are planes and parallel to each other, the upper surface of the connection plate 30 is detachably connected to the lower surface of the base 10, and the lower surface of the connection plate 30 is detachably connected to the upper surface of the cleaning pad 20; the connecting plate 30 has a plurality of through holes 31 extending through the thickness direction, and the through holes 31 have the same position distribution as the fluid channels 11 on the base 10 and the through holes 21 of the cleaning pad 20, that is, the fluid channels 11 of the base 10, the through holes 21 of the cleaning pad 20, and the through holes 31 of the connecting plate 30 can be coupled and communicated in a one-to-one correspondence manner, so that the cleaning solution can be sequentially sprayed to the surface of the substrate to be cleaned through the fluid channels 11 of the cleaning head 100, the through holes 31 of the connecting plate 30, and the through holes 21 of the cleaning pad 20, or after the cleaning solution is combined with the contaminants on the surface of the substrate, the cleaning solution is sequentially conveyed to the outside of the cleaning head 100 through the through holes 21 of the cleaning pad 20, the through holes 31 of the connecting plate 30, and the fluid channels 11 of the cleaning head 100 under the.
According to one aspect of this embodiment, as shown in FIG. 5, the thickness of the attachment plate 30 is between the thickness of the cleaning pad 20 and the thickness of the base 10; as a variant, the thickness of the attachment plate 30 is 1/3 to 2/3 times the thickness of the base 10, or the thickness of the base 10 is 1 to 5 times the thickness of the cleaning pad 20. Technically, the height of the base 10 is generally not more than 120mm, preferably not more than 80mm, so that the cleaning liquid has little pressure loss or less loss after flowing through the fluid channel 11, in other words, the cleaning liquid does not lose too much pressure or lose too much flow rate because the fluid channel 11 is too long and narrow; further, the height of the through-holes 31 of the connection plate 30 should also be such that there is little or no pressure loss of the cleaning liquid after flowing through the through-holes 31. Such a configuration also has an advantage in that, when the cleaning liquid on the substrate surface is sucked by the negative pressure action of the fluid passage 11, the negative pressure introduced into the upper opening 1101 of the fluid passage 11 is substantially equal to the negative pressure of the lower opening of the cleaning pad 20, and the pressure loss is small. The connection plate 30 is provided to easily collect contaminants and/or cleaning liquid and crystals thereof generated during the substrate cleaning process on the inner wall of the fluid channel 11, and to easily clean the inner wall of the narrow fluid channel 11 if the thickness of the base 10 is too large and the length of the fluid channel 11 of the base 10 is too long, and to easily clean the fluid channel 11 of the base 10 during maintenance work of the cleaning head 100 without affecting the overall height of the cleaning head 100 by providing the connection plate 30. In addition, the connection plate 30 has the advantages that since the base is generally made of engineering plastics such as PEEK or PPS and various operations such as replacing the cleaning pad 20 are frequently required, the base 10 is easily deformed or damaged after long-term use, and the entire base 10 is often required to be replaced, thereby causing high maintenance cost; after the connection plate 30 is provided, only the connection plate 30 is required to be replaced during maintenance work without replacing the base 10 as a whole, thereby greatly reducing the maintenance cost of the cleaning head 100.
According to another aspect of the present embodiment, the inner walls of the fluid channel 11 of the base 10, the through-hole 31 of the connection plate 30, and the through-hole 21 of the cleaning pad 20 may have different hydrophobicity, i.e., the hydrophobic contact angles of their respective inner walls may be different, respectively. Preferably, the inner walls of the through-holes 31 of the connection plate 30 have a hydrophobicity lower than that of the fluid channels 11 of the susceptor 10, so that contaminants and/or cleaning liquid and crystals thereof generated during the substrate cleaning process are more easily attached to the inner walls of the through-holes 31 of the connection plate 30, and are not or less attached to the inner walls of the fluid channels 11 of the susceptor 10. In the maintenance work of the cleaning head 100, the maintenance work of the cleaning head 100 can be completed only by detaching the connection plate 30 connected between the base 10 and the cleaning pad 20 and washing the through hole 31 of the connection plate 30 heavily and only by properly washing the fluid passage 11 of the base 10, thereby improving the convenience of the maintenance work of the cleaning head 100 and reducing the cost of the maintenance work at the same time. It should be noted that, if the hydrophobicity of the inner wall of the fluid channel 11 of the base 10 is lower than the hydrophobicity of the inner wall of the through hole 31 of the connecting plate 30, relatively more pollutants and/or cleaning liquid and crystals thereof may be attached to the inner wall of the fluid channel 11 of the base 10, and since the fluid channel 11 is a long and narrow structure, the difficulty of cleaning the inner wall of the fluid channel 11 may be increased, thereby increasing the maintenance cost of the cleaning head 100; since the thickness of the connecting plate 30 is generally smaller than the thickness of the base 10, i.e., the depth of the through-hole 31 of the connecting plate 30 is smaller than the height of the fluid passage 11 of the base 10, artificially directing the crystals and/or contaminants, etc. to adhere more to the inner wall of the through-hole 31 of the connecting plate 30 facilitates maintenance cleaning work of the cleaning head 100. As a variation of this embodiment, the inner walls of the through holes 31 of the connection plate 30 may be coated with no or little hydrophobic layer and the inner walls of the fluid channels 11 of the base 10 may be uniformly coated with a hydrophobic layer, such as a hydrophobic material, PTFE, FEP, etc., so that the inner walls of the through holes 31 of the connection plate 30 have a lower hydrophobicity than the inner walls of the fluid channels 11 of the base 10.
According to one aspect of the present embodiment, as shown in fig. 6a, the cross-sectional radius of the fluid channel 11 of the base 10 is the same as that of the through hole 31 of the connection plate 30, and the through hole 21 of the cleaning pad 20 is a tapered hole which is inwardly tapered from top to bottom and has a gradually decreasing cross-sectional radius from top to bottom, so that the cleaning solution with an increased flow rate is sprayed onto the surface of the substrate to be cleaned at a high speed after the cleaning solution flows out through the through hole 21 of the cleaning pad 20 after passing through the fluid channel 11 and the through hole 31 of the connection plate 30, and the arrangement of the through hole 21 of the cleaning pad 20 can increase the flow rate of the cleaning solution flowing through the through hole 21, so that the contaminants on the. As a variation of this embodiment, as shown in fig. 6b, the fluid channel 11 of the base 10 is a tapered hole which is inwardly contracted from top to bottom, the section radius of the tapered hole gradually decreases from top to bottom, the radius of the upper opening 1101 of the fluid channel 11 is greater than the radius of the lower opening 1102 of the fluid channel 11, and the through hole 31 of the connection plate 30 is in coupling communication with the lower opening 1102 of the fluid channel 11; similarly, the through holes 31 of the connecting plate 30 are tapered holes which are inwardly contracted from top to bottom, the section radius of the through holes 31 is gradually reduced from top to bottom, the upper section radius of the through holes 31 of the connecting plate 30 is larger than the lower section radius of the through holes 31, and the through holes 31 of the connecting plate 30 are in coupling communication with the through holes 21 of the cleaning pad 20; the through holes 21 of the cleaning pad 20 are tapered holes which are contracted inwards from top to bottom, the section radius of the through holes is gradually reduced from top to bottom, the flow rate of the cleaning liquid passing through the through holes 21 of the cleaning pad 20 is increased, and the cleaning liquid is sprayed to the surface of the substrate to be cleaned at a high speed, so that pollutants on the substrate to be cleaned can be separated from the surface of the substrate more easily; in other words, the fluid passage 11 of the base 10, the through-holes 31 of the connection plate 30, and the through-holes 21 of the cleaning pad 20 form a through tapered hole having a sectional radius gradually decreasing from top to bottom, and the flow rate of the cleaning liquid flowing out through the through tapered hole is slightly increased to make it easier for contaminants on the substrate to be cleaned to be separated from the surface of the substrate. In one aspect of this embodiment, the diameter of the upper opening 1101 of the fluid channel 11 of the base 10 is 3-5mm, and the fluid velocity of the cleaning solution flowing out through the through holes 21 of the cleaning pad 20 is 5-20mL/s, so that the contaminants are separated from the surface of the substrate.
According to one aspect of this embodiment, as shown in FIG. 6c, the cross-sectional radius of the fluid channel 11 of the base 10 is the same as the cross-sectional radius of the through hole 31 of the connection plate 30, and the through hole 21 of the cleaning pad 20 is a tapered hole spreading from top to bottom, and the cross-sectional radius thereof gradually increases from top to bottom, so that no capillary effect is generated inside the through hole 21 of the cleaning pad 20, and the cleaning solution blocks the through hole 21 of the cleaning pad 20 to affect the transportation of the cleaning solution containing contaminants from bottom to top to the outside of the cleaning head 100 under the action of the negative pressure. As a variation of this embodiment, as shown in fig. 6d, the fluid channel 11 of the base 10 is a conical hole which spreads outward from top to bottom, the section radius of the conical hole gradually increases from top to bottom, the radius of the upper opening 1101 of the fluid channel 11 is smaller than the radius of the lower opening 1102 of the fluid channel 11, and the through hole 31 of the connection plate 30 is in coupling communication with the lower opening 1102 of the fluid channel 11; similarly, the through holes 31 of the connecting plate 30 are tapered holes which are outwardly diffused from top to bottom, the section radius of the through holes 31 is gradually increased from top to bottom, the upper section radius of the through holes 31 of the connecting plate 30 is smaller than the lower section radius of the through holes 31, and the through holes 31 of the connecting plate 30 are in coupling communication with the through holes 21 of the cleaning pad 20; similarly, the through holes 21 of the cleaning pad 20 are tapered holes that diffuse outward from top to bottom, and the section radius thereof gradually increases from top to bottom, so that no capillary effect is generated inside the through holes 21 of the cleaning pad 20, and the cleaning solution blocks the through holes 21 of the cleaning pad 20, thereby affecting the transportation of the cleaning solution containing contaminants to the outside of the cleaning head 100 from bottom to top under the action of negative pressure. In other words, the fluid channel 11 of the base 10, the through hole 31 of the connection plate 30 and the through hole 21 of the cleaning pad 20 form a through tapered hole, and the section radius of the tapered hole gradually increases from top to bottom, so that the capillary effect is not generated inside the through hole 21 of the cleaning pad 20, and the cleaning solution blocks the through hole 21 of the cleaning pad 20 to affect the transportation of the cleaning solution containing the contaminants to the outside of the cleaning head 100 from bottom to top under the action of the negative pressure.
It is understood that other variations of the corresponding section radii of the fluid channel 11, the through hole 31 of the connecting plate 30 and the through hole 21 of the cleaning pad 20 are possible, as long as the following technical effects are achieved without departing from the spirit of the present invention and within the scope of the present invention: after the cleaning liquid is sprayed to the surface of the substrate to be cleaned through the through holes 21 of the cleaning pad 20 at a high speed, no capillary effect is generated through the through holes 21 of the cleaning pad 20, the through holes 31 of the connection plate 30 and/or the fluid passages 11 of the base 10 under the combined action of the discharge pressure of the through holes 21 of the cleaning pad 20 and the vacuum suction force of the other through holes 21, so that the cleaning liquid containing the contaminants is efficiently delivered to the outside of the cleaning head 100, and the cleaning liquid containing the contaminants is sucked or discharged, thereby cleaning the surface of the substrate.
Fig. 7 shows a schematic structural view of the cleaning pad 20, wherein the lower surface of the cleaning pad 20 is provided with a plurality of protrusions 22, the protrusions 22 are disposed between adjacent through holes 21, and the protrusions 22 of the cleaning pad 20 can rapidly absorb/absorb a certain amount of liquid such as cleaning liquid, so that the cleaning pad 20 is softened, and the connection plate 30 or the base 10 disposed on the upper portion of the cleaning pad 20 is prevented from directly contacting with the substrate to be cleaned to damage the characteristic structure of the substrate. According to an aspect of the present embodiment, the cross-sectional shape of the protrusion 21 is a circle, which may also be other closed shapes such as a square, a triangle, an ellipse, etc. As another aspect of the present embodiment, the protrusions 22 can be substantially uniformly arranged on the lower surface of the cleaning pad 20 according to a certain rule, and the protrusions 22 can also coincide with a part of the through holes 21, and the protrusions 22 of the cleaning pad 20 can be arbitrarily arranged on the lower surface of the cleaning pad 20 as long as the functional use of the cleaning pad 20 is not affected. As another aspect of this embodiment, the height of the protrusions 22 can be 1/3 to 1/2 of the thickness of the cleaning pad 20 to ensure functional use of the cleaning pad 20.
The present application further discloses a substrate cleaning apparatus, as shown in FIG. 8, the substrate cleaning apparatus 1000 comprises a substrate cleaning head 100, a substrate fixing device 200, a cleaning liquid pipeline 40 and a gas pipeline 50, the substrate fixing device 200 is used for fixing a substrate W to be cleaned, the substrate cleaning head 100 is arranged on the upper side of the substrate W and moves parallel to the substrate surface at a certain distance from the substrate surface to be cleaned under the action of a cleaning head driving device (not shown), one end of the cleaning liquid pipeline 40 is connected with the liquid supply unit 60, a plurality of cleaning liquid pipeline branch pipes are arranged on the cleaning liquid pipeline 40, the tail ends of the cleaning liquid pipeline branch pipes are connected with an upper opening 1101 of the fluid channel 11 of the base 10, and cleaning liquid is sprayed to the surface of the substrate to be cleaned through the cleaning liquid pipeline branch pipes, the fluid channel 11 of the base 10, the through holes 31 of the connecting plate 30 and the through holes 21 of the cleaning pad 20; according to an aspect of this embodiment, a flow control valve may be further disposed on the branch pipe of the cleaning solution pipeline to individually control the flow rate in each fluid channel 11, so as to improve the local cleaning effect on the surface of the substrate to be cleaned. One end of the gas pipeline 50 is connected to the gas pumping unit 70, a plurality of gas pipeline branch pipes are arranged on the gas pipeline 50, the ends of the gas pipeline branch pipes are connected to the upper opening 1101 of the fluid channel 11 of the base 10, after the cleaning liquid is combined with the contaminants on the surface of the substrate, the gas pumping unit 70 conveys the cleaning liquid containing the contaminants to the outside of the cleaning head 100 through the through hole 21 of the cleaning pad 20, the through hole 31 of the connection plate 30, the fluid channel 11 of the base 10, the gas pipeline branch pipes and the gas pipeline 50 under the action of negative pressure.
According to an aspect of the present embodiment, the cleaning pad 20 has a radius smaller than that of the substrate W, and a cleaning head driving device (not shown) needs to be moved parallel to the surface of the substrate W to be cleaned on the upper side of the substrate W to clean contaminants on the upper surface of the substrate W. According to another aspect of the present embodiment, the rotating motor 80 may be disposed at the lower portion of the substrate fixing device 200, as shown in fig. 10, the rotating motor 80 drives the substrate fixing device 200 to rotate, and the cleaning head driving device only needs to move along the radius direction of the substrate W to clean the surface of the substrate W to be cleaned. According to a further aspect of the present embodiment, the radius of the cleaning pad 20 may be slightly larger than the radius of the substrate W, and the cleaning head 100 is covered above the substrate to be cleaned, so that the substrate can be cleaned without configuring a cleaning head driving device to drive the cleaning head to move left and right.
Fig. 11 is a schematic structural diagram of a cleaning head driving device according to the present invention, which can be applied to the substrate cleaning device shown in fig. 8, wherein the cleaning head driving device 300 includes a cross bar 301 and a vertical bar 302, the cross bar 301 is horizontally fixed on the vertical bar 302, the cleaning head 100 is disposed at the end of the cross bar 301, and the vertical bar 302 can freely swing along the axis of the vertical bar 302, i.e., the cleaning head 100 at the end of the cross bar 301 is driven to swing; at the same time, the cross bar 302 is free to move along the double arrow a, i.e. to change the transverse position of the cleaning head 100; at the same time, the crossbar 302 is free to move along the double arrow B, i.e. to change the vertical position of the cleaning head 100.
Fig. 12 is a schematic structural diagram of another embodiment of the cleaning head driving device of the present invention, the cleaning head driving device 300 freely moves along the bidirectional arrow C to adjust the horizontal position of the cleaning head 100, the cleaning head driving device shown in fig. 12 can be applied to the substrate cleaning device shown in fig. 10, the rotating electrical machine 80 drives the substrate fixing device 200 to rotate, and the cleaning head driving device 300 moves along the radius direction of the substrate W to complete the cleaning of the surface of the substrate to be cleaned.
The substrate cleaning device of the utility model can clean substrates with the diameters of 200mm, 300mm and 450mm, and when the 200mm substrates are cleaned, the speed of the cleaning liquid flowing out from the through holes 21 of the cleaning pad 20 is 5-15 mLl/s; when cleaning a 300mm substrate, the cleaning liquid flows out from the through holes 21 of the cleaning pad 20 at a rate of 8 to 20mLl/s, so as to complete the cleaning of contaminants on the surface of the substrate.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
Claims (12)
1. A substrate cleaning head, comprising: the cleaning device comprises a disk-shaped base with a certain thickness and a circular cleaning pad concentrically connected to the lower surface of the base, wherein the base is provided with a plurality of fluid channels along the thickness direction, the cleaning pad is provided with a plurality of through holes, each through hole is coupled to different fluid channels, and cleaning liquid can be sprayed to the surface of a substrate through one part of the through holes and sucked away through the other part of the through holes after being combined with pollutants on the surface of the substrate.
2. The cleaning head according to claim 1 wherein said through holes are equally spaced along a circumference of said cleaning pad having different diameters.
3. The cleaning head of claim 1 wherein the through holes are equally spaced along a radius of the cleaning pad.
4. A cleaning head as claimed in any one of claims 1 to 3, characterized in that two adjacent through-holes are provided for spraying and sucking away respectively cleaning liquid.
5. The cleaning head of claim 1 wherein the cleaning pad has a radius that is less than the radius of the base.
6. The cleaning head of claim 1 wherein an attachment plate is removably disposed between the base and the cleaning pad, the attachment plate having through-holes identically distributed as the cleaning pad such that cleaning fluid can be sprayed onto the substrate surface via the coupled fluid passages, the through-holes of the attachment plate, the through-holes of the cleaning pad, or such that cleaning fluid can be drawn from the substrate surface via the coupled through-holes of the cleaning pad, the through-holes of the attachment plate, the fluid passages.
7. The cleaning head of claim 6 wherein the cross-sectional radii of the fluid passage, the through-hole of the connecting plate, and the through-hole of the cleaning pad are different.
8. The cleaning head of claim 6 wherein the fluid channels, the through-holes of the web, and the inner walls of the through-holes of the cleaning pad differ in hydrophobicity.
9. The cleaning head of claim 1 wherein the lower surface of the cleaning pad is provided with a plurality of protrusions.
10. The cleaning head of claim 1 wherein the cleaning pad has a radius that is less than the radius of the substrate.
11. A substrate cleaning apparatus comprising the substrate cleaning head according to any one of claims 1 to 10.
12. The apparatus for cleaning a substrate of claim 11, further comprising a cleaning head driving device, a substrate fixing device, a cleaning liquid line, and a gas line, so that the cleaning head is movable parallel to the substrate surface at a distance from the substrate surface, the cleaning liquid line and the gas line connecting the cleaning head to the liquid supply unit and the gas suction unit, respectively.
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| CN201920764868.7U CN210788335U (en) | 2019-05-24 | 2019-05-24 | Substrate cleaning head and substrate cleaning device |
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| CN201920764868.7U CN210788335U (en) | 2019-05-24 | 2019-05-24 | Substrate cleaning head and substrate cleaning device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110153077A (en) * | 2019-05-24 | 2019-08-23 | 清华大学 | A kind of base-plate cleaning head and base plate cleaning device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110153077A (en) * | 2019-05-24 | 2019-08-23 | 清华大学 | A kind of base-plate cleaning head and base plate cleaning device |
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