JP2022047493A - Substrate processing apparatus - Google Patents

Abstract

To provide a substrate processing apparatus capable of sequentially cleaning a front surface and a back surface of a substrate.SOLUTION: A substrate processing apparatus 1 includes: a stage 21 having a substantially disc-shaped form and including a hole 21a in a center thereof; a roller 24a configured to rotate the stage; a plurality of hold pins 22 configured to hold a substrate; a first liquid nozzle 44 configured to supply a first liquid 101 to a first surface 100c of the substrate 100 opposite to a side that faces the stage; a first driver 45 configured to move a position of the first liquid nozzle 44; a second liquid nozzle 54 configured to supply a second liquid from the hole 21a of the stage 21 to a second surface 100b of the substrate 100; a second driver 55 configured to move a position of the second liquid nozzle 54; a cooling nozzle 34 configured to supply a cooling gas 3a from the hole 21a of the stage 21 to the second surface 100b; a third driver 35 configured to move a position of the cooling nozzle 34; and a controller 9 configured to control the first driver 45, the second driver 55, and the third driver 35.SELECTED DRAWING: Figure 1

Description

Embodiments of the present invention relate to a substrate processing apparatus.

Fine uneven portions are provided on the surface of substrates such as imprint templates, photolithography mask substrates, and semiconductor wafers.
Here, as a method for removing contaminants such as particles adhering to the surface of the substrate, an ultrasonic cleaning method, a two-fluid spray cleaning method, and the like are known. However, if ultrasonic waves are applied to the substrate or a fluid is sprayed onto the surface of the substrate, the fine uneven portions formed on the surface of the substrate may be damaged. Further, in recent years, the uneven portion has become finer and the uneven portion is more easily damaged.

Therefore, a freeze-cleaning device has been proposed as a device for removing contaminants adhering to the surface of the substrate (see, for example, Patent Document 1).
Such a freeze-cleaning device includes a disk-shaped member that adsorbs and holds the substrate, a pure water supply nozzle that supplies pure water to the surface of the substrate held by the disk-shaped member, and a disk-shaped member. A cooling nozzle for supplying a cooling medium is provided on the surface opposite to the side where the cooling medium is held. In this case, the freeze-cleaning is performed on the front surface of the substrate to which pure water is supplied, and the back surface of the substrate to which pure water is not supplied is not freeze-cleaned.

In recent years, it has been required to remove contaminants such as particles adhering to the back surface of the substrate. In this case, if the front surface of the substrate is freeze-cleaned, the substrate is inverted, and the back surface of the substrate is freeze-cleaned, contaminants such as particles adhering to the back surface of the substrate can also be removed. However, in this way, the configuration of the apparatus becomes complicated, and the time required for cleaning the substrate becomes long.
Therefore, it has been desired to develop a substrate processing apparatus capable of sequentially cleaning the front surface and the back surface of the substrate.

Japanese Unexamined Patent Publication No. 11-31673

An object to be solved by the present invention is to provide a substrate processing apparatus capable of sequentially cleaning the front surface and the back surface of a substrate.

The substrate processing apparatus according to the embodiment is provided on a mounting table having a substantially disk shape and a hole in the central portion, a roller that comes into contact with the side surface of the described table and rotates the table, and the table. , The positions of the plurality of holding pins for holding the substrate, the first liquid nozzle for supplying the first liquid to the first surface of the substrate opposite to the above-mentioned pedestal side, and the position of the first liquid nozzle. A first drive unit for moving the liquid, a second liquid nozzle for supplying a second liquid to the second surface of the substrate on the side of the above-mentioned pedestal from the hole of the above-mentioned pedestal, and the second liquid nozzle. A second drive unit that moves the position of the liquid nozzle, a cooling nozzle that supplies cooling gas to the second surface from the hole of the above-mentioned table, and a third drive unit that moves the position of the cooling nozzle. And a controller for controlling the first drive unit, the second drive unit, and the third drive unit. When supplying the cooling gas to the second surface, the controller controls the third drive unit to dispose the cooling nozzle below the second surface, and the second surface is located. The drive unit is controlled to move the second liquid nozzle to the retracted position of the second liquid nozzle. Alternatively, when supplying the second liquid to the second surface, the controller controls the second drive unit to move the second liquid nozzle below the second surface. The third drive unit is arranged and the cooling nozzle is moved to the retracted position of the cooling nozzle.

According to an embodiment of the present invention, there is provided a substrate processing apparatus capable of sequentially cleaning the front surface and the back surface of a substrate.

It is a schematic diagram for exemplifying the substrate processing apparatus which concerns on this embodiment. It is a schematic plan view for exemplifying the structure and arrangement of a cooling part, a 1st liquid supply part, and a 2nd liquid supply part. It is a timing chart for exemplifying the operation of a substrate processing apparatus. It is a graph for exemplifying the temperature change in a freeze cleaning process (front surface cleaning process), a back surface cleaning process, and a drying process. It is a schematic diagram for exemplifying the arrangement of the nozzles at the time of carrying-in process and carrying-out process. It is a schematic diagram for exemplifying the arrangement of the nozzles at the time of performing a freeze-washing process. It is a schematic diagram for exemplifying the arrangement of the nozzles at the time of performing a back surface cleaning process. It is a schematic diagram for exemplifying the arrangement of the nozzles at the time of performing a drying process. It is a schematic sectional drawing for exemplifying the substrate processing apparatus which concerns on other embodiment. (A) is a schematic plan view of the mounting portion. (B) is a schematic plan view of the holding pin cover according to another embodiment. It is a schematic sectional drawing for exemplifying the substrate processing apparatus which concerns on other embodiment. It is a schematic sectional drawing for exemplifying the substrate processing apparatus which concerns on other embodiment. (A) is a schematic plan view of the mounting portion. (B) is a schematic plan view of the holding pin cover according to another embodiment.

Hereinafter, embodiments will be illustrated with reference to the drawings. In each drawing, similar components are designated by the same reference numerals and detailed description thereof will be omitted as appropriate.
The substrate 100 illustrated below may be, for example, a semiconductor wafer, a template for imprinting, a mask substrate for photolithography, a plate-like body used for MEMS (Micro Electro Mechanical Systems), or the like.
However, the use of the substrate 100 is not limited to these.

FIG. 1 is a schematic diagram for illustrating the substrate processing apparatus 1 according to the present embodiment.
As shown in FIG. 1, the substrate processing apparatus 1 includes a mounting unit 2, a cooling unit 3, a first liquid supply unit 4, a second liquid supply unit 5, a housing 6, a blower unit 7, an exhaust unit 8, and an exhaust unit 8. A controller 9 is provided.

The mounting portion 2 has a mounting base 21, a holding pin 22, an elevating portion 23, and a rotating portion 24.
The mounting table 21 is rotatably provided inside the housing 6. The mounting table 21 has, for example, a substantially disk shape, and the side surface 21c is a tapered surface. A hole 21a penetrating the thickness direction of the mounting table 21 is provided in the central portion of the mounting table 21.

Further, a plurality of holes 21b are provided so as to penetrate the mounting table 21 in the thickness direction. For example, the plurality of holes 21b can be provided along the peripheral edge of the substrate 100. For example, when the planar shape of the substrate 100 is a circle, a plurality of holes 21b can be provided at equal intervals on the circumference centered on the center of the substrate 100. For example, when the planar shape of the substrate 100 is a quadrangle, the holes 21b can be provided in the vicinity of the corners of the substrate 100.

The plurality of holes 21b can be stepped holes in which the opening diameter on the substrate 100 side is larger than the opening diameter on the side opposite to the substrate 100 side. A holding pin 22 is movably provided inside the hole 21b.

A plurality of holding pins 22 are provided and can come into contact with the side surface 100a of the substrate 100 and the edge of the back surface 100b (corresponding to an example of the second surface) of the substrate 100. That is, the plurality of holding pins 22 are provided on the mounting table 21 to hold the substrate 100. When the substrate 100 is held by the plurality of holding pins 22, the surface 100c of the substrate 100 (corresponding to an example of the first surface) faces the opposite side to the mounting table 21 side.

The holding pin 22 has a columnar shape and can have a guide portion 22a, a support portion 22b, a holding portion 22c, and a cushioning portion 22d. The guide portion 22a, the support portion 22b, and the holding portion 22c can be integrally formed. The guide portion 22a, the support portion 22b, and the holding portion 22c can be formed of, for example, a metal such as stainless steel.

The guide portion 22a has a columnar shape and can be provided inside the hole 21b. A slight gap is provided between the guide portion 22a and the inner wall of the portion of the hole 21b opposite to the substrate 100 side so that the guide portion 22a (holding pin 22) can move along the hole 21b. It has become.

The support portion 22b has a columnar shape and can be provided at one end of the guide portion 22a. The diameter dimension of the support portion 22b can be larger than the diameter dimension of the guide portion 22a. The end of the support portion 22b on the side opposite to the guide portion 22a side is a tapered surface. If the end of the support portion 22b has a tapered surface, it becomes easy to prevent the holding pin 22 from contacting the edge of the back surface 100b of the substrate 100 and not the back surface 100b of the substrate 100.

The holding portion 22c has a columnar shape and can be provided at the end of the support portion 22b on the side opposite to the guide portion 22a side. The diameter dimension of the holding portion 22c can be made smaller than the diameter dimension of the supporting portion 22b. The tip of the holding portion 22c has a tapered surface. If the tip of the holding portion 22c has a tapered surface, it becomes easy to insert the substrate 100 into the region where the plurality of holding pins 22 are provided from above.

The cushioning portion 22d has a columnar shape and is provided at the end portion of the guide portion 22a on the side opposite to the support portion 22b side. The tip of the cushioning portion 22d can be, for example, hemispherical. The cushioning portion 22d can be formed from an elastic body such as silicon rubber. The cushioning portion 22d can be adhered to, for example, the end portion of the guide portion 22a.

When the holding pin 22 is mounted inside the hole 21b, the end portion of the support portion 22b on the guide portion 22a side comes into contact with the bottom surface of the stepped portion of the hole 21b. Therefore, the positions of the plurality of holding pins 22 with respect to the mounting table 21 and, by extension, the positions of the substrate 100 with respect to the mounting table 21 are substantially constant. Further, since the plurality of holding pins 22 (holding portions 22c) come into contact with the side surface 100a of the substrate 100, it is possible to prevent the substrate 100 from being displaced due to centrifugal force when the substrate 100 is rotated.

The elevating part 23 can have a pusher 23a and a driving part 23b.
The pusher 23a can be provided inside the housing 6. The pusher 23a can be provided at a position facing the plurality of holding pins 22. The pusher 23a can be, for example, a plate-like body having an annular planar shape. As described above, the arrangement of the plurality of holding pins 22 is changed according to the planar shape and the planar dimensions of the substrate 100. Therefore, the planar shape and the planar dimensions of the pusher 23a can be changed according to the planar shape and the planar dimensions of the substrate 100 (arrangement of the plurality of holding pins 22). For example, when the planar shape of the substrate 100 is a circle, the planar shape of the pusher 23a can be an annular shape. For example, when the planar shape of the substrate 100 is a quadrangle, the planar shape of the pusher 23a can be a quadrangular annular shape.

The drive unit 23b can be provided outside the housing 6. The drive unit 23b moves the position of the pusher 23a in the elevating direction. The drive unit 23b is not particularly limited as long as it can raise and lower the pusher 23a. The drive unit 23b may be provided with a device such as an air cylinder or a servomotor and a guide mechanism.

For example, when the substrate 100 is transferred between the transfer device (not shown) and the mounting unit 2, the pusher 23a is raised by the drive unit 23b as shown in FIG. 5 to be described later. When the pusher 23a is raised, the plurality of holding pins 22 are lifted by the pusher 23a, and the distance between the substrate 100 and the mounting table 21 is increased. If the distance between the substrate 100 and the mounting table 21 becomes large, the substrate 100 can be easily transferred between the transport device (not shown) and the mounting portion 2.

For example, when the substrate 100 is rotated for freeze cleaning, which will be described later, the pusher 23a is lowered by the drive unit 23b. When the pusher 23a is lowered, the plurality of holding pins 22 are lowered to hold the substrate 100 in a predetermined position on the mounting table 21. At this time, as shown in FIG. 1, a predetermined gap is provided between the holding pin 22 and the pusher 23a. Therefore, when the mounting table 21 (board 100) rotates, the holding pin 22 and the pusher 23a do not interfere with each other.

The rotating unit 24 rotates the mounting table 21 around the central axis of the mounting table 21. As described above, the substrate 100 is held by a plurality of holding pins 22 provided on the mounting table 21. Therefore, the rotating unit 24 rotates the substrate 100 via the mounting table 21 and the plurality of holding pins 22. By doing so, since the substrate 100 can be indirectly rotated, it is possible to suppress damage such as rubbing on the side surface of the substrate 100 and the like. Further, it is possible to cope with various substrates 100 having different planar shapes and planar dimensions only by changing the number and arrangement of the plurality of holding pins 22. Further, the rotating portion 24 supports the mounting table 21.

The rotating portion 24 has a roller 24a, a driving portion 24b, and a supporting portion 24c.
The roller 24a comes into contact with the side surface 21c of the mounting table 21 and rotates the mounting table 21. For example, a plurality of rollers 24a can be provided on the circumference centered on the central axis of the mounting table 21. For example, the plurality of rollers 24a can be provided at equal intervals. The roller 24a can have, for example, a shape (for example, a drum shape) in which the vicinity of the center of the side surface is recessed. The shape of the side surface of the roller 24a can be adapted to the shape of the side surface 21c of the mounting table 21. By doing so, the contact portion between the side surface of the roller 24a and the side surface 21c of the mounting table 21 can be increased, so that the rotational force of the roller 24a can be efficiently transmitted to the mounting table 21.

The drive unit 24b can be provided outside the housing 6. The drive unit 24b can be connected to one of the plurality of rollers 24a. In this case, the roller 24a to which the drive unit 24b is connected can be used as the drive roller, and the other roller 24a can be used as the guide roller. Further, the roller 24a to which the drive unit 24b is connected and at least a part of the other rollers 24a can be connected by a conduction member such as a timing belt. The drive unit 24b can have a rotating device such as a motor. The drive unit 24b can change the rotation speed (rotational speed) as well as start and stop the rotation. The drive unit 24b may be provided with a control motor such as a servo motor, for example. The other rollers 24a are rotatably supported by the support portion 24c.

The support portion 24c is a member that rotatably supports the roller 24a. For example, a cylinder with a flange attached to one end. One end of the support portion 24c to which the flange is attached is fixed to the housing 6. The other end of the support portion 24c is connected to the lower surface of the roller 24a so that the rotation axis of the roller 24a and the central axis of the support portion 24c coincide with each other. The material of the support portion 24c can be, for example, a metal such as SUS or aluminum. However, it is not limited to these materials. A resin, ceramic, or the like may be used as long as it has a strength that does not break under the load of the mounting table 21.

When the support portion 24c rotates with the roller 24a, one end of the support portion 24c is rotatably connected to the flange. For example, it is connected to the flange via a ball bearing. When the support portion 24c does not rotate with the roller 24a, the other end of the support portion 24c is rotatably connected to the lower surface of the roller 24a. For example, it is connected to the lower surface of the roller 24a via a ball bearing.
Since the roller 24a is rotatably supported by the drive portion and the support portion 24c, the roller 24a can rotatably support the mounting table 21. That is, the rotating portion 24 rotatably supports the mounting table 21 via the rollers 24a.

FIG. 2 is a schematic plan view for illustrating the configuration and arrangement of the cooling unit 3, the first liquid supply unit 4, and the second liquid supply unit 5.
The cooling unit 3 directly supplies the cooling gas 3a to the back surface 100b of the substrate 100.
As shown in FIGS. 1 and 2, the cooling unit 3 includes a coolant unit 31, a filter 32, a flow rate control unit 33, a cooling nozzle 34, a drive unit 35 (corresponding to an example of a third drive unit), and piping. Has 36. The coolant unit 31, the filter 32, and the flow rate control unit 33 are provided outside the housing 6.

The coolant unit 31 stores the coolant and generates the cooling gas 3a. The cooling liquid is a liquefied cooling gas 3a. The cooling gas 3a is not particularly limited as long as it is a gas that does not easily react with the material of the substrate 100. The cooling gas 3a can be, for example, an inert gas such as nitrogen gas, helium gas, or argon gas. In this case, if a gas having a high specific heat is used, the cooling time of the substrate 100 can be shortened. For example, if helium gas is used, the cooling time of the substrate 100 can be shortened. Further, if nitrogen gas is used, the processing cost of the substrate 100 can be reduced.

The coolant unit 31 has a tank for storing the coolant and a vaporization unit for vaporizing the coolant stored in the tank. The tank is provided with a cooling device for maintaining the temperature of the coolant. The vaporization unit raises the temperature of the cooling liquid to generate cooling gas 3a from the cooling liquid. The temperature of the cooling gas 3a may be such that the liquid 101 (corresponding to an example of the first liquid) can be cooled to a temperature below the freezing point to be in a supercooled state. For example, the temperature of the cooling gas 3a may be a temperature equal to or lower than the freezing point of the liquid 101. For example, the temperature of the cooling gas 3a can be −170 ° C.

The filter 32 is connected to the coolant section 31 via a pipe. The filter 32 suppresses the outflow of contaminants such as particles contained in the coolant to the substrate 100 side.

The flow rate control unit 33 is connected to the filter 32 via a pipe. The flow rate control unit 33 controls the flow rate of the cooling gas 3a. The temperature of the cooling gas 3a generated from the cooling liquid in the cooling liquid unit 31 is substantially a predetermined temperature. Therefore, the flow rate control unit 33 can control the temperature of the substrate 100 and, by extension, the temperature of the liquid 101 on the substrate 100 by controlling the flow rate of the cooling gas 3a.

The flow rate control unit 33 may be, for example, an MFC (Mass Flow Controller) or the like. Further, the flow rate control unit 33 may indirectly control the flow rate of the cooling gas 3a by controlling the supply pressure of the cooling gas 3a. In this case, the flow rate control unit 33 may be, for example, an APC (Auto Pressure Controller).

The cooling nozzle 34 supplies the cooling gas 3a to the back surface 100b of the substrate 100 from the hole 21a of the mounting table 21. One end of the cooling nozzle 34 is connected to the flow rate control unit 33 via the pipe 36. The cooling nozzle 34 directly supplies the cooling gas 3a whose flow rate is controlled by the flow rate control unit 33 to the back surface 100b of the substrate 100.

The cooling nozzle 34 has a tubular shape and has a tapered shape in which the inner diameter gradually increases toward the side of the substrate 100. The cooling nozzle 34 may have a funnel shape, for example. In this case, if the angle θ of the tapered portion of the cooling nozzle 34 is made too large, the flow of the cooling gas 3a is separated from the inner wall of the tapered portion, and turbulent flow is generated. When turbulence occurs, air between the substrate 100 and the mounting table 21 may be entrained, the temperature of the cooling gas 3a may rise, or the temperature of the substrate 100 may have an in-plane distribution. On the other hand, if the angle θ of the tapered portion of the cooling nozzle 34 is made too small, the back surface 100b of the substrate 100 is locally cooled, and the temperature of the substrate 100 tends to be distributed in the plane. According to the findings obtained by the present inventor, the angle θ of the tapered portion of the cooling nozzle 34 is preferably larger than 0 ° and preferably 8 ° or less.

The drive unit 35 moves the position of the cooling nozzle 34 with respect to the substrate 100. As shown in FIG. 2, for example, the drive unit 35 can be an articulated robot or the like. However, the drive unit 35 is not limited to the articulated robot, and the cooling nozzle 34 can be moved between the position where the cooling gas 3a is supplied below the substrate 100 and the retracted position outside the substrate 100. Anything is fine.

The pipe 36 is a pipe made of a material having good thermal conductivity. The pipe 36 is made of, for example, a metal such as SUS or copper. Further, the pipe 36 has a shape in which a part of the pipe is bellows. The pipe 36 is connected to the drive unit 35. Since a part of the pipe 36 has a bellows shape, the operation of the drive unit 35 can be followed. The pipe 36 may be covered with a heat insulating material.

The first liquid supply unit 4 supplies the liquid 101 to the surface 100c (the surface opposite to the mounting table 21 side) of the substrate 100. The liquid 101 can be, for example, water (for example, pure water, ultrapure water, etc.), a liquid containing water as a main component, or the like. The liquid containing water as a main component can be, for example, a mixed solution of water and alcohol, a mixed solution of water and an acidic solution, a mixed solution of water and an alkaline solution, and the like. In this case, if the amount of components other than water becomes too large, it becomes difficult to utilize the physical force associated with the volume increase described later. Therefore, the concentration of components other than water is preferably 5 wt% or more and 30 wt% or less. Further, the gas can be dissolved in the liquid 101. The gas can be, for example, carbon dioxide gas, ozone gas, hydrogen gas, or the like. The temperature of the liquid 101 can be, for example, about room temperature (20 ° C.).

As shown in FIG. 1, the first liquid supply unit 4 includes a liquid storage unit 41, a supply unit 42, a flow rate control unit 43, a liquid nozzle 44 (corresponding to an example of the first liquid nozzle), a drive unit 45, and a drive unit 45. It has a pipe 46. The liquid storage unit 41, the supply unit 42, and the flow rate control unit 43 can be provided outside the housing 6.

The liquid storage unit 41 stores the liquid 101.
The supply unit 42 is connected to the liquid storage unit 41 via the pipe 46. The supply unit 42 supplies the liquid 101 stored in the liquid storage unit 41 toward the liquid nozzle 44.
The flow rate control unit 43 is connected to the supply unit 42 via a pipe. The flow rate control unit 43 controls the flow rate of the liquid 101 supplied by the supply unit 42. The flow rate control unit 43 can be, for example, a flow rate control valve. Further, the flow rate control unit 43 can also start and stop the supply of the liquid 101.

The liquid nozzle 44 is provided inside the housing 6. The liquid nozzle 44 supplies the liquid 101 to the surface 100c of the substrate 100. The liquid nozzle 44 has a tubular shape. One end of the liquid nozzle 44 is connected to the flow rate control unit 43 via a pipe. When supplying the liquid 101 to the surface 100c of the substrate 100, the other end of the liquid nozzle 44 faces the surface 100c of the substrate 100 mounted on the mounting table 21. In this case, the other end of the liquid nozzle 44 (the discharge port of the liquid 101) can face substantially the center of the surface 100c of the substrate 100.

The drive unit 45 moves the position of the liquid nozzle 44 with respect to the substrate 100. As shown in FIG. 2, for example, the drive unit 45 can be an articulated robot or the like. However, the drive unit 45 is not limited to the articulated robot, and the liquid nozzle 44 can be moved between the position where the liquid 101 is supplied above the substrate 100 and the retracted position outside the substrate 100. Anything is fine.

The pipe 46 is a flexible pipe. The pipe 46 is, for example, a tube made of resin. For example, PU (polyurethane), nylon, PVC (polyvinyl chloride), PP (polypropylene), PTFE (polytetrafluoroethylene), PVDF (polyvinylidene fluoride), CTFE (clotrifluoroethylene), polyolefin and the like can be used. .. The pipe 46 is connected to the drive unit 45 so as to be able to follow the operation of the drive unit 45.

The second liquid supply unit 5 supplies the liquid 102 (corresponding to an example of the second liquid) to the back surface 100b of the substrate 100. The liquid 102 is used in the back surface cleaning step described later. Therefore, the liquid 102 is not particularly limited as long as it does not easily react with the material of the substrate 100 and does not easily remain on the substrate 100 in the drying step described later. The liquid 102 can be, for example, water (for example, pure water or ultrapure water), a mixed liquid of water and alcohol, or the like. The temperature of the liquid 102 can be, for example, about room temperature (20 ° C.).

As shown in FIG. 1, the second liquid supply unit 5 includes a liquid storage unit 51, a supply unit 52, a flow rate control unit 53, a liquid nozzle 54 (corresponding to an example of a second liquid nozzle), and a drive unit 55 (second liquid nozzle). It corresponds to an example of the drive unit of 2), and has a pipe 56.
The liquid storage unit 51 can be the same as the liquid storage unit 41 described above. The supply unit 52 can be the same as the supply unit 42 described above. The flow rate control unit 53 can be the same as the flow rate control unit 43 described above. The liquid nozzle 54 can be the same as the liquid nozzle 44 described above. However, the liquid nozzle 54 supplies the liquid 102 to the back surface 100b of the substrate 100 from the hole 21a of the mounting table 21.

The drive unit 55 moves the position of the liquid nozzle 54 with respect to the substrate 100. As shown in FIG. 2, for example, the drive unit 55 can be an articulated robot or the like. However, the drive unit 55 is not limited to the articulated robot, and the liquid nozzle 54 can be moved between the position where the liquid 102 is supplied below the substrate 100 and the retracted position outside the substrate 100. Anything is fine.

When the liquid 102 and the liquid 101 are the same, for example, the liquid storage unit 51, the supply unit 52, and the flow rate control unit 53 are omitted, and the flow rate control unit 43 and the liquid nozzle 54 are connected via a switching valve. do it.

Here, as will be described later, when the surface 100c of the substrate 100 is freeze-cleaned, a preliminary step, a liquid film forming step, a cooling step, and a thawing step are executed. Further, after this freeze cleaning, a cleaning step of the back surface 100b of the substrate 100 is executed. Further, the drying step is executed after cleaning the back surface 100b of the substrate 100. After cleaning the back surface 100b of the substrate 100, the front surface 100c of the substrate 100 may be freeze-cleaned. Further, a carry-in step of delivering the uncleaned substrate 100 to the mounting unit 2 and a carrying-out step of receiving the cleaned substrate 100 from the mounting unit 2 are executed.

In this case, the cooling nozzle 34, the liquid nozzle 44, and the liquid nozzle 54 need to be arranged at appropriate positions according to the contents of these steps. Therefore, as described above, the cooling nozzle 34 is movable by the drive unit 35, the liquid nozzle 44 is movable by the drive unit 45, and the liquid nozzle 54 is movable by the drive unit 55. A detailed explanation of the contents of each process and the arrangement of nozzles in each process will be described later.

The housing 6 has a box shape. A cover 61 can be provided inside the housing 6. The cover 61 receives the liquid 101 and the liquid 102 discharged to the outside of the substrate 100 by rotating the substrate 100. If the cover 61 is provided, the liquid 101 and the liquid 102 can be effectively collected. A drain 63 for discharging the collected liquid 101 and the liquid 102 to the outside of the housing 6 can be provided on the bottom surface of the housing 6.

The blower portion 7 is provided on the ceiling surface of the housing 6. The blower portion 7 can also be provided on the side surface of the housing 6 on the ceiling side. The blower unit 7 may be provided with a blower such as a fan and a filter. If the blower portion 7 is provided, the pressure inside the housing 6 becomes higher than the pressure outside. As a result, it becomes easy to guide the used cooling gas 3a to the discharge port 62. In addition, it is possible to prevent contaminants such as particles from entering the inside of the housing 6.

The exhaust unit 8 is connected to an exhaust port 62 provided on the bottom surface side of the housing 6. The exhaust unit 8 discharges the used cooling gas 3a and the air supplied from the air blower unit 7 to the outside of the housing 6 from the exhaust port 62. The exhaust unit 8 may be, for example, a blower or the like.

The controller 9 controls the operation of each element provided in the substrate processing device 1. The controller 9 can have, for example, an arithmetic element such as a CPU (Central Processing Unit) and a storage element such as a semiconductor memory. The controller 9 can be, for example, a computer. A control program for controlling the operation of each element provided in the substrate processing device 1 can be stored in the storage element. The arithmetic element controls the operation of each element provided in the substrate processing apparatus 1 by using a control program stored in the storage element, data input by the operator, and the like.

For example, the cooling rate of the liquid 101 correlates with the thickness of the liquid film. For example, the thinner the liquid film, the faster the cooling rate of the liquid 101. Conversely, the thicker the liquid film, the slower the cooling rate of the liquid 101. Therefore, the controller 9 can control the cooling unit 3 based on the thickness of the liquid 101 (thickness of the liquid film) to control the flow rate of the cooling gas 3a and the cooling speed of the liquid 101. In this case, the correlation between the cooling rate of the liquid 101 and the thickness of the liquid film can be obtained by conducting experiments or simulations in advance.

Next, the operation of the substrate processing apparatus 1 will be illustrated.
FIG. 3 is a timing chart for exemplifying the operation of the substrate processing apparatus 1.
FIG. 4 is a graph for exemplifying temperature changes in the freeze-cleaning step (front surface cleaning step), the back surface cleaning step, and the drying step.
3 and 4 show the case where the substrate 100 is a 6025 quartz (Qz) substrate (152 mm × 152 mm × 6.35 mm), and the liquid 101 and the liquid 102 are pure water.
FIG. 5 is a schematic diagram for exemplifying the arrangement of nozzles when performing the carry-in step and the carry-out step.
FIG. 6 is a schematic diagram for exemplifying the arrangement of nozzles when performing the freeze-cleaning step.
FIG. 7 is a schematic diagram for exemplifying the arrangement of nozzles when performing the back surface cleaning step.
FIG. 8 is a schematic diagram for exemplifying the arrangement of nozzles when performing the drying step.

First, the substrate 100 is carried into the inside of the housing 6 through a carry-in / carry-out port (not shown) of the housing 6. In the carry-in process, as shown in FIG. 5, the controller 9 controls the drive unit 23b to raise the pusher 23a. When the pusher 23a is raised, the plurality of holding pins 22 are lifted, so that the distance between the mounting position of the substrate 100 on the plurality of holding pins 22 and the mounting table 21 becomes large. Therefore, the substrate 100 can be easily transferred between the transport device (not shown) and the mounting portion 2.

Subsequently, the controller 9 controls the drive unit 23b to lower the pusher 23a. When the pusher 23a is lowered, the plurality of holding pins 22 are lowered, and the substrate 100 is held at a predetermined position above the mounting table 21.

Next, as shown in FIG. 6, the controller 9 controls the drive unit 45 to arrange the liquid nozzle 44 above the substantially center of the surface 100c of the substrate 100. Further, the controller 9 controls the drive unit 35 to arrange the cooling nozzle 34 below the substantially center of the back surface 100b of the substrate 100. As shown in FIG. 6, the dimension L2 of the portion provided with the cooling nozzle 34 is smaller than the clearance dimension L1 between the holding pin 22 and the elevating portion 23. Therefore, the cooling nozzle 34 can pass through the gap between the holding pin 22 and the elevating portion 23.

Subsequently, as shown in FIG. 3, a freeze-cleaning step including a preliminary step, a liquid film forming step, a cooling step, and a thawing step is performed.

First, a preliminary step is performed as shown in FIGS. 3 and 4. In the preliminary step, the controller 9 controls the supply unit 42 and the flow rate control unit 43 to supply the liquid 101 at a predetermined flow rate to the surface 100c of the substrate 100. Further, the controller 9 controls the flow rate control unit 33 to supply the cooling gas 3a having a predetermined flow rate to the back surface 100b of the substrate 100. Further, the controller 9 controls the drive unit 24b to rotate the substrate 100 at a predetermined rotation speed.

At this time, the controller 9 can control the drive unit 45 to swing the liquid nozzle 44 from which the liquid 101 is discharged along the surface 100c of the substrate 100. By doing so, the liquid 101 can be supplied to a wider region of the surface 100c of the substrate 100, so that it becomes easy to form a liquid film having a uniform thickness.

Further, the controller 9 can control the drive unit 35 to swing the cooling nozzle 34 discharged from the cooling gas 3a along the back surface 100b of the substrate 100. By doing so, the cooling gas 3a can be supplied to a wider region of the back surface 100b of the substrate 100, so that the substrate 100 can be cooled more uniformly, and by extension, a wider region of the front surface 100c of the substrate 100. The liquid 101 can be uniformly cooled in the above.

Here, when the atmosphere inside the housing 6 is cooled by the supply of the cooling gas 3a, frost containing dust in the atmosphere may adhere to the substrate 100 and cause contamination. In the preliminary step, since the liquid 101 is continuously supplied to the surface 100c of the substrate 100, it is possible to prevent the adhesion of frost to the surface 100c of the substrate 100 while uniformly cooling the substrate 100.

For example, in the case of the example shown in FIG. 3, the second rotation speed is about 20 rpm to 500 rpm, the flow rate of the liquid 101 is about 0.1 L / min to 1.0 L / min, and the flow rate of the cooling gas 3a is 40 NL / min. The process time of the preliminary step can be set to about 1800 seconds and about 200 NL / min. The process time of the preliminary step may be any time as long as the in-plane temperature of the substrate 100 becomes substantially uniform, and is appropriately determined by conducting an experiment or a simulation.

The temperature of the liquid film in the preliminary step is substantially the same as the temperature of the supplied liquid 101 because the liquid 101 is in a flowing state. For example, when the temperature of the supplied liquid 101 is about normal temperature (20 ° C.), the temperature of the liquid film is about normal temperature (20 ° C.).

Next, the liquid film forming step is executed as shown in FIGS. 3 and 4. The rotation speed of the substrate 100 in the liquid film forming step is a rotation speed (first rotation speed) having a predetermined thickness at which a high removal rate of the liquid film can be obtained. For example, the first rotation speed is 0 rpm to 100 rpm. That is, the controller 9 rotates the substrate 100 at a rotation speed lower than the rotation speed at the time of the preliminary process. Then, as illustrated in FIG. 4, the supply of the liquid 101 supplied in the preliminary process is stopped. The first rotation speed may be any rotation speed that can suppress the variation in the thickness of the liquid film due to centrifugal force. During the liquid film forming step, the flow rate of the cooling gas 3a is maintained at the same supply amount as in the preliminary step. As a result, the in-plane temperature of the substrate 100 can be maintained in a substantially uniform state.

The number of revolutions may be the first from the preliminary step. In this case, in the liquid film forming step, the same rotation speed as in the preliminary step may be maintained. Further, the second rotation speed may be set to a rotation speed equal to or lower than the first rotation speed.

Further, when shifting from the preliminary step to the liquid film forming step, the supply of the liquid 101 may be stopped, and then the liquid 101 supplied in the preliminary step may be discharged by rotating the substrate 100 at a high speed. .. In this case, after the liquid 101 is discharged, the rotation speed of the substrate 100 is equal to or less than the rotation speed (50 rpm) at which a liquid film having a uniform thickness is maintained, or after the rotation of the substrate 100 is stopped, a predetermined amount of liquid is used. The 101 may be supplied to the substrate 100. By doing so, a liquid film having a predetermined thickness can be easily formed.

For example, the thickness of the liquid film when performing the cooling step can be about 30 μm to 1300 μm. In this case, the controller 9 controls the supply amount of the liquid 101 and the rotation speed of the substrate 100 to make the thickness of the liquid film on the surface 100c of the substrate 100 about 30 μm to 1300 μm.

Next, a cooling step is performed as shown in FIGS. 3 and 4. In the present embodiment, in the cooling step, the "supercooling step" starts before the freezing of the liquid 101 in the overcooled state starts, and the freezing of the liquid 101 in the overcooled state starts and freezes. The period until it is completely completed is called a "freezing step (solid-liquid phase)", and the period until the frozen liquid 101 is further cooled to cause cracks is called a "freezing step (solid phase)". In the supercooling step, only the liquid 101 is present on the surface 100c of the substrate 100. In the freezing step (solid-liquid phase), the liquid 101 and the liquid 101 are frozen on the surface 100c of the substrate 100. In the freezing step (solid phase), only the frozen liquid 101 is present on the surface 100c of the substrate 100.
The solid-liquid phase means a state in which the liquid 101 and the frozen liquid 101 are present at the same time.

First, in the supercooling step, the temperature of the liquid film on the substrate 100 is further lowered from the temperature of the liquid film in the liquid film forming step due to the cooling gas 3a continuously supplied to the back surface 100b of the substrate 100, resulting in supercooling. It becomes a state.

Here, if the cooling rate of the liquid 101 becomes too high, the liquid 101 does not become a supercooled state and freezes immediately. Therefore, the controller 9 controls at least one of the rotation speed of the substrate 100, the flow rate of the cooling gas 3a, and the supply amount of the liquid 101 so that the liquid 101 on the surface 100c of the substrate 100 is in an overcooled state. To.

The control conditions under which the liquid 101 is in the supercooled state are affected by the size of the substrate 100, the viscosity of the liquid 101, the specific heat of the cooling gas 3a, and the like. Therefore, it is preferable to appropriately determine the control conditions for the liquid 101 to be in the supercooled state by conducting an experiment or a simulation.

In the supercooled state, freezing of the liquid 101 starts due to, for example, the temperature of the liquid film, the presence of contaminants such as particles, vibration, and the like. For example, in the presence of contaminants such as particles, freezing of the liquid 101 starts when the temperature T of the liquid 101 becomes −35 ° C. or higher and −20 ° C. or lower.

When the supercooled liquid 101 starts to freeze, the process shifts from the supercooling step to the freezing step (solid-liquid phase). In the freezing step (solid-liquid phase), the liquid 101 and the liquid 101 are frozen on the surface 100c of the substrate 100. As described above, in the supercooled liquid 101, the contaminants may be the starting point of the start of freezing, and it is considered that the contaminants are taken into the solid. Further, it is considered that the contaminants adhering to the surface 100c of the substrate 100 are separated by the pressure wave accompanying the volume change when the liquid 101 changes to a solid, the physical force accompanying the volume increase, and the like. Therefore, the contaminants may be taken into the solid, or the contaminants adhering to the surface 100c of the substrate 100 may be separated by the pressure wave or physical force generated when a part of the liquid 101 freezes. It is believed that cleaning will take place.

When the liquid film on the surface 100c of the substrate 100 is completely frozen, the process shifts from the freezing step (solid-liquid phase) to the freezing step (solid phase). In the freezing step (solid phase), the temperature of the frozen film on the surface 100c of the substrate 100 is further lowered. Here, the liquid 101 mainly contains water. Therefore, when the liquid film on the surface 100c of the substrate 100 is completely frozen to form a frozen film and the temperature of the frozen film is further lowered, the volume of the frozen film is reduced and stress is generated in the frozen film.

In this case, for example, when the temperature of the frozen membrane becomes −50 ° C. or lower, the frozen membrane cracks. When the frozen film is cracked, the contaminants adhering to the surface 100c of the substrate 100 are more easily separated from the surface 100c of the substrate 100.

Next, after the frozen membrane is cracked, a thawing step is performed as shown in FIGS. 3 and 4. The occurrence of cracks can be detected by, for example, a sensor (not shown). The example shown in FIGS. 3 and 4 is a case where the liquid 101 is supplied by the first liquid supply unit 4 to thaw the frozen membrane. Therefore, the controller 9 controls the supply unit 42 and the flow rate control unit 43 to supply the liquid 101 having a predetermined flow rate to the surface 100c of the substrate 100.

Further, the controller 9 controls the flow rate control unit 33 to stop the supply of the cooling gas 3a. Further, the controller 9 controls the drive unit 24b to set the rotation speed of the substrate 100 as the third rotation speed. The third rotation speed is, for example, 200 rpm to 700 rpm. If the rotation of the substrate 100 becomes faster, the liquid 101 can be shaken off by centrifugal force. Therefore, the liquid 101 can be discharged from the surface 100c of the substrate 100. At this time, the contaminants separated from the surface 100c of the substrate 100 are also discharged together with the liquid 101.
The supply amount of the liquid 101 is not particularly limited as long as it can be thawed. Further, the rotation speed of the substrate 100 is not particularly limited as long as the liquid 101 and contaminants can be discharged.

Next, as shown in FIGS. 3 and 4, a back surface cleaning step is performed.
In the back surface cleaning step, as shown in FIG. 7, the controller 9 controls the drive unit 45 to move the liquid nozzle 44 to the retracted position outside the substrate 100. The controller 9 controls the drive unit 35 to move the cooling nozzle 34 to the retracted position outside the substrate 100. Then, the controller 9 controls the drive unit 55 to arrange the liquid nozzle 54 below the substantially center of the back surface 100b of the substrate 100.

Subsequently, as shown in FIG. 3, the controller 9 controls the supply unit 52 and the flow rate control unit 53 to supply the liquid 102 at a predetermined flow rate to the back surface 100b of the substrate 100. Further, the controller 9 controls the drive unit 24b to rotate the substrate 100 at a predetermined rotation speed.

At this time, the controller 9 can control the drive unit 55 to swing the liquid nozzle 54 from which the liquid 102 is discharged along the back surface 100b of the substrate 100. By doing so, the liquid 102 can be supplied to a wider area of the back surface 100b of the substrate 100, so that the back surface 100b of the substrate 100 can be washed more uniformly.

As an example, the flow rate of the liquid 102 is set to about 0.1 L / min to 1.0 L / min, and the rotation speed of the substrate 100 is set to about 20 rpm to 500 rpm, but the present invention is not limited thereto. The flow rate of the liquid 102, the rotation speed of the substrate 100, the cleaning time, and the like can be appropriately changed depending on the size of the substrate 100, the degree of contamination of the back surface 100b of the substrate 100, the components of the liquid 102, and the like.

Next, a drying step is performed as shown in FIGS. 3 and 4.
In the drying step, the controller 9 controls the supply unit 52 and the flow rate control unit 53 to stop the supply of the liquid 102. Subsequently, as shown in FIG. 8, the controller 9 controls the drive unit 55 to move the liquid nozzle 54 to the retracted position outside the substrate 100.

Then, the controller 9 controls the drive unit 24b to increase the rotation speed of the substrate 100 to a fourth rotation speed faster than the third rotation speed. If the rotation of the substrate 100 becomes faster, the substrate 100 can be dried quickly. The rotation speed of the substrate 100 is not particularly limited as long as it can be dried.

Next, the substrate 100 for which the drying step has been completed is carried out of the housing 6 by a transfer device (not shown) via a carry-in / carry-out port (not shown) of the housing 6. In the carry-out process, as shown in FIG. 5, the controller 9 controls the drive unit 23b to raise the pusher 23a. When the pusher 23a rises, the substrate 100 is lifted via the plurality of holding pins 22, so that the distance between the substrate 100 and the mounting table 21 increases. Therefore, the substrate 100 can be easily transferred between the transport device (not shown) and the mounting portion 2.

By doing the above, the front surface 100c of the substrate 100 and the back surface 100b of the substrate 100 can be cleaned once. The cleaning of the front surface 100c and the cleaning of the back surface 100b can be performed a plurality of times, respectively. In this case, the number of cleanings of the front surface 100c and the number of cleanings of the back surface 100b may be the same or different. Further, the series of steps described above can be performed a plurality of times.

As described above, when the cooling gas 3a is supplied to the back surface 100b of the substrate 100, the controller 9 controls the drive unit 35 to arrange the cooling nozzle 34 below the back surface 100b of the substrate 100. The drive unit 55 can be controlled to move the liquid nozzle 54 to the retracted position of the liquid nozzle 54.
When supplying the liquid 102 to the back surface 100b of the substrate 100, the controller 9 controls the drive unit 55 to arrange the liquid nozzle 54 below the back surface 100b of the substrate 100 and controls the drive unit 35. , The cooling nozzle 34 can be moved to the retracted position of the cooling nozzle 34.

When supplying the cooling gas 3a to the back surface 100b of the substrate 100, the controller 9 can control the drive unit 45 to arrange the liquid nozzle 44 above the front surface 100c of the substrate 100.
In this case, the controller 9 controls the drive unit 45 to swing the liquid nozzle 44, which is arranged above the surface 100c of the substrate 100 and discharges the liquid 101, along the surface 100c of the substrate 100. can.

When supplying the cooling gas 3a to the back surface 100b of the substrate 100, the controller 9 controls the drive unit 35 to move the cooling nozzle 34 discharging the cooling gas 3a along the back surface 100b of the substrate 100. Can be rocked.

When supplying the liquid 102 to the back surface 100b of the substrate 100, the controller 9 controls the drive unit 55 to swing the liquid nozzle 54 discharging the liquid 102 along the back surface 100b of the substrate 100. Can be made to.

FIG. 9 is a schematic cross-sectional view for illustrating the substrate processing apparatus 1a according to another embodiment.
The substrate processing device 1a is provided with a mounting unit 202, a cooling unit 3, a first liquid supply unit 4, a second liquid supply unit 5, a housing 6, a blower unit 7, an exhaust unit 8, and a controller 9. ..
In addition, in order to avoid complication, in FIG. 9, the cooling unit 3, the first liquid supply unit 4, the second liquid supply unit 5, the blower unit 7, the exhaust unit 8, the controller 9, and the like are appropriately omitted. I'm drawing.
FIG. 10A is a schematic plan view of the mounting portion 202.
FIG. 10B is a schematic plan view of the holding pin cover 26a according to another embodiment.

As shown in FIGS. 9 and 10A, the mounting portion 202 has a mounting base 21, a holding pin 222, an elevating portion 223, a rotating portion 24, a roller cover 25, and a holding pin cover 26.
The liquids 101 and 102 supplied to the substrate 100 flow from the upper surface of the mounting table 21 or the lower surface of the mounting table 21 from the opening 21a, and are discharged to the outside from the peripheral edge of the mounting table 21. However, a rotating portion 24 is provided on the peripheral edge of the mounting table 21, and a supporting portion 22 is provided so as to penetrate the front surface and the back surface of the mounting table 21. Therefore, the liquids 101 and 102 may adhere to at least one of the roller 24a, the support portion 24c, and the support portion 22. When the liquids 101 and 102 adhering to at least one of the rollers 24a, the support portion 24c and the support portion 22 are frozen by the cooling gas 3a supplied from the cooling unit 3 or the mounting table 21 cooled by the cooling gas 3a. There is. Alternatively, the liquids 101 and 102 on the upper or lower surface of the mounting table 21 may freeze, peel off from the upper surface or lower surface of the mounting table 21, and collide with at least one of the roller 24a, the support portion 24c, and the support portion 22.

Therefore, the mounting portion 202 is provided with a roller cover 25 so that the liquids 101 and 102 do not touch the rollers 24a, the supporting portion 24c, and the holding pin 22 of the rotating portion 24.

As shown in FIG. 9, the roller cover 25 has, for example, an upper roller cover 25a and a lower roller cover 25b.
The upper roller cover 25a is a member for covering the vicinity of the peripheral edge of the upper surface of the mounting table 21, the upper surface of the roller 24a, and the mounting table 21 side of the roller 24a. The upper roller cover 25a is provided on the upper surface of the mounting table 21. The upper roller cover 25a has, for example, a cylindrical shape having a flange at one end. The diameter of the cylindrical portion of the upper roller cover 25a is smaller than the diameter of the mounting table 21 in order to prevent contact with the roller 24a. The other end of the upper roller cover 25a comes into contact with the mounting table 21. Further, the upper roller cover 25a may be provided with an opening corresponding to the opening 21a of the mounting table 21. This opening may have the same shape and size as the opening 21a. Further, a hole into which the guide portion 22a and the support portion 22b of the holding pin 222 are inserted can be provided. The holding pin 222 is provided so as to penetrate the upper roller cover 25a and the mounting table 21. Therefore, the length of the guide portion 22a is longer than that of the holding portion 22.

The upper roller cover 25a can be formed of, for example, a metal such as stainless steel.
Further, the inside of the hole into which the guide portion 22a and the support portion 22b of the holding pin 222 are inserted may be coated with a liquid-repellent material. By doing so, even if the liquids 101 and 102 adhering to the holding pin 222 freeze, the holding pin 222 is likely to be peeled off from the upper roller cover 25a.
The upper roller cover 25a can be fixed to the mounting table 21 by using a fastening member such as a screw, or can be integrally formed with the mounting table 21.

As described above, the liquids 101 and 102 may flow from the opening 21a of the mounting table 21 to the lower surface of the mounting table 21, and the liquids 101 and 102 may adhere to the rollers 24a or the support portion 24c from the vicinity of the peripheral edge of the lower surface of the mounting table 21. There is. The lower roller cover 25b has a role of preventing the liquids 101 and 102 from adhering to the rollers 24a and the support portion 24c.

The lower roller cover 25b has, for example, a cylindrical shape and covers the vicinity of the peripheral edge of the lower surface of the mounting table 21, the mounting table 21 side of the roller 24a, and the mounting table 21 side of the support portion 24c.
The lower roller cover 25b is provided near the peripheral edge of the lower surface of the mounting table 21. The diameter of the lower roller cover 25b is smaller than the diameter of the mounting table 21 in order to prevent contact with the roller 24a.
The lower end of the lower roller cover 25b (the end opposite to the mounting table 21 side) is preferably located below the lower end of the roller 24a. More preferably, it is located below the lower end of the support portion 24c.

The lower roller cover 25b can be formed of, for example, a metal such as stainless steel.
The lower roller cover 25b can be fixed to the mounting table 21 by using a fastening member such as a screw, or can be integrally formed with the mounting table 21.

If the roller cover 25 is provided, it is possible to prevent the liquids 101 and 102 from freezing in the vicinity of the peripheral edge of the mounting table 21, the rollers 24a, and the support portion 24c. Therefore, it is possible to prevent the rotation of the mounting table 21 from being hindered by the freezing of the liquids 101 and 102.

As described above, the liquids 101 and 102 may flow from the opening 21a of the mounting table 21 to the lower surface of the mounting table 21. Further, a holding pin 222 is provided on the upper roller cover 25a so as to penetrate the mounting table 21 and the upper roller cover 25a. Therefore, if the liquids 101 and 102 freeze in the guide portion 22a, the holding pin 222 may not be able to move up and down. Therefore, the mounting portion 202 is provided with a holding pin cover 26.

The holding pin cover 26 is provided in the vicinity of the holding pin 222 on the lower surface of the mounting table 21. The holding pin cover 26 can be provided inside the lower roller cover 25b. The holding pin cover 26 covers the side surface of the guide portion 22a protruding from the lower surface of the mounting table 21. The holding pin cover 26 has a tubular shape and can be provided for each holding pin 222 (see FIG. 10B).
Further, the holding pin cover 26 can be provided so as to cover the plurality of holding pins 222. For example, as shown in FIG. 10A, the holding pin cover 26 covers the side surface of the guide portion 22a of two adjacent holding pins 222, so that the holding pin cover 26 has a cylindrical shape having a cross section as if the circles overlap. ..
Further, the holding pin cover 26 may have a square annular convex portion provided inside the plurality of holding pins 222 and a square annular convex portion provided outside the plurality of holding pins 222.
For example, the annular protrusion provided inside the plurality of holding pins 222 is provided along the opening 21a of the mounting table 21. Further, the annular convex portion provided on the outside of the plurality of holding pins 222 is an annular convex portion having a similar shape to the annular convex portion provided on the inside of the plurality of holding pins 222, and the plurality of holding pins 222 are attached from the outside. It is provided so as to surround it.
Further, as shown in FIG. 10B, the holding pin cover 26a is provided for each of the two adjacent holding pins 222, and the holding pin covers 26a can be prevented from overlapping each other.

The holding pin cover 26 can be formed of, for example, a metal such as stainless steel.
The holding pin cover 26 can be fixed to the mounting table 21 by using a fastening member such as a screw, or can be integrally formed with the mounting table 21.
The lower end of the holding pin cover 26 (the end opposite to the mounting table 21 side) is the position of the ejection port of the cooling nozzle 34 when supplying the cooling gas or the liquids 101 and 102 to the substrate 100, and the liquid nozzle 54. Is located below the position of the discharge port and the lower end of the guide portion 22a.

If the holding pin cover 26 is provided, it is possible to prevent the liquids 101 and 102 from freezing in the guide portion 22a.
On the upper surface side of the mounting table 21, the guide portion 22a and the support portion 22b of the holding pin 222 are covered by the upper roller cover 25a. Therefore, the upper roller cover 25a can prevent the holding pin 222 from freezing.

The elevating portion 223 has a pusher 23a, a driving portion 23b, and a convex portion 23c.
The convex portions 23c have a columnar shape, and a plurality of convex portions 23c are provided on the upper surface of the pusher 23a. The convex portion 23c is provided at a position facing the guide portion 22a of the holding pin 222. The cross-sectional dimension of the convex portion 23c is smaller than the inner dimension of the holding pin cover 26. Therefore, when the pusher 23a rises, the convex portion 23c can be inserted inside the holding pin cover 26. If the convex portion 23c can be inserted into the holding pin cover 26, the lower end of the guide portion 22a inside the holding pin cover 26 can be pushed.
The controller 9 monitors the rotation position of the mounting table 21. Therefore, when the controller 9 stops the rotation of the mounting portion 21, the holding pin 222 is stopped so as to face the convex portion 23c.

As described above, if the roller cover 25 and the holding pin cover 26 are provided, the liquids 101 and 102 are the rollers 24a and the holding pin in the preliminary step, the liquid film forming step, the thawing step and the back surface cleaning step. It can be suppressed from adhering to 222 or the like. Therefore, it is possible to prevent the rollers 24a, the holding pin 222, and the like from freezing.

In the loading / unloading step of the substrate 100, the liquid film forming step, the cooling step, and the like, the rotation of the mounting table 21 may be stopped. When the rotation of the mounting table 21 is stopped, the liquids 101 and 102 tend to stay on the mounting table 21. Therefore, when the rotation of the mounting table 21 is stopped, the rollers 24a, the holding pin 222, and the like are likely to freeze. If the roller cover 25 and the holding pin cover 26 are provided, it is possible to prevent the rollers 24a, the holding pin 222, and the like from freezing even if the rotation of the mounting table 21 is stopped.
Further, it is possible to prevent the liquids 101 and 102 frozen on the surface of the mounting table 21 from peeling off from the surface of the mounting table 21 and colliding with the rollers 24a to hinder the rotation of the mounting table 21.

FIG. 11 is a schematic cross-sectional view for illustrating the substrate processing apparatus 1b according to another embodiment. The substrate processing device 1b is provided with a mounting unit 302, a cooling unit 3, a first liquid supply unit 4, a second liquid supply unit 5, a housing 6, a blower unit 7, an exhaust unit 8, and a controller 9. ..
In addition, in order to avoid complication, in FIG. 11, the cooling unit 3, the first liquid supply unit 4, the second liquid supply unit 5, the blower unit 7, the exhaust unit 8, the controller 9, and the like are appropriately omitted. I'm drawing.

As shown in FIG. 11, the mounting portion 302 has a mounting base 21, a holding pin 222, an elevating portion 223, a rotating portion 24, a roller cover 325, and a holding pin cover 26.
The roller cover 325 has, for example, an upper roller cover 25c and a lower roller cover 25b.

The upper roller cover 25c is provided near the peripheral edge of the upper surface of the mounting table 21. The upper roller cover 25c covers the vicinity of the peripheral edge of the upper surface of the mounting table 21, the upper surface of the roller 24a, and the mounting table 21 side of the roller 24a. The upper roller cover 25c is provided on the outside of the holding pin 222. The upper roller cover 25c has, for example, a cylindrical shape, and has a shape in which the outer edge side of the upper end projects outward from the roller 24a. Further, the thickness of the upper roller cover 25c on the inner edge side is smaller than the thickness on the outer edge side. Therefore, the inner edge of the upper roller cover 25c expands in diameter from the lower end to the upper end. That is, the end portion on the inner edge side is formed so as to be an inclined surface from the upper end on the outer edge side toward the lower end on the inner edge side. Therefore, the upper surface of the upper roller cover 25c has a surface parallel to the surface of the mounting table 21 and an inclined surface.

The upper roller cover 25c can be formed of, for example, a metal such as stainless steel.
The upper roller cover 25c can be fixed to the mounting table 21 by using a fastening member such as a screw, or can be integrally formed with the mounting table 21.

If the roller cover 325 and the holding pin cover 26 are provided, the rollers 24a, the holding pin 222, and the like are prevented from freezing even if the mounting table 21 stops rotating, as in the roller cover 25 and the holding pin cover 26 described above. It can be suppressed. Further, it is possible to prevent the liquids 101 and 102 frozen on the surface of the mounting table 21 from peeling off from the surface of the mounting table 21 and colliding with the rollers 24a to hinder the rotation of the mounting table 21.

Further, the thickness of the upper roller cover 25c on the inner edge side is smaller than the thickness on the outer edge side. Therefore, the upper surface of the upper roller cover 25c has an inclined surface. If the upper surface of the upper roller cover 25c has an inclined surface inclined from the opening 21a toward the roller 24a, the liquid 101 inside the upper roller cover 25c is discharged to the outside of the upper roller cover 25c by centrifugal force. Will be easier.
Further, the weight can be reduced as compared with the upper roller cover 25a.

FIG. 12 is a schematic cross-sectional view for illustrating the substrate processing apparatus 1c according to another embodiment. The substrate processing device 1c is provided with a mounting unit 402, a cooling unit 3, a first liquid supply unit 4, a second liquid supply unit 5, a housing 6, a blower unit 7, an exhaust unit 8, and a controller 9. ..
In addition, in order to avoid complication, in FIG. 12, the cooling unit 3, the first liquid supply unit 4, the second liquid supply unit 5, the blower unit 7, the exhaust unit 8, the controller 9, and the like are appropriately omitted. I'm drawing.
FIG. 13A is a schematic plan view of the mounting portion 402.
FIG. 13B is a schematic plan view of the holding pin cover 26a according to another embodiment.

As shown in FIGS. 12 and 13A, the mounting portion 402 includes a mounting base 21, a holding pin 222, an elevating portion 223, a rotating portion 24, a roller cover 425, and a holding pin cover 26.
The roller cover 425 has, for example, an upper roller cover 25d and a lower roller cover 25b.

The upper roller cover 25d is provided near the peripheral edge of the upper surface of the mounting table 21. The upper roller cover 25d covers the vicinity of the peripheral edge of the upper surface of the mounting table 21, the upper surface of the roller 24a, and the mounting table 21 side of the roller 24a. The upper roller cover 25d has, for example, a cylindrical shape, and has a plate-like body at the upper end, which overhangs the outside of the mounting table 21. The plate-like body covers the upper surface of the roller 24a. The upper roller cover 25d is provided on the outside of the holding pin 222.

The upper roller cover 25d can be formed of, for example, a metal such as stainless steel.
The upper roller cover 25d can be fixed to the mounting table 21 by using a fastening member such as a screw, or can be integrally formed with the mounting table 21.

If the roller cover 425 and the holding pin cover 26 are provided, similarly to the roller cover 25 and the holding pin cover 26 described above, even if the rotation of the mounting table 21 is stopped, the rollers 24a, the holding pin 222, and the like are frozen. It can be suppressed.

As described above, the upper roller cover 25d has a cylindrical shape and has a plate-like body at the upper end, which projects outward from the mounting table 21. The plate-like body covers the upper surface of the roller 24a.
If the upper roller cover 25d has such a configuration, the weight can be reduced as compared with the upper roller covers 25a and 25c.

Further, the mounting table 21 may be provided with at least one hole 21d. The hole 21d penetrates between the upper surface and the lower surface of the mounting table 21. The end of the hole 21d on the upper surface side of the mounting table 21 is open in the vicinity of the inner side surface of the upper roller cover 25d. The lower end of the hole 21d on the lower surface side of the mounting table 21 is open between the lower roller cover 25b and the holding pin cover 26.

If the hole 21d is provided, the liquid 101 inside the upper roller cover 25d can be discharged below the mounting table 21. In this case, since the liquid 101 is discharged between the lower roller cover 25b and the holding pin cover 26, it is possible to prevent the discharged liquid 101 from adhering to the rollers 24a and the support portion 24c.
Further, similarly to the roller cover 25 and the holding pin cover 26 described above, even if the rotation of the mounting table 21 is stopped, it is possible to prevent the rollers 24a, the holding pin 222, and the like from freezing. Further, it is possible to prevent the liquids 101 and 102 frozen on the surface of the mounting table 21 from peeling off from the surface of the mounting table 21 and colliding with the rollers 24a to suppress the rotation of the mounting table 21.

Further, as shown in FIG. 13A, the holding pin cover 26 of the present embodiment has a cross section in which circles overlap each other in order to cover the side surfaces of the guide portions 22a of the two adjacent holding pins 222. ..
Further, as shown in FIG. 13B, the holding pin covers 26a are provided for each of the two adjacent holding pins 222, and the holding pin covers 26a can be prevented from overlapping each other.

The embodiment has been illustrated above. However, the present invention is not limited to these descriptions.
The above-mentioned embodiments which have been appropriately designed by those skilled in the art are also included in the scope of the present invention as long as they have the features of the present invention.
For example, the shape, dimensions, number, arrangement, and the like of each element included in the substrate processing apparatus 1 are not limited to those illustrated, and can be appropriately changed.

For example, in the above-described embodiment, the coolant unit 31 is used to generate the cooling gas 3a by vaporizing the coolant. For example, the coolant unit cools the gas at room temperature by chiller circulation. May be good.

For example, in the freezing step (solid phase), the thawing step may be performed before the frozen membrane is cracked.
For example, after the freezing step (solid-liquid phase), the thawing step may be performed without executing the freezing step (solid phase).

1 Board processing device, 2 mounting unit, 21 mounting table, 22 holding pin, 3 cooling unit, 3a cooling gas, 34 cooling nozzle, 35 drive unit, 4 first liquid supply unit, 44 liquid nozzle, 45 drive unit, 5 2nd liquid supply unit, 54 liquid nozzle, 55 drive unit, 9 controller, 100 substrate, 100b back surface, 100c front surface, 101 liquid, 102 liquid

The drive unit 24b can be provided outside the housing 6. The drive unit 24b can be connected to one of the plurality of rollers 24a. In this case, the roller 24a to which the drive unit 24b is connected can be used as the drive roller, and the other roller 24a can be used as the guide roller. Further, the roller 24a to which the drive unit 24b is connected and at least a part of the other rollers 24a can be connected by a transmission member such as a timing belt. The drive unit 24b can have a rotating device such as a motor. The drive unit 24b can change the rotation speed (rotational speed) as well as start and stop the rotation. The drive unit 24b may be provided with a control motor such as a servo motor, for example. The other rollers 24a are rotatably supported by the support portion 24c.

When the support portion 24c rotates with the roller 24a, one end of the support portion 24c is rotatably connected to the flange. For example, it is connected to the flange via a ball bearing. When the support portion 24c does not rotate with the roller 24a, the other end of the support portion 24c is rotatably connected to the lower surface of the roller 24a. For example, it is connected to the lower surface of the roller 24a via a ball bearing.
By rotatably supporting the roller 24a by the drive portion 24b and the support portion 24c, the roller 24a can rotatably support the mounting table 21. That is, the rotating portion 24 rotatably supports the mounting table 21 via the rollers 24a.

As shown in FIGS. 9 and 10A, the mounting portion 202 has a mounting base 21, a holding pin 222, an elevating portion 223, a rotating portion 24, a roller cover 25, and a holding pin cover 26.
The liquids 101 and 102 supplied to the substrate 100 flow from the upper surface of the mounting table 21 or the lower surface of the mounting table 21 through the holes 21a , and are discharged to the outside from the peripheral edge of the mounting table 21. However, a rotating portion 24 is provided on the peripheral edge of the mounting table 21, and a holding pin 22 is provided so as to penetrate the front surface and the back surface of the mounting table 21. Therefore, the liquids 101 and 102 may adhere to at least one of the roller 24a, the support portion 24c, and the holding pin 22. When the liquids 101 and 102 adhering to at least one of the roller 24a, the support portion 24c and the holding pin 22 are frozen by the cooling gas 3a supplied from the cooling unit 3 or the mounting table 21 cooled by the cooling gas 3a. There is. Alternatively, the liquids 101 and 102 on the upper or lower surface of the mounting table 21 may freeze, peel off from the upper surface or lower surface of the mounting table 21, and collide with at least one of the roller 24a, the support portion 24c, and the holding pin 22.

Therefore, the mounting portion 202 is provided with a roller cover 25 so that the liquids 101 and 102 do not touch the rollers 24a, the supporting portion 24c, and the holding pin 222 of the rotating portion 24.

As shown in FIG. 9, the roller cover 25 has, for example, an upper roller cover 25a and a lower roller cover 25b.
The upper roller cover 25a is a member for covering the vicinity of the peripheral edge of the upper surface of the mounting table 21, the upper surface of the roller 24a, and the mounting table 21 side of the roller 24a. The upper roller cover 25a is provided on the upper surface of the mounting table 21. The upper roller cover 25a has, for example, a cylindrical shape having a flange at one end. The diameter of the cylindrical portion of the upper roller cover 25a is smaller than the diameter of the mounting table 21 in order to prevent contact with the roller 24a. The other end of the upper roller cover 25a comes into contact with the mounting table 21. Further, the upper roller cover 25a may be provided with an opening corresponding to the hole 21a of the mounting table 21. This opening may have the same shape and size as the hole 21a . Further, a hole into which the guide portion 22a and the support portion 22b of the holding pin 222 are inserted can be provided. The holding pin 222 is provided so as to penetrate the upper roller cover 25a and the mounting table 21. Therefore, the length of the guide portion 22a is longer than that of the holding pin 22.

As described above, the liquids 101 and 102 may flow from the holes 21a of the mounting table 21 to the lower surface of the mounting table 21, and the liquids 101 and 102 may adhere to the rollers 24a or the support portion 24c from the vicinity of the peripheral edge of the lower surface of the mounting table 21. There is. The lower roller cover 25b has a role of preventing the liquids 101 and 102 from adhering to the rollers 24a and the support portion 24c.

As described above, the liquids 101 and 102 may flow from the hole 21a of the mounting table 21 to the lower surface of the mounting table 21. Further, a holding pin 222 is provided on the upper roller cover 25a so as to penetrate the mounting table 21 and the upper roller cover 25a. Therefore, if the liquids 101 and 102 freeze in the guide portion 22a, the holding pin 222 may not be able to move up and down. Therefore, the mounting portion 202 is provided with a holding pin cover 26.

The holding pin cover 26 is provided in the vicinity of the holding pin 222 on the lower surface of the mounting table 21. The holding pin cover 26 can be provided inside the lower roller cover 25b. The holding pin cover 26 covers the side surface of the guide portion 22a protruding from the lower surface of the mounting table 21. The holding pin cover 26 has a tubular shape and can be provided for each holding pin 222 (see FIG. 10B).
Further, the holding pin cover 26 can be provided so as to cover the plurality of holding pins 222. For example, as shown in FIG. 10A, the holding pin cover 26 covers the side surface of the guide portion 22a of two adjacent holding pins 222, so that the holding pin cover 26 has a cylindrical shape having a cross section as if the circles overlap. ..
Further, the holding pin cover 26 may have a square annular convex portion provided inside the plurality of holding pins 222 and a square annular convex portion provided outside the plurality of holding pins 222.
For example, the annular convex portion provided inside the plurality of holding pins 222 is provided along the hole 21a of the mounting table 21. Further, the annular convex portion provided on the outside of the plurality of holding pins 222 is an annular convex portion having a similar shape to the annular convex portion provided on the inside of the plurality of holding pins 222, and the plurality of holding pins 222 are attached from the outside. It is provided so as to surround it.
Further, as shown in FIG. 10B, the holding pin cover 26a is provided for each of the two adjacent holding pins 222, and the holding pin covers 26a can be prevented from overlapping each other.

The elevating portion 223 has a pusher 23a, a driving portion 23b, and a convex portion 23c.
The convex portions 23c have a columnar shape, and a plurality of convex portions 23c are provided on the upper surface of the pusher 23a. The convex portion 23c is provided at a position facing the guide portion 22a of the holding pin 222. The cross-sectional dimension of the convex portion 23c is smaller than the inner dimension of the holding pin cover 26. Therefore, when the pusher 23a rises, the convex portion 23c can be inserted inside the holding pin cover 26. If the convex portion 23c can be inserted into the holding pin cover 26, the lower end of the guide portion 22a inside the holding pin cover 26 can be pushed.
The controller 9 monitors the rotation position of the mounting table 21. Therefore, when the controller 9 stops the rotation of the mounting table 21, the holding pin 222 is stopped so as to face the convex portion 23c.

Further, the thickness of the upper roller cover 25c on the inner edge side is smaller than the thickness on the outer edge side. Therefore, the upper surface of the upper roller cover 25c has an inclined surface. If the upper surface of the upper roller cover 25c has an inclined surface inclined from the hole 21a toward the roller 24a, the liquid 101 inside the upper roller cover 25c is discharged to the outside of the upper roller cover 25c by centrifugal force. Will be easier.
Further, the weight can be reduced as compared with the upper roller cover 25a.

Claims (14)

A mounting table that is roughly disk-shaped and has a hole in the center,
With a roller that contacts the side surface of the above-mentioned pedestal and rotates the above-mentioned pedestal,
A plurality of holding pins provided on the above-mentioned stand to hold the board, and
A first liquid nozzle for supplying a first liquid to a first surface of the substrate opposite to the above-mentioned pedestal side,
A first drive unit that moves the position of the first liquid nozzle, and
A second liquid nozzle that supplies a second liquid from the hole of the above-mentioned pedestal to the second surface of the substrate on the side of the above-mentioned pedestal.
A second drive unit that moves the position of the second liquid nozzle,
A cooling nozzle that supplies cooling gas to the second surface from the hole of the above-mentioned stand, and
A third drive unit that moves the position of the cooling nozzle,
A controller that controls the first drive unit, the second drive unit, and the third drive unit.
Equipped with
When supplying the cooling gas to the second surface, the controller controls the third drive unit to dispose the cooling nozzle below the second surface, and the second surface is located. By controlling the drive unit, the second liquid nozzle is moved to the retracted position of the second liquid nozzle.
or,
When supplying the second liquid to the second surface, the controller controls the second drive unit to dispose the second liquid nozzle below the second surface. , A substrate processing device that controls the third drive unit to move the cooling nozzle to a retracted position of the cooling nozzle. The pre-described pedestal comprises a plurality of second holes penetrating the thickness direction of the pre-described pedestal.
The plurality of holding pins are
It is provided inside the second hole and has a guide portion protruding to the side opposite to the side holding the substrate in the above-mentioned pedestal, and is orthogonal to the first surface with respect to the above-mentioned pedestal. Can be moved individually along the direction of
The plurality of holding pins are provided separately from the plurality of holding pins, are configured to be movable in contact with the guide portion of the plurality of holding pins, and the plurality of holding pins are collectively arranged in a direction orthogonal to the first surface. The substrate processing apparatus according to claim 1, further comprising an elevating unit to be moved. The substrate processing apparatus according to claim 2, wherein the cooling nozzle and the second liquid nozzle move between the end of the guide portion of the holding pin and the elevating portion. When supplying the cooling gas to the second surface, the controller controls the first drive unit to arrange the first liquid nozzle above the first surface. The substrate processing apparatus according to any one of 1 to 3. The controller controls the first drive unit, is arranged above the first surface, and has the first liquid nozzle for discharging the first liquid along the first surface. The substrate processing apparatus according to claim 4. When supplying the cooling gas to the second surface, the controller controls the third drive unit to transfer the cooling nozzle discharging the cooling gas to the second surface. The substrate processing apparatus according to any one of claims 1 to 5, which is swung along the same. When supplying the second liquid to the second surface, the controller controls the second driving unit to use the second liquid nozzle for discharging the second liquid. The substrate processing apparatus according to any one of claims 1 to 6, which is swung along the second surface. The cooling nozzle has a tapered shape in which the inner diameter gradually increases toward the side of the substrate, and the angle of the tapered portion is larger than 0 ° and 8 ° or less, according to any one of claims 1 to 7. Board processing equipment. 1. The substrate processing apparatus described. The substrate processing apparatus according to claim 9, wherein the upper roller cover has a hole into which the plurality of holding pins are inserted. The upper roller cover has a cylindrical shape, and has a shape in which the outer edge side of the upper end projects outward from the roller.
The substrate processing apparatus according to claim 9, wherein the end portion on the inner edge side of the upper roller cover is formed so as to be an inclined surface from the upper end on the outer edge side of the end portion toward the lower end on the inner edge side. The upper roller cover has a cylindrical shape, and has a plate-like body at the upper end, which overhangs the outside of the above-mentioned stand.
The substrate processing apparatus according to claim 9, wherein the plate-shaped body covers the upper surface of the roller. One of claims 1 to 12, which is provided near the peripheral edge of the surface of the above-mentioned pedestal on the side opposite to the side holding the substrate and further includes a lower roller cover that covers the previously-described pedestal side of the roller. The substrate processing apparatus according to. The side surface of the guide portion of the above-mentioned pedestal, which is provided on the surface of the above-mentioned pedestal on the side opposite to the side of holding the board and protrudes on the side of the plurality of holding pins opposite to the side of the above-mentioned pedestal on which the board is held. Further equipped with a holding pin cover to cover
The substrate processing apparatus according to any one of claims 2 to 12, wherein the elevating portion further has a convex portion provided at a position facing the guide portion.

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