JP6271192B2 - Grinding equipment - Google Patents

Description

  The present invention relates to a plate-like workpiece grinding device, and more particularly, to a grinding device having a function of cleaning a holding table that sucks and holds a plate-like workpiece.

  In the grinding apparatus, a plate-like workpiece to be processed is sucked and held on a holding surface of a holding table, and then the surface of the plate-like workpiece is ground by a grinding means while supplying grinding water. During grinding by the grinding means, the holding table sucks the plate-like workpiece, and a part of the grinding water is sucked into the holding table from the outer peripheral edge of the plate-like workpiece. For this reason, the grinding waste generated by grinding flows toward the outer peripheral edge of the plate-like workpiece together with the grinding water, and enters the inside of the holding table through the gap between the plate-like workpiece and the holding table. At this time, relatively large grinding scraps adhere to the outer peripheral edge of the workpiece. And if a plate-shaped workpiece was conveyed after grinding, the grinding waste adhering to the outer periphery of a plate-shaped workpiece might fall, and may adhere to the holding surface of a holding table.

  Conventionally, as a method of cleaning the holding table to which such grinding scraps adhere, a method of directly rubbing the holding surface of the holding table with a brush or the like has been proposed (for example, see Patent Document 1). In the method described in Patent Document 1, a cleaning brush having an infinite number of brushes formed on the surface of a disk is opposed to the holding table, and the holding table is cleaned by rotating the cleaning brush and the surface of the holding table. ing. In addition, a method has also been proposed in which high-pressure mist collides from the upper side of the holding table toward the holding surface and blows away grinding scraps (see, for example, Patent Document 2). In the method described in Patent Document 2, the holding table is cleaned by spraying mist containing water and air from a nozzle positioned above the holding table toward the holding surface and blowing off grinding waste.

JP 2003-59881 A JP 2011-200785 A

  However, the method described in Patent Document 1 cannot completely remove the grinding dust that has entered the inside of the holding table, and the method described in Patent Document 2 holds again the grinding dust blown off from the holding table. There is a problem of sticking to the table.

  This invention is made in view of such a problem, and provides the grinding device which can prevent the reattachment of the grinding waste with respect to a holding table, removing the grinding waste which penetrate | invaded the inside of a holding table. For the purpose.

The grinding apparatus of the present invention includes a holding table having a holding surface for sucking and holding a plate-like work, a rotating means for rotating the holding table, and a grinding means for grinding the plate-like work sucked and held by the holding table with a grinding wheel. And a table cleaning means for cleaning the holding table, the table cleaning means comprising: a suction part having a suction port for sucking the holding surface in an area covering the entire surface of the holding surface; A suction pipe that communicates with the holding table, and a positioning unit that moves the suction unit toward / separates the holding table, and the holding surface is cleaned by suction by the suction unit positioned at a predetermined position by the positioning unit. .

  According to the grinding apparatus, since the holding surface of the holding table is sucked by the suction part of the table cleaning means, it is possible to remove grinding dust that has entered the inside of the holding table and grinding dust that has adhered to the holding surface. As a result, it is possible to prevent reattachment of the grinding dust to the holding table while removing the grinding dust that has entered the inside of the holding table.

Further, in the grinding apparatus of the present invention, the holding table has a holding portion made of a porous material having a holding surface that contacts the plate-like workpiece, and a communication hole that exposes the holding surface and surrounds the holding portion and communicates with the holding portion. And a suction part including a suction port including a ring-shaped groove covering the vicinity of the outer periphery of the holding surface.

  ADVANTAGE OF THE INVENTION According to this invention, the reattachment of the grinding waste with respect to a holding table can be prevented, removing the grinding waste which penetrate | invaded the inside of the holding table.

It is a mimetic diagram for explaining a grinding process of a grinding device concerning a 1st embodiment. It is a schematic diagram for demonstrating a mode that the plate-shaped workpiece | work after grinding is conveyed in the grinding apparatus which concerns on 1st Embodiment. It is a schematic diagram for demonstrating the washing | cleaning process of the grinding device which concerns on 1st Embodiment. It is a schematic diagram for demonstrating the table washing | cleaning means of the grinding device which concerns on 2nd Embodiment. It is a schematic diagram for demonstrating the table washing | cleaning means of the grinding device which concerns on 3rd Embodiment.

  Hereinafter, a first embodiment will be described in detail with reference to the accompanying drawings. The grinding apparatus according to the first embodiment removes grinding waste adhering to the holding table 2 (see FIG. 1) by grinding the plate-like workpiece W (see FIG. 1) with the table cleaning means 1 (see FIG. 3). Is configured to do. In the grinding apparatus according to the first embodiment, after the plate-like workpiece W is ground by the grinding means 3 (see FIG. 1), the plate-like workpiece W is unloaded from the holding table 2 by the conveying means 4 (see FIG. 2). Is done. And the table washing | cleaning means 1 is positioned above the holding table 2, and the mist containing water and air is blown up from the lower side of the holding table 2, and is also held by the suction part 10 (see FIG. 3) of the table cleaning means 1. 2 is aspirated. For this reason, the grinding dust adhering to the holding table 2 can be removed, and reattachment of the grinding dust to the holding table 2 can be prevented.

  The grinding process will be described in detail with reference to FIG. Drawing 1 is a mimetic diagram for explaining the grinding process of the grinding device concerning a 1st embodiment. Note that the grinding apparatus according to the first embodiment is not limited to the configuration shown in the following drawings, and any configuration that sucks and removes grinding scraps attached to the holding table may be used, and can be changed as appropriate. .

As shown in FIG. 1, the grinding apparatus according to the first embodiment sucks and holds a plate-like workpiece W on the holding surface 23 of the holding table 2, and grinds the surface of the plate-like workpiece W by the grinding means 3. Is configured to do. The plate-like workpiece W is formed in a disc shape with a semiconductor wafer such as silicon or gallium burrs. The plate-like workpiece W is not limited to the semiconductor wafer described above. For example, ceramic, glass, sapphire (Al ₂ O ₃ ) -based inorganic material substrate, semiconductor product package, various electrical components and micron-order processing position accuracy Various processing materials that are required may be used as a wafer.

  The holding table 2 has a disc shape, and is provided so as to be rotatable about a disc center by a rotating means 5. The holding table 2 has a holding portion 22 made of a porous material having a holding surface 23 that contacts the plate-like workpiece W, and a communication hole 24 that exposes the holding surface 23 and surrounds the holding portion 22 and communicates with the holding portion 22. It is comprised with the frame 25. FIG. The holding part 22 and the frame body 25 are formed in a disk shape. The holding unit 22 is made of, for example, a porous ceramic material. A plurality of ring-shaped grooves 26 (two in the present embodiment) are formed on the surface of the frame 25 so as to be offset from the center of the disk with the center of the disk as an axis. Each of the plurality of ring-shaped grooves 26 is connected to the communication hole 24.

  The holding unit 22 is connected to the suction source 28 and the supply source 29 via the switching valve 27 through the communication hole 24 of the frame 25. The supply source 29 supplies a fluid including water and air, for example. The switching valve 27 includes, for example, a three-way valve, and switches the connection destination of the holding unit 22 between the suction source 28 and the supply source 29. When sucking the plate-like workpiece W, the holding unit 22 is connected to the suction source 28. On the other hand, when cleaning the holding table 2, the holding unit 22 is connected to the supply source 29. In this way, the connection between the holding unit 22 and the suction source 28 or the supply source 29 is switched by the switching valve 27 according to the application. In the grinding process, the suction source 28 is connected to the holding unit 22 by the switching valve 27.

  The grinding means 3 is configured by providing a grinding wheel 32 on the lower surface of a grinding wheel 31 having a generally disk shape. The grinding wheel 31 is connected to a rotating means (not shown). The rotating means is configured to be rotatable about the disc center of the grinding wheel 31. The grinding means 3 is connected to a lifting means and a moving means (not shown). These lifting and lowering means and moving means are configured to allow the grinding wheel 31 to approach / separate from the holding table 2. The grinding wheel 32 is composed of, for example, a diamond wheel in which diamond abrasive grains are hardened with a binder such as metal bond or resin bond.

  In the grinding process, first, the plate-like workpiece W is placed on the holding surface 23 of the holding table 2 by the conveying means 4 (see FIG. 2). Then, the plate-like workpiece W is sucked and held on the holding surface 23 by the suction force from the suction source 28. The grinding means 3 is positioned above the plate-like workpiece W. Then, the grinding wheel 31 of the grinding means 3 is brought close to the holding table 2 while rotating around the axis. At this time, the holding table 2 holding the plate-like workpiece W is also driven to rotate by the rotating means 5. Then, the plate-like workpiece W is ground in the thickness direction by rotating and contacting the grinding wheel 32 and the surface of the plate-like workpiece W while supplying grinding water to the plate-like workpiece W.

  By grinding the plate-like workpiece W, grinding scraps are generated on the surface of the plate-like workpiece W by being mixed with grinding water. During the grinding by the grinding means 3, since the holding table 2 is sucking the plate-like workpiece W, a part of the grinding water is sucked from the outer peripheral edge of the plate-like workpiece W into the holding portion 22 of the holding table 2. Therefore, grinding waste flows from the surface of the plate-like workpiece W toward the outer peripheral edge together with the grinding water. Then, a situation may occur in which the grinding waste enters the holding portion 22 through the gap between the plate-like workpiece W and the holding table 2. At this time, relatively large grinding waste accumulates and adheres to the outer peripheral edge of the plate-like workpiece W.

  After the grinding is performed by the grinding means 3 in this way, the plate-like workpiece W is conveyed from the holding table 2. Here, with reference to FIG. 2, the conveyance of the plate-like workpiece W after grinding will be described in detail. FIG. 2 is a schematic diagram for explaining a state in which the ground plate-like workpiece W is conveyed in the grinding apparatus according to the first embodiment.

  As shown in FIG. 2, when the grinding process is finished, the plate-like workpiece W is unloaded from the holding table 2 by the conveying means 4. The conveying means 4 is configured by providing a conveying table 43 at the lower end of a column portion 42 extending downward from the tip of an arm 41 extending in the horizontal direction. The conveying means 4 is connected to a lifting means and a moving means (not shown). By these lifting and lowering means and moving means, the transport table 43 can be moved toward and away from the holding table 2.

  The transfer table 43 has a disk shape, and a circular recess 44 is formed on the lower surface. A holding plate 45 is embedded in the circular recess 44, and an exposed surface of the holding plate 45 is a holding surface 46 of the plate-like workpiece W. The holding plate 45 is made of, for example, a porous ceramic material. A communication hole 47 communicating with the holding plate 45 is formed in the transport unit 4. The communication hole 47 is provided through the center of the support column 42 in the vertical direction, and the lower end thereof is connected to the center of the transport table 43. A suction pipe 48 is attached to the upper end of the communication hole 47. A suction source 49 is connected to the tip of the suction pipe 48. As described above, the holding plate 45 is connected to the suction source 49 through the communication hole 47 and the suction pipe 48.

  When the plate-like workpiece W is transferred, first, the transfer table 43 is positioned above the plate-like workpiece W by the moving means. The position of the transfer table 43 is adjusted to a height at which the plate-like workpiece W and the holding plate 45 of the transfer table 43 approach each other by the lifting means. Then, the suction of the holding unit 22 of the holding table 2 is released and the holding plate 45 of the transfer table 43 is sucked, and the plate-like workpiece W is sucked and held by the transfer table 43. The plate-like workpiece W is unloaded from the holding table 2 by moving the conveyance table 43 while the plate-like workpiece W is sucked and held by the conveyance table 43. At this time, the grinding dust attached to the outer peripheral edge of the plate-like workpiece W falls, and the grinding waste can adhere to the holding surface of the holding table 2.

  Thus, after the plate-shaped workpiece W is carried out by the conveying means 4, the cleaning process of the holding table 2 is performed. Here, the cleaning process of the holding table 2 will be described with reference to FIG. FIG. 3 is a schematic diagram for explaining a cleaning process of the grinding apparatus according to the first embodiment. 3A is a perspective view of the table cleaning unit and the holding table used in the cleaning process, and FIG. 3B is a cross-sectional view of the table cleaning unit and the holding table at the time of cleaning the holding table.

  As shown in FIG. 3A, the table cleaning means 1 of the grinding apparatus includes a suction unit 10 that sucks the holding surface 23 of the holding table 2, a suction pipe 11 that communicates with a part of the suction unit 10, and the suction unit 10. And positioning means (not shown) for movement.

  The suction part 10 is provided at the tip of an arm 12 extending in the horizontal direction. For example, the suction unit 10 includes a support column 13 extending in the vertical direction in the vicinity of the tip of the arm 12, and a disk unit 14 provided at the lower end of the support column 13. The support | pillar part 13 and the disc part 14 are comprised with a metal material, for example. For example, although the support | pillar part 13 and the disc part 14 are comprised integrally, you may comprise by another member.

  As shown in FIG. 3B, the disc portion 14 has an outer diameter dimension that is substantially the same diameter as the holding table 2 (more specifically, slightly smaller than the outer diameter dimension of the holding table 2). A concave portion (circular concave portion) 15 having a generally circular shape is formed on the lower surface of the disc portion 14. The inner diameter of the circular recess 15 is set to be larger than the holding portion 22 of the holding table 2. By providing the circular concave portion 15 on the lower surface, the disc portion 14 has a shape opened downward. This opening constitutes the suction port 16 of the suction unit 10. In the first embodiment, the suction port 16 has an area covering the entire holding surface 23 of the holding table 2.

  A buffer material 17 is provided at the lower end of the disc portion 14. More specifically, an annular cushioning material 17 is provided on a part of the disk portion 14 that defines the circular recess 15. The cushioning material 17 serves to absorb an impact when the suction unit 10 and the holding table 2 are in contact with each other. For example, the buffer material 17 is formed of a polyurethane sponge having cushioning properties and wear resistance. For example, it can be formed with Soflas (registered trademark) manufactured by Aion Co., Ltd.

  A communication hole 18 that communicates with the circular recess 14 is formed inside the suction part 10. The communication hole 18 passes through the center of the support column 13 in the vertical direction, and the lower end thereof is connected to the center of the circular recess 15. The suction pipe 11 described above is attached to the upper end of the communication hole 18. A suction source 19 is connected to the tip of the suction pipe 11. As described above, the circular recess 15 is connected to the suction source 19 through the communication hole 18 and the suction pipe 11, whereby the suction unit 10 is configured to be able to suck the holding surface 23 of the holding table 2 through the suction port 16.

  Although not shown, the suction pipe 11 is connected to a collection unit that collects moisture and grinding scraps sucked by the suction unit 10. The collection unit preferably has a configuration in which, for example, moisture and grinding scrap collected by the suction unit 10 do not flow backward to the suction port 16 side (holding table 2 side). This collection part is constituted so that exchange is possible at the time of maintenance of a grinding device, for example.

  The positioning means constituting the table cleaning means 1 is composed of, for example, a lifting / lowering means for moving the suction unit 10 in the vertical direction and a moving means for moving in the horizontal direction. In the table cleaning means 1, this positioning means allows the suction part 10 to approach / separate from the holding table 2.

  In the cleaning process of the holding table 2, as shown in FIG. 3A, first, the suction unit 10 of the table cleaning means 1 is positioned above the holding table 2. Then, the suction unit 10 is moved so as to approach the holding table 2 by the positioning means. For example, the suction unit 10 is stopped at a position where the cushioning material 17 provided at the lower end of the disk unit 14 contacts the holding table 2. Here, a case where the suction unit 10 is moved to a position where the cushioning material 17 contacts the holding table 2 will be described. However, if the grinding dust adhering to the holding surface 23 can be removed, the moving position of the suction unit 10 can be arbitrarily set. For example, a position away from the holding table 2 may be used. In the cleaning process, the supply source 29 is switched to the state connected to the holding unit 22 by the switching valve 27.

  Water and air are supplied from the supply source 29 of the holding table 2 in a state where the buffer material 17 is in contact with the holding table 2. Water and air supplied from the supply source 29 reach the holding unit 22 through the communication hole 24 and the ring-shaped groove 26 in the holding table 2. Since the holding part 22 is formed of a porous material, the water and air that have reached the holding part 22 diffuse from the communication hole 24 and the ring-shaped groove 26 to the entire holding part 22. And water and air become mist and are blown up from the holding surface 23 whole surface. At this time, grinding scraps that enter the holding portion 22 or adhere to the holding surface 23 are blown upward from the holding surface 23 together with the mist. In this way, grinding waste is removed from the holding part 22.

  On the other hand, simultaneously with the supply of water and air from the supply source 29, the suction unit 10 is sucked by the suction source 19. The mist and grinding dust blown up from the holding surface 23 of the holding table 2 are sucked into the suction unit 10. Thus, since the grinding waste is sucked by the suction portion 10, the grinding waste removed from the holding portion 22 does not reattach to the holding table 2. In particular, since the grinding dust or the like sucked by the suction unit 10 is captured by the collection unit connected to the suction pipe 11, it is possible to reliably prevent the grinding dust or the like from reattaching to the holding table 2.

  Moreover, the flatness of the holding table 2 is ensured by removing grinding waste from the holding surface 23. For this reason, it becomes difficult to produce variation in the finished thickness of the plate-like workpiece W after grinding. Furthermore, since it is not necessary to directly rub the holding surface 23 with a brush or a grindstone, it is possible to prevent suction failure on the plate-like workpiece W due to clogging of the holding table 2 or the like.

  As described above, according to the grinding apparatus according to the first embodiment, the holding surface 23 of the holding table 2 is sucked by the suction unit 10 of the table cleaning means 1, so that it has entered the inside of the holding table 2. Grinding waste and grinding waste adhering to the holding surface 23 can be removed. As a result, it is possible to prevent reattachment of the grinding dust to the holding table 2 while removing the grinding dust that has entered the inside of the holding table 2.

  In particular, in the grinding apparatus according to the first embodiment, the suction port 16 provided in the suction unit 10 has an area covering the entire surface of the holding surface 23 of the holding table 2. For this reason, the holding surface 23 can be sucked without rotating the holding table 2 or moving the suction unit 10. Thereby, re-adhesion of the grinding | polishing waste with respect to the holding | maintenance table 2 can be prevented, removing the grinding | polishing waste which penetrate | invaded the inside of the holding | maintenance table 2, without performing complicated control with a grinding apparatus.

  Next, with reference to FIG.4 and FIG.5, the grinding apparatus which concerns on 2nd, 3rd embodiment is demonstrated in detail. FIG. 4 is a schematic diagram for explaining the table cleaning means of the grinding apparatus according to the second embodiment. 4A shows a perspective view of the table cleaning unit and the holding table, and FIG. 4B shows a cross-sectional view of the table cleaning unit and the holding table at the time of cleaning the holding table. FIG. 5 is a schematic diagram for explaining table cleaning means of a grinding apparatus according to the third embodiment. FIG. 5A shows a perspective view of the table cleaning means and the holding table, and FIG. 5B shows a cross-sectional view of the table cleaning means and the holding table at the time of cleaning the holding table. The second and third embodiments differ from the first embodiment only in the configuration of the table cleaning means. Therefore, the differences will be mainly described in detail. 4 and 5, the same components as those in the first embodiment are denoted by the same reference numerals for convenience of explanation.

  As shown in FIG. 4A, the table cleaning means 100 according to the second embodiment includes a suction part 110 that sucks the holding surface 23 of the holding table 2, and a suction pipe 111 that communicates with a part of the suction part 110. And positioning means (not shown) for moving the suction part 110. Since the positioning means has the same configuration as that of the first embodiment, the description thereof is omitted.

  The suction part 110 is provided at the tip of an arm 112 extending in the horizontal direction. For example, the suction unit 110 includes a support column 113 extending in the vertical direction in the vicinity of the tip of the arm 112, and a disk unit 114 provided at the lower end of the support column 113. The disc part 114 is made of polyurethane sponge, for example. A substantially triangular support plate 115 is provided between the arm 112 and the disc portion 114. The support plate 115 is fixed in a state where the support plate 115 is inserted into the support column 113 through a circular opening 115a formed at the center. The support plate 115 plays a role of fixing a mounting position of a first suction pipe 120 described later.

  As shown in FIG. 4B, the disc portion 114 has an outer diameter dimension that is substantially the same diameter as the holding table 2 (more specifically, slightly smaller than the outer diameter dimension of the holding table 2). A ring-shaped groove 116 is formed on the lower surface of the disc portion 114. The ring-shaped groove 116 is formed in a substantially triangular shape in sectional view so that the groove width becomes narrower from the lower surface to the upper surface of the disc portion 114. In addition, a facing portion 117 facing the holding surface 23 is provided on the lower surface of the disc portion 114 and inside the ring-shaped groove 116. The facing portion 117 faces the holding surface 23 with a slight gap G between the suction portion 110 and the holding table 2. By providing the ring-shaped groove 116 and the facing portion 117 on the lower surface, the disc portion 114 has a shape opened downward. This opening constitutes the suction port 118 of the suction unit 110. In the second embodiment, the suction port 118 is configured to cover the vicinity of the outer periphery of the holding surface 23 of the holding table 2. In other words, the suction port 118 has a configuration in which the ring-shaped groove 116 is disposed in the vicinity of the outer periphery of the holding surface 23, and the facing portion 117 is disposed in the central region of the holding surface 23.

  In addition, three first communication holes 119 are formed on the upper surface side of the disc portion 114 so as to communicate with the ring-shaped groove 116 (one of the three is not shown). A first suction pipe 120 is attached to each of the first communication holes 119. The first suction pipe 120 is connected to a second communication hole 121 formed on the outer peripheral surface of the support column 113. The second communication holes 121 are respectively connected to third communication holes 122 formed in the support column 113 in the vertical direction. The suction pipe 111 described above is attached to the upper end of the third communication hole 122. A suction source 123 is connected to the tip of the suction pipe 111. As described above, the ring-shaped groove 116 and the facing portion 117 are connected to the suction source 123 through the communication holes and the suction pipe 111, so that the suction portion 110 can suck the holding surface 23 of the holding table 2 through the suction port 118. It is configured.

  Although not shown in the drawing, the suction pipe 111 is connected to a collection unit that collects moisture and grinding scraps sucked by the suction unit 110 as in the first embodiment. The collection unit preferably has a configuration in which, for example, moisture and grinding scrap collected by the suction unit 110 do not flow backward to the suction port 118 side (holding table 2 side). This collection part is constituted so that exchange is possible at the time of maintenance of a grinding device, for example.

  In the cleaning process of the holding table 2 according to the second embodiment, as shown in FIG. 4A, first, the suction unit 110 of the table cleaning means 100 is positioned above the holding table 2. Then, the suction unit 110 is moved so as to approach the holding table 2 by the positioning means. For example, the suction part 110 is stopped at a position where the lower end of the outer peripheral part of the disk part 114 is in contact with the holding table 2. Further, in the cleaning process, similarly to the first embodiment, the switching valve 27 switches to the state where the supply source 29 is connected to the holding unit 22.

  Water and air are supplied from the supply source 29 to the holding unit 22 in a state in which a part of the disk unit 114 is in contact with the holding table 2. Water and air supplied from the supply source 29 are diffused from the communication hole 24 and the ring-shaped groove 26 in the holding table 2 to the entire holding unit 22. And water and air become mist and are blown up from the holding surface 23 whole surface. At this time, grinding scraps that enter the holding portion 22 or adhere to the holding surface 23 are blown upward from the holding surface 23 together with the mist. In this way, grinding waste is removed from the holding part 22.

  On the other hand, at the same time as water and air are supplied from the supply source 29, the suction unit 110 is sucked by the suction source 123. The mist and grinding dust blown up from the holding surface 23 of the holding table 2 are sucked into the suction unit 110. At this time, the mist and grinding dust blown up from the ring-shaped groove 26 of the holding table 2 collide with the facing portion 117 of the disk portion 114 and pass through the gap G between the facing portion 117 and the holding portion 22. 116 is aspirated.

  Here, the mist blowing force is strongest at the portion where the ring-shaped groove 26 is formed, and the outer peripheral portion of the holding portion 22 is relatively weak. On the other hand, by forming the suction port 118 with the ring-shaped groove 116 covering the vicinity of the outer periphery of the holding surface 23, the vicinity of the outer periphery of the holding surface 23 can be intensively sucked. Thereby, the grinding dust adhering to the vicinity of the outer periphery of the holding surface 23 can be efficiently removed. Thus, in the second embodiment, the suction force of the holding surface 23 is adjusted so as not to be biased. The mist and grinding scraps that have passed through the ring-shaped groove 116 are collected from the first communication hole 119 through the first suction pipe 120, the second communication hole 121, the third communication hole 122, and the suction pipe 111. Captured.

  As described above, also in the grinding apparatus according to the second embodiment, since the holding surface 23 of the holding table 2 is sucked by the suction unit 110 of the table cleaning means 100, the grinding that has entered the inside of the holding table 2 is performed. Grinding waste adhering to the waste and the holding surface 23 can be removed. As a result, it is possible to prevent reattachment of the grinding dust to the holding table 2 while removing the grinding dust that has entered the inside of the holding table 2.

  As shown in FIG. 5A, the table cleaning means 200 according to the third embodiment includes a suction part 210 that sucks the holding surface 23 of the holding table 2, and a suction pipe 211 that communicates with a part of the suction part 210. The positioning unit includes a positioning unit that moves the suction unit 210 toward and away from the holding table 2 and a moving unit that moves the suction unit 210 in the horizontal direction.

  The suction part 210 is provided at the tip of an arm 212 extending in the horizontal direction. For example, the suction unit 210 includes a support column 213 extending in the vertical direction in the vicinity of the tip of the arm 212 and a disk unit 214 provided at the lower end of the support column 213. The column part 213 and the disk part 214 are made of, for example, a metal material. For example, the support column part 213 and the disk part 214 are configured integrally, but may be configured by separate members.

  As shown in FIG. 5B, the disc portion 214 has an outer diameter dimension that is smaller than the holding table 2 (more specifically, smaller than about ½ of the holding portion 22 of the holding table 2). . A concave portion (circular concave portion) 215 having a generally circular shape is formed on the lower surface of the disc portion 214. The inner diameter of the circular recess 215 is set to be smaller than the holding portion 22 of the holding table 2. By providing the circular concave portion 215 on the lower surface, the disc portion 214 has a shape opened downward. This opening constitutes the suction port 216 of the suction unit 210. In the third embodiment, the suction port 216 has an area smaller than the area of the holding surface 23 of the holding table 2.

  A buffer material 217 is provided at the lower end of the disc portion 214. More specifically, an annular cushioning material 217 is provided on a part of the disk portion 214 that defines the circular recess 215. The buffer material 217 plays a role of absorbing an impact when the suction part 210 and the holding table 2 are in contact with each other. The buffer material 217 is made of the same material as the buffer agent 17 of the table cleaning means 1 according to the first embodiment.

  A communication hole 218 communicating with the circular recess 215 is formed inside the suction unit 210. The communication hole 218 is provided through the center of the support column 213 in the vertical direction, and the lower end thereof is connected to the center of the circular recess 215. The suction pipe 211 described above is attached to the upper end of the communication hole 218. A suction source 219 is connected to the tip of the suction pipe 211. In this way, the circular recess 215 is connected to the suction source 219 through the communication hole 218 and the suction pipe 211, so that the suction unit 210 is configured to be able to suck the holding surface 23 of the holding table 2 through the suction port 216. In addition, although not shown in figure, the collection | recovery part which collect | recovers the water | moisture content and the grinding waste attracted | sucked by the suction part 210 is connected to the suction piping 211 similarly to 1st Embodiment.

  In the table cleaning means 200 according to the third embodiment, the end portion of the arm 212 opposite to the suction portion 210 is fixed to the pivot shaft 220 extending in the vertical direction. A turning drive unit 221 for turning the arm 212 is provided at the lower end of the turning shaft 220. Further, an elevating means 222 is provided at the upper end of the turning shaft 220. The arm 212 and the suction part 210 can be lifted and lowered in the vertical direction by the lifting means 222. In the table cleaning means 200 according to the third embodiment, the elevating means 222 constitutes a positioning means. In the table cleaning unit 200, the positioning unit allows the suction unit 210 to approach / separate from the holding table 2.

  Further, the arm 212 is configured to be extendable and contractable in the directions of arrows A and B shown in FIG. In the table cleaning means 200 according to the third embodiment, the expansion / contraction means and the turning drive unit 221 constitute a moving means. By this moving means, the suction part 210 is movable in a direction parallel to the holding surface 23 of the holding table 2.

  In the cleaning process using the table cleaning means 200 configured in this way, first, the arm 212 is swung by the swivel drive unit 221 and the arm 212 is expanded and contracted by the expansion / contraction means, whereby the suction unit 210 is held. It is positioned at a predetermined position above the table 2. Then, the suction part 210 is moved so as to approach the holding table 2 by the lifting means 222. The suction part 210 is stopped at a position where the cushioning material 217 provided at the lower end of the disk part 214 contacts the holding table 2 or the holding surface 23. In the cleaning process, the supply source 29 is switched to the state connected to the holding unit 22 by the switching valve 27.

  Water and air are supplied from a supply source 29 of the holding table 2 in a state where the buffer material 217 is in contact with the holding table 2 and the holding surface 23. Water and air supplied from the supply source 29 reach the holding unit 22 through the communication hole 24 and the ring-shaped groove 26 in the holding table 2. And water and air turn up from the holding surface 23 as mist. At this time, grinding scraps that enter the holding portion 22 or adhere to the holding surface 23 are blown upward from the holding surface 23 together with the mist. In this way, grinding waste is removed from the holding part 22.

  On the other hand, at the same time as water and air are supplied from the supply source 29, the suction unit 210 is sucked by the suction source 28. The mist and grinding dust blown up from the holding surface 23 of the holding table 2 are sucked into the suction unit 210. In the third embodiment, the holding table 2 is rotationally driven by the rotating means 5 when the holding table 2 is cleaned. While the holding table 2 is rotating, the suction unit 210 is moved in a direction parallel to the holding surface 23 (arrow A and B directions) by the expansion / contraction means while sucking the holding surface 23. By moving the suction part 210 to substantially the center of the holding table 2, the grinding scraps on the entire holding surface 23 are sucked. In this way, the holding surface 23 is cleaned over the entire surface by moving the suction part 210 in parallel with the holding surface 23 simultaneously with the rotation of the holding table 2. In this case, the movement of the suction unit 210 may end at substantially the center of the holding table 2 or may continue until the suction unit 210 completely passes through the holding surface 23. Further, the moving speed of the suction unit 210 is adjusted according to the rotation speed of the holding table 2.

  As described above, also in the grinding apparatus according to the third embodiment, since the holding surface 23 of the holding table 2 is sucked by the suction unit 210 of the table cleaning means 200, the grinding that has entered the inside of the holding table 2 Grinding waste adhering to the waste and the holding surface 23 can be removed. As a result, it is possible to prevent reattachment of the grinding dust to the holding table 2 while removing the grinding dust that has entered the inside of the holding table 2.

  In particular, in the grinding apparatus according to the third embodiment, the suction unit 210 includes a suction port 216 having an area smaller than the area of the holding surface 23. For this reason, as compared with the case where the suction port 216 covers the entire surface of the holding surface 23 as in the first embodiment, the suction force with respect to the holding surface 23 can be increased. As a result, it is possible to effectively recover the grinding dust adhering to the holding table 2 (or entering the inside of the holding surface 23).

  In addition, this invention is not limited to the said embodiment, It can change and implement variously. In the above-described embodiment, the size, shape, and the like illustrated in the accompanying drawings are not limited to this, and can be appropriately changed within a range in which the effect of the present invention is exhibited. In addition, various modifications can be made without departing from the scope of the object of the present invention.

  For example, in the above-described embodiment, the case where the holding table 2 includes the porous material holding portion 22 is described. However, the configuration of the holding unit 22 of the holding table 2 is not limited to this configuration and can be changed as appropriate. The holding table 2 may be configured in any way as long as the plate-like workpiece W can be sucked and held.

  Furthermore, in the said embodiment, the case where water and air are supplied from the supply source 29 of the holding table 2 is demonstrated. However, the fluid supplied from the supply source 29 is not limited to these and can be appropriately changed. Only either water or air may be supplied, or cleaning water may be supplied instead of water.

  As described above, according to the present invention, the suction surface 23 of the holding table 2 is sucked to remove the grinding dust that has entered the inside of the holding table 2, while reattaching the grinding dust to the holding table 2. In particular, the present invention is useful for a grinding apparatus having a function of cleaning the holding table 2 that sucks and holds the plate-like workpiece W.

G Gap W Plate-like work 1, 100, 200 Table cleaning means 10, 110, 210 Suction part 11, 111, 211 Suction piping 12, 112, 212 Arm 13, 113, 213 Post part 14, 114, 214 Disc part 15 215 Circular recess 16, 118, 216 Suction port 17, 217 Cushioning material 18, 218 Communication hole 19, 123, 219 Suction source 2 Holding table 22 Holding part 23 Holding surface 24 Communication hole 25 Frame 26 Ring-shaped groove 27 Switching valve DESCRIPTION OF SYMBOLS 28 Suction source 29 Supply source 3 Grinding means 31 Grinding wheel 32 Grinding grindstone 4 Conveying means 41 Arm 42 Supporting column 43 Conveying table 44 Circular recess 45 Holding plate 46 Holding surface 47 Communication hole 48 Suction piping 49 Suction source 5 Rotating means 115 Support plate 116 Ring-shaped groove 117 Opposing portion 119 First communication hole 20 first suction pipe 121 and the second communicating hole 122 third communicating hole 211 arm 220 pivot shaft 221 rotation drive unit 222 lifting means

Claims (2)

A holding table having a holding surface for sucking and holding a plate-like work, a rotating means for rotating the holding table, a grinding means for grinding the plate-like work sucked and held on the holding table with a grinding wheel, and the holding table A grinding device comprising a table cleaning means for cleaning,
The table cleaning means includes
A suction part having a suction port for sucking the holding surface in an area covering the entire surface of the holding surface;
A suction pipe for communicating the suction port with a suction source;
Positioning means for making the suction part approach / separate the holding table,
A grinding device that cleans the holding surface by suction with the suction portion positioned at a predetermined position by the positioning means. The holding table includes a holding portion made of a porous material having the holding surface that comes into contact with a plate-shaped workpiece, and a frame body that has a communication hole that exposes the holding surface and surrounds the holding portion and communicates with the holding portion. Consists of
The grinding apparatus according to claim 1, comprising the suction portion including the suction port including a ring-shaped groove covering the outer periphery of the holding surface.

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