JPH08243518A - Rotary substrate washer - Google Patents

Abstract

PURPOSE: To uniformly wash the whole surface of a substrate by accurately detecting reaction force which a washing utensil receives from the substrate and following up the wrap deformation of the substrate well irrespective of the wrap deformation of the substrate. CONSTITUTION: Rotor 10 rotated by an electric motor M is provided with a washing utensil supporting body 14 to which a washing utensil 8 is fitted as one body so that it can freely ascend and descend through a linear actuator 42. Between the linear actuator 42 and the washing utensil supporting body 14, a pressure sensor 23 for detecting pressure which the washing utensil 8 gives to a substrate to control the linear actuator 42 so that pressure detected by the pressure sensor 23 can be kept within the setting range during washing.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor wafer, a glass substrate for a photomask, a glass substrate for a liquid crystal display device,
Substrate holding means for holding the substrate rotatably around a vertical axis and a cleaning tool for cleaning the substrate surface in order to supply a cleaning liquid such as pure water to the substrate such as an optical disk substrate for cleaning processing. A cleaning tool rotating means for rotating the cleaning tool around a vertical axis, a cleaning tool moving means for displacing the cleaning tool in the horizontal direction along the substrate surface, and a cleaning liquid for cleaning the substrate surface with the cleaning tool. The present invention relates to a rotary substrate cleaning apparatus provided with a cleaning liquid supply means for supplying.

[0002]

2. Description of the Related Art As a conventional rotary substrate cleaning apparatus, for example, one disclosed in Japanese Utility Model Laid-Open No. 1-107129 is known. According to this conventional example, while the substrate is rotated around the vertical axis, the cleaning liquid is supplied to the substrate surface, the cleaning tool is rotated and moved along the substrate surface, and the cleaning tool is moved to a predetermined pressure. The particles and dust adhering to the surface of the substrate are peeled off by pressing with the substrate, and the cleaning and removal products such as the peeled particles and dust are made to flow to the outside of the substrate together with the cleaning liquid by utilizing the centrifugal force due to the rotation of the substrate. Was there.

[0003]

However, in the case of the conventional example, the height of the cleaning tool at the cleaning position at the time of cleaning is constant, and the pressure applied from the cleaning tool to the substrate is uniquely determined by the initial setting. Was there. On the other hand, the substrate often undergoes warp deformation of about 0.5 mm due to its weight and the influence of heat treatment such as cooling and heating. As a result, the pressure applied to the substrate from the cleaning tool is different between the warped portion and the recessed portion, and the cleaning property on the substrate surface becomes uneven.

Further, there is a drawback that the cleaning property becomes non-uniform due to a dimensional error of the cleaning tool, a dimensional change, a change in fitting condition when the cleaning tool is replaced, and the like.

The present invention has been made in view of the above circumstances, and a rotary substrate cleaning apparatus according to the first aspect of the present invention accurately detects a reaction force received by the cleaning tool from the substrate, 3. The rotary substrate cleaning apparatus of the invention according to claim 2, wherein the substrate warp deformation is well followed and the entire surface of the substrate can be uniformly cleaned regardless of the warp deformation of the substrate. It is an object of the present invention to make it possible to easily follow the warp deformation of the substrate with a relatively simple structure and to uniformly wash the entire surface of the substrate regardless of the warp deformation of the substrate. Further, the rotary type substrate cleaning apparatus of the invention according to claim 3 is intended to enable the pressing force to the substrate to be favorably controlled with a small force while simplifying the configuration, and according to claim 4 The rotary substrate cleaning apparatus of the present invention aims to evenly press the cleaning tool against the substrate, sense the pressure applied to the substrate with high accuracy, and further improve the cleaning performance.
Another object of the rotary substrate cleaning apparatus of the present invention is to follow the warp deformation of the substrate swiftly to further improve the cleaning performance.

[0006]

In order to achieve the above-mentioned object, a rotary substrate cleaning apparatus according to a first aspect of the present invention holds a substrate rotatably around a vertical axis. Means, a cleaning tool for cleaning the surface of the substrate, a cleaning tool rotating means for rotating the cleaning tool around a vertical axis, a cleaning tool moving means for horizontally displacing the cleaning tool along the substrate surface, and a substrate In a rotary substrate cleaning apparatus equipped with a cleaning liquid supply means for supplying a cleaning liquid to a cleaning portion of a surface cleaning tool, a pressing force for receiving a reaction force from the substrate when cleaning the substrate and supporting the cleaning tool so that the cleaning tool can move up and down with respect to the substrate. Means and
A pressure sensor for detecting the pressure applied to the substrate by the cleaning tool in the substrate cleaning state is provided between the cleaning tool and the pressing means, and the pressing means is maintained so that the pressure detected by the pressure sensor is maintained within a set range. It is configured by providing control means for activating.

Further, the rotary substrate cleaning apparatus of the invention according to claim 2 is rotated by the cleaning tool rotating means in the rotary substrate cleaning apparatus of the invention according to claim 1 in order to achieve the above object. A cleaning tool support having a cleaning tool integrally attached to the rotating body is provided to be movable up and down via pressing means, and the cleaning tool support is configured to move up and down with respect to the substrate.

Further, in order to achieve the above-mentioned object, the rotary substrate cleaning apparatus of the invention according to claim 3 has a rotating body and a cleaning tool support in the rotary substrate cleaning apparatus of the invention according to claim 2. And a weight balance means for maintaining the cleaning tool at a predetermined height in balance with the weight of the cleaning tool.

In order to achieve the above-mentioned object, the rotary substrate cleaning apparatus according to the fourth aspect of the present invention has a weight balance means, a pressing means and a weight balancing means in the rotary substrate cleaning apparatus according to the third aspect of the invention. The center of each pressure sensor in plan view is configured to match the rotation center of the cleaning tool.

Further, in order to achieve the above-mentioned object, the rotary substrate cleaning apparatus of the invention according to claim 5 is the rotary substrate cleaning device according to any one of claims 1 to 4. The pressing means in the apparatus is composed of a linear actuator that uses electromagnetic force as a drive source.

[0011]

According to the structure of the rotary type substrate cleaning apparatus of the present invention, not the operating pressure of the pressing means but the reaction force received by the cleaning tool from the rotating substrate, that is, the pressure applied by the cleaning tool to the rotating substrate. Is accurately detected by a pressure sensor provided between the cleaning tool and the pressing means. The present inventors have tried to sense the operating pressure of the pressing means and control the pressing means so that the value becomes constant, but there is a problem that the substrate does not follow the warp deformation. I found out. This is because the change in pressure caused by the warp deformation of the substrate is small with respect to the pressure applied to the substrate by the cleaning tool, and even if the change in pressure is transmitted to the pressing means, it is delayed in being reflected in the operating pressure. Is likely to occur, and it is likely that an error is likely to occur between the operating pressure applied by the pressing means and the pressure applied to the substrate due to resistance or the like in the configuration for raising and lowering the cleaning tool. Inferred. Based on this knowledge, the pressure sensor directly senses the reaction force that the cleaning tool receives from the rotating substrate without using the pressing means, and as described above, the pressure applied by the cleaning tool to the rotating substrate is accurately measured. Sense. Based on this accurately sensed pressure,
When the pressure applied to the rotating substrate by the cleaning tool changes from the setting range due to the warp deformation of the substrate, the pressure sensor directly detects that the pressure is not set and the detected pressure is set. If it is larger than the range, the cleaning tool is raised by the pressing means to raise the cleaning tool away from the substrate, while if the sensed pressure is smaller than the set range, the cleaning tool is lowered with respect to the substrate. As a result, the cleaning tool can be moved closer to the substrate, and the pressure of the cleaning tool applied to the substrate can always be maintained within the set range with high accuracy.

According to the structure of the rotary type substrate cleaning apparatus of the second aspect of the present invention, when the pressure applied to the rotating substrate by the cleaning tool changes from the set range due to the warp deformation of the substrate, Is directly detected by the pressure sensor without using the pressing means, and if the detected pressure is larger than the set range, the cleaning tool support is raised with respect to the rotating body to separate the cleaning tool from the substrate. On the other hand, if the sensed pressure is lower than the set range, the cleaning tool support is moved down to the rotating body to move the cleaning tool closer to the substrate and the pressure of the cleaning tool applied to the substrate. Can always be maintained within the set range with high accuracy.

According to the structure of the rotary type substrate cleaning apparatus of the third aspect of the present invention, the weight balance means balances the weight of the cleaning tool with the weight of the cleaning tool and supports the cleaning tool and the cleaning tool integrated with the rotating body. The body can be raised and lowered, and the pressure applied to the substrate by the pressing means can be made constant at all times.

Further, according to the structure of the rotary type substrate cleaning apparatus of the invention according to claim 4, the center of the force for supporting the cleaning tool by the weight balancing means in order to balance with the own weight of the cleaning tool,
In addition, it is possible to prevent the center of the pressure applied by the cleaning tool to the substrate by the pressing means from coincident with the center of rotation of the cleaning tool, and to avoid applying a biased force to the rotating cleaning tool. The pressure applied to the substrate by the cleaning tool in the cleaning state can be detected by the pressure sensor in a state where the center of the applied pressure matches the rotation center of the cleaning tool.

According to the structure of the rotary substrate cleaning apparatus of the fifth aspect of the present invention, the electromagnetic value is changed by changing the current value in response to the change in the pressure applied to the rotating substrate by the cleaning tool. Thus, the pressure applied to the substrate by the pressing means can be made constant at all times.

[0016]

Embodiments of the present invention will now be described in detail with reference to the drawings. 1 is an overall schematic vertical sectional view showing a first embodiment of a rotary substrate cleaning apparatus of the present invention, and FIG. 2 is a plan view.

A rotary table 3 for vacuum-holding a substrate W is attached to the upper end of a rotary shaft 2 which rotates around a vertical axis by driving the electric motor 1 so as to be integrally rotatable, and the substrate W is vertically axised. Substrate holding means 4 that holds the substrate rotatably around the core is configured.

In the present embodiment, the substrate holding means 4 is constructed by using the rotary table 3 as a vacuum suction type, but the present invention is not limited to this, and for example, the substrate W can be placed on the rotary table 3. A plurality of substrate support members that support the outer edge are provided, and a positioning pin that regulates the horizontal position of the substrate W is provided at the upper end of the substrate support member to configure the substrate holding means, and the substrate W is separated from the upper surface of the turntable 3. You may make it hold rotatably in the state.

The periphery of the substrate holding means 4 and the substrate W held thereby is covered with a cup 5 which can be moved up and down by an elevating drive mechanism (not shown). Nozzles 6 serving as cleaning liquid supply means for supplying a cleaning liquid such as pure water toward the center of rotation of the substrate W are provided on the lateral outside of the cup 5.

An angle-shaped support arm 7 is provided on the lateral outside of the cup 5 so as to be rotatable around a vertical first axis P1 by an electric motor (not shown). A cleaning tool 8 for cleaning the substrate surface is provided below the tip-side arm portion 7a so as to be rotatable around the second axis P2 in the vertical direction.

As shown in the enlarged vertical sectional view of the main part of FIG.
A rotating body 10 is rotatably provided around the second axis P2 via a bearing 9 in the front-end-side arm portion 7a, and a pulley 11 and a motor attached to the rotating body 10 are integrally rotatable. M and M are interlockingly connected via a timing belt 12. A pair of guide rollers 1 is provided at both upper and lower sides of the rotating body 10 with the pulley 11 interposed therebetween.
3 are provided, and the guide rollers 13 are configured to act on a spline portion 14a formed at an intermediate position of the cleaning tool support 14 having the cleaning tool 8 attached to the lower end thereof, and rotate integrally with the rotating body 10. However, the cleaning tool support 14 can be raised and lowered with less resistance.

A spring seat 15 is attached to the cleaning tool support 14 so as to be able to rotate integrally, and a compression coil spring 17 is provided between the spring seat 15 and the spring seat 16 mounted on the rotating body 10 to clean the cleaning tools 8 and Cleaning tool support 1
4 to balance the weight of the cleaning tool 8 with the tip arm part 7
Weight balance means 1 so as to maintain a predetermined height with respect to a
8 are configured.

A bearing 19 is provided at the upper end of the cleaning tool support 14.
The contact member 20 is attached so as to be relatively rotatable via the contact member 20, and a reaction force from the substrate W is applied to the upper side of the tip side arm portion 7a so as to correspond to the upper end of the contact member 20 at the time of cleaning the substrate. At the same time, an air cylinder 21 is provided as a pressing means for supporting the cleaning tool 8 so that the cleaning tool 8 can be moved up and down with respect to the substrate W. It is touched.

As shown in the conceptual diagram of FIG. 4, the air cylinder 21 is formed by forming a minute gap between the inner peripheral surface of the cylinder 24 and the outer peripheral surfaces of the piston 25 and the cylinder rod 22, respectively. The space opposite to the cylinder rod 22 with the piston 25 in between and the compressor 26 are connected via the first air pipe 28 with the flow rate adjusting valve 27 interposed therebetween, while the piston 25 is in between. The space on the side of the cylinder rod 22 and the compressor 26 are connected via a second air pipe 30 having a metering valve 29, and the resistance is reduced in a non-sliding state while aligning the air cylinder 21 with the supply air. It is configured to be stretchable.

The weight balance means 18 consisting of the spring seats 15 and 16 and the compression coil spring 17 and the center of the air cylinder 21 in plan view are provided so as to coincide with the rotation center P2 of the cleaning tool 8. .

A magnetic fluid seal 31 and a labyrinth mechanism 32 are provided between the tip side arm portion 7a and the lower side of the rotating body 10.
Is provided, and it is configured so that it is possible to prevent dust generated by abrasion due to rotation from falling on the bearing 9 above the substrate W or the invasion of the cleaning liquid.

As shown in FIG. 4, a controller 34 as control means is connected to the driver 33 of the flow rate adjusting valve 27, and the controller 34 is connected to the pressure sensor 23 and the pressure setter 35.

The controller 34 includes the first comparing means 3
6, a second comparison means 37, an open signal output means 38 and a closed signal output means 39 are provided. In the first comparison means 36, the pressure detected by the pressure sensor 23 and the pressure setter 35.
The set pressure set in step 2 is input, the sensed pressure is compared with a set lower limit pressure obtained by subtracting a small amount from the set pressure, and when the sensed pressure becomes lower than the set lower limit pressure, a command signal is sent to the open signal output means 38. Is output and an open signal is output from the open signal output means 38 to the driver 33 to operate the flow rate adjusting valve 27 to the open side to increase the operating pressure applied to the air cylinder 21.

In the second comparing means 37, the pressure sensor 23
The pressure sensed by and the set pressure set by the pressure setter 35 are input, and the sensed pressure and the set upper limit pressure obtained by adding a small amount to the set pressure are compared, and the sensed pressure becomes larger than the set upper limit pressure. At this time, a command signal is output to the closing signal output means 39, a closing signal is output from the closing signal output means 39 to the driver 33 to operate the flow rate adjusting valve 27 to the closing side, and the operating pressure applied to the air cylinder 21 is reduced. Is configured to.

With the above structure, prior to cleaning the substrate W,
Depending on the type of film formed on the substrate W (aluminum film, oxide film, nitride film, polysilicon film, pattern film, bare silicon film, etc.) or the nature and type of contaminants attached to the substrate, The corresponding cleaning pressure is set and input by the pressure setting device 35. As a result, the pressure sensor 23 detects the pressure applied to the substrate W by the cleaning tool 8 in the cleaning state as the support arm 7 is displaced to the cleaning position and the cleaning tool 8 is pressed against the rotating substrate W, and the sensed pressure is detected. Flow control valve 2 based on the change of
7 is automatically controlled to open and close, and the pressure applied to the substrate W by the cleaning tool 8 is maintained within the set range of the above-described set upper limit pressure and set lower limit pressure, and cleaning is performed while applying a predetermined pressure to the substrate W. It can be processed.

FIG. 5 is an enlarged vertical cross-sectional view of the essential parts of the second embodiment. The differences from the first embodiment are as follows.
That is, as the pressing means, instead of the air cylinder 21, a linear actuator 42 in which the operation rod 41 is linearly movable in the coil 40 and a power supply device 43 are provided in the tip side arm portion 7a.

As shown in the block diagram of FIG. 6, the power supply device 43 comprises a power supply 43a and a variable resistor 43b.
By adjusting the resistance with the variable resistor 43b, the coil 4
The electromagnetic force of the linear actuator 42 can be controlled by changing the current flowing to zero.

A controller 45 as a control means is connected to the driver 44 of the variable resistor 43b, and the controller 45 is provided between the operating rod 41 and the cleaning tool support 14 as in the first embodiment. The pressure sensor 23 and the pressure setting device 35 are connected.

The controller 45 includes the first comparing means 4
6, a second comparison means 47, a decrease signal output means 48 and an increase signal output means 49 are provided. First comparison means 4
In 6, the pressure sensed by the pressure sensor 23 and the set pressure set by the pressure setter 35 are input, and the sensed pressure and the set lower limit pressure obtained by subtracting a small amount from the set pressure are compared, and the sensed pressure is set lower limit. When it becomes smaller than the pressure, a command signal is output to the increase signal output means 49, and the increase signal output means 4
9 outputs an increase signal to the driver 44 to increase the electromagnetic force on the linear actuator 42, and the cleaning tool 8 causes the substrate W to move.
The pressure applied to is increased.

In the second comparing means 47, the pressure sensor 23
The pressure sensed by and the set pressure set by the pressure setter 35 are input, and the sensed pressure and the set upper limit pressure obtained by adding a small amount to the set pressure are compared, and the sensed pressure becomes larger than the set upper limit pressure. At the same time, a command signal is output to the decrease signal output means 48, and a decrease signal is output from the decrease signal output means 48 to the driver 44 to weaken the electromagnetic force applied to the linear actuator 42, so that the pressure applied to the substrate W by the cleaning tool 8 is low. Is configured to be. The other structure is the same as that of the first embodiment, and the description is omitted by giving the same drawing numbers.

With the above structure, the pressure sensor 23 detects the pressure applied to the substrate W by the cleaning tool 8 in the cleaning state, and automatically controls the electromagnetic force of the linear actuator 42 based on the change in the detected pressure. The pressure applied to the substrate W by the cleaning tool 8 is maintained within the set range of the above-mentioned set upper limit pressure and set lower limit pressure, and the cleaning process can be performed while applying a predetermined pressure to the substrate W.

FIG. 7 is an enlarged vertical sectional view of an essential part of the third embodiment,
FIG. 8 is a side view of FIG. 7, and FIG. 9 is a transverse cross-sectional view. Differences from the second embodiment are as follows. That is, the cleaning tool support 14 and the rotary body 10 are paired in the upper and lower links 50.
The contact member 51 and the operating rod 41, which are connected to each other to form a parallel four-link mechanism via the ... And are rotatably attached to the upper end of the cleaning tool support 14, have a load cell type pressure sensor 23. Is abutted through. The center of the pressure sensor 23 in a plan view is provided so as to coincide with the rotation center P2 of the cleaning tool 8. The other structure is the same as that of the second embodiment, and the description thereof will be omitted by giving the same drawing numbers.

In the above-described embodiment, the cleaning tool 8 and the cleaning tool support 14 integrated with the cleaning tool 8 are configured to be moved up and down with respect to the rotating body 10. However, the tip side arm portion 7a of the support arm 7 is cleaned. The tool 8 and the cleaning tool support 14 to which the rotating body 10 is added may be configured to move up and down.

FIG. 10 is an overall schematic vertical sectional view showing a fourth embodiment of the rotary substrate cleaning apparatus of the present invention, in which a supporting cylinder 53 is rotatably provided on a device frame 52 via a bearing 54. The support cylinder 53 is provided with an integral rotary support shaft 55 on one end side of the support arm 7 so as to be capable of only raising and lowering. A pulley 56 is integrally attached to the support cylinder 53, and an electric motor 57 capable of rotating forward and backward with the pulley 56.
And are linked and coupled via a transmission belt 58.

On the other end side of the support arm 7, a cleaning tool support 14 having a cleaning tool 8 attached is rotatably provided, and the cleaning tool support 14 and the electric motor M provided on the support arm 7 are connected to each other. The belt type transmission mechanism 59 is interlockingly connected.

A spring seat 60 is attached at an intermediate position of the rotary support shaft 55, and between the spring seat 60 and the support cylinder 53,
A compression coil spring 61 for urging the rotation support shaft 55 to rise is provided, and the weight balance means 62 is configured so that the cleaning tool 8 can be maintained at the cleaning position for the substrate W in a natural state with a slight supporting force. ing.

A linear actuator 42 is provided at a position corresponding to the lower side of the rotation support shaft 55, and the rotation support shaft 55 is supported by the operating rod 41 in the coil 40 thereof via the pressure sensor 23. With this configuration, the pressure sensor 2
When the pressure sensed by 3 becomes larger than the set range, the linear actuator 42 is controlled so as to increase the electromagnetic force and raise the support arm 7, while the pressure sensor 23
When the pressure sensed by the cleaning tool 8 becomes smaller than the set range, the linear actuator 42 is controlled to lower the support arm 7 by reducing the electromagnetic force, and the pressure applied to the substrate W by the cleaning tool 8 is maintained within the set range. To do so.

Instead of the compression coil springs 17 and 61 in the above embodiment, a non-linear spring having a constant repulsive force regardless of the degree of elastic displacement may be used.

In the present invention, the cleaning tool 8 can be preferably implemented by using a soft material such as nylon brush, mohair brush, sponge or felt, but a plastic tool is used. It is also applicable when doing.

In the above embodiment, the cleaning tool 8 is used as the substrate W.
Although it is configured to rotate the support arm 7 around the first axis P1 in the vertical direction by an electric motor for horizontal displacement along the surface of the support arm 7, the support arm 7 is linearly moved by an air cylinder or the like. It may be configured to be moved in a direction, and is collectively referred to as a cleaning tool moving means by a configuration including the support arm 7 and the electric motor, a configuration including the support arm 7 and the air cylinder, and the like.

The present invention is not limited to the circular substrate as in the above embodiment, but can be applied to a rotary substrate cleaning apparatus for a rectangular substrate.

[0047]

According to the rotary type substrate cleaning apparatus of the first aspect of the present invention, the pressing means changes the pressure applied to the rotating substrate by the cleaning tool in the cleaning state due to the warp deformation of the substrate. Since the cleaning tool is moved up and down with respect to the substrate and the pressure of the cleaning tool applied to the substrate is maintained within the set range, it follows warpage deformation on the substrate surface, regardless of whether the substrate warps or deforms. Can be uniformly washed with a washing tool while always applying a predetermined pressure.

According to the rotating type substrate cleaning apparatus of the second aspect of the present invention, the cleaning tool is cleaned as the pressure applied to the rotating substrate by the cleaning tool changes in the cleaning state due to the warp deformation of the substrate. Since the attached cleaning tool support is moved up and down with respect to the rotating body by the pressing means to maintain the pressure of the cleaning tool applied to the substrate within the set range, for example, a base supporting the cleaning tool rotating means and the cleaning tool moving means. Compared to the case of raising and lowering the whole on the end side, the weight of the member to be raised and lowered is light and the cleaning tool can be raised and lowered quickly and easily, it is easy to follow the warp deformation on the substrate surface, and regardless of the warp deformation of the substrate. Instead, the entire surface of the substrate can be uniformly cleaned with a cleaning tool with a relatively simple structure while always applying a predetermined pressure.

Further, according to the rotary type substrate cleaning apparatus of the third aspect of the present invention, the weight balancing means balances with the weight of the cleaning tool, so that the cleaning tool and its integrated body are integrated with respect to the change in the pressure applied to the substrate. The force required to move the cleaning tool support up and down is small, and the pressing means can have a simple structure with a small operating force, but can be well controlled with a small force against changes in the pressure applied to the substrate. It became so.

According to the rotating type substrate cleaning apparatus of the fourth aspect of the invention, both the supporting force of the weight balancing means for the cleaning tool and the pressure applied by the cleaning tool to the substrate by the pressing means are rotated. Since it can be applied to the cleaning tool without bias, the cleaning tool can be pressed evenly over the entire working surface against the substrate, the cleaning performance can be improved, and the pressure applied by the cleaning tool to the substrate can be improved. The pressure applied to the substrate can be detected accurately because the pressure sensor detects the pressure in a state where it matches the rotation center of the cleaning tool, and based on that, the pressure applied to the substrate by the cleaning tool can be better controlled to further improve the cleaning performance. I can improve.

According to the rotary type substrate cleaning apparatus of the fifth aspect of the invention, since the quick response to the change in the pressure applied to the rotating substrate by the cleaning tool, the cleaning tool can be used on the substrate surface. The warp deformation can be more easily followed, and the cleaning performance can be further improved.

[Brief description of drawings]

FIG. 1 is an overall schematic vertical sectional view showing a first embodiment of a rotary substrate cleaning apparatus of the present invention.

FIG. 2 is a plan view.

FIG. 3 is an enlarged vertical sectional view of a main part.

FIG. 4 is a block diagram showing a control configuration of the first embodiment.

FIG. 5 is an enlarged vertical sectional view of a main part of the second embodiment.

FIG. 6 is a block diagram showing a control configuration of a second embodiment.

FIG. 7 is an enlarged vertical sectional view of a main part of the third embodiment.

FIG. 8 is a side view of FIG. 7;

9 is a cross-sectional view of FIG.

FIG. 10 is a partially cutaway front view of the fourth embodiment.

[Explanation of symbols]

 4 ... Substrate holding means 6 ... Nozzle as cleaning liquid supply means 8 ... Cleaning tool 10 ... Rotating body 14 ... Cleaning tool support 18 ... Weight balancing means 21 ... Air cylinder 23 as pressing means 23 ... Pressure sensor 34 ... As control means Controller 42 ... Linear actuator 37 as pressing means 37 ... Single-acting air cylinder 62 ... Weight balancing means M ... Electric motor as cleaning tool rotating means W ... Substrate

Claims (5)

[Claims] 1. A substrate holding means for holding a substrate rotatably around a vertical axis, a cleaning tool for cleaning the surface of the substrate, and a cleaning tool rotating means for rotating the cleaning tool around a vertical axis. In a rotary substrate cleaning apparatus comprising: a cleaning tool moving unit that horizontally displaces the cleaning tool along a substrate surface; and a cleaning liquid supply unit that supplies a cleaning liquid to a cleaning location on the substrate surface by the cleaning tool, A pressing unit that receives a reaction force from the substrate at the time of cleaning the substrate and supports the cleaning tool so that the cleaning tool can move up and down with respect to the substrate; and the cleaning tool in the substrate cleaning state between the cleaning tool and the pressing unit. A pressure sensor for detecting the pressure applied to the substrate is provided, and a control means for activating the pressing means is provided so that the pressure sensed by the pressure sensor is maintained within a set range. A rotary substrate cleaning device. 2. A cleaning tool supporting body having a cleaning tool integrally attached to a rotating body rotated by the cleaning tool rotating means according to claim 1, is vertically movable via a pressing means, and the cleaning tool support is provided. A rotary substrate cleaning apparatus for lifting and lowering a body with respect to the substrate. 3. A rotary substrate provided between the rotating body according to claim 2 and a cleaning tool support, and a weight balance means for maintaining the cleaning tool at a predetermined height in balance with the weight of the cleaning tool. Cleaning device. 4. A rotary substrate cleaning apparatus in which the centers of the weight balancing means, the pressing means, and the pressure sensor in plan view as described above are aligned with the center of rotation of the cleaning tool. 5. A rotary substrate cleaning apparatus, wherein the pressing means according to claim 1 is a linear actuator using an electromagnetic force as a drive source.