CN104952696A - Wafer cleaning method and wafer cleaning equipment - Google Patents

Abstract

The invention discloses a method for cleaning a wafer. Cleaning brushes are used to clean the surface of the wafer. Both the wafer and the cleaning brushes rotate, and the cleaning brushes are arranged in a direction parallel to the surface of the wafer. At the same time, the wafer and the cleaning brush are relatively displaced, and the range of relative displacement covers part of the surface of the wafer and the direction of relative displacement is perpendicular to the length direction of the cleaning brush. The present invention also discloses a wafer cleaning device, which includes a cleaning chamber, a wafer driving and supporting mechanism and cleaning brushes located inside the cleaning chamber. The cleaning chamber has a door for wafers to enter and exit, and both the wafer and the cleaning brush rotate on their own. The cleaning brush can be close to or away from the surface of the wafer, and also includes a relative displacement device. The relative displacement device drives the relative displacement of the wafer and the cleaning brush while the wafer and the cleaning brush are rotating. The range of relative displacement covers part of the surface of the wafer and The direction of relative displacement is perpendicular to the length direction of the cleaning brush.

Description

Wafer cleaning method and equipment

technical field

The invention relates to the field of integrated circuit manufacturing, more specifically, to the wafer cleaning technology in the integrated circuit.

Background technique

After the wafer is polished, a large number of particles will be left on the surface of the wafer, and these particles must be removed in time, otherwise the subsequent process will be seriously affected. At the same time, whether the particles on the surface of the wafer are cleaned thoroughly will directly affect the yield of the final wafer.

FIG. 1 discloses a schematic diagram of cleaning a wafer surface in the prior art. As shown in FIG. 1 , a wafer 101 is usually vertically placed in a cleaning chamber 102 . A door 104 is provided on a side of the cleaning chamber 102 , and the door 104 allows the wafer to enter and exit the cleaning chamber. A set of rollers 106 and a pair of cleaning brushes 108 are arranged inside the cleaning chamber. A set of rollers 106 is used to support the wafer 101 and drive the wafer 101 to rotate. Generally, there are at least three rollers 106 , two at the bottom and one at the top. The three rollers 106 form a stable support for the wafer 101 . The three rollers 106 rotate under the drive of the driving mechanism, usually at the same speed and in the same direction, so as to drive the wafer 101 to rotate. A pair of cleaning brushes 108 can respectively rotate around their respective axes, and the arrangement direction of the cleaning brushes 108 is parallel to the surface of the wafer 101 . The usual cleaning process is as follows:

Open the door 104 of the cleaning chamber 102, put the wafer 101 into the cleaning chamber 102 and mount it on the roller 106, and the roller 106 starts to rotate, driving the wafer 101 to rotate together. A pair of cleaning brushes 108 are closed so that the cleaning brushes 108 are close to the front and back surfaces of the wafer 101. The meaning of "close" here is that the cleaning brushes 108 can effectively clean the surface of the wafer 101. The specific distance, or two Whether or not to contact can be selected according to the actual situation according to the conventional standards in this field. The cleaning brush 108 rotates about its own axis. During the cleaning process, both the wafer and the cleaning brush rotate, and the cleaning process is carried out in combination with the sprayed cleaning liquid. After the cleaning is completed, the pair of cleaning brushes 108 are separated so that there is enough distance to take out the wafer 101 . The door 104 is opened again, and the cleaned wafer 101 is taken out.

In this way of cleaning, each point on the wafer 101 is cleaned twice by the cleaning brush 108 every time the wafer 101 rotates once. In some cases, this degree of cleaning is not enough to clean the particles thoroughly. If you want to increase the cleaning rate, you can only prolong the time of the cleaning process, but prolonging the time of the cleaning process will undoubtedly lead to a decline in production. If the time of the cleaning process is compressed, the particles cannot be guaranteed to be cleaned, which may affect the yield of the wafer. Therefore, the current cleaning method is difficult to achieve a balance between work efficiency and pass rate.

Contents of the invention

The purpose of the present invention is to propose a wafer cleaning technology, by adjusting the movement mode of the wafer and the cleaning brush, the efficiency of wafer cleaning in the same time is higher.

According to an embodiment of the present invention, a wafer cleaning method is proposed. The surface of the wafer is cleaned by using a cleaning brush. The wafer rotates around its own center, and the cleaning brush rotates around its own rotation axis. The direction of the circular surface, the wafer is placed vertically, while the wafer and the cleaning brush rotate, the relative displacement of the wafer and the cleaning brush, the range of relative displacement covers part of the surface of the wafer and the direction of relative displacement is the same as the length direction of the cleaning brush vertical.

In one embodiment, while the wafer and the cleaning brush are rotating, the cleaning brush reciprocates in the vertical direction, and the reciprocating stroke is not greater than the diameter of the wafer. Or when the wafer and the cleaning brush rotate, the wafer moves back and forth in the vertical direction, and the round-trip stroke is not greater than the diameter of the wafer.

In one embodiment, cleaning brushes are arranged on both sides of the wafer, and the front and back sides of the wafer are cleaned at the same time. When cleaning, the cleaning brushes on both sides are close to the surface of the wafer. Cleaning brushes separate surfaces away from the wafer.

According to an embodiment of the present invention, a wafer cleaning device is proposed, including a cleaning chamber, a wafer driving and supporting mechanism and a cleaning brush located inside the cleaning chamber, the cleaning chamber has a door for wafers to enter and exit, the wafer driving and The support mechanism supports the wafer and drives the wafer to rotate around its own center of circle. The cleaning brush is arranged in a direction parallel to the surface of the wafer. The cleaning brush rotates around its own rotation axis and can approach or stay away from the surface of the wafer. The wafer is placed vertically. The cleaning equipment also includes a relative displacement device. The relative displacement device drives the relative displacement of the wafer and the cleaning brush while the wafer and the cleaning brush rotate. The range of relative displacement covers part of the surface of the wafer and the direction of relative displacement is the same as that of the cleaning brush. The length direction is vertical.

In one embodiment, the wafer driving and supporting mechanism is a set of rollers, which support the wafer and drive the wafer to rotate around its own center of circle through the rotation of the rollers. The relative displacement device is a driving motor, which is connected to the wafer driving and supporting mechanism, and drives the wafer driving and supporting mechanism together with the wafer to move back and forth in the vertical direction while the wafer and the cleaning brush rotate. The diameter of the circle. Or the driving motor is connected to the cleaning brush, and the cleaning brush is driven to move back and forth in the vertical direction while the wafer and the cleaning brush rotate, and the back and forth stroke is not greater than the diameter of the wafer.

In one embodiment, there are two cleaning brushes, which are respectively arranged on the front and back sides of the wafer to clean the front and back sides of the wafer at the same time. When cleaning, the two cleaning brushes are close to the surface of the wafer. After cleaning, The cleaning brushes on both sides separate away from the surface of the wafer.

The wafer cleaning method and the wafer cleaning device of the present invention adjust the movement mode of the wafer and the cleaning brush, and increase the relative displacement while the two rotate, so that in the same time period, a point on the wafer is cleaned The cleaning brushes are cleaned more often, thereby improving cleaning efficiency and obtaining a better balance between cleaning effect and output.

Description of drawings

The above and other features, properties and advantages of the present invention will become more apparent from the following description in conjunction with the accompanying drawings and embodiments, in which the same reference numerals represent the same features throughout, wherein:

FIG. 1 discloses a schematic diagram of cleaning a wafer in the prior art.

Fig. 2 discloses a schematic diagram of cleaning a wafer according to the first embodiment of the present invention, wherein the wafer is vertically arranged and the cleaning brush moves back and forth.

FIG. 3 discloses a schematic diagram of cleaning a wafer according to a second embodiment of the present invention, wherein the wafer is vertically arranged and the wafer moves back and forth.

FIG. 4 discloses a schematic diagram of cleaning a wafer according to a third embodiment of the present invention, wherein the wafer is arranged horizontally and the cleaning brush moves back and forth.

FIG. 5 discloses a schematic diagram of cleaning a wafer according to a fourth embodiment of the present invention, wherein the wafer is vertically arranged and the wafer moves back and forth.

Detailed ways

The present invention proposes a wafer cleaning technology. During the cleaning process, a relative displacement occurs between the wafer and the cleaning brush while the wafer and the cleaning brush rotate, so that within the same time, a point on the wafer The number of times to be cleaned by the cleaning brush is increased, and the cleaning efficiency can be improved.

first embodiment

Referring to FIG. 2 , it discloses a schematic diagram of cleaning a wafer according to a first embodiment of the present invention. In the first embodiment, a wafer cleaning device is proposed, which includes a cleaning chamber 202 , a wafer driving and supporting mechanism 204 and cleaning brushes 206 inside the cleaning chamber. A side of the cleaning chamber 202 has a door 203 for the wafer 201 to enter and exit. The wafer driving and supporting mechanism 204 supports the wafer 201 and drives the wafer 201 to rotate around its own center of circle. The cleaning brush 206 is arranged in a direction parallel to the surface of the wafer. The cleaning brush 206 rotates around its own axis of rotation and can approach or move away from the wafer. s surface. The above structures are similar to the prior art shown in FIG. 1 . Continuing to refer to Fig. 2, in the first embodiment, the wafer cleaning equipment also includes a relative displacement device 208, and the relative displacement device 208 also drives the wafer 201 and the cleaning brush 206 to be relatively opposite while the wafer 201 and the cleaning brush 206 are rotating. displacement, and the range of relative displacement covers part of the surface of wafer 201 , and the direction of relative displacement is perpendicular to the length direction of cleaning brush 206 .

In the first embodiment, the wafer 201 is placed vertically. The wafer driving and supporting mechanism 204 is a set of rollers, which can adopt the structure of three rollers in the prior art as shown in FIG. 1 , with two rollers arranged at the bottom and one roller arranged at the top. The set of rollers supports the wafer 201 , and the rotation of the rollers drives the wafer to rotate around its own center of circle. The relative displacement device 208 is a drive motor, and the drive motor is connected to the wafer drive and support mechanism 204. In this embodiment, the relative displacement device 208 needs to be connected to all three rollers, and the relative displacement device 208 drives the wafer drive and support mechanism. 204, that is, the three rollers together with the wafer 201 move back and forth in the vertical direction while the wafer and the cleaning brush rotate. Since the cleaning brush 206 remains stationary in the vertical direction, the movement of the wafer driving and supporting mechanism 204 and the wafer 201 forms a relative displacement of the wafer relative to the cleaning brush. The relative displacement device 208 drives the wafer back and forth for a stroke not greater than the diameter of the wafer. Usually, the range of this relative displacement is controlled within the radius range of the wafer, that is, the center of the wafer is taken as the center, and the upward or downward longitudinal movement is each 1/3 of the diameter. For a circular wafer, the width of both ends is narrow, and the effective working area of the cleaning brush is small if cleaning is performed at both ends, and the efficiency is not high. Therefore, it is advantageous to limit the moving range to a wider middle part. In this way, within the same period of time (for example, the wafer rotates once), a point on the wafer can be cleaned more than twice by the cleaning brush, which is more than the traditional method, thereby improving the cleaning efficiency and cleaning effect . The rotation speed range of the wafer is 5-100 rpm, and the rotation speed range of the cleaning brush is 50-1000 rpm. The speed of relative displacement is 5-20 cm/min.

There are two cleaning brushes 206 in the first embodiment, which are respectively arranged on the front and back sides of the wafer 201 to clean the front and back sides of the wafer at the same time. When cleaning, the two cleaning brushes 206 are close to the surface of the wafer. After the cleaning is completed, the cleaning brushes 206 on both sides separate the surface away from the wafer.

The first embodiment also embodies a wafer cleaning method, using a cleaning brush to clean the surface of the wafer, the wafer is placed vertically, the wafer rotates around its own center of circle, the cleaning brush rotates around its own rotating shaft, and the cleaning brush Arranged in a direction parallel to the surface of the wafer, while the wafer and the cleaning brush rotate, the wafer moves back and forth in the vertical direction, and the round-trip stroke is not greater than the diameter of the wafer, so that the relative displacement and relative displacement of the wafer and cleaning brush The range covers part of the surface of the wafer and the direction of relative displacement is perpendicular to the length direction of the cleaning brush.

second embodiment

Referring to FIG. 3 , it discloses a schematic diagram of cleaning a wafer according to a second embodiment of the present invention. In the second embodiment, a wafer cleaning device is proposed, which includes a cleaning chamber 302 , a wafer driving and supporting mechanism 304 and cleaning brushes 306 inside the cleaning chamber. A side of the cleaning chamber 302 has a door 303 for the wafer 301 to enter and exit. The wafer drive and support mechanism 304 supports the wafer 301 and drives the wafer 301 to rotate around its own center of circle. The cleaning brush 306 is arranged in a direction parallel to the surface of the wafer. The cleaning brush 306 rotates around its own axis of rotation and can approach or move away from the wafer. s surface. The above structures are similar to the prior art shown in FIG. 1 and the first embodiment shown in FIG. 2 . Continuing to refer to Fig. 3, in the second embodiment, the wafer cleaning equipment also includes a relative displacement device 308, and the relative displacement device 308 also drives the wafer 301 and the cleaning brush 306 to be relative to each other while the wafer 301 and the cleaning brush 306 are rotating. displacement, and the range of relative displacement covers part of the surface of the wafer 301. The direction of relative displacement is perpendicular to the length direction of cleaning brush 306 . Different from the first embodiment, in the second embodiment, the relative displacement device 308 drives the cleaning brush 306 to move back and forth in the vertical direction, while the wafer driving and supporting mechanism 304 and the wafer 301 are stationary.

In the second embodiment, the wafer 301 is also placed vertically. The wafer driving and supporting mechanism 304 is also a set of rollers, such as a structure of three rollers, two rollers are arranged at the bottom, and one roller is arranged at the top. The rollers support the wafer 301, and the rotation of the rollers drives the wafer to rotate around its own center of circle. The relative displacement device 308 is a driving motor, which is connected to the cleaning brush 306, and the driving motor drives the cleaning brush 306 to move back and forth in the vertical direction while the wafer and the cleaning brush rotate, and the reciprocating stroke is not greater than the diameter of the wafer 301. In the second embodiment, the wafer 301 remains stationary in the vertical direction, so the movement of the cleaning brush also forms a relative displacement with the wafer. The relative displacement device 308 drives the cleaning brush to make a round trip that is not greater than the diameter of the wafer. Usually, the range of this relative displacement is controlled within the radius range of the wafer, that is, with the center of the wafer as the center, the upward or downward longitudinal movement is each 1/3 the distance of the diameter. For a circular wafer, the width of both ends is narrow, and the effective working area of the cleaning brush is small if cleaning is performed at both ends, and the efficiency is not high. Therefore, it is advantageous to limit the moving range to a wider middle part. In this way, within the same period of time (for example, the wafer rotates once), a point on the wafer can be cleaned more than twice by the cleaning brush, which is more than the traditional method, thereby improving the cleaning efficiency and cleaning effect . The rotation speed range of the wafer is 5-100 rpm, and the rotation speed range of the cleaning brush is 50-1000 rpm. The speed of relative displacement is 5-20 cm/min.

There are two cleaning brushes 306 in the second embodiment, which are respectively arranged on the front and back sides of the wafer 301 to clean the front and back sides of the wafer at the same time. When cleaning, the two cleaning brushes 306 are close to the surface of the wafer. After the cleaning is completed, the cleaning brushes 306 on both sides separate the surface away from the wafer.

The second embodiment also embodies a wafer cleaning method, using a cleaning brush to clean the surface of the wafer, the wafer is placed vertically, the wafer rotates around its own center of circle, the cleaning brush rotates around its own rotating shaft, the cleaning brush Arranged in a direction parallel to the wafer surface, while the wafer and the cleaning brush rotate, the cleaning brush moves back and forth in the vertical direction, and the round-trip stroke is not greater than the diameter of the wafer, so that the wafer and the cleaning brush are relatively displaced and relatively displaced The range covers part of the surface of the wafer and the direction of relative displacement is perpendicular to the length direction of the cleaning brush.

third embodiment

Referring to FIG. 4 , it discloses a schematic diagram of cleaning a wafer according to a third embodiment of the present invention. In the third embodiment, a wafer cleaning device is proposed, including a cleaning chamber 402 , a wafer driving and supporting mechanism 404 and cleaning brushes 406 inside the cleaning chamber. A side of the cleaning chamber 402 has a door 403 for the wafer 401 to enter and exit. The wafer driving and supporting mechanism 404 supports the wafer 401 and drives the wafer 401 to rotate around its own center of circle. The cleaning brush 406 is arranged in a direction parallel to the surface of the wafer. The cleaning brush 406 rotates around its own axis of rotation and can approach or move away from the wafer. s surface. In the third embodiment, the wafer 401 is placed horizontally. The wafer driving and supporting mechanism 404 in this embodiment is a clamp. The clamp 404 clamps the edge of the wafer 401 . The rotation of the clamp 404 drives the wafer 401 to rotate around its own center of circle. The wafer cleaning equipment also includes a relative displacement device 408. The relative displacement device 408 also drives the relative displacement of the wafer 401 and the cleaning brush 406 while the wafer 401 and the cleaning brush 406 are rotating, and the range of relative displacement covers the area of the wafer 401. part surface. The direction of relative displacement is perpendicular to the length direction of cleaning brush 406 .

In the third embodiment, the wafer 401 is placed horizontally. The fixture clamps the wafer to support and drive the rotation. The relative displacement device 408 is a driving motor, and the driving motor 408 is connected to the wafer driving and supporting mechanism 404 , that is, the clamp. The drive motor drives the jig and the wafer to reciprocate in the horizontal direction while the wafer and the cleaning brush rotate, and the reciprocating stroke is not greater than the diameter of the wafer. Since the cleaning brush 406 remains stationary in the horizontal direction, the movement of the clamp along with the wafer in the horizontal direction forms a relative displacement of the wafer relative to the cleaning brush. In the third embodiment, the cleaning brushes 406 are arranged horizontally, the direction of relative displacement is perpendicular to the length direction of the cleaning brushes 406, and they move longitudinally in the horizontal plane. The relative displacement device 408 drives the wafer back and forth for a stroke not greater than the diameter of the wafer. Usually, the range of this relative displacement is controlled within the radius range of the wafer, that is, the center of the wafer is taken as the center, and the distance of each 1/3 diameter is moved horizontally. For a circular wafer, the width at both ends is narrow, and the effective working area of the cleaning brush is small if the cleaning is performed at both ends, and the efficiency is not high. Therefore, it is advantageous to limit the moving range to a wider middle part. In this way, within the same period of time (for example, the wafer rotates once), a point on the wafer can be cleaned more than twice by the cleaning brush, which is more than the traditional method, thereby improving the cleaning efficiency and cleaning effect . The rotation speed range of the wafer is 5-100 rpm, and the rotation speed range of the cleaning brush is 50-1000 rpm. The speed of relative displacement is 5-20 cm/min.

There are two cleaning brushes 406 in the third embodiment, which are respectively arranged on the front and back sides of the wafer 401 to clean the front and back sides of the wafer at the same time. When cleaning, the two cleaning brushes 406 are close to the surface of the wafer. After the cleaning is completed, the cleaning brushes 406 on both sides separate the surface away from the wafer.

The third embodiment embodies a wafer cleaning method. Cleaning brushes are used to clean the surface of the wafer. The wafer is placed horizontally. The wafer rotates around its own center of circle. The cleaning brush rotates around its own rotation axis. The cleaning brush is arranged on Parallel to the direction of the wafer surface, while the wafer and the cleaning brush rotate, the wafer moves back and forth in the horizontal direction, and the round-trip stroke is not greater than the diameter of the wafer, so that the relative displacement of the wafer and the cleaning brush covers Part of the surface of the wafer and the direction of relative displacement is perpendicular to the length direction of the cleaning brush.

Fourth embodiment

Referring to FIG. 5 , it discloses a schematic diagram of cleaning a wafer according to a fourth embodiment of the present invention. In the fourth embodiment, a wafer cleaning device is proposed, including a cleaning chamber 502 , a wafer driving and supporting mechanism 504 and cleaning brushes 506 inside the cleaning chamber. A side of the cleaning chamber 502 has a door 503 for the wafer 501 to enter and exit. The wafer driving and supporting mechanism 504 supports the wafer 501 and drives the wafer 501 to rotate around its own center of circle. The cleaning brush 506 is arranged in a direction parallel to the surface of the wafer. The cleaning brush 506 rotates around its own axis of rotation and can approach or move away from the wafer. s surface. Similar to the third embodiment, the wafer 501 is also placed horizontally in the fourth embodiment. The wafer driving and supporting mechanism 504 in this embodiment is also a clamp. The clamp 504 clamps the edge of the wafer 501 . The rotation of the clamp 504 drives the wafer 501 to rotate around its own center of circle. The wafer cleaning equipment also includes a relative displacement device 508. The relative displacement device 508 also drives the relative displacement of the wafer 501 and the cleaning brush 506 while the wafer 501 and the cleaning brush 506 are rotating, and the range of the relative displacement covers the wafer 501. part surface. The direction of relative displacement is perpendicular to the length direction of cleaning brush 506 .

In the fourth embodiment, the wafer 501 is placed horizontally. The fixture clamps the wafer to support and drive the rotation. The relative displacement device 508 is a driving motor, and the driving motor 508 is connected with the cleaning brush 506 . The driving motor drives the cleaning brush 506 to reciprocate in the horizontal direction while the wafer and the cleaning brush rotate, and the reciprocating stroke is not greater than the diameter of the wafer. Since the wafer 501 remains stationary in the horizontal direction, the movement of the cleaning brush 506 in the horizontal direction forms a relative displacement of the wafer relative to the cleaning brush. In the fourth embodiment, the cleaning brushes 506 are arranged horizontally, the direction of relative displacement is perpendicular to the length direction of the cleaning brushes 506, and they move longitudinally in the horizontal plane. The relative displacement device 508 drives the wafer back and forth for a stroke not greater than the diameter of the wafer. Usually, the range of this relative displacement is controlled within the radius range of the wafer, that is, the center of the wafer is taken as the center, and the distance of each 1/3 diameter is moved horizontally. For a circular wafer, the width at both ends is narrow, and the effective working area of the cleaning brush is small if the cleaning is performed at both ends, and the efficiency is not high. Therefore, it is advantageous to limit the moving range to a wider middle part. In this way, within the same period of time (for example, the wafer rotates once), a point on the wafer can be cleaned more than twice by the cleaning brush, which is more than the traditional method, thereby improving the cleaning efficiency and cleaning effect . The rotation speed range of the wafer is 5-100 rpm, and the rotation speed range of the cleaning brush is 50-1000 rpm. The speed of relative displacement is 5-20 cm/min.

There are two cleaning brushes 506 in the fourth embodiment, which are respectively arranged on the front and back sides of the wafer 501 to clean the front and back sides of the wafer at the same time. When cleaning, the two cleaning brushes 506 are close to the surface of the wafer. After the cleaning is completed, the cleaning brushes 506 on both sides separate the surface away from the wafer.

The fourth embodiment also embodies a wafer cleaning method. Cleaning brushes are used to clean the surface of the wafer. The wafer is placed horizontally, the wafer rotates around its own center, the cleaning brush rotates around its own rotation axis, and the cleaning brushes are arranged In the direction parallel to the wafer surface, while the wafer and the cleaning brush are rotating, the cleaning brush moves back and forth in the horizontal direction, and the round-trip stroke is not greater than the diameter of the wafer, so that the relative displacement of the wafer and the cleaning brush and the range of relative displacement Part of the surface of the wafer is covered and the direction of relative displacement is perpendicular to the length direction of the cleaning brush.

The wafer cleaning method and the wafer cleaning device of the present invention adjust the movement mode of the wafer and the cleaning brush, and increase the relative displacement while the two rotate, so that in the same time period, a point on the wafer is cleaned The cleaning brushes are cleaned more often, thereby improving cleaning efficiency and obtaining a better balance between cleaning effect and output.

The above-mentioned embodiments are provided to those familiar with the field to implement or use the present invention, and those familiar with the art can make various modifications or changes to the above-mentioned embodiments without departing from the inventive concept of the present invention, thus protection of the present invention The scope is not limited by the examples described above, but should be the widest range consistent with the innovative features set forth in the claims.

Claims (7)

1. a method for cleaning wafer, the surface of cleaning brush to wafer is used to clean, wafer is around the center of circle rotation of self, cleaning brush is around the rotating shaft rotation of self, and cleaning brush is arranged in the direction being parallel to crystal column surface, it is characterized in that, wafer is vertically placed, while wafer and cleaning brush rotation, wafer and cleaning brush relative displacement, the scope of described relative displacement covers the part surface of wafer and the direction of relative displacement is vertical with the length direction of cleaning brush.

2. method for cleaning wafer as claimed in claim 1, it is characterized in that, while wafer and cleaning brush rotation, cleaning brush reciprocates at vertical direction, and described round stroke is not more than brilliant diameter of a circle.

3. method for cleaning wafer as claimed in claim 1, it is characterized in that, while wafer and cleaning brush rotation, wafer reciprocates at vertical direction, and described round stroke is not more than brilliant diameter of a circle.

4. the method for cleaning wafer according to any one of claims 1 to 3, it is characterized in that, all cleaning brush is configured at the tow sides of wafer, the tow sides of wafer are cleaned simultaneously, when cleaning, the cleaning brush of both sides closes up the surface close to wafer, and after completing cleaning, the cleaning brush of both sides is separated the surface away from wafer.

5. a wafer cleaning equipment, comprise cleaning chambers, the wafer being positioned at cleaning chambers inside drives and supporting mechanism and cleaning brush, described cleaning chambers has the door for wafer turnover, described wafer drives and supporting mechanism supporting wafer drive wafer around the center of circle rotation of self, described cleaning brush is arranged in the direction being parallel to crystal column surface, cleaning brush around self axis of rotation and can close to or far away from the surface of wafer, it is characterized in that, wafer is vertically arranged, this wafer cleaning equipment also comprises relative displacement apparatus, relative displacement apparatus is while wafer and cleaning brush rotation, drive wafer and cleaning brush relative displacement, the scope of described relative displacement covers the part surface of wafer and the direction of relative displacement is vertical with the length direction of cleaning brush.

6. wafer cleaning equipment as claimed in claim 5, is characterized in that,

Described wafer drives and supporting mechanism is one group of roller, described one group of roller supporting wafer, and rotarily drives the center of circle rotation of wafer around self by roller;

Described relative displacement apparatus is CD-ROM drive motor, CD-ROM drive motor is connected to wafer and drives and supporting mechanism, drive wafer driving and supporting mechanism to reciprocate at vertical direction while wafer and cleaning brush rotation together with wafer, described round stroke is not more than brilliant diameter of a circle; Or described CD-ROM drive motor is connected to cleaning brush, drive cleaning brush to reciprocate at vertical direction while wafer and cleaning brush rotation, described round stroke is not more than brilliant diameter of a circle.

7. the wafer cleaning equipment as described in claim 5 or 6, it is characterized in that, described cleaning brush is two, be arranged in the tow sides of wafer to clean the tow sides of wafer simultaneously, when cleaning, two cleaning brush close up the surface close to wafer, and after completing cleaning, the cleaning brush of both sides is separated the surface away from wafer.