JPH0458687B2 - - Google Patents
Info
- Publication number
- JPH0458687B2 JPH0458687B2 JP59063857A JP6385784A JPH0458687B2 JP H0458687 B2 JPH0458687 B2 JP H0458687B2 JP 59063857 A JP59063857 A JP 59063857A JP 6385784 A JP6385784 A JP 6385784A JP H0458687 B2 JPH0458687 B2 JP H0458687B2
- Authority
- JP
- Japan
- Prior art keywords
- sliding ring
- main shaft
- gripper
- support rod
- grippers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000463 material Substances 0.000 claims description 25
- 239000004065 semiconductor Substances 0.000 claims description 24
- 230000005540 biological transmission Effects 0.000 claims description 8
- 238000001035 drying Methods 0.000 claims description 8
- 230000000630 rising effect Effects 0.000 claims description 5
- 230000002093 peripheral effect Effects 0.000 claims 1
- 230000007246 mechanism Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Centrifugal Separators (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Description
【発明の詳細な説明】
本発明はシリコンウエハやガラスフオトマスク
などの薄板状の半導体材料を一枚ごとに回転して
水切乾燥を行なうための装置に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an apparatus for rotating thin plate-shaped semiconductor materials such as silicon wafers and glass photomasks one by one to drain and dry them.
半導体材料に配線回路を形成するプロセスには
エツチング工程が含まれ、従つてその直後に半導
体材料を純水により水洗する水洗工程、さらにそ
の後に半導体材料を乾燥する工程が含まれる。そ
の乾燥工程は好適には半導体材料を回転すること
による水切乾燥によつてなされる。しかるに従来
は、半導体材料の１枚ごとの水切乾燥は回転主軸
を中空にしてその先端を備えられた真空による吸
盤で半導体材料を吸着して行なわれたため、回転
用の駆動装置のほか、真空源および切換弁を要
し、従つて装置が大がかりになり且つ操作も複雑
になり、さらに半導体材料の片面しか水切乾燥が
できない欠点があつた。 The process of forming a wiring circuit on a semiconductor material includes an etching step, and immediately thereafter a washing step of washing the semiconductor material with pure water, and then a step of drying the semiconductor material. The drying step is preferably done by drain drying by rotating the semiconductor material. However, in the past, the semiconductor material was drained and dried one by one by suctioning the semiconductor material with a vacuum suction cup attached to the tip of a hollow rotating main shaft. This method also requires a switching valve, making the device bulky and complicated to operate, and has the disadvantage that only one side of the semiconductor material can be drained and dried.
本発明の目的は吸盤に伴なう真空源および切換
弁などを用いず、純機械系により半導体材料を比
較的広い寸法範囲にわたり把持し得るようにし且
つ半導体材料の両面の水切乾燥を行ない得る装置
を提供することである。 The purpose of the present invention is to provide an apparatus that can grip semiconductor materials over a relatively wide range of dimensions using a purely mechanical system without using vacuum sources and switching valves associated with suction cups, and can drain and dry both sides of semiconductor materials. The goal is to provide the following.
本発明による水切乾燥装置の特徴は回転する主
軸の上端に枢止された少なくとも３つのグリツパ
ーの開閉を各グリツパーに連結された共通の摺動
リングの上下移動によつて行ない、その上下移動
を該摺動リングを可回動に受入れる保持部材とそ
の支持ロツドを介して行なうようにし、各グリツ
パーの上端に係止部を有し該係止部は前記グリツ
パーが開いた状態において上側に位置する内側に
向つてゆるく下降する傾斜部と、その傾斜部の外
端に接続して急勾配で立上る部分と、該立上り部
分の上端に在る内向きの突起を有するようにした
ことである。 The feature of the drain drying device according to the present invention is that at least three grippers pivotally fixed to the upper end of the rotating main shaft are opened and closed by vertical movement of a common sliding ring connected to each gripper, and the vertical movement is performed by vertical movement of a common sliding ring connected to each gripper. This is done through a holding member rotatably receiving the sliding ring and its support rod, and each gripper has a locking portion at the upper end thereof, and the locking portion is located on the inner side located on the upper side when the gripper is in the open state. It has a sloped part that gently descends toward , a part that rises steeply connected to the outer end of the sloped part, and an inward protrusion that is located at the upper end of the rising part.
次に図面を参照のもとに本発明の実施例に関し
説明する。本発明による水切乾燥装置は第１図お
よび第２図に示すように、回転される主軸１と、
その主軸を回転自在に且つ直立状態に支持する支
持体２と、主軸１の上端に枢止された少なくとも
３つのグリツパー３およびそれらのグリツパーの
開閉機構から成つている。４は主軸１を回転する
ための駆動用モータであり、５はその間の伝動装
置である。この伝動装置５としては通常のベルト
伝動、タイミングベルトなど適当な装置が用いら
れる。 Next, embodiments of the present invention will be described with reference to the drawings. As shown in FIGS. 1 and 2, the drain dryer according to the present invention includes a main shaft 1 to be rotated,
It consists of a support 2 that rotatably supports the main shaft in an upright state, at least three grippers 3 pivotally fixed to the upper end of the main shaft 1, and opening/closing mechanisms for these grippers. 4 is a drive motor for rotating the main shaft 1, and 5 is a transmission device therebetween. As this transmission device 5, a suitable device such as a normal belt transmission or a timing belt is used.
グリツパー３は等間隔に設けられるのが好まし
く、一例では第２図に示すように、対状に組合わ
されたものが３組備えられる。各グリツパーはピ
ン６によつて枢止され且つその上端は係止部７に
なつている。この係止部７の形状は第３図に示す
ように、グリツパー３が開いた状態において、上
側に位置して内側に向つてゆるく下降する傾斜部
７ａと、その傾斜部の外端に接続して急勾配で立
上る部分７ｂと、その立上り部分の上端に在る内
向きの突起７ｃから成り、このようなグリツパー
の形状により半導体材料を可成り広範囲の寸法に
わたつて保持することができる。 It is preferable that the grippers 3 are provided at equal intervals, and in one example, as shown in FIG. 2, three pairs of grippers are provided. Each gripper is pivoted by a pin 6 and has a stop 7 at its upper end. As shown in FIG. 3, the shape of the locking portion 7 is such that when the gripper 3 is open, it connects to an inclined portion 7a located on the upper side that gently descends inward, and an outer end of the inclined portion. The gripper consists of a steeply rising portion 7b and an inward protrusion 7c at the upper end of the rising portion, and this shape of the gripper makes it possible to hold semiconductor material over a fairly wide range of dimensions.
各グリツパー３を開閉するため、主軸の上部は
第４図に示すようにスプライン軸１ａになつてい
るのが好ましく、そこに摺動リング８がはめ込ま
れる。従つて、この摺動リング８の内周面はその
スプラインに嵌合する凹凸面になつている。な
お、このスプラインとしては角形スプラインであ
つても、インボリユート形のスプラインであつて
もよい。そのため摺動リング８は主軸１に対して
相対的には回転し得ないが、軸方向には可動にな
つている。各グリツパー３の主軸１から離れた外
側の部分と摺動リング８とはアーム９によつて接
続され、アーム９は両端においてグリツパーの部
分および摺動リング８に対してピンにより枢止さ
れている。 In order to open and close each gripper 3, the upper part of the main shaft is preferably formed into a spline shaft 1a, as shown in FIG. 4, into which a sliding ring 8 is fitted. Therefore, the inner circumferential surface of the sliding ring 8 has an uneven surface that fits into the splines. Note that this spline may be a rectangular spline or an involute spline. Therefore, the sliding ring 8 cannot rotate relative to the main shaft 1, but is movable in the axial direction. The outer part of each gripper 3 remote from the main shaft 1 and the sliding ring 8 are connected by an arm 9, which is pivoted at both ends to the gripper part and the sliding ring 8 by pins. .
また、第４図および第５図に示すように、摺動
リング８の下部は中央部８′が小径になつており、
その部分に保持部材１０の一対の脚１０ａが嵌合
することによつて、摺動リング８は保持部材１０
にはめ込まれている。この保持部材１０はそれに
固定された支持ロツド１１によつて支持される。
支持ロツド１１は主軸１に平行に設置され、その
適当な部分、好ましくは第１図に見られるよう
に、その下部に支持ロツド１１を上下に移動する
機構が備えられている。 Further, as shown in FIGS. 4 and 5, the lower part of the sliding ring 8 has a small diameter at the center 8'.
By fitting the pair of legs 10a of the holding member 10 into the portions, the sliding ring 8 is attached to the holding member 10.
It's stuck in. This holding member 10 is supported by a support rod 11 fixed thereto.
The support rod 11 is installed parallel to the main shaft 1 and is provided with a mechanism for moving the support rod 11 up and down at a suitable part thereof, preferably in its lower part, as seen in FIG.
支持ロツド１１の上下機構としては好ましくは
パルスモータ１２および伝動装置１３を含み、且
つ第１図に示すように、支持ロツド１１の下部に
ねじ１４が形成され且つそのねじ１４に係合する
めねじ部材１５が備えられ、めねじ部材１５は回
転自在になつているが、上下には不動になつてい
る。めねじ部材１５は伝動装置１３を介してパル
スモータ１２によつて回転される。この伝動装置
としては確動伝動ができる点でチエーンまたはタ
イミングベルトであるのが好ましい。 The up and down mechanism for the support rod 11 preferably includes a pulse motor 12 and a transmission device 13, and as shown in FIG. 15, and the female screw member 15 is rotatable, but not vertically movable. The female threaded member 15 is rotated by a pulse motor 12 via a transmission 13 . As this transmission device, a chain or a timing belt is preferable since positive transmission is possible.
この装置により水切乾燥を行なう際は、パルス
モータ１２を予め決められた方向に所定の回転数
だけ回転して、支持ロツド１１および保持部材１
０を介して摺動リング８を所定寸法だけ降下し、
アーム９を介して各グリツパーを枢動し、第３図
および第７図中に実線で示すように開く。この状
態で、乾燥すべき半導体材料Ｓをグリツパー３の
傾斜部７ａの上に載せる。次いでパルスモータ１
２を前とは逆の方向に所定回転数だけ回転し、摺
動リング８を上昇すれば、各グリツパー３は閉じ
る方向に枢動し、第７図中に想像線で示すように
閉じ、係止部の部分７ｂで半導体材料Ｓを保持す
る。 When draining and drying with this device, the pulse motor 12 is rotated in a predetermined direction at a predetermined number of rotations, and the support rod 11 and the holding member 1 are
0 by lowering the sliding ring 8 by a predetermined dimension,
Each gripper is pivoted via arm 9 to open as shown in solid lines in FIGS. 3 and 7. In this state, the semiconductor material S to be dried is placed on the inclined portion 7a of the gripper 3. Next, pulse motor 1
2 by a predetermined number of rotations in the opposite direction to the previous direction, and the sliding ring 8 is raised, each gripper 3 pivots in the closing direction, and closes and engages as shown by the imaginary line in FIG. The semiconductor material S is held at the stop portion 7b.
このように保持した状態でモータ４を作動して
主軸１を回転し、グリツパー３および半導体材料
も同時に回転するので、水切乾燥が行なわれる。
なお、その際、摺動リング８は保持部材１０で保
持された状態で主軸１と共に回転する。主軸の回
転数は好ましくは1000〜8000rpmである。回転中
はパルスモータ１２は停止したままであり、摺動
リング８もその高さ位置を保ち、各グリツパー３
は閉じた状態を維持する。 In this held state, the motor 4 is operated to rotate the main shaft 1, and the gripper 3 and the semiconductor material are also rotated at the same time, so that draining and drying is performed.
At this time, the sliding ring 8 rotates together with the main shaft 1 while being held by the holding member 10. The rotation speed of the main shaft is preferably 1000 to 8000 rpm. During rotation, the pulse motor 12 remains stopped, the sliding ring 8 also maintains its height position, and each gripper 3
remains closed.
主軸の回転が所定時間続けられて半導体材料の
水切乾燥が終ると、モータ４の作動が停止し、再
びパルスモータ１２が作動して摺動リング８を下
げて前と同様にグリツパー３を開き、乾燥された
半導体材料を次工程に搬送し、次の材料をグリツ
パー３の傾斜部７ａに載せる。所望により、主軸
１を中空にして、そこから半導体材料の下面の中
心区域にN2ガスを吹き付け且つ可動のガスノズ
ルにより同じ半導体材料の上面の中心区域には
N2ガスを吹き付けてもよく、それにより両面の
中心区域の乾燥を促進することできる。 When the spindle continues to rotate for a predetermined period of time and the semiconductor material is drained and dried, the motor 4 stops operating, and the pulse motor 12 operates again to lower the sliding ring 8 and open the gripper 3 as before. The dried semiconductor material is transported to the next step, and the next material is placed on the inclined portion 7a of the gripper 3. If desired, the main shaft 1 is made hollow, from which N 2 gas is blown onto the central area of the lower surface of the semiconductor material, and the central area of the upper surface of the same semiconductor material is blown with a movable gas nozzle.
N 2 gas may be blown, which can help dry the central area on both sides.
なお、通常は第１図に示すように、グリツパー
３は被い１７で包囲され、排気口１８が設けられ
る。１９は水抜きである。 Note that, as shown in FIG. 1, the gripper 3 is usually surrounded by a cover 17 and provided with an exhaust port 18. 19 is a drain.
上記の実施例ではスプラインによつて主軸１に
対する摺動リング８の回転を阻止しているが、そ
のような機能はスプラインでなくても可能であ
り、例えば第６図に示すように主軸に軸方向に延
びる突起１６を設け摺動リング８の内周面にそれ
に嵌合する溝を設けてもよい。また、支持ロツド
１１を上下に移動する装置としてはパルスモータ
によれば正確に移動し得る利点があるが、他のモ
ータまたは駆動体を用いてもよく、さらにねじの
代りにウオーム機構、またはラツクピニオン機構
などを用いてもよい。 In the above embodiment, the rotation of the sliding ring 8 with respect to the main shaft 1 is prevented by a spline, but such a function is also possible without a spline. For example, as shown in FIG. It is also possible to provide a protrusion 16 extending in the direction and provide a groove in the inner circumferential surface of the sliding ring 8 to fit into the protrusion 16 . Further, as a device for moving the support rod 11 up and down, a pulse motor has the advantage of being able to move it accurately, but other motors or drivers may also be used, and a worm mechanism or rack may be used instead of a screw. A pinion mechanism or the like may also be used.
上記のように、本発明によれば、半導体材料は
その周囲の縁で保持された状態で水切乾燥が行な
われるので、その両面の水切乾燥を行なうことが
できる。そして真空による吸着を用いる従来の方
式に比し、真空源を用いないためコンパクトにな
り、且つ半導体材料を適度に保持することがで
き、操作および制御系を単純化でき、円滑な作業
がなされる。その上、半導体材料の水切乾燥を比
較的広い範囲にわたり行なうことができる。 As described above, according to the present invention, the semiconductor material is drained and dried while being held by its surrounding edges, so that both sides of the semiconductor material can be drained and dried. In addition, compared to the conventional method that uses vacuum suction, it is more compact because it does not use a vacuum source, and can hold the semiconductor material appropriately, simplifying the operation and control system, and allowing smooth work. . Moreover, the semiconductor material can be drained and dried over a relatively wide range.
第１図は本発明の一例による水切乾燥装置の立
面図、第２図はその平面図、第３図はグリツパー
部分を部分的断面で示した立面図、第４図は第１
図の線Ａ−Ａ断面図、第５図は第４図の線Ｂ−Ｂ
断面図、第６図は他の実施例を示す第４図に類似
の断面図、第７図は第２図の線Ｃ−Ｃ矢視図であ
る。
図中、１……主軸、３……グリツパー、７……
係止部、８……摺動リング、９……アーム、１０
……保持部材、１１……支持ロツド、１２，１３
……上下移動用の装置、１４……ねじ、１５……
めねじ部材、１ａ……スプライン軸。
FIG. 1 is an elevation view of a drain dryer according to an example of the present invention, FIG. 2 is a plan view thereof, FIG.
A sectional view taken along line A-A in the figure, and Figure 5 is a cross-sectional view taken along line B-B in Figure 4.
6 is a sectional view similar to FIG. 4 showing another embodiment, and FIG. 7 is a view taken along line CC in FIG. 2. In the figure, 1... main shaft, 3... gripper, 7...
Locking part, 8...Sliding ring, 9...Arm, 10
... Holding member, 11 ... Support rod, 12, 13
... Device for vertical movement, 14 ... Screw, 15 ...
Female thread member, 1a...spline shaft.
Claims (1)
れた少なくとも３つのグリツパーと、主軸の上部
に軸方向に可摺動になつているが前記主軸に対し
相対的に回動できないように設けられた摺動リン
グを含み、各前記グリツパーは上部に半導体材料
を係止し得る係止部を備え且つ前記摺動リングが
上下に移動すると枢動するようにアームを介して
前記摺動リングに接続され、各前記グリツパーの
係止部は前記グリツパーが開いた状態において上
側に位置する内側に向つてゆるく下降する傾斜部
と、その傾斜部の外端に接続して急勾配で立上る
部分と、該立上り部分の上端に在る内向きの突起
を有し、さらに前記摺動リングを回動自在に且つ
軸方向には共に移動するようにはめ込む保持部材
と、前記保持部材を支持し且つ前記主軸に平行に
延びる支持ロツドと、前記支持ロツドを上下に移
動するための装置とを含む半導体材料の水切乾燥
装置。 ２ 特許請求の範囲第１項に記載の装置におい
て、前記主軸の上部はスプライン軸になつており
且つ前記摺動リングの内周面は前記スプライン軸
に嵌合する凹凸面になつている水切乾燥装置。 ３ 特許請求の範囲第１項に記載の装置におい
て、前記支持ロツドを上下に移動する装置は前記
支持ロツドの下部に形成されたねじと、前記ねじ
に係合するめねじを含み、前記めねじは回転自在
であるが上下には不動に保持され、さらに伝動装
置を介し前記めねじを回転するパルスモータを含
む水切乾燥装置。[Scope of Claims] 1. A rotationally driven main shaft, at least three grippers pivotally fixed to the upper end of the main shaft, and at least three grippers axially slidable on the upper part of the main shaft but relative to the main shaft. Each gripper includes a sliding ring provided so as not to be rotatable, and each of the grippers has a locking portion capable of locking a semiconductor material on an upper portion thereof, and is arranged via an arm so as to pivot when the sliding ring moves up and down. and is connected to the sliding ring, and the locking part of each gripper has an inclined part located on the upper side that gently descends inward when the gripper is open, and a steep part connected to the outer end of the inclined part. a holding member having a rising part and an inward protrusion at the upper end of the rising part, and into which the sliding ring is fitted so as to be rotatable and move together in the axial direction; A device for draining and drying semiconductor materials, comprising a support rod supporting a member and extending parallel to the main axis, and a device for moving the support rod up and down. 2. The apparatus according to claim 1, wherein the upper part of the main shaft is a spline shaft, and the inner peripheral surface of the sliding ring is an uneven surface that fits into the spline shaft. Device. 3. In the device according to claim 1, the device for moving the support rod up and down includes a screw formed at a lower part of the support rod and a female screw that engages with the screw, and the female screw is A draining/drying device including a pulse motor that is rotatable but held immovable vertically and further rotates the female screw via a transmission device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6385784A JPS60206139A (en) | 1984-03-30 | 1984-03-30 | Hydroextractor of semiconductor material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6385784A JPS60206139A (en) | 1984-03-30 | 1984-03-30 | Hydroextractor of semiconductor material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60206139A JPS60206139A (en) | 1985-10-17 |
| JPH0458687B2 true JPH0458687B2 (en) | 1992-09-18 |
Family
ID=13241424
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6385784A Granted JPS60206139A (en) | 1984-03-30 | 1984-03-30 | Hydroextractor of semiconductor material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60206139A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4924852U (en) * | 1972-06-10 | 1974-03-02 | ||
| JPS5737837A (en) * | 1980-08-20 | 1982-03-02 | Toshiba Corp | Drying device for semiconductor wafer |
-
1984
- 1984-03-30 JP JP6385784A patent/JPS60206139A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4924852U (en) * | 1972-06-10 | 1974-03-02 | ||
| JPS5737837A (en) * | 1980-08-20 | 1982-03-02 | Toshiba Corp | Drying device for semiconductor wafer |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60206139A (en) | 1985-10-17 |
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