JPS60204637A - 低融点封着用組成物 - Google Patents

低融点封着用組成物

Info

Publication number
JPS60204637A
JPS60204637A JP59052822A JP5282284A JPS60204637A JP S60204637 A JPS60204637 A JP S60204637A JP 59052822 A JP59052822 A JP 59052822A JP 5282284 A JP5282284 A JP 5282284A JP S60204637 A JPS60204637 A JP S60204637A
Authority
JP
Japan
Prior art keywords
powder
melting point
low melting
low
sealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59052822A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0127982B2 (cg-RX-API-DMAC10.html
Inventor
Ichiro Matsuura
一郎 松浦
Fumio Yamaguchi
山口　二三男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Electric Glass Co Ltd
Original Assignee
Nippon Electric Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Glass Co Ltd filed Critical Nippon Electric Glass Co Ltd
Priority to JP59052822A priority Critical patent/JPS60204637A/ja
Priority to US06/713,000 priority patent/US4621064A/en
Priority to DE19853509955 priority patent/DE3509955A1/de
Publication of JPS60204637A publication Critical patent/JPS60204637A/ja
Publication of JPH0127982B2 publication Critical patent/JPH0127982B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W76/60—
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
    • C03C8/245—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders containing more than 50% lead oxide, by weight
    • H10W70/682—
    • H10W90/756—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Glass Compositions (AREA)
JP59052822A 1984-03-19 1984-03-19 低融点封着用組成物 Granted JPS60204637A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP59052822A JPS60204637A (ja) 1984-03-19 1984-03-19 低融点封着用組成物
US06/713,000 US4621064A (en) 1984-03-19 1985-03-18 Low temperature sealing composition with synthetic zircon
DE19853509955 DE3509955A1 (de) 1984-03-19 1985-03-19 Niedrigtemperatur-abdichtungszusammensetzung

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59052822A JPS60204637A (ja) 1984-03-19 1984-03-19 低融点封着用組成物

Publications (2)

Publication Number Publication Date
JPS60204637A true JPS60204637A (ja) 1985-10-16
JPH0127982B2 JPH0127982B2 (cg-RX-API-DMAC10.html) 1989-05-31

Family

ID=12925539

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59052822A Granted JPS60204637A (ja) 1984-03-19 1984-03-19 低融点封着用組成物

Country Status (3)

Country Link
US (1) US4621064A (cg-RX-API-DMAC10.html)
JP (1) JPS60204637A (cg-RX-API-DMAC10.html)
DE (1) DE3509955A1 (cg-RX-API-DMAC10.html)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE33859E (en) * 1985-09-24 1992-03-24 John Fluke Mfg. Co., Inc. Hermetically sealed electronic component
US4906311A (en) * 1985-09-24 1990-03-06 John Fluke Co., Inc. Method of making a hermetically sealed electronic component
US4725480A (en) * 1985-09-24 1988-02-16 John Fluke Mfg. Co., Inc. Hermetically sealed electronic component
JPS62191442A (ja) * 1986-02-17 1987-08-21 Nippon Electric Glass Co Ltd 低融点封着用組成物
US4696909A (en) * 1986-04-07 1987-09-29 Owens-Illinois Television Products Inc. Platinum corrosion reducing premelted oxide compositions for lead containing solder glasses
US4883777A (en) * 1988-04-07 1989-11-28 Nippon Electric Glass Company, Limited Sealing glass composition with filler containing Fe and W partially substituted for Ti in PbTiO3 filler
US5034358A (en) * 1989-05-05 1991-07-23 Kaman Sciences Corporation Ceramic material and method for producing the same
US5510300A (en) * 1992-12-16 1996-04-23 Samsung Corning Co., Ltd. Sealing glass compositions using ceramic composite filler
JPH08139230A (ja) * 1994-11-11 1996-05-31 Sumitomo Kinzoku Ceramics:Kk セラミック回路基板とその製造方法
KR970011336B1 (ko) * 1995-03-31 1997-07-09 삼성코닝 주식회사 접착용 유리조성물
JP3273773B2 (ja) * 1999-08-12 2002-04-15 イビデン株式会社 半導体製造・検査装置用セラミックヒータ、半導体製造・検査装置用静電チャックおよびウエハプローバ用チャックトップ
EP1248293A1 (en) 2000-07-25 2002-10-09 Ibiden Co., Ltd. Ceramic substrate for semiconductor manufacture/inspection apparatus, ceramic heater, electrostatic clampless holder, and substrate for wafer prober

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6146421A (ja) * 1984-08-10 1986-03-06 Mitsubishi Motors Corp エンジン

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3119661A (en) * 1959-06-18 1964-01-28 Nat Distillers Chem Corp Method for recovery of sio2 and zro2 from zircon
US3963505A (en) * 1973-11-23 1976-06-15 Technology Glass Corporation Lead-zinc-boron sealing glass compositions
US3954486A (en) * 1974-07-30 1976-05-04 Owens-Illinois, Inc. Solder glass with refractory filler
DE2554651C2 (de) * 1975-12-05 1983-07-14 Dynamit Nobel Ag, 5210 Troisdorf Verfahren zum Abtrennen radioaktiver Verunreinigungen aus Baddeleyit
US4421947A (en) * 1977-10-11 1983-12-20 James C. Kyle Polycrystalline insulating material seals between spaced members such as a terminal pin and a ferrule
JPS5510426A (en) * 1978-07-07 1980-01-24 Asahi Glass Co Ltd Sealing glass composition
JPS5591145A (en) * 1978-12-28 1980-07-10 Narumi China Corp Production of ceramic package
US4405722A (en) * 1979-01-23 1983-09-20 Asahi Glass Company Ltd. Sealing glass compositions
US4256463A (en) * 1979-03-12 1981-03-17 Teledyne Industries, Inc. Preparation of zirconium oxychloride
JPS5649861A (en) * 1979-09-29 1981-05-06 Matsushita Electric Industrial Co Ltd Capacity controller for air conditioner
JPS56114364A (en) * 1980-02-13 1981-09-08 Nippon Electric Glass Co Ltd Composite for covering semiconductor device
US4365021A (en) * 1981-07-22 1982-12-21 Owens-Illinois, Inc. Low temperature sealant glass
US4528212A (en) * 1982-07-22 1985-07-09 International Business Machines Corporation Coated ceramic substrates for mounting integrated circuits
FR2533907B1 (fr) * 1982-10-04 1985-06-28 Pechiney Ugine Kuhlmann Uran Procede de purification de solutions aqueuses uraniferes contenant du zirconium et/ou du hafnium entre autres impuretes
US4537863A (en) * 1983-08-10 1985-08-27 Nippon Electric Glass Company, Ltd. Low temperature sealing composition

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6146421A (ja) * 1984-08-10 1986-03-06 Mitsubishi Motors Corp エンジン

Also Published As

Publication number Publication date
US4621064A (en) 1986-11-04
DE3509955A1 (de) 1985-09-19
JPH0127982B2 (cg-RX-API-DMAC10.html) 1989-05-31
DE3509955C2 (cg-RX-API-DMAC10.html) 1993-05-13

Similar Documents

Publication Publication Date Title
US5336644A (en) Sealing glass compositions
US4186023A (en) Sealing glass composition
US4310357A (en) Low temperature sealing glass
JPS60204637A (ja) 低融点封着用組成物
US4710479A (en) Sealing glass composition with lead calcium titanate filler
US4537863A (en) Low temperature sealing composition
JPH0428657B2 (cg-RX-API-DMAC10.html)
JPH04288389A (ja) シーリング材料およびそれに用いられるミル添加物
JPH02267137A (ja) 封着材料
US4704370A (en) Sealing glass composition
JPS63315536A (ja) 低温封着用フリット
US4775647A (en) Sealing glass composite
US4752521A (en) Sealing glass composite
JP3172592B2 (ja) 接着又は封着用ガラス
US4818730A (en) Sealing glass composite
CA1250602A (en) Sealing glass composite
JP3519121B2 (ja) 封着用組成物
JP3125971B2 (ja) 低温封着用組成物
JP2957087B2 (ja) 低温封着用組成物
JPS59169955A (ja) 半導体装置の封着用低融点ガラス
JPS5945620B2 (ja) 低融点封着用組成物
KR910009953B1 (ko) 저융점 분말 접착유리 조성물
KR100281991B1 (ko) 복합체 필러를 사용한 저융점 접착 유리조성물
JPS5918132A (ja) 封着用硝子組成物
JPS58213682A (ja) 低温封着組成物