JPS56114364A - Composite for covering semiconductor device - Google Patents

Composite for covering semiconductor device

Info

Publication number
JPS56114364A
JPS56114364A JP1735580A JP1735580A JPS56114364A JP S56114364 A JPS56114364 A JP S56114364A JP 1735580 A JP1735580 A JP 1735580A JP 1735580 A JP1735580 A JP 1735580A JP S56114364 A JPS56114364 A JP S56114364A
Authority
JP
Japan
Prior art keywords
low melting
melting point
heat
composite
noncrystalline
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1735580A
Other languages
Japanese (ja)
Other versions
JPS6146420B2 (en
Inventor
Kazuo Hatano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Electric Glass Co Ltd
Original Assignee
Nippon Electric Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Glass Co Ltd filed Critical Nippon Electric Glass Co Ltd
Priority to JP1735580A priority Critical patent/JPS56114364A/en
Publication of JPS56114364A publication Critical patent/JPS56114364A/en
Publication of JPS6146420B2 publication Critical patent/JPS6146420B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

PURPOSE:To obtain the low melting point semiconductor covering composite superior in electrical characteristic and heat-proof impulse property by a method wherein low melting point glass and Willemite powders of noncrystalline PbO-B2O3-SiO2 system whose submitting point is at 360-500 deg.C are mixed up in a prescribed weight ration and melted by applying heat to be made slurrylike. CONSTITUTION:The low melting point glass of 40-80wt% of the noncrystalline PbO-B2O3-SiO2 whose submitting point is at more than 300 deg.C and less than 500 deg.C and the Willemite powder of 20-60wt% which is partially replaced by titani acid lead powder as much as 20 are mixed and heated at about 110 deg.C for 60min to be melted is a platinum pot. Subsequently, those are made powders passing through a 350-mesh and slurry-wise by adding demineralized water after being cooled and molded in plate-shape. With the use of the thus obtained composite as the one for covering the semiconductor the reverse leakage current is restrained under 1muA even in the withstand voltage test at 1,000V, and no abnormality appears even in the heat impulse test at 0-300 deg.C.
JP1735580A 1980-02-13 1980-02-13 Composite for covering semiconductor device Granted JPS56114364A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1735580A JPS56114364A (en) 1980-02-13 1980-02-13 Composite for covering semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1735580A JPS56114364A (en) 1980-02-13 1980-02-13 Composite for covering semiconductor device

Publications (2)

Publication Number Publication Date
JPS56114364A true JPS56114364A (en) 1981-09-08
JPS6146420B2 JPS6146420B2 (en) 1986-10-14

Family

ID=11941732

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1735580A Granted JPS56114364A (en) 1980-02-13 1980-02-13 Composite for covering semiconductor device

Country Status (1)

Country Link
JP (1) JPS56114364A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4621064A (en) * 1984-03-19 1986-11-04 Nippon Electric Glass Company, Limited Low temperature sealing composition with synthetic zircon

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0695030B2 (en) * 1988-12-09 1994-11-24 株式会社日立製作所 Electromagnetic flowmeter detector

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4621064A (en) * 1984-03-19 1986-11-04 Nippon Electric Glass Company, Limited Low temperature sealing composition with synthetic zircon

Also Published As

Publication number Publication date
JPS6146420B2 (en) 1986-10-14

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