JPS60177659A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法

Info

Publication number
JPS60177659A
JPS60177659A JP59032610A JP3261084A JPS60177659A JP S60177659 A JPS60177659 A JP S60177659A JP 59032610 A JP59032610 A JP 59032610A JP 3261084 A JP3261084 A JP 3261084A JP S60177659 A JPS60177659 A JP S60177659A
Authority
JP
Japan
Prior art keywords
temperature
dianhydride
resin
diamine
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59032610A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0122308B2 (enExample
Inventor
Michio Kobayashi
道雄 小林
Akira Toko
都甲　明
Toshiro Takeda
敏郎 竹田
Shigenori Yamaoka
重徳 山岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP59032610A priority Critical patent/JPS60177659A/ja
Publication of JPS60177659A publication Critical patent/JPS60177659A/ja
Publication of JPH0122308B2 publication Critical patent/JPH0122308B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/1064—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing sulfur
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Paints Or Removers (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
JP59032610A 1984-02-24 1984-02-24 半導体装置の製造方法 Granted JPS60177659A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59032610A JPS60177659A (ja) 1984-02-24 1984-02-24 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59032610A JPS60177659A (ja) 1984-02-24 1984-02-24 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS60177659A true JPS60177659A (ja) 1985-09-11
JPH0122308B2 JPH0122308B2 (enExample) 1989-04-26

Family

ID=12363621

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59032610A Granted JPS60177659A (ja) 1984-02-24 1984-02-24 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS60177659A (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62156132A (ja) * 1985-12-28 1987-07-11 Ube Ind Ltd ポリイミドフイルム製造用ド−プ液の調製法
JPH01131245A (ja) * 1987-09-14 1989-05-24 General Electric Co <Ge> ポリエーテルイミド及びその前駆物質
JPH04299885A (ja) * 1990-12-17 1992-10-23 E I Du Pont De Nemours & Co ベンゾフェノンテトラカルボン酸二無水物を含有するテトラポリイミドフィルム
JPH06334204A (ja) * 1993-05-21 1994-12-02 Ind Technol Res Inst 可撓性アモルファスシリコン太陽電池の製造法
JP2007190692A (ja) * 2006-01-17 2007-08-02 Nippon Steel Chem Co Ltd 配線基板用積層体
JP2017155167A (ja) * 2016-03-03 2017-09-07 日立化成デュポンマイクロシステムズ株式会社 樹脂組成物及びポリイミド樹脂膜

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62156132A (ja) * 1985-12-28 1987-07-11 Ube Ind Ltd ポリイミドフイルム製造用ド−プ液の調製法
JPH01131245A (ja) * 1987-09-14 1989-05-24 General Electric Co <Ge> ポリエーテルイミド及びその前駆物質
JPH04299885A (ja) * 1990-12-17 1992-10-23 E I Du Pont De Nemours & Co ベンゾフェノンテトラカルボン酸二無水物を含有するテトラポリイミドフィルム
JPH06334204A (ja) * 1993-05-21 1994-12-02 Ind Technol Res Inst 可撓性アモルファスシリコン太陽電池の製造法
JP2007190692A (ja) * 2006-01-17 2007-08-02 Nippon Steel Chem Co Ltd 配線基板用積層体
JP2017155167A (ja) * 2016-03-03 2017-09-07 日立化成デュポンマイクロシステムズ株式会社 樹脂組成物及びポリイミド樹脂膜

Also Published As

Publication number Publication date
JPH0122308B2 (enExample) 1989-04-26

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