JPS6210015B2 - - Google Patents

Info

Publication number
JPS6210015B2
JPS6210015B2 JP54050895A JP5089579A JPS6210015B2 JP S6210015 B2 JPS6210015 B2 JP S6210015B2 JP 54050895 A JP54050895 A JP 54050895A JP 5089579 A JP5089579 A JP 5089579A JP S6210015 B2 JPS6210015 B2 JP S6210015B2
Authority
JP
Japan
Prior art keywords
resin
film
heat
weight
resins
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54050895A
Other languages
English (en)
Japanese (ja)
Other versions
JPS55143056A (en
Inventor
Shigenori Yamaoka
Katamatsu Isozaki
Masuo Mizuno
Mitsuo Waki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP5089579A priority Critical patent/JPS55143056A/ja
Publication of JPS55143056A publication Critical patent/JPS55143056A/ja
Publication of JPS6210015B2 publication Critical patent/JPS6210015B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W74/47

Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Formation Of Insulating Films (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP5089579A 1979-04-26 1979-04-26 Manufacture of wiring structure for electronic circuit Granted JPS55143056A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5089579A JPS55143056A (en) 1979-04-26 1979-04-26 Manufacture of wiring structure for electronic circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5089579A JPS55143056A (en) 1979-04-26 1979-04-26 Manufacture of wiring structure for electronic circuit

Publications (2)

Publication Number Publication Date
JPS55143056A JPS55143056A (en) 1980-11-08
JPS6210015B2 true JPS6210015B2 (enExample) 1987-03-04

Family

ID=12871465

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5089579A Granted JPS55143056A (en) 1979-04-26 1979-04-26 Manufacture of wiring structure for electronic circuit

Country Status (1)

Country Link
JP (1) JPS55143056A (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6097648A (ja) * 1983-11-02 1985-05-31 Hitachi Ltd 半導体装置
JPS61198634A (ja) * 1985-02-27 1986-09-03 Asahi Chem Ind Co Ltd 半導体装置の製造方法
JPS62263692A (ja) * 1986-05-12 1987-11-16 ニツポン高度紙工業株式会社 耐熱性フレキシブルプリント配線板

Also Published As

Publication number Publication date
JPS55143056A (en) 1980-11-08

Similar Documents

Publication Publication Date Title
EP0133533B1 (en) Low thermal expansion resin material for a wiring insulating film.
KR100605517B1 (ko) 폴리이미드-금속 적층체 및 폴리아미드이미드-금속 적층체
JP3133976B2 (ja) 高誘電率フレキシブルポリイミドフィルムおよびその製造方法
KR101115598B1 (ko) 에폭시 수지 조성물
TWI750050B (zh) 黏結膜、其黏結膜附著層疊體及其金屬箔層疊體
TW202028329A (zh) 樹脂組成物、包含其的預浸材、包含其的層疊板、包含其的樹脂覆蓋式金屬箔
CN103540102A (zh) 用于内置绝缘膜的环氧树脂组合物及其形成的绝缘膜和有该绝缘膜的多层印刷电路板
EP0271736B1 (en) Resins of low thermal expansivity
US5133989A (en) Process for producing metal-polyimide composite article
CN108192136A (zh) 导热填料组合物、高导热绝缘复合材料及其制备方法
JP3653499B2 (ja) ポリ(イミド−ベンゾオキサゾール)コポリマー
JPS6032827A (ja) 低熱膨張樹脂材料
US5734008A (en) Polyimide film
JPH0553819B2 (enExample)
JPH0553820B2 (enExample)
JPS6210015B2 (enExample)
KR20110035620A (ko) 폴리이미드 필름
JP3650493B2 (ja) 電子部品用接着テープ
JP2000183239A (ja) 半導体装置
JPS60177659A (ja) 半導体装置の製造方法
JPH0455483A (ja) 耐熱性および絶縁性ワニス組成物およびそれを用いた被膜の形成方法
JPS60177660A (ja) 半導体装置の製造方法
JP2000086742A (ja) エポキシ樹脂組成物及び導電性ペースト
KR100625055B1 (ko) 내열성 접착테이프
JPS6210016B2 (enExample)