TWI800485B - 電磁波遮蔽材 - Google Patents

電磁波遮蔽材 Download PDF

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Publication number
TWI800485B
TWI800485B TW106122503A TW106122503A TWI800485B TW I800485 B TWI800485 B TW I800485B TW 106122503 A TW106122503 A TW 106122503A TW 106122503 A TW106122503 A TW 106122503A TW I800485 B TWI800485 B TW I800485B
Authority
TW
Taiwan
Prior art keywords
electromagnetic wave
shielding material
wave shielding
electromagnetic
wave
Prior art date
Application number
TW106122503A
Other languages
English (en)
Other versions
TW201819183A (zh
Inventor
宏
竹山早苗
櫻木喬規
平野昌由
Original Assignee
日商藤森工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商藤森工業股份有限公司 filed Critical 日商藤森工業股份有限公司
Publication of TW201819183A publication Critical patent/TW201819183A/zh
Application granted granted Critical
Publication of TWI800485B publication Critical patent/TWI800485B/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)
TW106122503A 2016-07-11 2017-07-05 電磁波遮蔽材 TWI800485B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-136743 2016-07-11
JP2016136743A JP2018010888A (ja) 2016-07-11 2016-07-11 電磁波シールド材

Publications (2)

Publication Number Publication Date
TW201819183A TW201819183A (zh) 2018-06-01
TWI800485B true TWI800485B (zh) 2023-05-01

Family

ID=60995750

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106122503A TWI800485B (zh) 2016-07-11 2017-07-05 電磁波遮蔽材

Country Status (4)

Country Link
JP (1) JP2018010888A (zh)
KR (1) KR101949143B1 (zh)
CN (1) CN107613628B (zh)
TW (1) TWI800485B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6624331B1 (ja) * 2019-08-01 2019-12-25 東洋インキＳｃホールディングス株式会社 電磁波シールドシート、および電磁波シールド性配線回路基板
CN112888288B (zh) * 2021-01-18 2022-10-28 哈尔滨工业大学 一种基于超薄掺杂金属/介质复合结构的电磁屏蔽曲面光学窗

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201309111A (zh) * 2011-04-26 2013-02-16 Fujimori Kogyo Co Ｆｐｃ用電磁波屏蔽材料
TW201322836A (zh) * 2011-11-24 2013-06-01 Tatsuta Densen Kk 遮罩膜、遮罩印刷電路板以及遮罩膜的製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005056906A (ja) * 2003-08-05 2005-03-03 Reiko Co Ltd 電磁波遮蔽性転写フイルム
JP2005068227A (ja) * 2003-08-21 2005-03-17 Suzuka Fuji Xerox Co Ltd ポリイミドフィルムおよび該ポリイミドフィルムを使用した電子写真用転写・定着部材
JP2006245160A (ja) * 2005-03-02 2006-09-14 Sharp Corp フェライトリングコア収納ケース
JP5726048B2 (ja) * 2011-11-14 2015-05-27 藤森工業株式会社 Ｆｐｃ用電磁波シールド材
WO2013099173A1 (ja) * 2011-12-26 2013-07-04 三井化学株式会社 多層成形体およびその製造方法、並びに、電磁波シールド部材および放熱性部材
JP6650660B2 (ja) * 2014-01-20 2020-02-19 東洋インキＳｃホールディングス株式会社 フレキシブルプリント配線板用電磁波シールドシート、および電磁波シールドシート付きフレキシブルプリント配線板
JP6402584B2 (ja) * 2014-10-23 2018-10-10 住友ベークライト株式会社 電磁波シールド用フィルムの製造方法
JP2017193673A (ja) * 2016-04-22 2017-10-26 パナソニックＩｐマネジメント株式会社 脱硫方法及び脱硫器

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201309111A (zh) * 2011-04-26 2013-02-16 Fujimori Kogyo Co Ｆｐｃ用電磁波屏蔽材料
TW201322836A (zh) * 2011-11-24 2013-06-01 Tatsuta Densen Kk 遮罩膜、遮罩印刷電路板以及遮罩膜的製造方法

Also Published As

Publication number Publication date
JP2018010888A (ja) 2018-01-18
CN107613628B (zh) 2021-10-01
KR101949143B1 (ko) 2019-02-18
TW201819183A (zh) 2018-06-01
CN107613628A (zh) 2018-01-19
KR20180006851A (ko) 2018-01-19

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