JPS6014456A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS6014456A
JPS6014456A JP58121644A JP12164483A JPS6014456A JP S6014456 A JPS6014456 A JP S6014456A JP 58121644 A JP58121644 A JP 58121644A JP 12164483 A JP12164483 A JP 12164483A JP S6014456 A JPS6014456 A JP S6014456A
Authority
JP
Japan
Prior art keywords
wiring
base
semiconductor device
film
wirings
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58121644A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0481331B2 (enExample
Inventor
Kanji Otsuka
寛治 大塚
Takayuki Okinaga
隆幸 沖永
Toshiro Kuroda
俊郎 黒田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Narumi China Corp
Hitachi Microcomputer System Ltd
Hitachi Ltd
Original Assignee
Narumi China Corp
Hitachi Ltd
Hitachi Microcomputer Engineering Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Narumi China Corp, Hitachi Ltd, Hitachi Microcomputer Engineering Ltd filed Critical Narumi China Corp
Priority to JP58121644A priority Critical patent/JPS6014456A/ja
Publication of JPS6014456A publication Critical patent/JPS6014456A/ja
Publication of JPH0481331B2 publication Critical patent/JPH0481331B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W90/701—
    • H10W72/07551—
    • H10W72/50—
    • H10W72/5363—
    • H10W72/5524—
    • H10W72/884—
    • H10W90/734—
    • H10W90/754—

Landscapes

  • Die Bonding (AREA)
JP58121644A 1983-07-06 1983-07-06 半導体装置 Granted JPS6014456A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58121644A JPS6014456A (ja) 1983-07-06 1983-07-06 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58121644A JPS6014456A (ja) 1983-07-06 1983-07-06 半導体装置

Publications (2)

Publication Number Publication Date
JPS6014456A true JPS6014456A (ja) 1985-01-25
JPH0481331B2 JPH0481331B2 (enExample) 1992-12-22

Family

ID=14816356

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58121644A Granted JPS6014456A (ja) 1983-07-06 1983-07-06 半導体装置

Country Status (1)

Country Link
JP (1) JPS6014456A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101652482B1 (ko) * 2015-05-12 2016-08-30 메디컬아이피 주식회사 투명 입체물 제작방법과 이를 통해 생성된 투명 입체물

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5165568A (enExample) * 1974-12-04 1976-06-07 Hitachi Ltd
JPS558057A (en) * 1978-07-04 1980-01-21 Hitachi Ltd Semiconductor
JPS56155555A (en) * 1980-05-06 1981-12-01 Seiko Epson Corp Semiconductor device
JPS5795952U (enExample) * 1980-12-03 1982-06-12
JPS5848944A (ja) * 1981-09-18 1983-03-23 Hitachi Ltd 気密封止方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5165568A (enExample) * 1974-12-04 1976-06-07 Hitachi Ltd
JPS558057A (en) * 1978-07-04 1980-01-21 Hitachi Ltd Semiconductor
JPS56155555A (en) * 1980-05-06 1981-12-01 Seiko Epson Corp Semiconductor device
JPS5795952U (enExample) * 1980-12-03 1982-06-12
JPS5848944A (ja) * 1981-09-18 1983-03-23 Hitachi Ltd 気密封止方法

Also Published As

Publication number Publication date
JPH0481331B2 (enExample) 1992-12-22

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