JPH0481331B2 - - Google Patents

Info

Publication number
JPH0481331B2
JPH0481331B2 JP58121644A JP12164483A JPH0481331B2 JP H0481331 B2 JPH0481331 B2 JP H0481331B2 JP 58121644 A JP58121644 A JP 58121644A JP 12164483 A JP12164483 A JP 12164483A JP H0481331 B2 JPH0481331 B2 JP H0481331B2
Authority
JP
Japan
Prior art keywords
pellet
base
wiring
bonding
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58121644A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6014456A (ja
Inventor
Kanji Ootsuka
Takayuki Okinaga
Toshiro Kuroda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Microcomputer System Ltd
Hitachi Ltd
Original Assignee
Hitachi Microcomputer System Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Microcomputer System Ltd, Hitachi Ltd filed Critical Hitachi Microcomputer System Ltd
Priority to JP58121644A priority Critical patent/JPS6014456A/ja
Publication of JPS6014456A publication Critical patent/JPS6014456A/ja
Publication of JPH0481331B2 publication Critical patent/JPH0481331B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W90/701—
    • H10W72/07551—
    • H10W72/50—
    • H10W72/5363—
    • H10W72/5524—
    • H10W72/884—
    • H10W90/734—
    • H10W90/754—

Landscapes

  • Die Bonding (AREA)
JP58121644A 1983-07-06 1983-07-06 半導体装置 Granted JPS6014456A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58121644A JPS6014456A (ja) 1983-07-06 1983-07-06 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58121644A JPS6014456A (ja) 1983-07-06 1983-07-06 半導体装置

Publications (2)

Publication Number Publication Date
JPS6014456A JPS6014456A (ja) 1985-01-25
JPH0481331B2 true JPH0481331B2 (enExample) 1992-12-22

Family

ID=14816356

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58121644A Granted JPS6014456A (ja) 1983-07-06 1983-07-06 半導体装置

Country Status (1)

Country Link
JP (1) JPS6014456A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101652482B1 (ko) * 2015-05-12 2016-08-30 메디컬아이피 주식회사 투명 입체물 제작방법과 이를 통해 생성된 투명 입체물

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5165568A (enExample) * 1974-12-04 1976-06-07 Hitachi Ltd
JPS558057A (en) * 1978-07-04 1980-01-21 Hitachi Ltd Semiconductor
JPS56155555A (en) * 1980-05-06 1981-12-01 Seiko Epson Corp Semiconductor device
JPS5795952U (enExample) * 1980-12-03 1982-06-12
JPS5848944A (ja) * 1981-09-18 1983-03-23 Hitachi Ltd 気密封止方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101652482B1 (ko) * 2015-05-12 2016-08-30 메디컬아이피 주식회사 투명 입체물 제작방법과 이를 통해 생성된 투명 입체물

Also Published As

Publication number Publication date
JPS6014456A (ja) 1985-01-25

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