JPS60124616A - 半導電層用混和物 - Google Patents
半導電層用混和物Info
- Publication number
- JPS60124616A JPS60124616A JP23343683A JP23343683A JPS60124616A JP S60124616 A JPS60124616 A JP S60124616A JP 23343683 A JP23343683 A JP 23343683A JP 23343683 A JP23343683 A JP 23343683A JP S60124616 A JPS60124616 A JP S60124616A
- Authority
- JP
- Japan
- Prior art keywords
- mixture
- semiconducting layer
- base polymer
- crosslinking
- polyamide resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Conductive Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23343683A JPS60124616A (ja) | 1983-12-10 | 1983-12-10 | 半導電層用混和物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23343683A JPS60124616A (ja) | 1983-12-10 | 1983-12-10 | 半導電層用混和物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60124616A true JPS60124616A (ja) | 1985-07-03 |
| JPH0236147B2 JPH0236147B2 (cs) | 1990-08-15 |
Family
ID=16955005
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23343683A Granted JPS60124616A (ja) | 1983-12-10 | 1983-12-10 | 半導電層用混和物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60124616A (cs) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3476898A1 (en) * | 2017-10-27 | 2019-05-01 | Henkel AG & Co. KGaA | Thermoplastic composition for 3d printing |
-
1983
- 1983-12-10 JP JP23343683A patent/JPS60124616A/ja active Granted
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3476898A1 (en) * | 2017-10-27 | 2019-05-01 | Henkel AG & Co. KGaA | Thermoplastic composition for 3d printing |
| WO2019081143A1 (en) * | 2017-10-27 | 2019-05-02 | Henkel Ag & Co. Kgaa | THERMOPLASTIC COMPOSITION FOR 3D PRINTING |
| CN111247209A (zh) * | 2017-10-27 | 2020-06-05 | 汉高股份有限及两合公司 | 用于3d印刷的热塑性组合物 |
| US20200247995A1 (en) * | 2017-10-27 | 2020-08-06 | Henkel Ag & Co. Kgaa | Thermoplastic Composition for 3D Printing |
| CN111247209B (zh) * | 2017-10-27 | 2023-10-31 | 汉高股份有限及两合公司 | 用于3d印刷的热塑性组合物 |
| US11884819B2 (en) | 2017-10-27 | 2024-01-30 | Henkel Ag & Co. Kgaa | Thermoplastic composition for 3D printing |
| US20240034880A1 (en) * | 2017-10-27 | 2024-02-01 | Henkel Ag & Co. Kgaa | Thermoplastic Composition for 3D Printing |
| US12365798B2 (en) * | 2017-10-27 | 2025-07-22 | Henkel Ag & Co. Kgaa | Thermoplastic composition for 3D printing |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0236147B2 (cs) | 1990-08-15 |
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