JPS60121740A - 多層配線構造体 - Google Patents

多層配線構造体

Info

Publication number
JPS60121740A
JPS60121740A JP2851884A JP2851884A JPS60121740A JP S60121740 A JPS60121740 A JP S60121740A JP 2851884 A JP2851884 A JP 2851884A JP 2851884 A JP2851884 A JP 2851884A JP S60121740 A JPS60121740 A JP S60121740A
Authority
JP
Japan
Prior art keywords
layer
wiring structure
polyamic acid
multilayer wiring
polyimide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2851884A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6331939B2 (enExample
Inventor
Kazunari Takemoto
一成 竹元
Fumio Kataoka
文雄 片岡
Fusaji Shoji
房次 庄子
Mitsuo Nakatani
中谷　光雄
Ataru Yokono
中 横野
Tokio Isogai
磯貝　時男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP2851884A priority Critical patent/JPS60121740A/ja
Publication of JPS60121740A publication Critical patent/JPS60121740A/ja
Publication of JPS6331939B2 publication Critical patent/JPS6331939B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2851884A 1984-02-20 1984-02-20 多層配線構造体 Granted JPS60121740A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2851884A JPS60121740A (ja) 1984-02-20 1984-02-20 多層配線構造体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2851884A JPS60121740A (ja) 1984-02-20 1984-02-20 多層配線構造体

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP9233581A Division JPS57208158A (en) 1981-06-17 1981-06-17 Manufacture of multilayer wiring structure

Publications (2)

Publication Number Publication Date
JPS60121740A true JPS60121740A (ja) 1985-06-29
JPS6331939B2 JPS6331939B2 (enExample) 1988-06-27

Family

ID=12250901

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2851884A Granted JPS60121740A (ja) 1984-02-20 1984-02-20 多層配線構造体

Country Status (1)

Country Link
JP (1) JPS60121740A (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5393697A (en) * 1994-05-06 1995-02-28 Industrial Technology Research Institute Composite bump structure and methods of fabrication
US8018057B2 (en) * 2007-02-21 2011-09-13 Seiko Epson Corporation Semiconductor device with resin layers and wirings and method for manufacturing the same
WO2017146153A1 (ja) * 2016-02-26 2017-08-31 富士フイルム株式会社 積層体の製造方法および半導体デバイスの製造方法
WO2018025738A1 (ja) * 2016-08-01 2018-02-08 富士フイルム株式会社 感光性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、積層体の製造方法および半導体デバイス
WO2018038002A1 (ja) * 2016-08-25 2018-03-01 富士フイルム株式会社 積層体の製造方法および電子デバイスの製造方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NO339852B1 (no) * 2014-11-26 2017-02-06 Esea As Anordning og fremgangsmåte for håndtering av partikkelformet materiale

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS559538A (en) * 1978-07-07 1980-01-23 Asahi Chem Ind Co Ltd Heat resistant photoresist composition

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS559538A (en) * 1978-07-07 1980-01-23 Asahi Chem Ind Co Ltd Heat resistant photoresist composition

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5393697A (en) * 1994-05-06 1995-02-28 Industrial Technology Research Institute Composite bump structure and methods of fabrication
US8018057B2 (en) * 2007-02-21 2011-09-13 Seiko Epson Corporation Semiconductor device with resin layers and wirings and method for manufacturing the same
WO2017146153A1 (ja) * 2016-02-26 2017-08-31 富士フイルム株式会社 積層体の製造方法および半導体デバイスの製造方法
JPWO2017146153A1 (ja) * 2016-02-26 2019-01-17 富士フイルム株式会社 積層体の製造方法および半導体デバイスの製造方法
WO2018025738A1 (ja) * 2016-08-01 2018-02-08 富士フイルム株式会社 感光性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、積層体の製造方法および半導体デバイス
JPWO2018025738A1 (ja) * 2016-08-01 2019-05-30 富士フイルム株式会社 感光性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、積層体の製造方法および半導体デバイス
WO2018038002A1 (ja) * 2016-08-25 2018-03-01 富士フイルム株式会社 積層体の製造方法および電子デバイスの製造方法
KR20190027881A (ko) * 2016-08-25 2019-03-15 후지필름 가부시키가이샤 적층체의 제조 방법 및 전자 디바이스의 제조 방법
JPWO2018038002A1 (ja) * 2016-08-25 2019-04-11 富士フイルム株式会社 積層体の製造方法および電子デバイスの製造方法

Also Published As

Publication number Publication date
JPS6331939B2 (enExample) 1988-06-27

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