JPS559538A - Heat resistant photoresist composition - Google Patents

Heat resistant photoresist composition

Info

Publication number
JPS559538A
JPS559538A JP8212078A JP8212078A JPS559538A JP S559538 A JPS559538 A JP S559538A JP 8212078 A JP8212078 A JP 8212078A JP 8212078 A JP8212078 A JP 8212078A JP S559538 A JPS559538 A JP S559538A
Authority
JP
Japan
Prior art keywords
compounds
aromatic
meth
aromatic polyamide
polyamide acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8212078A
Other languages
Japanese (ja)
Other versions
JPH0253779B2 (en
Inventor
Kaoru Omura
Takeo Kimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Chemical Industry Co Ltd
Original Assignee
Asahi Chemical Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Chemical Industry Co Ltd filed Critical Asahi Chemical Industry Co Ltd
Priority to JP8212078A priority Critical patent/JPS559538A/en
Publication of JPS559538A publication Critical patent/JPS559538A/en
Publication of JPH0253779B2 publication Critical patent/JPH0253779B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0387—Polyamides or polyimides

Abstract

PURPOSE:To enhance insulation characteristics, and resistance to chemicals and heat, and to form high sensitivity photoresist having practical characteristics, by introducing acrylate groups in an aromatic polyamide acid. CONSTITUTION:An aromatic polyamide acid, such as products resulting from an aromatic diamide compound and an aromatic tetracarboxylic acid derivative and (meth)acryloyl chloride or glycidyl (meth)acrylate in an amount of 0.001 to 10 moles per mole of monomer unit are reacted in a polar organic solvent below 150 deg.C. Photopolymerization initiator(s) selected from carbonyl compounds, peroxides, azo compounds, S compounds, and halogen compounds are added preferably by 0.1 to 10 wt.% based on the polymer to a solution prepared by redissolving the above reaction product after precipitation separation in order to remove this solvent or impurities.
JP8212078A 1978-07-07 1978-07-07 Heat resistant photoresist composition Granted JPS559538A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8212078A JPS559538A (en) 1978-07-07 1978-07-07 Heat resistant photoresist composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8212078A JPS559538A (en) 1978-07-07 1978-07-07 Heat resistant photoresist composition

Publications (2)

Publication Number Publication Date
JPS559538A true JPS559538A (en) 1980-01-23
JPH0253779B2 JPH0253779B2 (en) 1990-11-19

Family

ID=13765545

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8212078A Granted JPS559538A (en) 1978-07-07 1978-07-07 Heat resistant photoresist composition

Country Status (1)

Country Link
JP (1) JPS559538A (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60121740A (en) * 1984-02-20 1985-06-29 Hitachi Ltd Multilayered wiring structure
JPS63206740A (en) * 1987-02-24 1988-08-26 Mitsubishi Gas Chem Co Inc Photosensitive polymer composition
JPS63317553A (en) * 1987-06-22 1988-12-26 Mitsubishi Gas Chem Co Inc Photosensitive polyamide acid composition
JPS63318549A (en) * 1987-06-22 1988-12-27 Hitachi Ltd Heatresistant photosensitive polymer composition
JPH03296758A (en) * 1990-04-17 1991-12-27 Sumitomo Bakelite Co Ltd Production of photosensitive resin composition
JPH0470661A (en) * 1990-07-06 1992-03-05 Sumitomo Bakelite Co Ltd Photosensitive resin composition
JPH0477741A (en) * 1990-07-20 1992-03-11 Sumitomo Bakelite Co Ltd Photosensitive resin composition
JPH04120543A (en) * 1990-09-12 1992-04-21 Sumitomo Bakelite Co Ltd Photosensitive resin composition
JPH04130323A (en) * 1990-09-21 1992-05-01 Sumitomo Bakelite Co Ltd Photosensitive resin composition
US5385808A (en) * 1989-11-30 1995-01-31 Sumitomo Bakelite Company Limited Photosensitive resin composition and semiconductor apparatus using it
EP0702998A1 (en) 1994-09-22 1996-03-27 Hüls Aktiengesellschaft Process for preparing keto compounds

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60121740A (en) * 1984-02-20 1985-06-29 Hitachi Ltd Multilayered wiring structure
JPS6331939B2 (en) * 1984-02-20 1988-06-27 Hitachi Ltd
JPS63206740A (en) * 1987-02-24 1988-08-26 Mitsubishi Gas Chem Co Inc Photosensitive polymer composition
JPS63317553A (en) * 1987-06-22 1988-12-26 Mitsubishi Gas Chem Co Inc Photosensitive polyamide acid composition
JPS63318549A (en) * 1987-06-22 1988-12-27 Hitachi Ltd Heatresistant photosensitive polymer composition
US5385808A (en) * 1989-11-30 1995-01-31 Sumitomo Bakelite Company Limited Photosensitive resin composition and semiconductor apparatus using it
JPH03296758A (en) * 1990-04-17 1991-12-27 Sumitomo Bakelite Co Ltd Production of photosensitive resin composition
JPH0470661A (en) * 1990-07-06 1992-03-05 Sumitomo Bakelite Co Ltd Photosensitive resin composition
JPH0477741A (en) * 1990-07-20 1992-03-11 Sumitomo Bakelite Co Ltd Photosensitive resin composition
JPH04120543A (en) * 1990-09-12 1992-04-21 Sumitomo Bakelite Co Ltd Photosensitive resin composition
JPH04130323A (en) * 1990-09-21 1992-05-01 Sumitomo Bakelite Co Ltd Photosensitive resin composition
EP0702998A1 (en) 1994-09-22 1996-03-27 Hüls Aktiengesellschaft Process for preparing keto compounds

Also Published As

Publication number Publication date
JPH0253779B2 (en) 1990-11-19

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