JPS60118781A - フレキシブル印刷回路基板用接着剤組成物 - Google Patents
フレキシブル印刷回路基板用接着剤組成物Info
- Publication number
- JPS60118781A JPS60118781A JP22541983A JP22541983A JPS60118781A JP S60118781 A JPS60118781 A JP S60118781A JP 22541983 A JP22541983 A JP 22541983A JP 22541983 A JP22541983 A JP 22541983A JP S60118781 A JPS60118781 A JP S60118781A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- parts
- weight
- adhesive composition
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22541983A JPS60118781A (ja) | 1983-12-01 | 1983-12-01 | フレキシブル印刷回路基板用接着剤組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22541983A JPS60118781A (ja) | 1983-12-01 | 1983-12-01 | フレキシブル印刷回路基板用接着剤組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60118781A true JPS60118781A (ja) | 1985-06-26 |
| JPS6359434B2 JPS6359434B2 (enrdf_load_stackoverflow) | 1988-11-18 |
Family
ID=16829073
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22541983A Granted JPS60118781A (ja) | 1983-12-01 | 1983-12-01 | フレキシブル印刷回路基板用接着剤組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60118781A (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62153373A (ja) * | 1985-12-27 | 1987-07-08 | Mitsui Toatsu Chem Inc | フレキシブル印刷回路基板用難燃性接着剤組成物 |
| JPS62153371A (ja) * | 1985-12-27 | 1987-07-08 | Mitsui Toatsu Chem Inc | フレキシブル印刷回路基板用接着剤組成物 |
| US5464494A (en) * | 1991-11-15 | 1995-11-07 | Henkel Kommanditgesellschaft Auf Aktien | Dispersion-based heat-sealable coating |
-
1983
- 1983-12-01 JP JP22541983A patent/JPS60118781A/ja active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62153373A (ja) * | 1985-12-27 | 1987-07-08 | Mitsui Toatsu Chem Inc | フレキシブル印刷回路基板用難燃性接着剤組成物 |
| JPS62153371A (ja) * | 1985-12-27 | 1987-07-08 | Mitsui Toatsu Chem Inc | フレキシブル印刷回路基板用接着剤組成物 |
| US5464494A (en) * | 1991-11-15 | 1995-11-07 | Henkel Kommanditgesellschaft Auf Aktien | Dispersion-based heat-sealable coating |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6359434B2 (enrdf_load_stackoverflow) | 1988-11-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0453911B2 (enrdf_load_stackoverflow) | ||
| TWI417357B (zh) | 粘接片用樹脂組成物及利用此組成物之撓性印刷電路板用之粘接片 | |
| JP2000109776A (ja) | 難燃性接着剤組成物および積層体 | |
| JPS61204288A (ja) | フレキシブル印刷回路基板用接着剤組成物 | |
| JPS60118781A (ja) | フレキシブル印刷回路基板用接着剤組成物 | |
| JPS61261307A (ja) | アクリル系共重合体組成物 | |
| JP2545419B2 (ja) | フレキシブル印刷回路基板用接着剤組成物 | |
| JP3125582B2 (ja) | 金属箔張り積層板の製造法 | |
| JPS6336639B2 (enrdf_load_stackoverflow) | ||
| JPS62153373A (ja) | フレキシブル印刷回路基板用難燃性接着剤組成物 | |
| JP5348867B2 (ja) | 粘接着剤および粘接着シート | |
| JP2722402B2 (ja) | フレキシブル印刷回路基板用の接着剤組成物 | |
| JPH0657826B2 (ja) | フレキシブル印刷回路基板用接着剤組成物 | |
| JP2001513115A (ja) | 熱で活性化される硬化成分を有するポリアミドを基盤とするラミネート、カバーレイ、ボンド・プライ接着剤 | |
| JPS629628B2 (enrdf_load_stackoverflow) | ||
| JP2000218734A (ja) | 金属箔張積層板の製造方法 | |
| JP2007297599A (ja) | 硬化性樹脂組成物、樹脂含浸基材、プリプレグ、基板、接着層付金属箔及びプリント配線板 | |
| JP2644233B2 (ja) | フレキシブル印刷回路基板用難燃性接着剤組成物 | |
| JPH0328285A (ja) | 難燃性カバーレイフィルム | |
| JP4370926B2 (ja) | 薄葉配線板材料とその製造方法 | |
| JP3823649B2 (ja) | アミド基含有有機繊維基材を用いたプリプレグ、積層板ならびにプリント配線板 | |
| JPH04199694A (ja) | フレキシブル印刷配線用基板 | |
| JPH10330713A (ja) | 金属箔用接着剤組成物及びそれを用いた金属箔張り積層板 | |
| JPH0250148B2 (enrdf_load_stackoverflow) | ||
| JP2991484B2 (ja) | フレキシブル印刷配線用基板 |