JPS6011644Y2 - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS6011644Y2
JPS6011644Y2 JP1978182299U JP18229978U JPS6011644Y2 JP S6011644 Y2 JPS6011644 Y2 JP S6011644Y2 JP 1978182299 U JP1978182299 U JP 1978182299U JP 18229978 U JP18229978 U JP 18229978U JP S6011644 Y2 JPS6011644 Y2 JP S6011644Y2
Authority
JP
Japan
Prior art keywords
solder
frame
cap
package
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1978182299U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5599152U (enExample
Inventor
隆 原口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP1978182299U priority Critical patent/JPS6011644Y2/ja
Publication of JPS5599152U publication Critical patent/JPS5599152U/ja
Application granted granted Critical
Publication of JPS6011644Y2 publication Critical patent/JPS6011644Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP1978182299U 1978-12-28 1978-12-28 半導体装置 Expired JPS6011644Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1978182299U JPS6011644Y2 (ja) 1978-12-28 1978-12-28 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1978182299U JPS6011644Y2 (ja) 1978-12-28 1978-12-28 半導体装置

Publications (2)

Publication Number Publication Date
JPS5599152U JPS5599152U (enExample) 1980-07-10
JPS6011644Y2 true JPS6011644Y2 (ja) 1985-04-17

Family

ID=29193981

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1978182299U Expired JPS6011644Y2 (ja) 1978-12-28 1978-12-28 半導体装置

Country Status (1)

Country Link
JP (1) JPS6011644Y2 (enExample)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3823468A (en) * 1972-05-26 1974-07-16 N Hascoe Method of fabricating an hermetically sealed container
JPS51123065A (en) * 1975-04-21 1976-10-27 Hitachi Ltd Semiconductor device

Also Published As

Publication number Publication date
JPS5599152U (enExample) 1980-07-10

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