JPS6218054Y2 - - Google Patents
Info
- Publication number
- JPS6218054Y2 JPS6218054Y2 JP1981109748U JP10974881U JPS6218054Y2 JP S6218054 Y2 JPS6218054 Y2 JP S6218054Y2 JP 1981109748 U JP1981109748 U JP 1981109748U JP 10974881 U JP10974881 U JP 10974881U JP S6218054 Y2 JPS6218054 Y2 JP S6218054Y2
- Authority
- JP
- Japan
- Prior art keywords
- leads
- resin
- heat sink
- lead
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981109748U JPS5815360U (ja) | 1981-07-22 | 1981-07-22 | 樹脂封止型半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981109748U JPS5815360U (ja) | 1981-07-22 | 1981-07-22 | 樹脂封止型半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5815360U JPS5815360U (ja) | 1983-01-31 |
| JPS6218054Y2 true JPS6218054Y2 (enExample) | 1987-05-09 |
Family
ID=29904116
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1981109748U Granted JPS5815360U (ja) | 1981-07-22 | 1981-07-22 | 樹脂封止型半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5815360U (enExample) |
-
1981
- 1981-07-22 JP JP1981109748U patent/JPS5815360U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5815360U (ja) | 1983-01-31 |
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