JPS6010759A - リードフレームの製造方法 - Google Patents

リードフレームの製造方法

Info

Publication number
JPS6010759A
JPS6010759A JP58119349A JP11934983A JPS6010759A JP S6010759 A JPS6010759 A JP S6010759A JP 58119349 A JP58119349 A JP 58119349A JP 11934983 A JP11934983 A JP 11934983A JP S6010759 A JPS6010759 A JP S6010759A
Authority
JP
Japan
Prior art keywords
internal
lead
leads
bed
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58119349A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0458695B2 (cg-RX-API-DMAC7.html
Inventor
Kazuhide Sato
和秀 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP58119349A priority Critical patent/JPS6010759A/ja
Publication of JPS6010759A publication Critical patent/JPS6010759A/ja
Publication of JPH0458695B2 publication Critical patent/JPH0458695B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP58119349A 1983-06-30 1983-06-30 リードフレームの製造方法 Granted JPS6010759A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58119349A JPS6010759A (ja) 1983-06-30 1983-06-30 リードフレームの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58119349A JPS6010759A (ja) 1983-06-30 1983-06-30 リードフレームの製造方法

Publications (2)

Publication Number Publication Date
JPS6010759A true JPS6010759A (ja) 1985-01-19
JPH0458695B2 JPH0458695B2 (cg-RX-API-DMAC7.html) 1992-09-18

Family

ID=14759286

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58119349A Granted JPS6010759A (ja) 1983-06-30 1983-06-30 リードフレームの製造方法

Country Status (1)

Country Link
JP (1) JPS6010759A (cg-RX-API-DMAC7.html)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0216759A (ja) * 1988-07-05 1990-01-19 Hitachi Cable Ltd 半導体用リードフレームの製造方法
JPH02199265A (ja) * 1989-01-26 1990-08-07 Mazda Motor Corp エンジンの吸気構造
JPH0521133U (ja) * 1991-09-02 1993-03-19 日産自動車株式会社 エンジンの負圧供給装置
US5720189A (en) * 1995-07-27 1998-02-24 Daewoo Electronics Co., Ltd. Pulsator assembly for a washing machine

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5650420A (en) * 1979-10-02 1981-05-07 Fuji Heavy Ind Ltd Operation device of speed change gear for car

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5650420A (en) * 1979-10-02 1981-05-07 Fuji Heavy Ind Ltd Operation device of speed change gear for car

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0216759A (ja) * 1988-07-05 1990-01-19 Hitachi Cable Ltd 半導体用リードフレームの製造方法
JPH02199265A (ja) * 1989-01-26 1990-08-07 Mazda Motor Corp エンジンの吸気構造
JPH0521133U (ja) * 1991-09-02 1993-03-19 日産自動車株式会社 エンジンの負圧供給装置
US5720189A (en) * 1995-07-27 1998-02-24 Daewoo Electronics Co., Ltd. Pulsator assembly for a washing machine

Also Published As

Publication number Publication date
JPH0458695B2 (cg-RX-API-DMAC7.html) 1992-09-18

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