JPS6010744A - 半導体ウエ−ハ試験方法 - Google Patents

半導体ウエ−ハ試験方法

Info

Publication number
JPS6010744A
JPS6010744A JP58119598A JP11959883A JPS6010744A JP S6010744 A JPS6010744 A JP S6010744A JP 58119598 A JP58119598 A JP 58119598A JP 11959883 A JP11959883 A JP 11959883A JP S6010744 A JPS6010744 A JP S6010744A
Authority
JP
Japan
Prior art keywords
wafer
elements
defective
semiconductor
boundary line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58119598A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6321346B2 (enExample
Inventor
Hidenobu Yamaguchi
英伸 山口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP58119598A priority Critical patent/JPS6010744A/ja
Publication of JPS6010744A publication Critical patent/JPS6010744A/ja
Publication of JPS6321346B2 publication Critical patent/JPS6321346B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP58119598A 1983-06-30 1983-06-30 半導体ウエ−ハ試験方法 Granted JPS6010744A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58119598A JPS6010744A (ja) 1983-06-30 1983-06-30 半導体ウエ−ハ試験方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58119598A JPS6010744A (ja) 1983-06-30 1983-06-30 半導体ウエ−ハ試験方法

Publications (2)

Publication Number Publication Date
JPS6010744A true JPS6010744A (ja) 1985-01-19
JPS6321346B2 JPS6321346B2 (enExample) 1988-05-06

Family

ID=14765349

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58119598A Granted JPS6010744A (ja) 1983-06-30 1983-06-30 半導体ウエ−ハ試験方法

Country Status (1)

Country Link
JP (1) JPS6010744A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6342137A (ja) * 1986-08-07 1988-02-23 Tokyo Electron Ltd プロ−ブ装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6342137A (ja) * 1986-08-07 1988-02-23 Tokyo Electron Ltd プロ−ブ装置

Also Published As

Publication number Publication date
JPS6321346B2 (enExample) 1988-05-06

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