JPH0370903B2 - - Google Patents
Info
- Publication number
- JPH0370903B2 JPH0370903B2 JP59221199A JP22119984A JPH0370903B2 JP H0370903 B2 JPH0370903 B2 JP H0370903B2 JP 59221199 A JP59221199 A JP 59221199A JP 22119984 A JP22119984 A JP 22119984A JP H0370903 B2 JPH0370903 B2 JP H0370903B2
- Authority
- JP
- Japan
- Prior art keywords
- inspection
- wafer
- inspection item
- element position
- defective
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H10P74/00—
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59221199A JPS61100941A (ja) | 1984-10-23 | 1984-10-23 | 半導体素子の検査データ分析装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59221199A JPS61100941A (ja) | 1984-10-23 | 1984-10-23 | 半導体素子の検査データ分析装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61100941A JPS61100941A (ja) | 1986-05-19 |
| JPH0370903B2 true JPH0370903B2 (enExample) | 1991-11-11 |
Family
ID=16763020
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59221199A Granted JPS61100941A (ja) | 1984-10-23 | 1984-10-23 | 半導体素子の検査データ分析装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61100941A (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0814601B2 (ja) * | 1987-12-25 | 1996-02-14 | 東京エレクトロン株式会社 | テープキャリヤの検査装置 |
| US5240866A (en) * | 1992-02-03 | 1993-08-31 | At&T Bell Laboratories | Method for characterizing failed circuits on semiconductor wafers |
| KR100499163B1 (ko) * | 1997-12-11 | 2005-09-30 | 삼성전자주식회사 | 웨이퍼 디펙트 분류 방법 |
| JPH11243041A (ja) * | 1998-02-26 | 1999-09-07 | Mitsubishi Electric Corp | 品質管理システムおよび記録媒体 |
| CN107037345B (zh) * | 2016-02-02 | 2019-09-17 | 上海和辉光电有限公司 | 晶圆测试时自我检测的方法及其晶圆测试制具 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53104168A (en) * | 1977-02-23 | 1978-09-11 | Hitachi Ltd | Semiconductor pellet bonding method |
| JPS58165337A (ja) * | 1982-03-26 | 1983-09-30 | Hitachi Ltd | 半導体製造プラントにおける不良解析方法 |
-
1984
- 1984-10-23 JP JP59221199A patent/JPS61100941A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61100941A (ja) | 1986-05-19 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |