JPS5976891A - 金合金の製造方法 - Google Patents

金合金の製造方法

Info

Publication number
JPS5976891A
JPS5976891A JP18556882A JP18556882A JPS5976891A JP S5976891 A JPS5976891 A JP S5976891A JP 18556882 A JP18556882 A JP 18556882A JP 18556882 A JP18556882 A JP 18556882A JP S5976891 A JPS5976891 A JP S5976891A
Authority
JP
Japan
Prior art keywords
gold
silver
alloy
copper
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18556882A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0470394B2 (en, 2012
Inventor
Eiji Togawa
戸川　栄司
Mitsutaka Nishikawa
西川　光貴
Masaki Kasai
笠井　昌己
Shigeo Toda
茂生 戸田
Yoshiyuki Miyasaka
宮坂　善之
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HAMASAWA KOGYO KK
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
HAMASAWA KOGYO KK
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HAMASAWA KOGYO KK, Seiko Epson Corp, Suwa Seikosha KK filed Critical HAMASAWA KOGYO KK
Priority to JP18556882A priority Critical patent/JPS5976891A/ja
Publication of JPS5976891A publication Critical patent/JPS5976891A/ja
Publication of JPH0470394B2 publication Critical patent/JPH0470394B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
JP18556882A 1982-10-22 1982-10-22 金合金の製造方法 Granted JPS5976891A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18556882A JPS5976891A (ja) 1982-10-22 1982-10-22 金合金の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18556882A JPS5976891A (ja) 1982-10-22 1982-10-22 金合金の製造方法

Publications (2)

Publication Number Publication Date
JPS5976891A true JPS5976891A (ja) 1984-05-02
JPH0470394B2 JPH0470394B2 (en, 2012) 1992-11-10

Family

ID=16173079

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18556882A Granted JPS5976891A (ja) 1982-10-22 1982-10-22 金合金の製造方法

Country Status (1)

Country Link
JP (1) JPS5976891A (en, 2012)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0382788A (ja) * 1989-08-28 1991-04-08 Eagle Ind Co Ltd 多層電析層の形成方法
JP2006348383A (ja) * 2005-06-02 2006-12-28 Rohm & Haas Electronic Materials Llc 改善された金合金電解質
CN102896832A (zh) * 2011-07-28 2013-01-30 中国科学院金属研究所 一种功率模块金属化陶瓷基板及金属化方法
CN109396364A (zh) * 2018-12-11 2019-03-01 西安诺博尔稀贵金属材料有限公司 一种金银铜合金铸锭的制备方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0382788A (ja) * 1989-08-28 1991-04-08 Eagle Ind Co Ltd 多層電析層の形成方法
JP2006348383A (ja) * 2005-06-02 2006-12-28 Rohm & Haas Electronic Materials Llc 改善された金合金電解質
CN102896832A (zh) * 2011-07-28 2013-01-30 中国科学院金属研究所 一种功率模块金属化陶瓷基板及金属化方法
CN109396364A (zh) * 2018-12-11 2019-03-01 西安诺博尔稀贵金属材料有限公司 一种金银铜合金铸锭的制备方法

Also Published As

Publication number Publication date
JPH0470394B2 (en, 2012) 1992-11-10

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