JPS5972754A - リ−ドフレ−ムの製造方法 - Google Patents

リ−ドフレ−ムの製造方法

Info

Publication number
JPS5972754A
JPS5972754A JP57184180A JP18418082A JPS5972754A JP S5972754 A JPS5972754 A JP S5972754A JP 57184180 A JP57184180 A JP 57184180A JP 18418082 A JP18418082 A JP 18418082A JP S5972754 A JPS5972754 A JP S5972754A
Authority
JP
Japan
Prior art keywords
lead frame
internal
linking piece
tips
sizes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57184180A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6244422B2 (https=
Inventor
Yasuharu Nakamura
中村　安治
Kenji Iinuma
飯沼　健司
Yoshio Konuma
小沼　良雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP57184180A priority Critical patent/JPS5972754A/ja
Publication of JPS5972754A publication Critical patent/JPS5972754A/ja
Publication of JPS6244422B2 publication Critical patent/JPS6244422B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP57184180A 1982-10-19 1982-10-19 リ−ドフレ−ムの製造方法 Granted JPS5972754A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57184180A JPS5972754A (ja) 1982-10-19 1982-10-19 リ−ドフレ−ムの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57184180A JPS5972754A (ja) 1982-10-19 1982-10-19 リ−ドフレ−ムの製造方法

Publications (2)

Publication Number Publication Date
JPS5972754A true JPS5972754A (ja) 1984-04-24
JPS6244422B2 JPS6244422B2 (https=) 1987-09-21

Family

ID=16148757

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57184180A Granted JPS5972754A (ja) 1982-10-19 1982-10-19 リ−ドフレ−ムの製造方法

Country Status (1)

Country Link
JP (1) JPS5972754A (https=)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6224656A (ja) * 1985-07-24 1987-02-02 Shinko Electric Ind Co Ltd リ−ドフレ−ムの製造方法
US4725607A (en) * 1985-09-19 1988-02-16 Imperial Chemical Industries Plc Aryl pyridones and insecticidal use thereof
JPH0366153A (ja) * 1989-08-04 1991-03-20 Mitsui High Tec Inc 半導体装置用リードフレームの製造方法
WO1994024705A1 (fr) * 1993-04-14 1994-10-27 Hitachi Construction Machinery Co., Ltd. Procede d'usinage d'une feuille metallique, procede d'usinage d'une grille de connexion, procede d'usinage d'une grille de connexion et d'un dispositif a semi-conducteur, et dispositif a semi-conducteur
JP2007235067A (ja) * 2006-03-03 2007-09-13 Nitto Denko Corp 配線回路基板集合体シートおよびその製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5119970A (en) * 1974-08-12 1976-02-17 Nippon Electric Co Riidofureemuno seizohoho
JPS5461874A (en) * 1977-10-14 1979-05-18 Plessey Inc Punching lead frame for semiconductor package

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5119970A (en) * 1974-08-12 1976-02-17 Nippon Electric Co Riidofureemuno seizohoho
JPS5461874A (en) * 1977-10-14 1979-05-18 Plessey Inc Punching lead frame for semiconductor package

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6224656A (ja) * 1985-07-24 1987-02-02 Shinko Electric Ind Co Ltd リ−ドフレ−ムの製造方法
US4725607A (en) * 1985-09-19 1988-02-16 Imperial Chemical Industries Plc Aryl pyridones and insecticidal use thereof
JPH0366153A (ja) * 1989-08-04 1991-03-20 Mitsui High Tec Inc 半導体装置用リードフレームの製造方法
WO1994024705A1 (fr) * 1993-04-14 1994-10-27 Hitachi Construction Machinery Co., Ltd. Procede d'usinage d'une feuille metallique, procede d'usinage d'une grille de connexion, procede d'usinage d'une grille de connexion et d'un dispositif a semi-conducteur, et dispositif a semi-conducteur
US5580466A (en) * 1993-04-14 1996-12-03 Hitachi Construction Machinery Co., Ltd. Metal plate processing method, lead frame processing method, lead frame, semiconductor device manufacturing method, and semiconductor device
JP2007235067A (ja) * 2006-03-03 2007-09-13 Nitto Denko Corp 配線回路基板集合体シートおよびその製造方法

Also Published As

Publication number Publication date
JPS6244422B2 (https=) 1987-09-21

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