JPS5972155A - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法Info
- Publication number
- JPS5972155A JPS5972155A JP18435482A JP18435482A JPS5972155A JP S5972155 A JPS5972155 A JP S5972155A JP 18435482 A JP18435482 A JP 18435482A JP 18435482 A JP18435482 A JP 18435482A JP S5972155 A JPS5972155 A JP S5972155A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- cells
- films
- electrodes
- resist
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 239000004065 semiconductor Substances 0.000 title claims description 5
- 238000000034 method Methods 0.000 claims description 12
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract description 7
- 239000010931 gold Substances 0.000 abstract description 7
- 229910052737 gold Inorganic materials 0.000 abstract description 7
- 238000009713 electroplating Methods 0.000 abstract description 6
- 239000010410 layer Substances 0.000 abstract 2
- 239000002344 surface layer Substances 0.000 abstract 2
- 238000004544 sputter deposition Methods 0.000 abstract 1
- 230000015572 biosynthetic process Effects 0.000 description 17
- 238000010586 diagram Methods 0.000 description 10
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 241000254032 Acrididae Species 0.000 description 1
- 241000208822 Lactuca Species 0.000 description 1
- 235000003228 Lactuca sativa Nutrition 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000002747 voluntary effect Effects 0.000 description 1
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18435482A JPS5972155A (ja) | 1982-10-18 | 1982-10-18 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18435482A JPS5972155A (ja) | 1982-10-18 | 1982-10-18 | 半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5972155A true JPS5972155A (ja) | 1984-04-24 |
| JPS6342413B2 JPS6342413B2 (en, 2012) | 1988-08-23 |
Family
ID=16151779
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18435482A Granted JPS5972155A (ja) | 1982-10-18 | 1982-10-18 | 半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5972155A (en, 2012) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0442407U (en, 2012) * | 1990-08-10 | 1992-04-10 |
-
1982
- 1982-10-18 JP JP18435482A patent/JPS5972155A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6342413B2 (en, 2012) | 1988-08-23 |
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