JPS59501387A - リ−ド・フレ−ムおよびその処理方法 - Google Patents

リ−ド・フレ−ムおよびその処理方法

Info

Publication number
JPS59501387A
JPS59501387A JP58502514A JP50251483A JPS59501387A JP S59501387 A JPS59501387 A JP S59501387A JP 58502514 A JP58502514 A JP 58502514A JP 50251483 A JP50251483 A JP 50251483A JP S59501387 A JPS59501387 A JP S59501387A
Authority
JP
Japan
Prior art keywords
lead frame
components
parallel
runner
tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58502514A
Other languages
English (en)
Japanese (ja)
Other versions
JPH035666B2 (cg-RX-API-DMAC7.html
Inventor
ジヨ−ンズ・レイモンド・エヌ
ロ−ソン・ジヨン・エム
ケイル・オデ−ル・エフ
Original Assignee
モトロ−ラ・インコ−ポレ−テツド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by モトロ−ラ・インコ−ポレ−テツド filed Critical モトロ−ラ・インコ−ポレ−テツド
Publication of JPS59501387A publication Critical patent/JPS59501387A/ja
Publication of JPH035666B2 publication Critical patent/JPH035666B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H01L2221/68331—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding of passive members, e.g. die mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4981—Utilizing transitory attached element or associated separate material

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Connections Arranged To Contact A Plurality Of Conductors (AREA)
JP58502514A 1982-07-12 1983-06-15 リ−ド・フレ−ムおよびその処理方法 Granted JPS59501387A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/397,662 US4480150A (en) 1982-07-12 1982-07-12 Lead frame and method
US397662 1982-07-12

Publications (2)

Publication Number Publication Date
JPS59501387A true JPS59501387A (ja) 1984-08-02
JPH035666B2 JPH035666B2 (cg-RX-API-DMAC7.html) 1991-01-28

Family

ID=23572127

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58502514A Granted JPS59501387A (ja) 1982-07-12 1983-06-15 リ−ド・フレ−ムおよびその処理方法

Country Status (8)

Country Link
US (1) US4480150A (cg-RX-API-DMAC7.html)
EP (1) EP0113763B1 (cg-RX-API-DMAC7.html)
JP (1) JPS59501387A (cg-RX-API-DMAC7.html)
KR (1) KR910001421B1 (cg-RX-API-DMAC7.html)
DE (1) DE3376044D1 (cg-RX-API-DMAC7.html)
IT (1) IT1172287B (cg-RX-API-DMAC7.html)
MY (1) MY100275A (cg-RX-API-DMAC7.html)
WO (1) WO1984000444A1 (cg-RX-API-DMAC7.html)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4646127A (en) * 1985-09-03 1987-02-24 Gte Products Corporation Scrap-less taping system for IC lead-frames
US4597816A (en) * 1985-09-03 1986-07-01 Gte Products Corporation Scrap-less taping system for IC lead-frames
FR2590052B1 (fr) * 1985-11-08 1991-03-01 Eurotechnique Sa Procede de recyclage d'une carte comportant un composant, carte prevue pour etre recyclee
AU8034087A (en) * 1987-02-20 1988-09-14 Lsi Logic Corporation Integrated circuit package assembly
FR2622353B1 (fr) * 1987-10-22 1990-03-23 Bendix Electronics Sa Produit en bande pour supporter et convoyer des composants electroniques et procede pour sa fabrication
US4859632A (en) * 1987-12-28 1989-08-22 Siemens Corporate Research And Support, Inc. Method for manufacturing the same
JPH0622111B2 (ja) * 1989-08-29 1994-03-23 スタンレー電気株式会社 基板装着用電球及びその製造方法
JP3088193B2 (ja) * 1992-06-05 2000-09-18 三菱電機株式会社 Ｌｏｃ構造を有する半導体装置の製造方法並びにこれに使用するリードフレーム
JPH06196603A (ja) * 1992-12-23 1994-07-15 Shinko Electric Ind Co Ltd リードフレームの製造方法
US5587890A (en) 1994-08-08 1996-12-24 Cooper Industries, Inc. Vehicle electric power distribution system
US5706952A (en) * 1996-01-11 1998-01-13 Autosplice Systems Inc. Continuous carrier for electrical or mechanical components
US6202853B1 (en) 1996-01-11 2001-03-20 Autosplice Systems, Inc. Secondary processing for electrical or mechanical components molded to continuous carrier supports
US6107910A (en) * 1996-11-29 2000-08-22 X-Cyte, Inc. Dual mode transmitter/receiver and decoder for RF transponder tags
US5892178A (en) * 1997-03-20 1999-04-06 Qualcomm Incorporated Support fixture for control panel assembly
US6060815A (en) * 1997-08-18 2000-05-09 X-Cyte, Inc. Frequency mixing passive transponder
US5986382A (en) 1997-08-18 1999-11-16 X-Cyte, Inc. Surface acoustic wave transponder configuration
US6114971A (en) * 1997-08-18 2000-09-05 X-Cyte, Inc. Frequency hopping spread spectrum passive acoustic wave identification device
US6208062B1 (en) 1997-08-18 2001-03-27 X-Cyte, Inc. Surface acoustic wave transponder configuration
US6574858B1 (en) 1998-02-13 2003-06-10 Micron Technology, Inc. Method of manufacturing a chip package
US6386959B2 (en) * 1999-01-13 2002-05-14 Micro Contacts Inc. Feeding system for electro-chemically polishing contact tips
US8497697B2 (en) 2010-06-14 2013-07-30 Analog Devices, Inc. Apparatus and method for testing multiple integrated circuit devices on a film frame handler

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS505466A (cg-RX-API-DMAC7.html) * 1973-05-18 1975-01-21
JPS55150264A (en) * 1979-05-10 1980-11-22 Mitsubishi Electric Corp Lead frame for semiconductor device and method of fabricating the same

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3426423A (en) * 1965-07-08 1969-02-11 Molectro Corp Method of manufacturing semiconductors
FR2153383A1 (cg-RX-API-DMAC7.html) * 1971-09-22 1973-05-04 Dodge Ind Inc
DD143331A1 (de) * 1979-04-27 1980-08-13 Lessig Hans Joerg Filmtraegerbonden und zwischentraeger
FR2503673A1 (fr) * 1981-04-08 1982-10-15 Philips Nv Emballage pour composants electroniques

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS505466A (cg-RX-API-DMAC7.html) * 1973-05-18 1975-01-21
JPS55150264A (en) * 1979-05-10 1980-11-22 Mitsubishi Electric Corp Lead frame for semiconductor device and method of fabricating the same

Also Published As

Publication number Publication date
MY100275A (en) 1990-07-28
EP0113763A1 (en) 1984-07-25
US4480150A (en) 1984-10-30
DE3376044D1 (en) 1988-04-21
EP0113763A4 (en) 1984-11-16
IT1172287B (it) 1987-06-18
KR840005607A (ko) 1984-11-14
IT8348635A0 (it) 1983-07-06
KR910001421B1 (ko) 1991-03-05
WO1984000444A1 (en) 1984-02-02
IT8348635A1 (it) 1985-01-06
JPH035666B2 (cg-RX-API-DMAC7.html) 1991-01-28
EP0113763B1 (en) 1988-03-16

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