JPS5948978A - 半導体レ−ザ用ベ−スおよびその製造方法 - Google Patents
半導体レ−ザ用ベ−スおよびその製造方法Info
- Publication number
- JPS5948978A JPS5948978A JP58145782A JP14578283A JPS5948978A JP S5948978 A JPS5948978 A JP S5948978A JP 58145782 A JP58145782 A JP 58145782A JP 14578283 A JP14578283 A JP 14578283A JP S5948978 A JPS5948978 A JP S5948978A
- Authority
- JP
- Japan
- Prior art keywords
- strip
- groove
- semiconductor laser
- preform
- support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims description 21
- 238000000034 method Methods 0.000 title claims description 12
- 235000012431 wafers Nutrition 0.000 claims description 19
- 239000002184 metal Substances 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 229910045601 alloy Inorganic materials 0.000 claims description 11
- 239000000956 alloy Substances 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 238000002844 melting Methods 0.000 claims description 8
- 230000008018 melting Effects 0.000 claims description 8
- 238000005219 brazing Methods 0.000 claims description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 239000010931 gold Substances 0.000 claims description 5
- 238000005498 polishing Methods 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 238000005096 rolling process Methods 0.000 claims description 4
- 239000000654 additive Substances 0.000 claims description 3
- 230000000996 additive effect Effects 0.000 claims description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 238000000227 grinding Methods 0.000 claims description 3
- 238000007650 screen-printing Methods 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 claims description 2
- 239000000945 filler Substances 0.000 claims description 2
- 238000003801 milling Methods 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 claims 2
- 229910052763 palladium Inorganic materials 0.000 claims 1
- 238000003825 pressing Methods 0.000 claims 1
- 239000004020 conductor Substances 0.000 description 5
- 239000002904 solvent Substances 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 241000212342 Sium Species 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/02315—Support members, e.g. bases or carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0233—Mounting configuration of laser chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Semiconductor Lasers (AREA)
- Ceramic Products (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR8214042A FR2531819A1 (fr) | 1982-08-12 | 1982-08-12 | Embase pour laser a semi-conducteur et son procede de fabrication |
| FR8214042 | 1982-08-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5948978A true JPS5948978A (ja) | 1984-03-21 |
Family
ID=9276828
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58145782A Pending JPS5948978A (ja) | 1982-08-12 | 1983-08-11 | 半導体レ−ザ用ベ−スおよびその製造方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US4584688A (Direct) |
| EP (1) | EP0101374B1 (Direct) |
| JP (1) | JPS5948978A (Direct) |
| CA (1) | CA1209235A (Direct) |
| DE (1) | DE3369033D1 (Direct) |
| FR (1) | FR2531819A1 (Direct) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4688076A (en) * | 1983-04-22 | 1987-08-18 | The Charles Stark Draper Laboratory, Inc. | Noise reducing heat sink for semiconductor laser diodes |
| FR2550023B1 (fr) * | 1983-07-25 | 1987-03-27 | Auffret Rene | Source lumineuse infrarouge comprenant un laser a semiconducteur associe a des moyens de selection de mode et d'asservissement en puissance |
| US4820659A (en) * | 1986-07-16 | 1989-04-11 | General Electric Company | Method of making a semiconductor device assembly |
| US4797728A (en) * | 1986-07-16 | 1989-01-10 | General Electric Company | Semiconductor device assembly and method of making same |
| JPH0750813B2 (ja) * | 1988-05-23 | 1995-05-31 | 三菱電機株式会社 | 半導体レーザ素子用サブマウント |
| US6869231B2 (en) * | 2002-05-01 | 2005-03-22 | Jds Uniphase Corporation | Transmitters, receivers, and transceivers including an optical bench |
| US7061949B1 (en) * | 2002-08-16 | 2006-06-13 | Jds Uniphase Corporation | Methods, apparatus, and systems with semiconductor laser packaging for high modulation bandwidth |
| US20060038302A1 (en) * | 2004-08-19 | 2006-02-23 | Kejun Zeng | Thermal fatigue resistant tin-lead-silver solder |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5314588A (en) * | 1976-07-26 | 1978-02-09 | Mitsubishi Electric Corp | Optical device |
| JPS55148483A (en) * | 1979-05-08 | 1980-11-19 | Canon Inc | Semiconductor laser device |
| JPS56104485A (en) * | 1980-01-23 | 1981-08-20 | Canon Inc | Semiconductor laser device |
| NL180365C (nl) * | 1979-06-11 | 1987-02-02 | Philips Nv | Werkwijze voor het vervaardigen van koelblokken voor halfgeleiderlasers, alsmede halfgeleiderlaser die een volgens deze werkwijze vervaardigd koelblok bevat. |
| NL181963C (nl) * | 1979-06-26 | 1987-12-01 | Philips Nv | Halfgeleiderlaserinrichting. |
-
1982
- 1982-08-12 FR FR8214042A patent/FR2531819A1/fr active Granted
-
1983
- 1983-08-08 CA CA000434081A patent/CA1209235A/en not_active Expired
- 1983-08-08 US US06/521,106 patent/US4584688A/en not_active Expired - Fee Related
- 1983-08-08 DE DE8383401626T patent/DE3369033D1/de not_active Expired
- 1983-08-08 EP EP83401626A patent/EP0101374B1/fr not_active Expired
- 1983-08-11 JP JP58145782A patent/JPS5948978A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US4584688A (en) | 1986-04-22 |
| EP0101374B1 (fr) | 1987-01-07 |
| CA1209235A (en) | 1986-08-05 |
| FR2531819A1 (fr) | 1984-02-17 |
| FR2531819B1 (Direct) | 1985-03-08 |
| DE3369033D1 (en) | 1987-02-12 |
| EP0101374A3 (en) | 1984-04-11 |
| EP0101374A2 (fr) | 1984-02-22 |
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