JPS5948945A - 半導体用リ−ドフレ−ムの製造方法 - Google Patents

半導体用リ−ドフレ−ムの製造方法

Info

Publication number
JPS5948945A
JPS5948945A JP57160198A JP16019882A JPS5948945A JP S5948945 A JPS5948945 A JP S5948945A JP 57160198 A JP57160198 A JP 57160198A JP 16019882 A JP16019882 A JP 16019882A JP S5948945 A JPS5948945 A JP S5948945A
Authority
JP
Japan
Prior art keywords
metal strip
etching
lead frame
coated
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57160198A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6347345B2 (index.php
Inventor
Yoshihiro Matsuyama
松山 圭宏
Masaru Watanabe
勝 渡辺
Mitsuhiko Sugiyama
光彦 杉山
Kenji Konishi
健司 小西
Mamoru Onda
護 御田
Takashi Suzumura
隆志 鈴村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Priority to JP57160198A priority Critical patent/JPS5948945A/ja
Publication of JPS5948945A publication Critical patent/JPS5948945A/ja
Publication of JPS6347345B2 publication Critical patent/JPS6347345B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/042

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP57160198A 1982-09-14 1982-09-14 半導体用リ−ドフレ−ムの製造方法 Granted JPS5948945A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57160198A JPS5948945A (ja) 1982-09-14 1982-09-14 半導体用リ−ドフレ−ムの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57160198A JPS5948945A (ja) 1982-09-14 1982-09-14 半導体用リ−ドフレ−ムの製造方法

Publications (2)

Publication Number Publication Date
JPS5948945A true JPS5948945A (ja) 1984-03-21
JPS6347345B2 JPS6347345B2 (index.php) 1988-09-21

Family

ID=15709922

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57160198A Granted JPS5948945A (ja) 1982-09-14 1982-09-14 半導体用リ−ドフレ−ムの製造方法

Country Status (1)

Country Link
JP (1) JPS5948945A (index.php)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7790048B2 (en) 2004-03-10 2010-09-07 S.O.I.Tec Silicon On Insulator Technologies Treatment of the working layer of a multilayer structure

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7790048B2 (en) 2004-03-10 2010-09-07 S.O.I.Tec Silicon On Insulator Technologies Treatment of the working layer of a multilayer structure

Also Published As

Publication number Publication date
JPS6347345B2 (index.php) 1988-09-21

Similar Documents

Publication Publication Date Title
US5683943A (en) Process for etching a semiconductor lead frame
TWI766114B (zh) 蒸鍍遮罩用基材、蒸鍍遮罩用基材的製造方法、蒸鍍遮罩的製造方法及顯示裝置的製造方法
JPS5826828B2 (ja) テ−プキヤリアの製造方法
JPH0746681B2 (ja) X線ステッパー用マスクの製造方法
JPS5948945A (ja) 半導体用リ−ドフレ−ムの製造方法
JPH0936084A (ja) パターン形成方法
JP2632456B2 (ja) リードフレームの製造方法
JP3440610B2 (ja) リードフレームの製造方法
JPS5948946A (ja) 半導体用リ−ドフレ−ムの製造方法
JP3674238B2 (ja) リードフレームの製造方法
JPH0139655B2 (index.php)
JPS5854188B2 (ja) 部分メツキ装置
JP2743566B2 (ja) エッチングにより微細パターンを形成する方法
JPH11126859A (ja) リードフレームの製造方法
JPH07202098A (ja) リードフレームおよびその製造方法
JPS627877A (ja) メツシユ製品の製造方法
JP3018216B2 (ja) リ−ドフレ−ムの製造方法
JPS5823466B2 (ja) ブブンメツキホウホウ
JPH1041448A (ja) リードフレーム
JPH06250395A (ja) 金属印刷刷版の製造方法
JPS63142660A (ja) リ−ドフレ−ムの製造方法
JPH02284453A (ja) 半導体集積回路用リードフレームの製造方法
DE1521967A1 (de) Verfahren zum Herstellen einer Bedampfungsmaske
JPH09316667A (ja) エッチング加工方法
JPS60211862A (ja) 半導体装置用リ−ドフレ−ムの製造方法