JPS6347345B2 - - Google Patents

Info

Publication number
JPS6347345B2
JPS6347345B2 JP57160198A JP16019882A JPS6347345B2 JP S6347345 B2 JPS6347345 B2 JP S6347345B2 JP 57160198 A JP57160198 A JP 57160198A JP 16019882 A JP16019882 A JP 16019882A JP S6347345 B2 JPS6347345 B2 JP S6347345B2
Authority
JP
Japan
Prior art keywords
etching
metal strip
composite metal
aluminum
mask
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57160198A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5948945A (ja
Inventor
Yoshihiro Matsuyama
Masaru Watanabe
Mitsuhiko Sugyama
Kenji Konishi
Mamoru Onda
Takashi Suzumura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Priority to JP57160198A priority Critical patent/JPS5948945A/ja
Publication of JPS5948945A publication Critical patent/JPS5948945A/ja
Publication of JPS6347345B2 publication Critical patent/JPS6347345B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/042—

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP57160198A 1982-09-14 1982-09-14 半導体用リ−ドフレ−ムの製造方法 Granted JPS5948945A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57160198A JPS5948945A (ja) 1982-09-14 1982-09-14 半導体用リ−ドフレ−ムの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57160198A JPS5948945A (ja) 1982-09-14 1982-09-14 半導体用リ−ドフレ−ムの製造方法

Publications (2)

Publication Number Publication Date
JPS5948945A JPS5948945A (ja) 1984-03-21
JPS6347345B2 true JPS6347345B2 (index.php) 1988-09-21

Family

ID=15709922

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57160198A Granted JPS5948945A (ja) 1982-09-14 1982-09-14 半導体用リ−ドフレ−ムの製造方法

Country Status (1)

Country Link
JP (1) JPS5948945A (index.php)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2867606B1 (fr) 2004-03-10 2006-06-02 Soitec Silicon On Insulator Procede et dispositif de traitement de la couche utile d'une structure multicouche

Also Published As

Publication number Publication date
JPS5948945A (ja) 1984-03-21

Similar Documents

Publication Publication Date Title
US5683943A (en) Process for etching a semiconductor lead frame
JPH05343600A (ja) 半導体装置用スタビライザ／スペーサ
JPS591683A (ja) ダイス型とその製法
JPS6347345B2 (index.php)
JPS6347346B2 (index.php)
JP2003078097A (ja) リードフレーム及びその製造方法
JPS5858439B2 (ja) リ−ドフレ−ムの製造方法
JPH0139655B2 (index.php)
JPS6324073B2 (index.php)
JP2807505B2 (ja) リードフレームの製造方法
KR0147652B1 (ko) 리이드 프레임의 제조방법
JP2611431B2 (ja) 均一部分電気メッキ法
JPH05326788A (ja) リードフレーム素材及びこれを用いた半導体装置
JPS6315992B2 (index.php)
JP2784352B2 (ja) リードフレームの製造方法
JPH07231062A (ja) リードフレームの加工方法
US6635407B1 (en) Two pass process for producing a fine pitch lead frame by etching
JP2972016B2 (ja) リードフレームの製造方法
JPH01147848A (ja) Ｉｃ用リードフレームの製造方法
JPH08319584A (ja) エッチング部品の製造方法
JPS61241957A (ja) リードフレームの製造方法およびリードフレームを用いた半導体装置の製造方法
JP2520610Y2 (ja) リードフレーム
JP3018216B2 (ja) リ−ドフレ−ムの製造方法
JPS5987845A (ja) リ−ドフレ−ムの製造方法
JPH0864751A (ja) リードフレームの製造方法