JPS5933853A - パツケ−ジおよび半導体装置の製造方法 - Google Patents
パツケ−ジおよび半導体装置の製造方法Info
- Publication number
- JPS5933853A JPS5933853A JP14448782A JP14448782A JPS5933853A JP S5933853 A JPS5933853 A JP S5933853A JP 14448782 A JP14448782 A JP 14448782A JP 14448782 A JP14448782 A JP 14448782A JP S5933853 A JPS5933853 A JP S5933853A
- Authority
- JP
- Japan
- Prior art keywords
- package
- metal
- short
- semiconductor element
- metal layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 24
- 238000004519 manufacturing process Methods 0.000 title description 4
- 229910052751 metal Inorganic materials 0.000 claims abstract description 32
- 239000002184 metal Substances 0.000 claims abstract description 32
- 238000007747 plating Methods 0.000 claims abstract description 17
- 239000004020 conductor Substances 0.000 claims abstract description 13
- 239000000758 substrate Substances 0.000 claims abstract 4
- 238000005538 encapsulation Methods 0.000 claims 2
- 238000005260 corrosion Methods 0.000 abstract description 8
- 230000007797 corrosion Effects 0.000 abstract description 8
- 238000007789 sealing Methods 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 239000010410 layer Substances 0.000 description 8
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 238000003466 welding Methods 0.000 description 3
- 229910000833 kovar Inorganic materials 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- 229910002708 Au–Cu Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000012792 core layer Substances 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49822—Multilayer substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14448782A JPS5933853A (ja) | 1982-08-19 | 1982-08-19 | パツケ−ジおよび半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14448782A JPS5933853A (ja) | 1982-08-19 | 1982-08-19 | パツケ−ジおよび半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5933853A true JPS5933853A (ja) | 1984-02-23 |
| JPS6248383B2 JPS6248383B2 (enrdf_load_stackoverflow) | 1987-10-13 |
Family
ID=15363463
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14448782A Granted JPS5933853A (ja) | 1982-08-19 | 1982-08-19 | パツケ−ジおよび半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5933853A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6130246U (ja) * | 1984-07-27 | 1986-02-24 | 日本碍子株式会社 | 部分めつきセラミツクパツケ−ジ |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0198689U (enrdf_load_stackoverflow) * | 1987-12-21 | 1989-06-30 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5015547A (enrdf_load_stackoverflow) * | 1973-06-07 | 1975-02-19 | ||
| JPS553821A (en) * | 1978-06-22 | 1980-01-11 | Mitsubishi Electric Corp | Dehydrating treatment apparatus for sludge |
-
1982
- 1982-08-19 JP JP14448782A patent/JPS5933853A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5015547A (enrdf_load_stackoverflow) * | 1973-06-07 | 1975-02-19 | ||
| JPS553821A (en) * | 1978-06-22 | 1980-01-11 | Mitsubishi Electric Corp | Dehydrating treatment apparatus for sludge |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6130246U (ja) * | 1984-07-27 | 1986-02-24 | 日本碍子株式会社 | 部分めつきセラミツクパツケ−ジ |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6248383B2 (enrdf_load_stackoverflow) | 1987-10-13 |
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