JPS5933837A - 半導体装置表面上への絶縁膜形成法 - Google Patents

半導体装置表面上への絶縁膜形成法

Info

Publication number
JPS5933837A
JPS5933837A JP57143580A JP14358082A JPS5933837A JP S5933837 A JPS5933837 A JP S5933837A JP 57143580 A JP57143580 A JP 57143580A JP 14358082 A JP14358082 A JP 14358082A JP S5933837 A JPS5933837 A JP S5933837A
Authority
JP
Japan
Prior art keywords
insulating film
gas
semiconductor device
temperature
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57143580A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6366415B2 (OSRAM
Inventor
Koichi Wakita
紘一 脇田
Seitaro Matsuo
松尾 誠太郎
Hiroshi Kanbe
神戸 宏
Susumu Hata
進 秦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NTT Inc
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP57143580A priority Critical patent/JPS5933837A/ja
Publication of JPS5933837A publication Critical patent/JPS5933837A/ja
Publication of JPS6366415B2 publication Critical patent/JPS6366415B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10P14/6903
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • H10P14/6336

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Plasma & Fusion (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Formation Of Insulating Films (AREA)
  • Photovoltaic Devices (AREA)
  • Semiconductor Lasers (AREA)
JP57143580A 1982-08-19 1982-08-19 半導体装置表面上への絶縁膜形成法 Granted JPS5933837A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57143580A JPS5933837A (ja) 1982-08-19 1982-08-19 半導体装置表面上への絶縁膜形成法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57143580A JPS5933837A (ja) 1982-08-19 1982-08-19 半導体装置表面上への絶縁膜形成法

Publications (2)

Publication Number Publication Date
JPS5933837A true JPS5933837A (ja) 1984-02-23
JPS6366415B2 JPS6366415B2 (OSRAM) 1988-12-20

Family

ID=15342037

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57143580A Granted JPS5933837A (ja) 1982-08-19 1982-08-19 半導体装置表面上への絶縁膜形成法

Country Status (1)

Country Link
JP (1) JPS5933837A (OSRAM)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6123381A (ja) * 1984-07-11 1986-01-31 Nippon Telegr & Teleph Corp <Ntt> 半導体レーザの製法
JPS6350028A (ja) * 1986-08-20 1988-03-02 Fujitsu Ltd 薄膜形成方法
JPS6350027A (ja) * 1986-08-20 1988-03-02 Sanyo Electric Co Ltd 窒化シリコン膜形成方法
JPS63316442A (ja) * 1987-06-18 1988-12-23 Sanyo Electric Co Ltd 窒化シリコン膜の形成方法
JPS6455871A (en) * 1987-08-26 1989-03-02 Sumitomo Electric Industries Manufacture of self-alignment type gate electrode

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63233712A (ja) * 1987-03-20 1988-09-29 井関農機株式会社 苗植機

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6123381A (ja) * 1984-07-11 1986-01-31 Nippon Telegr & Teleph Corp <Ntt> 半導体レーザの製法
JPS6350028A (ja) * 1986-08-20 1988-03-02 Fujitsu Ltd 薄膜形成方法
JPS6350027A (ja) * 1986-08-20 1988-03-02 Sanyo Electric Co Ltd 窒化シリコン膜形成方法
JPS63316442A (ja) * 1987-06-18 1988-12-23 Sanyo Electric Co Ltd 窒化シリコン膜の形成方法
JPS6455871A (en) * 1987-08-26 1989-03-02 Sumitomo Electric Industries Manufacture of self-alignment type gate electrode

Also Published As

Publication number Publication date
JPS6366415B2 (OSRAM) 1988-12-20

Similar Documents

Publication Publication Date Title
JP3660391B2 (ja) 半導体装置の製造方法
JPH0945679A (ja) 半導体及び半導体基板表面の酸化膜の形成方法
JPS583269A (ja) 縦型mosダイナミツクメモリ−セル
US6723599B2 (en) Methods of forming capacitors and methods of forming capacitor dielectric layers
US6891215B2 (en) Capacitors
JPS5933837A (ja) 半導体装置表面上への絶縁膜形成法
JP2001007120A (ja) ヘテロ接合バイポーラトランジスタ及びその製造方法
JP3254885B2 (ja) 抵抗体の製造方法
JPH11233760A (ja) 金属、酸化膜及び炭化珪素半導体からなる積層構造体
JP3193287B2 (ja) 太陽電池
JP2593898B2 (ja) 半導体素子
JP2845160B2 (ja) 半導体装置
JP3589801B2 (ja) 半導体基板表面の酸化膜の形成方法
JPH04230033A (ja) 半導体装置の製造およびパッシベーション方法
US5877073A (en) Modified poly-buffered locos forming technology avoiding the positive charge trapping at the beak of field oxide
JPS5933874A (ja) 絶縁ゲ−ト型電界効果トランジスタの製法
JP3205150B2 (ja) 半導体装置の製造方法
JPH10223629A (ja) 半導体表面の酸化膜の形成方法及び半導体装置の製造方法
JP2911291B2 (ja) 半導体装置の製造方法
JPH11330360A (ja) 半導体装置の製造方法
JPS5934639A (ja) 窒化シリコン膜形成装置
JPS6143474A (ja) 半導体装置
JP2903735B2 (ja) 半導体装置
JPS60223132A (ja) 半導体装置およびその製造方法
KR960002105B1 (ko) 피엔(pn) 접합 구조를 갖는 반도체 소자의 제조 방법