JPS592843A - 難燃性フエノ−ル樹脂積層板の製法 - Google Patents

難燃性フエノ−ル樹脂積層板の製法

Info

Publication number
JPS592843A
JPS592843A JP57111558A JP11155882A JPS592843A JP S592843 A JPS592843 A JP S592843A JP 57111558 A JP57111558 A JP 57111558A JP 11155882 A JP11155882 A JP 11155882A JP S592843 A JPS592843 A JP S592843A
Authority
JP
Japan
Prior art keywords
flame
resin
retardant
impregnated
aluminum hydroxide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57111558A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6333777B2 (OSRAM
Inventor
中村　義男
倫史 成島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Kokusaku Pulp Co Ltd
Original Assignee
Sanyo Kokusaku Pulp Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Kokusaku Pulp Co Ltd filed Critical Sanyo Kokusaku Pulp Co Ltd
Priority to JP57111558A priority Critical patent/JPS592843A/ja
Priority to KR8204827A priority patent/KR880001906B1/ko
Priority to GB08305113A priority patent/GB2123748B/en
Publication of JPS592843A publication Critical patent/JPS592843A/ja
Publication of JPS6333777B2 publication Critical patent/JPS6333777B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B29/00—Layered products comprising a layer of paper or cardboard
    • B32B29/06—Layered products comprising a layer of paper or cardboard specially treated, e.g. surfaced, parchmentised
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/10—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of wood
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/12—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of paper or cardboard
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/12—Coating on the layer surface on paper layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/26—Polymeric coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/028—Paper layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B32B2307/3065—Flame resistant or retardant, fire resistant or retardant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2317/00—Animal or vegetable based
    • B32B2317/12—Paper, e.g. cardboard
    • B32B2317/122—Kraft paper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/012—Flame-retardant; Preventing of inflammation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0284—Paper, e.g. as reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0293—Non-woven fibrous reinforcement

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)
JP57111558A 1982-06-30 1982-06-30 難燃性フエノ−ル樹脂積層板の製法 Granted JPS592843A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP57111558A JPS592843A (ja) 1982-06-30 1982-06-30 難燃性フエノ−ル樹脂積層板の製法
KR8204827A KR880001906B1 (ko) 1982-06-30 1982-10-27 난연성 페놀수지 적층판의 제법
GB08305113A GB2123748B (en) 1982-06-30 1983-02-24 Flame-retardant laminates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57111558A JPS592843A (ja) 1982-06-30 1982-06-30 難燃性フエノ−ル樹脂積層板の製法

Publications (2)

Publication Number Publication Date
JPS592843A true JPS592843A (ja) 1984-01-09
JPS6333777B2 JPS6333777B2 (OSRAM) 1988-07-06

Family

ID=14564427

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57111558A Granted JPS592843A (ja) 1982-06-30 1982-06-30 難燃性フエノ−ル樹脂積層板の製法

Country Status (3)

Country Link
JP (1) JPS592843A (OSRAM)
KR (1) KR880001906B1 (OSRAM)
GB (1) GB2123748B (OSRAM)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02150346A (ja) * 1988-11-30 1990-06-08 Shin Kobe Electric Mach Co Ltd 積層板
US7621597B2 (en) 2006-10-05 2009-11-24 Toyoshi Fukuda Plastic headrest frame

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100826958B1 (ko) * 2007-02-09 2008-05-02 김승현 벌집형 내장재와 이를 구비하는 판넬과 벌집형 내장재제조방법 및 판넬 제조방법
KR100896900B1 (ko) * 2008-11-11 2009-05-14 김홍열 연료전지와 수전해를 이용한 산소발생기
USD827144S1 (en) 2017-09-14 2018-08-28 3M Innovative Properties Company Nasogastric tube securement device
CN115651366B (zh) * 2022-11-18 2023-09-12 江苏耀鸿电子有限公司 一种用于覆铜板的含氧化铝的树脂胶液及其制备方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51119766A (en) * 1975-04-14 1976-10-20 Tokyo Shibaura Electric Co Manufacture of fireeproof phenol resin laminated plate
JPS5212224A (en) * 1975-07-18 1977-01-29 Kanebo Ltd Apparatus for producing cement products highly reinforced with glass fibres
JPS5246112A (en) * 1975-10-06 1977-04-12 Koodo Kk Production of water proof and fire resistant finished paper

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51119766A (en) * 1975-04-14 1976-10-20 Tokyo Shibaura Electric Co Manufacture of fireeproof phenol resin laminated plate
JPS5212224A (en) * 1975-07-18 1977-01-29 Kanebo Ltd Apparatus for producing cement products highly reinforced with glass fibres
JPS5246112A (en) * 1975-10-06 1977-04-12 Koodo Kk Production of water proof and fire resistant finished paper

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02150346A (ja) * 1988-11-30 1990-06-08 Shin Kobe Electric Mach Co Ltd 積層板
US7621597B2 (en) 2006-10-05 2009-11-24 Toyoshi Fukuda Plastic headrest frame

Also Published As

Publication number Publication date
GB2123748B (en) 1986-01-29
JPS6333777B2 (OSRAM) 1988-07-06
GB2123748A (en) 1984-02-08
KR880001906B1 (ko) 1988-09-30
GB8305113D0 (en) 1983-03-30
KR840001889A (ko) 1984-06-07

Similar Documents

Publication Publication Date Title
CN102093672A (zh) 一种无卤无磷阻燃环氧树脂类组合物及其在粘结片和覆铜板中的应用
KR880001906B1 (ko) 난연성 페놀수지 적층판의 제법
JP4568937B2 (ja) 難燃性樹脂組成物、これを用いたプリプレグ及び積層板
JP2000263733A (ja) フェノール樹脂積層板及びその製造方法
JPH047374B2 (OSRAM)
TWI423741B (zh) An epoxy resin composition and a film and a substrate made of the epoxy resin composition
JPS59166533A (ja) 寸法安定性の良好な熱硬化性樹脂積層板
JPH06287329A (ja) プリプレグの製造方法及びこのプリプレグを用いた電気用積層板の製造方法
JPH11262979A (ja) フェノール樹脂銅張積層板の製造方法
JPH0239928A (ja) フェノール樹脂積層板
JPS63186745A (ja) 難燃性フエノ−ル樹脂積層板
JPS5971333A (ja) 樹脂含浸紙積層板
CN119266026A (zh) 一种高强度无卤阻燃酚醛纸基层压板及其制备方法
JPS6364306B2 (OSRAM)
US2990312A (en) Process of making laminates from paper impregnated with a melamine-formaldehyde resin containing a buffering agent
JPH06297663A (ja) フェノール樹脂積層板の製造方法
JPH05301310A (ja) 難燃性フェノール樹脂積層板
JP2001335651A (ja) 有機繊維基材含浸用エポキシ樹脂組成物ならびにそれを用いたプリプレグ、積層板及びプリント配線板
JPS59157126A (ja) 積層板の製造方法
JPH09164630A (ja) フェノール樹脂積層板の製造方法
JPH0959482A (ja) フェノール樹脂組成物
JPS5857447B2 (ja) 積層板の製造方法
JPH06220225A (ja) プリプレグの製造方法および電気用積層板
JPH05245971A (ja) 難燃性銅張り積層板の製造方法
JPS6036383B2 (ja) 難燃性積層板の製造方法