JPS59219940A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法

Info

Publication number
JPS59219940A
JPS59219940A JP9523183A JP9523183A JPS59219940A JP S59219940 A JPS59219940 A JP S59219940A JP 9523183 A JP9523183 A JP 9523183A JP 9523183 A JP9523183 A JP 9523183A JP S59219940 A JPS59219940 A JP S59219940A
Authority
JP
Japan
Prior art keywords
film
wiring
alloy
wiring layer
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9523183A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0220142B2 (enExample
Inventor
Shohei Shima
昇平 嶋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP9523183A priority Critical patent/JPS59219940A/ja
Publication of JPS59219940A publication Critical patent/JPS59219940A/ja
Publication of JPH0220142B2 publication Critical patent/JPH0220142B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP9523183A 1983-05-30 1983-05-30 半導体装置の製造方法 Granted JPS59219940A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9523183A JPS59219940A (ja) 1983-05-30 1983-05-30 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9523183A JPS59219940A (ja) 1983-05-30 1983-05-30 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS59219940A true JPS59219940A (ja) 1984-12-11
JPH0220142B2 JPH0220142B2 (enExample) 1990-05-08

Family

ID=14131983

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9523183A Granted JPS59219940A (ja) 1983-05-30 1983-05-30 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS59219940A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5266521A (en) * 1991-03-20 1993-11-30 Samsung Electronics Co., Ltd. Method for forming a planarized composite metal layer in a semiconductor device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5380184A (en) * 1976-12-24 1978-07-15 Matsushita Electric Ind Co Ltd Manufacture of semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5380184A (en) * 1976-12-24 1978-07-15 Matsushita Electric Ind Co Ltd Manufacture of semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5266521A (en) * 1991-03-20 1993-11-30 Samsung Electronics Co., Ltd. Method for forming a planarized composite metal layer in a semiconductor device

Also Published As

Publication number Publication date
JPH0220142B2 (enExample) 1990-05-08

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