JPS59218938A - プリント基板の配線パタ−ン検査方法 - Google Patents

プリント基板の配線パタ−ン検査方法

Info

Publication number
JPS59218938A
JPS59218938A JP58094270A JP9427083A JPS59218938A JP S59218938 A JPS59218938 A JP S59218938A JP 58094270 A JP58094270 A JP 58094270A JP 9427083 A JP9427083 A JP 9427083A JP S59218938 A JPS59218938 A JP S59218938A
Authority
JP
Japan
Prior art keywords
wiring pattern
infrared
temperature
pattern
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58094270A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0249650B2 (US07902200-20110308-C00004.png
Inventor
Nobuo Igusa
井草　延夫
Katsunori Tanaka
克典 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP58094270A priority Critical patent/JPS59218938A/ja
Publication of JPS59218938A publication Critical patent/JPS59218938A/ja
Publication of JPH0249650B2 publication Critical patent/JPH0249650B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00—Investigating or analyzing materials by the use of thermal means
    • G01N25/72—Investigating presence of flaws
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
JP58094270A 1983-05-27 1983-05-27 プリント基板の配線パタ−ン検査方法 Granted JPS59218938A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58094270A JPS59218938A (ja) 1983-05-27 1983-05-27 プリント基板の配線パタ−ン検査方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58094270A JPS59218938A (ja) 1983-05-27 1983-05-27 プリント基板の配線パタ−ン検査方法

Publications (2)

Publication Number Publication Date
JPS59218938A true JPS59218938A (ja) 1984-12-10
JPH0249650B2 JPH0249650B2 (US07902200-20110308-C00004.png) 1990-10-30

Family

ID=14105578

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58094270A Granted JPS59218938A (ja) 1983-05-27 1983-05-27 プリント基板の配線パタ−ン検査方法

Country Status (1)

Country Link
JP (1) JPS59218938A (US07902200-20110308-C00004.png)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6281517A (ja) * 1985-10-04 1987-04-15 Nec Corp 凹凸パタ−ン読取装置
JPH01121712A (ja) * 1987-11-06 1989-05-15 Nkk Corp 被検査物内面の減肉部検出方法
JPH01182745A (ja) * 1988-01-13 1989-07-20 Nec Corp スルーホール欠陥検出装置
JPH01274006A (ja) * 1988-04-27 1989-11-01 Hitachi Ltd プリント基板のはんだ付け検査方法および装置
JPH02201110A (ja) * 1988-12-06 1990-08-09 Bull Sa プリント配線回路の検査方法、特にカードの構成部分の検査方法及び該方法を適用する装置
WO2001073819A3 (en) * 2000-03-28 2002-03-21 Advanced Micro Devices Inc Infrared inspection for determining residual films on semiconductor devices
WO2004023122A1 (ja) * 2002-09-03 2004-03-18 Hamamatsu Foundation For Science And Technology Promotion パターン検査方法とその検査装置
WO2006093613A1 (en) * 2005-02-25 2006-09-08 3M Innovative Properties Company Nondestructive inspection method for inspecting junction of flexible printed circuit board
JP2015010937A (ja) * 2013-06-28 2015-01-19 リンテック株式会社 位置検出装置および位置検出方法
CZ305219B6 (cs) * 2013-03-21 2015-06-17 České vysoké učení technické v Praze, Fakulta strojní, Ústav přístrojové a řídící techniky Způsob automatického bezdotykového stanovení emisivity povrchu a zařízení k provádění tohoto způsobu

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0467555U (US07902200-20110308-C00004.png) * 1990-10-22 1992-06-16

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4938154A (US07902200-20110308-C00004.png) * 1972-08-14 1974-04-09
JPS4941855A (US07902200-20110308-C00004.png) * 1972-05-01 1974-04-19
JPS5074167A (US07902200-20110308-C00004.png) * 1973-10-30 1975-06-18

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4941855A (US07902200-20110308-C00004.png) * 1972-05-01 1974-04-19
JPS4938154A (US07902200-20110308-C00004.png) * 1972-08-14 1974-04-09
JPS5074167A (US07902200-20110308-C00004.png) * 1973-10-30 1975-06-18

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6281517A (ja) * 1985-10-04 1987-04-15 Nec Corp 凹凸パタ−ン読取装置
JPH01121712A (ja) * 1987-11-06 1989-05-15 Nkk Corp 被検査物内面の減肉部検出方法
JPH01182745A (ja) * 1988-01-13 1989-07-20 Nec Corp スルーホール欠陥検出装置
JPH01274006A (ja) * 1988-04-27 1989-11-01 Hitachi Ltd プリント基板のはんだ付け検査方法および装置
JPH02201110A (ja) * 1988-12-06 1990-08-09 Bull Sa プリント配線回路の検査方法、特にカードの構成部分の検査方法及び該方法を適用する装置
US6452180B1 (en) 2000-03-28 2002-09-17 Advanced Micro Devices, Inc. Infrared inspection for determining residual films on semiconductor devices
WO2001073819A3 (en) * 2000-03-28 2002-03-21 Advanced Micro Devices Inc Infrared inspection for determining residual films on semiconductor devices
WO2004023122A1 (ja) * 2002-09-03 2004-03-18 Hamamatsu Foundation For Science And Technology Promotion パターン検査方法とその検査装置
JPWO2004023122A1 (ja) * 2002-09-03 2005-12-22 財団法人浜松科学技術研究振興会 パターン検査方法とその検査装置
JP4504191B2 (ja) * 2002-09-03 2010-07-14 財団法人浜松科学技術研究振興会 パターン検査方法とその検査装置
WO2006093613A1 (en) * 2005-02-25 2006-09-08 3M Innovative Properties Company Nondestructive inspection method for inspecting junction of flexible printed circuit board
CZ305219B6 (cs) * 2013-03-21 2015-06-17 České vysoké učení technické v Praze, Fakulta strojní, Ústav přístrojové a řídící techniky Způsob automatického bezdotykového stanovení emisivity povrchu a zařízení k provádění tohoto způsobu
JP2015010937A (ja) * 2013-06-28 2015-01-19 リンテック株式会社 位置検出装置および位置検出方法

Also Published As

Publication number Publication date
JPH0249650B2 (US07902200-20110308-C00004.png) 1990-10-30

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