JPS59189603A - カ−ボンレジン印刷抵抗ペ−スト - Google Patents
カ−ボンレジン印刷抵抗ペ−ストInfo
- Publication number
- JPS59189603A JPS59189603A JP58066096A JP6609683A JPS59189603A JP S59189603 A JPS59189603 A JP S59189603A JP 58066096 A JP58066096 A JP 58066096A JP 6609683 A JP6609683 A JP 6609683A JP S59189603 A JPS59189603 A JP S59189603A
- Authority
- JP
- Japan
- Prior art keywords
- carbon
- resin
- resistance
- paste
- epoxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims description 46
- 229910052799 carbon Inorganic materials 0.000 title claims description 42
- 229920005989 resin Polymers 0.000 title claims description 24
- 239000011347 resin Substances 0.000 title claims description 24
- 229920001721 polyimide Polymers 0.000 description 21
- 239000009719 polyimide resin Substances 0.000 description 20
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 11
- 239000003822 epoxy resin Substances 0.000 description 10
- 229920000647 polyepoxide Polymers 0.000 description 10
- 239000006240 Fast Extruding Furnace Substances 0.000 description 6
- 239000006230 acetylene black Substances 0.000 description 5
- 238000010304 firing Methods 0.000 description 5
- 239000011256 inorganic filler Substances 0.000 description 5
- 229910003475 inorganic filler Inorganic materials 0.000 description 5
- 229920003192 poly(bis maleimide) Polymers 0.000 description 5
- 238000007650 screen-printing Methods 0.000 description 5
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 4
- 239000002798 polar solvent Substances 0.000 description 4
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- FUECIDVNGAUMGJ-UHFFFAOYSA-N acetic acid;2-(2-butoxyethoxy)ethanol Chemical compound CC(O)=O.CCCCOCCOCCO FUECIDVNGAUMGJ-UHFFFAOYSA-N 0.000 description 1
- 239000003034 coal gas Substances 0.000 description 1
- 238000009841 combustion method Methods 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000000295 fuel oil Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000003505 heat denaturation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000003345 natural gas Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 229920006259 thermoplastic polyimide Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Paints Or Removers (AREA)
- Non-Adjustable Resistors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58066096A JPS59189603A (ja) | 1983-04-13 | 1983-04-13 | カ−ボンレジン印刷抵抗ペ−スト |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58066096A JPS59189603A (ja) | 1983-04-13 | 1983-04-13 | カ−ボンレジン印刷抵抗ペ−スト |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59189603A true JPS59189603A (ja) | 1984-10-27 |
| JPH0129041B2 JPH0129041B2 (enrdf_load_stackoverflow) | 1989-06-07 |
Family
ID=13306000
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58066096A Granted JPS59189603A (ja) | 1983-04-13 | 1983-04-13 | カ−ボンレジン印刷抵抗ペ−スト |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59189603A (enrdf_load_stackoverflow) |
-
1983
- 1983-04-13 JP JP58066096A patent/JPS59189603A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0129041B2 (enrdf_load_stackoverflow) | 1989-06-07 |
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