JPS59188996A - 電子部品の実装方法 - Google Patents
電子部品の実装方法Info
- Publication number
- JPS59188996A JPS59188996A JP6390183A JP6390183A JPS59188996A JP S59188996 A JPS59188996 A JP S59188996A JP 6390183 A JP6390183 A JP 6390183A JP 6390183 A JP6390183 A JP 6390183A JP S59188996 A JPS59188996 A JP S59188996A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- solder
- mounting
- components
- electronic part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 17
- 229910000679 solder Inorganic materials 0.000 claims description 15
- 229910017401 Au—Ge Inorganic materials 0.000 claims description 4
- 239000011888 foil Substances 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 description 7
- 239000010931 gold Substances 0.000 description 5
- 238000011109 contamination Methods 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000003353 gold alloy Substances 0.000 description 1
- 230000005499 meniscus Effects 0.000 description 1
- 239000012768 molten material Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6390183A JPS59188996A (ja) | 1983-04-12 | 1983-04-12 | 電子部品の実装方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6390183A JPS59188996A (ja) | 1983-04-12 | 1983-04-12 | 電子部品の実装方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59188996A true JPS59188996A (ja) | 1984-10-26 |
| JPH0120559B2 JPH0120559B2 (enrdf_load_stackoverflow) | 1989-04-17 |
Family
ID=13242677
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6390183A Granted JPS59188996A (ja) | 1983-04-12 | 1983-04-12 | 電子部品の実装方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59188996A (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62112160U (enrdf_load_stackoverflow) * | 1985-12-28 | 1987-07-17 | ||
| US5288677A (en) * | 1991-06-28 | 1994-02-22 | Exxon Chemical Patents Inc. | Immobilized Lewis acid catalysts |
| JP2016033992A (ja) * | 2014-07-31 | 2016-03-10 | 富士電機株式会社 | 半導体装置の製造方法、接合材および接合材の形成方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4939934A (enrdf_load_stackoverflow) * | 1972-08-25 | 1974-04-15 |
-
1983
- 1983-04-12 JP JP6390183A patent/JPS59188996A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4939934A (enrdf_load_stackoverflow) * | 1972-08-25 | 1974-04-15 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62112160U (enrdf_load_stackoverflow) * | 1985-12-28 | 1987-07-17 | ||
| US5288677A (en) * | 1991-06-28 | 1994-02-22 | Exxon Chemical Patents Inc. | Immobilized Lewis acid catalysts |
| JP2016033992A (ja) * | 2014-07-31 | 2016-03-10 | 富士電機株式会社 | 半導体装置の製造方法、接合材および接合材の形成方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0120559B2 (enrdf_load_stackoverflow) | 1989-04-17 |
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