JP3219793B2 - 基板にｓｍｄ構成要素を実装する方法 - Google Patents

基板にｓｍｄ構成要素を実装する方法

Info

Publication number
JP3219793B2
JP3219793B2 JP22680091A JP22680091A JP3219793B2 JP 3219793 B2 JP3219793 B2 JP 3219793B2 JP 22680091 A JP22680091 A JP 22680091A JP 22680091 A JP22680091 A JP 22680091A JP 3219793 B2 JP3219793 B2 JP 3219793B2
Authority
JP
Japan
Prior art keywords
substrate
adhesive
melt adhesive
component
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP22680091A
Other languages
English (en)
Other versions
JPH04234193A (ja
Inventor
ゲルシュトナー ローラント
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of JPH04234193A publication Critical patent/JPH04234193A/ja
Application granted granted Critical
Publication of JP3219793B2 publication Critical patent/JP3219793B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0469—Surface mounting by applying a glue or viscous material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10969—Metallic case or integral heatsink of component electrically connected to a pad on PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0108—Male die used for patterning, punching or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)

Description

【発明の詳細な説明】
【０００１】
【産業上の利用分野】本発明は、請求項１の部類による
基板にＳＭＤ（Ｓｕｒｆａｃｅ−Ｍｏｕｎｔｅｄ−Ｄｅ
ｖｉｃｅ）構成要素を実装する方法に関する。
【０００２】
【従来の技術】構成要素接続端子を導体路と導電結合す
るために、エポキシを主体とする導電性接着剤を使用す
ることは公知である。このために、液状接着剤をスクリ
ン印刷法で設け、構成要素を湿潤接着剤中へ装着し、引
き続き接着剤をたとえば１５０℃で硬化する。しかしこ
れは、接着剤の塗布と構成要素の装着との間で、接着剤
のポットライフに依存する最終時間が経過する必要があ
るという欠点を有する。さらに、導電性接着剤が一度硬
化した構成要素は、場合により温度の支持で、機械的に
剥取ることによってのみ除去することができる。しかし
この場合には、基板および／または隣接構成部品が損傷
する危険がある。
【０００３】この方法は、電子構成部品の一部を接着
し、残りをはんだ付けする混合技術の場合には、基板上
に既にプリントされたはんだペーストが次の導電性接着
剤のスクリン印刷の際によごれるので、もはや使用する
ことができない。
【０００４】さらに、定期刊行物“Ｍｉｃｒｏｅｌｅｃ
ｔｒｏｎｉｃ Ｍａｎｕｆａｃｔｕｒｉｎｇ ａｎｄ
Ｔｅｓｔｉｎｇ”（１９８８年６月号）の“Ｔｈｅｒｍ
ａｌＳｔｒｅｓｓ Ｒｅｄｕｃｔｉｏｎ Ｖｉａ Ｔｈ
ｅｒｍｏｐｌａｓｔｉｃ Ｄｉｅ−Ａｔｔａｃｈ Ａｄ
ｈｅｓｉｖｅ”（熱可塑性のダイアタッチ接着剤による
熱応力の減少）から、ＩＣの実装のためにホットメルト
接着剤を使用することは公知である。しかし、該接着剤
は、液状で塗布されないで、固形で小板として基板上で
はじめて溶融される。しかしこれは、各ＩＣに対し接着
剤を小板として個々に位置定めしなければならないとい
う欠点を有する。
【０００５】マイクロエレクトロニックＩＳＨＭの１９
８６年度国際シンポジウム議事録“Ａ Ｒｅｗｏｒｈａ
ｂｌｅ Ｈｉｇｈ Ｒｅｌｉａｂｉｌｉｔｙ Ｔｈｅｒ
ｍｏｐｌａｓｔｉｃ Ｄｉｅ−Ａｔｔａｃｈ Ａｄｈｅ
ｓｉｖｅ”（再生可能な高信頼性の熱可塑性のダイアタ
ッチ接着剤）（国際シンポジウムに対する告示）から、
ホットメルト接着剤をスクリン印刷法を用いて塗布する
ために溶剤に溶解し、溶剤をあとで蒸発させる方法が公
知である。
【０００６】
【発明が解決しようとする課題】本発明の課題は、公知
技術水準の欠点を回避し、これに比して幾多の利点を有
するＳＭＤ構成要素の実装技術を開発することである。
【０００７】
【課題を解決するための手段】本発明は、導電性接着剤
を使用して基板上にＳＭＤ構成要素を、接着剤をスクリ
ン印刷法を用いるかまたはスタンプで基板上に設けるこ
とにより実装する方法に関し、接着剤として、導電性粒
子を充填した、室温で固体であり、加熱の際に液体の状
態に変わるホットメルト接着剤を、加熱した状態でまず
最初に基板上に設け、あとでＳＭＤ構成要素を実装する
ためにホットメルト接着剤を有する基板を加熱すること
を特徴とする。
【０００８】本発明の１実施形によれば、銀粒子を充填
したホットメルト接着剤が使用される。
【０００９】さらに、ホットメルト接着剤は本発明によ
れば加熱したスタンプを用いるスタンプ法ないしは加熱
したスクリンを用いるスクリン印刷法で設けられる。
【００１０】本発明のもう１つの実施形によれば、接着
剤塗布とＳＭＤ構成要素の装着との間の時間内に、基板
上に別のはんだ付け可能の構成要素を実装するために、
このための個所にはんだペーストを設け、その後強固に
はんだ付けする。
【００１１】請求項１の特徴部に記載された構成要件を
有する本発明による解決手段は、公知技術水準に比し
て、混合技術の場合でもホットメルト接着剤はスクリン
印刷法を用いて設けることができるという利点を有す
る。接着剤は最初の過程で設けられ、冷却過程後はもは
や粘着性ではないので、次いではんだペーストを問題な
しにプリントすることができる。
【００１２】もう１つの利点は、不良構成要素の交換
を、基板の簡単な加熱によって問題なく行なうことがで
きるという事実である。
【００１３】接着剤の塗布と構成要素の装着との間に、
冷却して接着剤が凝固した後は導電性粒子は移動しえな
いので、任意に長い時間を設けることができるという可
能性である。
【００１４】さらに、ホットメルト接着剤は、溶剤を有
する接着剤に比して、溶剤の蒸発を内容とする待ち時間
とは異なり、直ちに処理することができるという利点を
有する。最後に、溶剤なしの接着剤は環境汚染防止の点
で著しく有利である。
【００１５】
【実施例】本発明の１実施例は図面に示され、下記に詳
述されている。図は、基板上の種種の構成要素の配置を
示す。
【００１６】図においては、基板１上に種々のＳＭＤ構
成要素、たとえば２個のコンデンサ３、ＰＬＣＣ（プラ
スチックリードチップキャリヤ）４、ＳＯ（スモールア
ウトライン）５およびＩＣ２が実装されている。これら
の構成部品２〜５は、基板１に異なる方法で実装されて
いる。たとえば、構成要素３〜５ははんだペースト６を
用いて固定され、ボンディングワイヤ７により導電接続
されている。この場合、ホットメルト接着剤８は、基板
１の導体路へのＩＣ２のボンディングを形成する。
【００１７】この混合技術においては、まずたとえばポ
リアミドを主体とする、導電性粒子、たとえば銀粒子が
添加されているホットメルト接着剤８が、スクリン印刷
法を用いて基板１上に設けられる。この場合、接着剤は
あらかじめ加熱されており、従って液状である。短かい
冷却過程後、ホットメルト接着剤８はもはや粘着性でな
い。次の過程で、はんだペースト６を基板１上へ導体路
の範囲内にプリントし、はんだ付け可能な構成要素３〜
５を装着し、はんだ付けすることができる。引き続き、
接着可能の構成要素、たとえばＩＣ２を、基板を実装機
械（Ｂｅｓｔｕｅｃｋｕｎｇｓｍａｓｃｈｉｎｅ）中で
加熱してホットメルト接着剤８を液状にし、構成要素を
装着することができるようにすることによって実装する
ことができる。
【００１８】場合により修理する場合には、基板を簡単
に加熱することによって同様に容易に除去ないしは交換
できる。この場合、ＩＣではボンデングワイヤを更新し
なければならない。
【００１９】ホットメルト接着剤を用いてＳＭＤ構成要
素を固定するこの方法を用いると、すべての構成要素を
基板に固定し、導体路に導電接続することも可能であ
る、つまりＳＭＤ構成要素にあるすべての接続部が接着
される。
【図面の簡単な説明】
【図１】本発明の１実施例により種々の構成要素が実装
された基板の断面図
【符号の説明】
１ 基板 ２〜５ 構成要素 ６ はんだペースト ７ ボンディングワイヤ ８ ホットメルト接着剤
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭63−45892（ＪＰ，Ａ) 特開 平１−95596（ＪＰ，Ａ) 特開 昭59−84962（ＪＰ，Ａ) 特開 昭62−104791（ＪＰ，Ａ) 特開 平２−177390（ＪＰ，Ａ) 特開 昭62−145601（ＪＰ，Ａ) 実開 昭57−83841（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.7，ＤＢ名) H05K 3/32 H05K 3/34

Claims (3)

    (57)【特許請求の範囲】
  1. 【請求項１】 導電性接着剤を使用して基板上にＳＭＤ
    構成要素を、接着剤をスクリン印刷法またはスタンプを
    用いて基板に設けることにより実装する方法において、
    接着剤として、導電性粒子を充填した、室温で固体であ
    り、加熱の際に液体の状態に変わるホットメルト接着剤
    を加熱された状態でまず最初に基板（１）上に設け、基
    板（１）に別のはんだ付け可能な構成要素（３，４，
    ５）を実装するために、相当する個所にはんだペースト
    （６）を塗布し、その後構成要素（３，４，５）をこの
    個所に装着し、その後強固にはんだ付けし、あとでＳＭ
    Ｄ構成要素（２）を実装するために、ホットメルト接着
    剤（８）を有する基板（１）を加熱することを特徴とす
    る、基板にＳＭＤ構成要素を実装する方法。
  2. 【請求項２】 銀粒子が充填されたホットメルト接着剤
    （８）を使用することを特徴とする、請求項１記載の方
    法。
  3. 【請求項３】 ホットメルト接着剤（８）を、加熱され
    たスタンプを用いるスタンプ法ないしは加熱されたスク
    リンを用いるスクリン印刷法で設けることを特徴とす
    る、請求項１または２記載の方法。
JP22680091A 1990-09-08 1991-09-06 基板にｓｍｄ構成要素を実装する方法 Expired - Fee Related JP3219793B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE4028556.1 1990-09-08
DE4028556A DE4028556C1 (ja) 1990-09-08 1990-09-08

Publications (2)

Publication Number Publication Date
JPH04234193A JPH04234193A (ja) 1992-08-21
JP3219793B2 true JP3219793B2 (ja) 2001-10-15

Family

ID=6413881

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22680091A Expired - Fee Related JP3219793B2 (ja) 1990-09-08 1991-09-06 基板にｓｍｄ構成要素を実装する方法

Country Status (3)

Country Link
US (1) US5220724A (ja)
JP (1) JP3219793B2 (ja)
DE (1) DE4028556C1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6445473B1 (en) 1998-03-26 2002-09-03 Nec Corporation Optical switching apparatus using wavelength division multiplexing technology

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5268048A (en) * 1992-12-10 1993-12-07 Hewlett-Packard Company Reworkable die attachment
JPH07302868A (ja) * 1992-12-10 1995-11-14 Hewlett Packard Co <Hp> 電子部品の接着法
FR2722138B1 (fr) 1994-07-07 1996-09-20 Bourrieres Francis Pochoir de serigraphie et procede pour le realiser
US5769989A (en) * 1995-09-19 1998-06-23 International Business Machines Corporation Method and system for reworkable direct chip attach (DCA) structure with thermal enhancement
US5822856A (en) * 1996-06-28 1998-10-20 International Business Machines Corporation Manufacturing circuit board assemblies having filled vias
IT1291779B1 (it) * 1997-02-17 1999-01-21 Magnetek Spa Procedimento per la realizzazione di circuiti stampati e circuiti stampati cosi'ottenuti
JPH1140595A (ja) * 1997-07-16 1999-02-12 Mitsubishi Electric Corp ワイヤ配線方法、このワイヤ配線方法に使用する配線分岐パッド、および、ボンディング装置、並びに、ワイヤ配線方法をコンピュータに実行させるためのプログラムを記録したコンピュータ読み取り可能な記録媒体
US6238223B1 (en) 1997-08-20 2001-05-29 Micro Technology, Inc. Method of depositing a thermoplastic polymer in semiconductor fabrication
US6243944B1 (en) * 1997-12-08 2001-06-12 Unisys Corporation Residue-free method of assembling and disassembling a pressed joint with low thermal resistance
FR2818490B1 (fr) * 2000-12-15 2003-01-24 Thomson Multimedia Sa Procede de fixation sur un support metallique d'au moins un module electronique hyperfrequence
US6761978B2 (en) 2001-04-11 2004-07-13 Xerox Corporation Polyamide and conductive filler adhesive
KR100690960B1 (ko) * 2004-06-24 2007-03-09 삼성전자주식회사 스크린 프린팅 공정을 갖는 반도체 칩 패키지 제조 방법
DE102005031181A1 (de) * 2005-07-01 2007-01-04 Endress + Hauser Gmbh + Co. Kg Leiterplatte mit einer Oberfläche mit mehreren Kontaktflächen, Verfahren zur Beschichtung von Kontaktflächen einer Leiterplatte
DE102005048702B4 (de) * 2005-10-11 2014-02-20 Continental Automotive Gmbh Elektrische Anordnung zweier elektrisch leitender Fügepartner und Verfahren zum Befestigen einer Platte auf einer Grundplatte
DE102006016614A1 (de) * 2006-04-06 2007-10-11 Xstatic-Systems Gmbh Tragsystem und Verfahren zur Herstellung eines Tragsystems für die Befestigung von Leichtobjekten mittels elektrostatischer Aufladung
US9112616B2 (en) * 2008-08-13 2015-08-18 Avago Technologies General Ip (Singapore) Pte. Ltd. Transceiver system on a card for simultaneously transmitting and receiving information at a rate equal to or greater than approximately one terabit per second
US9713851B2 (en) 2013-09-04 2017-07-25 Apple Inc. Method and system for attaching flexible circuits to a mounting surface
DE102014217866A1 (de) * 2014-09-08 2016-03-10 Robert Bosch Gmbh Verfahren zum Herstellen eines Elektronikmuduls insbesondere für ein Kfz-Getriebesteuergerät

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54105774A (en) * 1978-02-08 1979-08-20 Hitachi Ltd Method of forming pattern on thin film hybrid integrated circuit
FR2524247A1 (fr) * 1982-03-23 1983-09-30 Thomson Csf Procede de fabrication de circuits imprimes avec support metallique rigide conducteur individuel
FR2560437B1 (fr) * 1984-02-28 1987-05-29 Citroen Sa Procede de report a plat d'elements de puissance sur un reseau conducteur par brasage de leurs connexions
US4654752A (en) * 1984-12-04 1987-03-31 Kyle James C Terminal assembly and method of making terminal assembly
US4667401A (en) * 1985-11-26 1987-05-26 Clements James R Method of making an electronic device using an uniaxial conductive adhesive
JPS62194693A (ja) * 1986-02-12 1987-08-27 信越ポリマ−株式会社 基板付き電気電子部品
US4694572A (en) * 1986-06-13 1987-09-22 Tektronix, Inc. Printed polymer circuit board method
FR2606784B1 (fr) * 1986-11-14 1989-03-03 Rhone Poulenc Multi Tech Composition potentiellement adhesive electriquement conductrice
DE3777995D1 (de) * 1986-12-22 1992-05-07 Siemens Ag Verfahren zur befestigung von elektronischen bauelementen auf einem substrat, folie zur durchfuehrung des verfahrens und verfahren zur herstellung der folie.
US4811081A (en) * 1987-03-23 1989-03-07 Motorola, Inc. Semiconductor die bonding with conductive adhesive
DE3800136A1 (de) * 1988-01-05 1989-07-13 Adalbert Fritsch Geraet zum bedrucken von leiterplatten mittels einer lochfolie
FR2627776B1 (fr) * 1988-02-26 1990-09-07 Asulab Sa Melange adhesif electriquement conducteur
US4994207A (en) * 1989-03-09 1991-02-19 National Starch And Chemical Investment Holding Corporation Thermoplastic film die attach adhesives
US5002818A (en) * 1989-09-05 1991-03-26 Hughes Aircraft Company Reworkable epoxy die-attach adhesive

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6445473B1 (en) 1998-03-26 2002-09-03 Nec Corporation Optical switching apparatus using wavelength division multiplexing technology

Also Published As

Publication number Publication date
JPH04234193A (ja) 1992-08-21
DE4028556C1 (ja) 1992-04-02
US5220724A (en) 1993-06-22

Similar Documents

Publication Publication Date Title
JP3219793B2 (ja) 基板にｓｍｄ構成要素を実装する方法
JP4809761B2 (ja) エリアアレイデバイスを電気基板に取り付ける方法及びパターン付きアンダーフィル膜
US7456504B2 (en) Electronic component assemblies with electrically conductive bonds
JP3339035B2 (ja) ボール・グリッド・アレイ・モジュールを基板にはんだ付けするための方法および装置
JPH06232186A (ja) 電子部品の接着方法
US20050121806A1 (en) Method for attaching circuit elements
JP2573829B2 (ja) 面実装型電子素子の実装方法および面実装型電子素子を実装した電子装置
JP2658967B2 (ja) 電子パッケージ組立体用支持部材およびこれを用いた電子パッケージ組立体
JPH0120559B2 (ja)
JP2002134682A (ja) 混成集積回路装置の製造方法
JPH04326747A (ja) 部品実装方法
JPS58103198A (ja) 電子部品の取付け方法
JPS63177584A (ja) 混成集積回路の組立方法
JPH04151861A (ja) 混成集積回路の製造方法
JPH05235532A (ja) 回路部品およびその実装方法
JPH0837278A (ja) ピングリッドアレイの製造方法
JPS5921093A (ja) リ−ドレスチツプキヤリアの取付方法
JPH04246839A (ja) Ｉｃ実装方法
JPH05235108A (ja) フィルムキャリアテープの製造方法
JPH03200393A (ja) 印刷配線板及びその製造方法
JP2002134683A (ja) 混成集積回路装置の製造方法
JPH04151894A (ja) プリント配線板への電子部品取付法
JPH075486A (ja) 液晶表示装置
JP2002134680A (ja) 混成集積回路装置の製造方法
JPS58197793A (ja) 電子部品の取り付け方法

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees