JPS59188153A - 多層配線を有する電子回路装置の製造方法 - Google Patents

多層配線を有する電子回路装置の製造方法

Info

Publication number
JPS59188153A
JPS59188153A JP58060765A JP6076583A JPS59188153A JP S59188153 A JPS59188153 A JP S59188153A JP 58060765 A JP58060765 A JP 58060765A JP 6076583 A JP6076583 A JP 6076583A JP S59188153 A JPS59188153 A JP S59188153A
Authority
JP
Japan
Prior art keywords
wiring
insulating film
layer
bonding
circuit device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58060765A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0462176B2 (enExample
Inventor
Toru Inaba
稲葉　透
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP58060765A priority Critical patent/JPS59188153A/ja
Publication of JPS59188153A publication Critical patent/JPS59188153A/ja
Publication of JPH0462176B2 publication Critical patent/JPH0462176B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07553—Controlling the environment, e.g. atmosphere composition or temperature changes in shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/29—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/923—Bond pads having multiple stacked layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/934—Cross-sectional shape, i.e. in side view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/981—Auxiliary members, e.g. spacers
    • H10W72/983—Reinforcing structures, e.g. collars

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP58060765A 1983-04-08 1983-04-08 多層配線を有する電子回路装置の製造方法 Granted JPS59188153A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58060765A JPS59188153A (ja) 1983-04-08 1983-04-08 多層配線を有する電子回路装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58060765A JPS59188153A (ja) 1983-04-08 1983-04-08 多層配線を有する電子回路装置の製造方法

Publications (2)

Publication Number Publication Date
JPS59188153A true JPS59188153A (ja) 1984-10-25
JPH0462176B2 JPH0462176B2 (enExample) 1992-10-05

Family

ID=13151694

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58060765A Granted JPS59188153A (ja) 1983-04-08 1983-04-08 多層配線を有する電子回路装置の製造方法

Country Status (1)

Country Link
JP (1) JPS59188153A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5235212A (en) * 1988-03-18 1993-08-10 Kabushiki Kaisha Toshiba Semiconductor device having a mechanical buffer
US7183189B2 (en) 1996-12-04 2007-02-27 Seiko Epson Corporation Semiconductor device, circuit board, and electronic instrument
US7470979B2 (en) 1996-12-04 2008-12-30 Seiko Epson Corporation Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument
CN102810523A (zh) * 2011-05-31 2012-12-05 三菱电机株式会社 半导体装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5227389A (en) * 1975-08-27 1977-03-01 Hitachi Ltd Semiconductor device containing multi-layer wiring

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5227389A (en) * 1975-08-27 1977-03-01 Hitachi Ltd Semiconductor device containing multi-layer wiring

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5235212A (en) * 1988-03-18 1993-08-10 Kabushiki Kaisha Toshiba Semiconductor device having a mechanical buffer
US7183189B2 (en) 1996-12-04 2007-02-27 Seiko Epson Corporation Semiconductor device, circuit board, and electronic instrument
US7470979B2 (en) 1996-12-04 2008-12-30 Seiko Epson Corporation Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument
US7511362B2 (en) 1996-12-04 2009-03-31 Seiko Epson Corporation Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument
US7521796B2 (en) 1996-12-04 2009-04-21 Seiko Epson Corporation Method of making the semiconductor device, circuit board, and electronic instrument
US7842598B2 (en) 1996-12-04 2010-11-30 Seiko Epson Corporation Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument
US7888260B2 (en) 1996-12-04 2011-02-15 Seiko Epson Corporation Method of making electronic device
US8115284B2 (en) 1996-12-04 2012-02-14 Seiko Epson Corporation Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board and electronic instrument
US8384213B2 (en) 1996-12-04 2013-02-26 Seiko Epson Corporation Semiconductor device, circuit board, and electronic instrument
CN102810523A (zh) * 2011-05-31 2012-12-05 三菱电机株式会社 半导体装置

Also Published As

Publication number Publication date
JPH0462176B2 (enExample) 1992-10-05

Similar Documents

Publication Publication Date Title
US5061985A (en) Semiconductor integrated circuit device and process for producing the same
JPWO1998025298A1 (ja) 半導体装置及びその製造方法、回路基板並びに電子機器
GB2184600A (en) Bonding pad interconnection structure
JPH07201855A (ja) 半導体装置
CN1957455A (zh) 在铜金属化集成电路之上具有保护性防护层可焊金属接头的接触点的结构和方法
JPS6248892B2 (enExample)
JPS59188153A (ja) 多層配線を有する電子回路装置の製造方法
TWI405300B (zh) 半導體裝置及其製造方法
JP2738145B2 (ja) 半導体装置
JPH05121727A (ja) 半導体装置及びその製造方法
JPS61170056A (ja) 半導体装置の電極材料
JPS63308924A (ja) 半導体装置
JPH0794548A (ja) 半導体装置及びその製造方法
JPH03209823A (ja) 樹脂封止型半導体装置
JPS5929430A (ja) 半導体装置
JPH0233949A (ja) 半導体ヒューズ素子
JPS6367751A (ja) 半導体装置
JPH0661288A (ja) 半導体集積回路の配線方法
JPS58192350A (ja) 半導体装置
JP2947800B2 (ja) 半導体装置
JPH01179434A (ja) 半導体集積回路装置
JPS6043845A (ja) 多層配線部材の製造方法
JPH03280441A (ja) 半導体装置
JPH03136331A (ja) 半導体装置
JPS61272957A (ja) 半導体装置