JPS59188153A - 多層配線を有する電子回路装置の製造方法 - Google Patents

多層配線を有する電子回路装置の製造方法

Info

Publication number
JPS59188153A
JPS59188153A JP58060765A JP6076583A JPS59188153A JP S59188153 A JPS59188153 A JP S59188153A JP 58060765 A JP58060765 A JP 58060765A JP 6076583 A JP6076583 A JP 6076583A JP S59188153 A JPS59188153 A JP S59188153A
Authority
JP
Japan
Prior art keywords
wiring
insulating film
layer
bonding
circuit device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58060765A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0462176B2 (cg-RX-API-DMAC10.html
Inventor
Toru Inaba
稲葉　透
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP58060765A priority Critical patent/JPS59188153A/ja
Publication of JPS59188153A publication Critical patent/JPS59188153A/ja
Publication of JPH0462176B2 publication Critical patent/JPH0462176B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/90—
    • H10W72/07551—
    • H10W72/07553—
    • H10W72/29—
    • H10W72/50—
    • H10W72/531—
    • H10W72/536—
    • H10W72/59—
    • H10W72/923—
    • H10W72/932—
    • H10W72/934—
    • H10W72/952—
    • H10W72/983—

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP58060765A 1983-04-08 1983-04-08 多層配線を有する電子回路装置の製造方法 Granted JPS59188153A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58060765A JPS59188153A (ja) 1983-04-08 1983-04-08 多層配線を有する電子回路装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58060765A JPS59188153A (ja) 1983-04-08 1983-04-08 多層配線を有する電子回路装置の製造方法

Publications (2)

Publication Number Publication Date
JPS59188153A true JPS59188153A (ja) 1984-10-25
JPH0462176B2 JPH0462176B2 (cg-RX-API-DMAC10.html) 1992-10-05

Family

ID=13151694

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58060765A Granted JPS59188153A (ja) 1983-04-08 1983-04-08 多層配線を有する電子回路装置の製造方法

Country Status (1)

Country Link
JP (1) JPS59188153A (cg-RX-API-DMAC10.html)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5235212A (en) * 1988-03-18 1993-08-10 Kabushiki Kaisha Toshiba Semiconductor device having a mechanical buffer
US7183189B2 (en) 1996-12-04 2007-02-27 Seiko Epson Corporation Semiconductor device, circuit board, and electronic instrument
US7470979B2 (en) 1996-12-04 2008-12-30 Seiko Epson Corporation Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument
CN102810523A (zh) * 2011-05-31 2012-12-05 三菱电机株式会社 半导体装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5227389A (en) * 1975-08-27 1977-03-01 Hitachi Ltd Semiconductor device containing multi-layer wiring

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5227389A (en) * 1975-08-27 1977-03-01 Hitachi Ltd Semiconductor device containing multi-layer wiring

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5235212A (en) * 1988-03-18 1993-08-10 Kabushiki Kaisha Toshiba Semiconductor device having a mechanical buffer
US7183189B2 (en) 1996-12-04 2007-02-27 Seiko Epson Corporation Semiconductor device, circuit board, and electronic instrument
US7470979B2 (en) 1996-12-04 2008-12-30 Seiko Epson Corporation Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument
US7511362B2 (en) 1996-12-04 2009-03-31 Seiko Epson Corporation Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument
US7521796B2 (en) 1996-12-04 2009-04-21 Seiko Epson Corporation Method of making the semiconductor device, circuit board, and electronic instrument
US7842598B2 (en) 1996-12-04 2010-11-30 Seiko Epson Corporation Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument
US7888260B2 (en) 1996-12-04 2011-02-15 Seiko Epson Corporation Method of making electronic device
US8115284B2 (en) 1996-12-04 2012-02-14 Seiko Epson Corporation Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board and electronic instrument
US8384213B2 (en) 1996-12-04 2013-02-26 Seiko Epson Corporation Semiconductor device, circuit board, and electronic instrument
CN102810523A (zh) * 2011-05-31 2012-12-05 三菱电机株式会社 半导体装置

Also Published As

Publication number Publication date
JPH0462176B2 (cg-RX-API-DMAC10.html) 1992-10-05

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